Camera module and electronic equipment

Abstract

The utility model discloses a camera module and electronic equipment, which comprise a lens assembly, an optical filter, a photosensitive chip and a circuit board which are sequentially arranged from an object space to an image space along an optical axis direction, and is characterized in that one side surface, facing the object space, of the circuit board is provided with a first concave position; the optical filter is at least partially accommodated in the first sunken position; a second concave position is arranged on one side surface, far away from the object space, of the circuit board, and the photosensitive chip is accommodated in the second concave position; the circuit board is provided with a through cavity for communicating the first concave position and the second concave position for light entering, the space of the circuit board is effectively utilized, a support is omitted, the space and manufacturing materials can be saved, the structure of the whole camera module is more compact, the height of the camera module is reduced, and therefore equipment is light and thin.

Description

Technical Field

[0001] The utility model belongs to the technical field of optical devices, and in particular relates to a camera module and electronic equipment. Background Art

[0002] With the continuous development of electronic device technology, lightweight and thinning has become a major design trend. As one of the core components of electronic devices, the height of the camera module directly affects the thickness of the entire device. Therefore, reducing the overall height of the camera module is one of the keys to achieving lightweight and thin devices.

[0003] Traditional camera module designs typically include a lens assembly, bracket, filter, and circuit board. The lens assembly is connected to the bracket at the bottom, which then mounts the filter and finally connects to the circuit board. Because each component requires a certain amount of space, and the physical height of the lens assembly, bracket, and other components is limited, traditional camera module designs result in a relatively high overall height, limiting their application in thinner and lighter devices. Utility Model Content

[0004] In order to solve the technical problem in the prior art that the camera module is relatively high in overall height and heavy in size, which is not conducive to the thinning and lightening of electronic equipment, the utility model provides a camera module and an electronic equipment.

[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0006] A camera module comprises a lens assembly, a filter, a photosensitive chip and a circuit board, which are arranged in sequence from the object side to the image side along the optical axis. A first recess is provided on the side of the circuit board facing the object side, and the filter is at least partially accommodated in the first recess; a second recess is provided on the side of the circuit board away from the object side, and the photosensitive chip is accommodated in the second recess; a through cavity is provided on the circuit board to connect the first recess and the second recess for light entry, and the first recess is configured as a first groove formed by a recess from the object side to the image side; the second recess is configured as a second groove formed by a recess from the image side to the object side, and the first groove and the second groove are both centered on the center of the through cavity and arranged around the periphery of the through cavity, and the end of the photosensitive chip facing the bottom of the second groove is welded to the second groove through a plurality of gold balls.

[0007] Furthermore, the through-cavity passes through the circuit board vertically along the optical axis, and the first end port of the through-cavity is located at the bottom surface of the first groove; on the vertical projection plane, the port of the first groove surrounds the first port of the through-cavity, so that the bottom surface of the first groove and the side wall of the first groove form a first L-shaped bonding portion, which is bonded to the filter through the first L-shaped bonding portion.

[0008] Furthermore, the second end port of the through cavity is located at the bottom surface of the second groove. On the vertical projection plane, the port of the second groove surrounds the second port of the through cavity, so that the bottom surface of the second groove and the side wall of the second groove form a second L-shaped bonding portion, which is bonded to the photosensitive chip through the second L-shaped bonding portion.

[0009] Furthermore, each corner position of the through cavity and each corner position of the first groove are in the shape of arc chamfers.

[0010] Furthermore, the port area of ​​the second groove is larger than the port area of ​​the first groove, and each corner position of the second groove is in the shape of an arc chamfer.

[0011] Furthermore, the depth of the second groove is greater than or equal to the thickness of the photosensitive chip; a metal reinforcement plate is bonded to the end face of the photosensitive chip facing away from the second groove, and the reinforcement plate contacts the circuit board and covers the port of the second groove.

[0012] Furthermore, the lens assembly includes a lens and a lens holder for mounting the lens, the lens holder being bonded to the circuit board at an end surface thereof facing the circuit board, a third recessed portion recessed toward the lens side and a support portion provided around the periphery of the third recessed portion on one end of the lens holder facing the object side, the support portion extending toward the object side so as to protrude from the third recessed portion; the support portion being supported on the circuit board at a position located outside the first recessed portion, so that the third recessed portion and the first recessed portion are interconnected to form a closed space;

[0013] The filter is partially accommodated in the first recess, and the other part is accommodated in the third recess;

[0014] The support portion is provided with a fourth recessed position located outside the third recessed position. The fourth recessed position is separated from the third recessed position by a barrier wall. The fourth recessed position is used to accommodate components on the circuit board.

[0015] An electronic device comprises the above-mentioned camera module.

[0016] In summary, the beneficial effects of the present invention are as follows: First, the bracket structure is eliminated, and the lens assembly is directly bonded to the circuit board. The circuit board is provided with a first groove for sunken installation of the filter, and a second groove for embedded installation of the photosensitive chip, which effectively utilizes the space of the circuit board, reduces the overall volume and occupied space of the module, and directly installs the filter and the photosensitive chip in the corresponding grooves on the circuit board, which simplifies the assembly steps in the production process, can reduce the difficulty and cost of production, and enable electronic equipment equipped with this camera module to meet the requirements of lightness and thinness. Second, the photosensitive chip is welded to the circuit board through gold balls, which can save material usage, and the connection formed by the gold ball welding usually has a lower resistance, which is conducive to the transmission of electrical signals and reduces signal loss and noise interference. Third, a metal reinforcement plate is also provided at the lower end of the circuit board, which not only strengthens the support, but also improves the heat conduction efficiency, and helps to quickly dissipate the heat generated by the photosensitive chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a structural schematic diagram of a camera module provided by the utility model.

[0018] Figure 2 yes Figure 1 A partial enlarged view of part A in the middle.

[0019] Figure 3 It is a structural schematic diagram of the bottom surface of the circuit board in the utility model.

[0020] In the figure, 100-lens assembly, 110-lens, 120-lens mount, 121-third recess, 122-fourth recess, 200-filter, 300-photosensitive chip, 310-gold ball, 400-circuit board, 410-first L-shaped bonding part, 420-second groove, 421-second L-shaped bonding part, 430-through cavity, 500-reinforcement plate, 600-components. DETAILED DESCRIPTION

[0021] The present invention will be further described below with reference to specific drawings.

[0022] See also Figure 1The present invention provides a camera module comprising a lens 110 assembly 100, a filter 200, a photosensitive chip 300, and a circuit board 400, arranged sequentially along the optical axis from the object side to the image side. A first recess is provided on a side of the circuit board 400 facing the object side, and the filter 200 is at least partially accommodated in the first recess. A second recess is provided on a side of the circuit board 400 facing away from the object side, and the photosensitive chip 300 is accommodated in the second recess. A through cavity 430 is formed on the circuit board 400 to connect the first and second recesses for light entry. By accommodating the filter 200 and the photosensitive chip 300 in the first recessed position and the second recessed position on the circuit board 400 respectively, the space of the circuit board 400 is effectively utilized. Eliminating the bracket can save space and manufacturing materials, reduce the height of the camera module, and make the structure of the entire camera module more compact. Compared with the traditional design, it will be lighter and thinner, which helps to achieve the miniaturization and thinness of the camera module and meet the requirements of modern electronic devices for portability and thinness.

[0023] The lens assembly 100 includes a lens 110 and a lens mount 120 for mounting the lens 110. The end surface of the lens mount 120 facing the circuit board 400 is bonded to the circuit board 400. A third recessed portion 121, recessed toward the lens, is provided on one end of the lens mount 120 facing the object side. A support portion is provided around the periphery of the third recessed portion 121. The support portion extends toward the object side to protrude beyond the third recessed portion 121. The support portion supports the circuit board 400 at a location outside the first recessed portion, connecting the third recessed portion 121 and the first recessed portion to form a closed space. This ensures a more secure and reliable connection between the lens assembly 100 and the circuit board 400, reducing the risk of component loosening or damage due to vibration or impact. The optical filter 200 is partially housed in the first recess, and partially housed in the third recess 121. The optical filter 200 is no longer connected to the circuit board 400 via a bracket, but is instead mounted on the circuit board 400 by sinking. The lens assembly 100 is directly bonded to the circuit board 400, reducing additional installation space and material usage. Furthermore, the optical filter 200's placement in the first recess allows for more accurate installation and reduces interference with surrounding components, thereby enhancing filtering effectiveness and further improving image color and clarity.

[0024] The support portion is provided with a fourth recessed position 122 located outside the third recessed position 121. The fourth recessed position 122 is separated from the third recessed position 121 by a barrier wall. The fourth recessed position 122 is used to accommodate components 600 on the circuit board 400, providing additional accommodation space for other components 600 on the circuit board 400. This design makes the layout of the components 600 more reasonable and orderly, and helps to reduce mutual interference and electromagnetic radiation problems.

[0025] The first recessed position is configured as a first groove that is recessed from the object side to the image side, and the second recessed position is configured as a second groove 420 that is recessed from the image side to the object side. The first groove and the second groove 420 are both centered on the center of the through cavity 430 and are arranged around the periphery of the through cavity 430. The first groove and the second groove 420 are both arranged around the periphery of the through cavity 430, ensuring that the optical path of light from the lens assembly 100 through the filter 200 to the photosensitive chip 300 is unobstructed. This design helps to reduce light loss and scattering during transmission, thereby improving image quality.

[0026] See also Figure 3 The port area of ​​the second groove 420 is larger than the port area of ​​the first groove, and each corner of the second groove 420 is chamfered, which not only helps the smooth propagation of light, but also enhances the structural stability of the module and reduces the stress concentration problem caused by sharp corners.

[0027] The depth of the second groove 420 is greater than or equal to the thickness of the photosensitive chip 300. A metal reinforcement plate 500 is bonded to the end face of the photosensitive chip 300 facing away from the second groove 420. The reinforcement plate 500 is preferably made of steel. The reinforcement plate 500 is in contact with the circuit board 400 and covers the port of the second groove 420. The photosensitive chip 300 is one of the heating elements in the camera module. By accommodating it in the second groove 420 and contacting it with the circuit board 400 through the metal reinforcement plate 500, an effective heat dissipation path can be formed. The metal reinforcement plate 500 not only provides structural support, but also improves the heat conduction efficiency, helps to quickly dissipate the heat generated by the photosensitive chip 300, and maintains a stable operating temperature of the module.

[0028] The through-hole 430 extends perpendicularly through the circuit board 400 along the optical axis, with a first end of the through-hole 430 located at the bottom of the first groove. In vertical projection, the end of the first groove surrounds the first end of the through-hole 430, forming a first L-shaped adhesive portion 410 between the bottom and sidewalls of the first groove. The first L-shaped adhesive portion 410 bonds the optical filter 200, facilitating installation and positioning of the optical filter 200. The second end of the through-hole 430 is located at the bottom of the second groove 420. In vertical projection, the end of the second groove 420 surrounds the second end of the through-hole 430, forming a second L-shaped adhesive portion 421 between the bottom and sidewalls of the second groove 420. The second L-shaped adhesive portion 421 bonds the optical filter 300. By injecting glue into the first L-shaped bonding portion 410 and the second L-shaped bonding portion 420, the filter 200 and the photosensitive chip 300 are firmly bonded to the circuit board 400 respectively, thereby increasing the bonding area and improving the bonding strength, making the filter 200 and the photosensitive chip 300 more stable and reliable in the module and not easy to loosen or fall off.

[0029] Each corner position of the through cavity 430 and each corner position of the first groove are arc-shaped chamfered. The arc-shaped chamfered design can smooth the propagation path of light, reduce the scattering and reflection of light at the corners, and ensure that the light can be focused more accurately on the photosensitive chip 300, thereby improving the imaging quality of the camera.

[0030] See also Figure 2 The end of the photosensitive chip 300 facing the bottom of the second groove 420 is welded to the second groove 420 through a plurality of gold balls 310. The gold ball welding can accurately control the amount of welding material. Compared with the traditional gold wire connection, it can save material usage. Moreover, the connection formed by the gold ball 310 welding usually has a lower resistance, which is conducive to the transmission of electrical signals and reduces signal loss and noise interference.

[0031] An electronic device includes the above-mentioned camera module. Since the camera module eliminates the bracket, the lens assembly 100 is directly connected to the circuit board 400, and the filter 200 is installed in a sunken manner in a first groove on the circuit board 400, and the photosensitive chip 300 is also embedded in the second groove 420 of the circuit board 400, thereby effectively reducing the overall height of the camera module and greatly saving the space of the module, making the entire camera module structure more compact. Therefore, the electronic device equipped with this camera module can be made lightweight.

[0032] The above camera module and electronic device: 1. The bracket structure is eliminated, and the lens assembly 100 is directly bonded to the circuit board 400. The circuit board 400 is provided with a first groove for the sunken installation of the filter 200 and a second groove 420 for the embedded installation of the photosensitive chip 300. This effectively utilizes the space on the circuit board 400, reducing the overall volume and space occupied by the module. The filter 200 and the photosensitive chip 300 are directly installed in the corresponding grooves on the circuit board 400, simplifying the assembly steps during the production process, reducing production difficulty and cost, and making the electronic device equipped with this camera module meet the requirements of lightweight and thinness. 2. The photosensitive chip 300 is soldered to the circuit board 400 via the gold ball 310, which can save material usage. The connection formed by the gold ball 310 is generally low in resistance, which is conducive to the transmission of electrical signals and reduces signal loss and noise interference. 3. A metal reinforcement plate 500 is also provided at the lower end of the circuit board 400, which not only strengthens the support but also improves the heat conduction efficiency, helping to quickly dissipate the heat generated by the photosensitive chip 300.

[0033] The above is only an embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structure made using the contents of the description and drawings of the present invention, directly or indirectly used in other related technical fields, is also within the patent protection scope of the present invention.

Claims

1. A camera module, characterized in that: The optical filter comprises a lens assembly, a filter, a photosensitive chip and a circuit board which are arranged in sequence from the object side to the image side along the optical axis, and is characterized in that: a first recess is provided on a side of the circuit board facing the object side, and the filter is at least partially accommodated in the first recess; a second recess is provided on a side of the circuit board away from the object side, and the photosensitive chip is accommodated in the second recess; a through cavity is provided on the circuit board to connect the first recess and the second recess for light entry, and the first recess is configured as a first groove formed by a recess from the object side to the image side; the second recess is configured as a second groove formed by a recess from the image side to the object side, and the first groove and the second groove are both centered on the center of the through cavity and arranged around the outer periphery of the through cavity, and the end of the photosensitive chip facing the bottom of the second groove is welded to the second groove through a plurality of gold balls.

2. The camera module according to claim 1, wherein: The through-cavity passes through the circuit board vertically along the optical axis, and the first end port of the through-cavity is located at the bottom surface of the first groove; on the vertical projection plane, the port of the first groove surrounds the first end port of the through-cavity, so that the bottom surface of the first groove and the side wall of the first groove form a first L-shaped bonding portion, and are bonded to the filter through the first L-shaped bonding portion.

3. The camera module according to claim 2, wherein: The second end port of the through cavity is located at the bottom surface of the second groove. On the vertical projection plane, the port of the second groove surrounds the second port of the through cavity, so that the bottom surface of the second groove and the side wall of the second groove form a second L-shaped bonding portion, which is bonded to the photosensitive chip through the second L-shaped bonding portion.

4. The camera module according to claim 3, wherein: Each corner position of the through cavity and each corner position of the first groove are in the shape of arc chamfers.

5. The camera module according to claim 3, wherein: The port area of ​​the second groove is larger than the port area of ​​the first groove, and each corner position of the second groove is in the shape of an arc chamfer.

6. The camera module according to claim 1, wherein: The depth of the second groove is greater than or equal to the thickness of the photosensitive chip; a metal reinforcement plate is bonded to the end face of the photosensitive chip facing away from the second groove, and the reinforcement plate contacts the circuit board and covers the port of the second groove.

7. The camera module according to any one of claims 1 to 6, wherein: The lens assembly includes a lens and a lens holder for mounting the lens. The end surface of the lens holder facing the circuit board is bonded to the circuit board. A third recessed portion that is recessed toward the lens side is provided on one end of the lens holder facing the object side, and a support portion is provided around the periphery of the third recessed portion. The support portion extends toward the object side so as to protrude from the third recessed portion. The support portion supports the circuit board at a position located around the first recessed portion, so that the third recessed portion and the first recessed portion are connected to each other to form a closed space. The filter is partially accommodated in the first recess, and the other part is accommodated in the third recess; The support portion is provided with a fourth recessed position located outside the third recessed position. The fourth recessed position is separated from the third recessed position by a barrier wall. The fourth recessed position is used to accommodate components on the circuit board.

8. An electronic device, characterized in that: The electronic device includes the camera module according to any one of claims 1 to 7.

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