Radiator and power conversion equipment

Abstract

The utility model discloses a radiator and a power conversion device, and the radiator comprises a heat conduction substrate and a heat exchange module. The heat exchange module is installed on the first surface of the heat conduction substrate, and the heat conduction substrate is used for receiving heat. The airflow blowing to the heat exchange module is at least divided into two flow paths in different directions. When a heating device of the electrical equipment needs to be cooled, the radiator is installed on the electrical equipment, the heat conduction substrate exchanges heat with the device in the case, and the heat of the heat conduction substrate exchanges heat with the heat exchange module. Under the action of the airflow, cold air is blown to the heat exchange module, and the airflow is at least divided into two flow paths in different directions to exchange with the heat exchange module. According to the radiator, the airflow blowing to the heat exchange module is at least divided into the two flow paths in the different directions, the flowing distance of the airflow in the heat exchange module is shortened, and then heat accumulation is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of equipment heat dissipation, in particular to a radiator and power conversion equipment. Background Art

[0002] During operation, the conversion / power modules used within power modules such as inverters and power devices generate heat. To improve ease of use and installation and prevent heat buildup within the equipment, heat dissipation within the modules is necessary. Traditional heat sinks utilize air cooling. Specifically, the modules fit within the cooling duct, using forced convection from a fan. One side of the cooling duct acts as an air inlet for cool air to enter, while the other side acts as an outlet for hot air to escape after heat exchange.

[0003] However, as the capacity of heat-generating devices such as power modules or other heat-generating modules continues to increase, and the heat flux density in electrical equipment is also getting larger and larger, air cooling has gradually failed to meet the heat dissipation needs of electrical equipment. At the same time, as the radiator continues to work, the heat accumulation at the air outlet of the radiator increases seriously.

[0004] Therefore, how to reduce the heat accumulation of the radiator is a technical problem that needs to be solved urgently by those skilled in the art. Utility Model Content

[0005] The purpose of the utility model is to provide a radiator, electrical equipment and photovoltaic system to reduce heat accumulation of the radiator.

[0006] A heat sink provided in the present application includes a heat-conducting substrate and a heat exchange module; the heat exchange module is installed on the first surface of the heat-conducting substrate, and the heat-conducting substrate is used to receive heat; the airflow blowing toward the heat exchange module is divided into at least two flow paths in different directions.

[0007] Optionally, in the above-mentioned radiator, the heat-conducting substrate is formed by filling the inner cavity with a phase-change working medium to form an evaporator, and the heat exchange module is connected to the evaporator as a condenser. The evaporator is used to carry the power module and absorb the heat of the power module; in the height direction, the top of the condenser is higher than the top of the evaporator; and the horizontal projections of the condenser and the evaporator overlap or are arranged at intervals up and down.

[0008] Optionally, in the above radiator, the inner cavity of the evaporator is provided with first flow-turbulating structures arranged at intervals;

[0009] The wall of the evaporator close to the heating area in the chassis is a heat exchange wall, and the inner wall of the heat exchange wall includes a first wall facing the heating area in the chassis and a second wall facing the non-heating area in the chassis; the first density of the first spoiler structure set at the first wall position is greater than the second density of the first spoiler structure set at the second wall position, the first density is the area occupied by the first spoiler structure on the first wall divided by the total area of ​​the first wall, and the second density is the area occupied by the first spoiler structure on the second wall divided by the total area of ​​the second wall.

[0010] Optionally, in the above-mentioned radiator, the inner cavity of the evaporator is divided into at least two working fluid accommodating chambers, each of the working fluid accommodating chambers is filled with the phase-change working fluid; at least one condenser is connected to one or more working fluid accommodating chambers, or at least one working fluid accommodating chamber is connected to one or more condensers.

[0011] Optionally, in the above-mentioned radiator: the working medium accommodating chamber provided in the evaporator is arranged along a horizontal direction; or the working medium accommodating chamber provided in the evaporator is arranged along a vertical direction perpendicular to the horizontal direction.

[0012] Optionally, in the above-mentioned radiator, the condenser includes a plurality of first heat dissipation fins arranged at intervals, one end of the first heat dissipation fin is connected to the heat conductive substrate, and has a certain height away from the heat conductive substrate, and the first heat dissipation fin is a solid fin or a hollow fin.

[0013] Optionally, in the above heat sink: an end of the first heat dissipating fin facing away from the heat conducting substrate is bent toward an end of the heat conducting substrate.

[0014] Optionally, in the above radiator, the condenser includes a heat exchange channel and a second heat dissipation fin, the heat exchange channel has a height in a direction away from the evaporator; the second heat dissipation fin is connected to the outer wall of the heat exchange channel;

[0015] One end of the heat exchange channel is connected to the heat conductive substrate, and the inner cavity of the heat exchange channel is communicated with the inner cavity of the heat conductive substrate; or the inner cavity of the heat exchange channel is communicated with the inner cavity of the heat conductive substrate through an intermediate channel.

[0016] Optionally, in the above-mentioned radiator: the heat exchange channel has a plate-shaped inner cavity, the second heat dissipation fins and the heat exchange channel are arranged at intervals or the second heat dissipation fins are connected to the outer wall of the heat exchange channel; or, the heat exchange channel has a columnar inner cavity, and the second heat dissipation fins are passed through the outer wall of the heat exchange channel.

[0017] Optionally, in the above radiator, the inner cavity of the heat exchange channel is provided with second flow-disturbing structures arranged at intervals, and the second flow-disturbing structures are connected to the inner wall of the heat exchange channel.

[0018] Optionally, in the above radiator, one end of the condenser away from the evaporator is concave toward the evaporator to form a first fan accommodating space for accommodating a fan.

[0019] Optionally, in the above-mentioned radiator, the condenser has an air inlet channel; the inlet of the air inlet channel is used to enter the air flow blowing toward the heat exchange module; the outlet of the air inlet channel is arranged close to the heat conductive substrate; the air inlet channel is connected to the gap between adjacent first heat dissipation fins in the condenser, or the gap between adjacent first heat dissipation fins is connected.

[0020] Optionally, the above radiator further includes an air duct housing, wherein the air duct housing is arranged on the outside of the heat exchange module; the air duct housing is provided with an air inlet and an air outlet.

[0021] Optionally, in the above radiator, at least two air outlets are provided, and the at least two air outlets are respectively located on two opposite sides of the air duct housing that are arranged in a back-to-back manner.

[0022] A power conversion device includes a chassis, a fan, a power module and a radiator mounted on the back outer wall of the chassis; the power module is supported by a heat-conducting substrate of the radiator; the radiator is any of the radiators described above; along the direction of airflow, the fan blows the airflow toward the heat exchange module.

[0023] Optionally, the power conversion device further includes a first heating device, and the airflow passes through the fan, the heat exchange module, and the first heating device in sequence.

[0024] In the above technical solution, the heat sink provided by the present invention includes a heat-conducting substrate and a heat exchange module; the heat exchange module is mounted on the first surface of the heat-conducting substrate, and the heat-conducting substrate is used to receive heat; the airflow blowing toward the heat exchange module is divided into at least two flow paths in different directions. When heat is needed to dissipate heat from the heating components of an electrical device, the heat sink is mounted on the electrical device, the heat-conducting substrate exchanges heat with the components in the chassis, and the heat of the heat-conducting substrate exchanges heat with the heat exchange module. Under the action of the airflow, cold air blows toward the heat exchange module, and the airflow is divided into at least two flow paths in different directions to exchange heat with the heat exchange module.

[0025] From the above description, it can be seen that in the radiator provided in this application, the airflow blowing toward the heat exchange module is divided into at least two flow paths in different directions, shortening the flow distance of the airflow in the heat exchange module and thereby reducing heat accumulation. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the technical solutions in the present disclosure or the prior art, the following briefly introduces the drawings required for use in the specific implementation methods or the description of the prior art. Obviously, the drawings described below are only specific implementation methods of the present utility model. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying any creative work.

[0027] Figure 1 A layout diagram of the first power conversion device provided by the present disclosure;

[0028] Figure 2 A layout diagram of the working medium accommodating chamber provided in the present disclosure;

[0029] Figure 3 A front view of the first power conversion device provided by the present disclosure;

[0030] Figure 4 A side view of a first power conversion device provided by the present disclosure;

[0031] Figure 5 for Figure 4 The schematic diagram of the structure of the power conversion device shown is along the AA direction;

[0032] Figure 6 A top view of a first power conversion device provided by the present disclosure;

[0033] Figure 7 6 is a schematic diagram of the structure of the power conversion device along the BB direction;

[0034] Figure 8 A layout diagram of a second power conversion device provided by the present disclosure;

[0035] Figure 9 A front view of a second power conversion device provided by the present disclosure;

[0036] Figure 10 A side view of a second power conversion device provided by the present disclosure;

[0037] Figure 11 for Figure 10 The schematic diagram of the structure of the power conversion device along the CC direction is shown;

[0038] Figure 12 A top view of a second power conversion device provided by the present disclosure;

[0039] Figure 13 for Figure 12 The schematic diagram of the structure of the power conversion device shown along the DD direction;

[0040] Figure 14A layout diagram of a third power conversion device provided by the present disclosure;

[0041] Figure 15 This is a front view of a third power conversion device provided by the present disclosure;

[0042] Figure 16 A top view of a third power conversion device provided by the present disclosure;

[0043] Figure 17 A side view of a third power conversion device provided by the present disclosure;

[0044] Figure 18 for Figure 17 The schematic diagram of the structure of the power conversion device shown is along the EE direction;

[0045] Figure 19 This is a front view of the layout of the fourth power conversion device provided by the present disclosure;

[0046] Figure 20 A side view of the layout of a fourth power conversion device provided by the present disclosure;

[0047] Figure 21 This is a front view of a fourth power conversion device provided by the present disclosure;

[0048] Figure 22 A top view of a fourth power conversion device provided by the present disclosure;

[0049] Figure 23 A side view of a fourth power conversion device provided by the present disclosure;

[0050] Figure 24 for Figure 23 The schematic diagram of the structure of the power conversion device shown in the FF direction;

[0051] Figure 25 A schematic structural diagram of the radiator provided by the present disclosure;

[0052] Figure 26 A schematic diagram of the structure of the evaporator and condenser provided by the present disclosure;

[0053] Figure 27 An axonometric view of the heat dissipation fin provided by the present disclosure;

[0054] Figure 28 A schematic structural diagram of the heat dissipation fin provided by the present disclosure;

[0055] Figure 29 This is a schematic structural diagram of the heat exchange module provided by the present disclosure;

[0056] Figure 30This is a schematic diagram of the first airflow direction provided by the present disclosure;

[0057] Figure 31 A second schematic diagram of air flow provided by the present disclosure;

[0058] Figure 32 This is a schematic diagram of the third airflow direction provided by the present disclosure;

[0059] Figure 33 This is a schematic structural diagram of a fifth power conversion device provided by the present disclosure;

[0060] Figure 34 This is a schematic structural diagram of a sixth power conversion device provided by the present disclosure;

[0061] Figure 35 This is a structural schematic diagram of the seventh power conversion device provided by the present disclosure.

[0062] in Figure 1-35 Middle: 1-chassis, 2-air duct housing, 21-air inlet, 22-air outlet, 3-first heating device, 4-radiator, 41-evaporator, 411-heat-conducting substrate, 4111-working fluid accommodating chamber, 4112-heat-conducting mounting plate, 4113-first spoiler structure, 4114-first wall, 4115-second wall, 4116-first surface, 4117-second surface, 42-heat exchange module, 42A-condenser, 421-heat exchange channel, 422-second spoiler structure, 423-first heat dissipating fins, 424-second heat dissipating fins, 43-first fan accommodating space, 44-air inlet channel, 45-middle channel, 5-fan, 6-power module, 7-PCB board, 8-second heating device. DETAILED DESCRIPTION

[0063] The core of the present invention is to provide a radiator, electrical equipment and photovoltaic system to reduce heat accumulation in the radiator. In order to enable those skilled in the art to better understand the technical solution of the present invention, the present invention is further described in detail below with reference to the accompanying drawings and embodiments.

[0064] For ease of understanding, the present disclosure is described by taking the heat-conducting substrate 411 as an example in which it is arranged in a vertical direction. In actual application, the heat-conducting substrate 411 can also be arranged horizontally, and the specific structure is similar to that of the present disclosure, the only difference being the change in posture. Figure 1As shown, the heat sink 4 provided in a specific embodiment of the present invention includes a heat-conducting substrate 411 and a heat exchange module 42; the heat exchange module 42 is mounted on the first surface of the heat-conducting substrate 411, and the heat-conducting substrate 411 is used to receive heat. The airflow blowing toward the heat exchange module 42 is divided into at least two flow paths in different directions. When heat dissipation is required for the heat-generating components of an electrical device, the heat sink 4 is installed in the electrical device, and the heat-conducting substrate 411 exchanges heat with the components in the chassis 1, and the heat of the heat-conducting substrate 411 is heat-exchanged with the heat exchange module 42.

[0065] Under the action of the airflow, the cold air blows toward the heat exchange module 42 , and the airflow is divided into at least two flow paths in different directions to exchange with the heat exchange module 42 .

[0066] In the radiator 4 provided in the specific embodiment of the present application, by dividing the airflow blowing toward the heat exchange module 42 into at least two flow paths in different directions, the flow distance of the airflow in the heat exchange module 42 is shortened, thereby reducing heat accumulation.

[0067] At the same time, the airflow blowing toward the heat exchange module 42 is divided into at least two flow paths in different directions, shortening the flow distance of the airflow in the heat exchange module 42, thereby reducing the temperature of the airflow exchanging heat with the heat exchange module 42, thereby improving the heat dissipation efficiency of the radiator 4.

[0068] In a specific embodiment, the heat exchange module 42 includes heat dissipation fins arranged in sequence, with airflow passing between two adjacent heat dissipation fins, and one end of the heat dissipation fin is connected to the heat conductive substrate 411. The heat dissipation fins may be solid structures.

[0069] exist Figures 1 to 24 In the illustrated implementation, to further improve heat dissipation efficiency, in one embodiment, a heat-conducting substrate 411 has an inner cavity filled with a phase-change working fluid to form an evaporator 41. A heat exchange module 42 functions as a condenser 42A connected to the evaporator 41. The evaporator 41 is used to support the power module 6 and absorb heat from the power module 6. Specifically, the phase-change working fluid becomes a gas when heated and a liquid when cooled.

[0070] It should be noted that the evaporator 41 is usually rectangular and has a plate-like structure of a certain thickness. Of course, it can also be a circular or other shaped plate-like structure. Figure 10 As shown, the outer surface of the evaporator 41 has two relatively large surfaces (a first surface 4116 and a second surface 4117) disposed in opposite directions. The first surface 4116 is used to mount the power module 6, and the second surface 4117 is used to mount the condenser 42A. Specifically, the first surface 4116 is mounted on a heat-conducting mounting plate 4112 that has a heat-conducting function.

[0071] When setting specific settings, such as Figure 26As shown, the condenser 42A can also be connected to the evaporator 41 through the intermediate channel 45, or the end of the condenser 42A can be directly connected to the evaporator 41 and connected. In this case, the condenser 42A and the evaporator 41 can be arranged with an interval up and down along the horizontal projection. In this case, the condenser 42A and the evaporator 41 are connected through a pipe. Heat is dissipated by thermal siphoning. Specifically, during heat exchange, the liquid phase change medium in the evaporator 41 absorbs heat and turns into gaseous state and evaporates to the position of the condenser 42A. The gaseous phase change medium exchanges heat with the cooler air flow flowing through the periphery of the condenser 42A. The condensed phase change medium turns into liquid and flows back to the evaporator 41 under the action of its own gravity, completing the heat exchange operation.

[0072] In a specific embodiment, the horizontal projections of the condenser 42A and the evaporator 41 partially overlap. In this case, the condenser 42A and the evaporator 41 are directly connected and communicated with each other.

[0073] This disclosure is described by taking the evaporator 41 arranged in a vertical direction as an example. Figure 1 As shown, the power modules 6 may be distributed along the vertical direction on the first surface 4116. Alternatively, the power modules 6 may be distributed in an array on the first surface 4116.

[0074] like Figure 2 As shown, the evaporator 41 can be arranged horizontally, that is, the first surface 4116 and the second surface 4117 of the evaporator 41 extend horizontally. In this case, the condenser 42A is located directly above the evaporator 41, so that the vaporized gas phase change working medium can flow fully to the condenser 42A for heat exchange. In actual use, the radiator 4 can be installed on the top of the chassis 1.

[0075] like Figure 4 As shown, the evaporator 41 can be arranged in a vertical direction, that is, the first surface 4116 and the second surface 4117 of the evaporator 41 extend in the vertical direction, wherein the vertical direction and the horizontal direction are arranged perpendicularly. In this case, the condenser 42A is located to the left of the evaporator 41. With this arrangement, the radiator 4 can be directly installed on the back of the chassis 1, reducing the overall height of the power conversion device after the radiator 4 is installed. Considering that the power module 6 is usually installed on the back of the chassis 1, the radiator 4 is directly installed inside the chassis 1. Specifically, the first surface 4116 of the evaporator 41 serves as the back panel of the chassis 1, and the power module 6 is directly installed on the first surface 4116, further improving the heat dissipation efficiency.

[0076] Of course, in practical applications, such as Figure 25As shown, the evaporator 41 can also be tilted at a certain angle from the vertical direction. For example, the first surface 4116 and the second surface 4117 of the evaporator 41 are arranged at acute angles with the horizontal direction and the vertical direction. This arrangement can adapt to special installation environments and improve the versatility of the radiator 4.

[0077] Taking into account the rising of hot air, in order to facilitate the gaseous phase change working medium after evaporation to fully flow to the condenser 42A for heat exchange, preferably, along the height direction, the top of the condenser 42A is higher than the top of the evaporator 41, wherein the height direction is the direction perpendicular to the horizontal plane.

[0078] like Figure 5 、 Figure 11 、 Figure 18 and Figure 24 As shown, the inner cavity of the evaporator 41 is provided with spaced-apart first flow-disrupting structures 4113. Specifically, the ends of the first flow-disrupting structures 4113 may be connected to the first surface 4116 or the second surface 4117, or the opposite ends of the first flow-disrupting structures 4113 may be connected to the first surface 4116 and the second surface 4117, respectively. The provision of the first flow-disrupting structures 4113 allows the liquid phase-change medium flowing through these locations to fully exchange heat with the corresponding locations. Furthermore, the first flow-disrupting structures 4113 may be heat-conducting members, for example, metal members, to achieve a heat transfer effect.

[0079] The first spoiler structure 4113 may be a columnar structure, such as a cylindrical or rectangular parallelepiped structure, etc. Two opposite ends of the columnar structure are connected to the first surface 4116 and the second surface 4117 respectively.

[0080] The first spoiler structures 4113 are preferably metal. Specifically, the first spoiler structures 4113 can be arranged in an array. The cross-sectional dimensions of the first spoiler structures 4113 perpendicular to the line connecting the first surface 4116 and the second surface 4117 can be the same or different. The first spoiler structures 4113 serve to separate the flow channels while also enhancing heat exchange and supporting the pressure resistance of the evaporator 41.

[0081] like Figure 5 、 Figure 11 、 Figure 18 and Figure 24As shown, in a specific embodiment, the wall of the evaporator 41 close to the heating area in the chassis 1 is a heat exchange wall, and the inner wall of the heat exchange wall includes a first wall 4114 and a second wall 4115 facing the heating area in the chassis 1. The second wall 4155 is facing the area on the chassis 1 other than the heating area. In actual applications, the heating area in the chassis 1 is usually installed with devices that generate relatively high heat or have relatively high heat dissipation requirements, such as IGBTs, MOS tubes and the like; the area in the chassis 1 corresponding to the second wall 4155 is usually installed with devices that generate relatively low heat, or no devices are installed. The first wall 4114 refers to the wall on the heat exchange wall that is projected along the direction of the evaporator 41 extending toward the chassis 1 and coincides with the projection of the heating area. The second wall 4115 refers to the wall on the heat exchange wall that is projected along the direction of the evaporator 41 extending toward the chassis 1 and coincides with the projection of the non-heating area.

[0082] To improve heat dissipation efficiency, the first density of the first spoiler structures 4113 disposed on the first wall surface 4114 is preferably greater than the second density of the first spoiler structures 4113 disposed on the second wall surface 4115. Specifically, the first density is the area of ​​the projection of the first spoiler structures 4113 on the first wall surface 4114 divided by the total area of ​​the first wall surface 4114. The second density is the area of ​​the projection of the first spoiler structures 4113 on the second wall surface 4115 divided by the total area of ​​the second wall surface 4115. Specifically, the first density can be twice or more the second density.

[0083] The inner cavity of the evaporator 41 is divided into at least two working medium accommodating chambers 4111, and each working medium accommodating chamber 4111 is filled with a phase change working medium. Figure 2 As shown, in a specific embodiment, the working medium containing chambers 4111 provided in the evaporator 41 are arranged in a horizontal direction.

[0084] like Figure 13 As shown, in another specific embodiment, the working medium accommodating chambers 4111 provided within the evaporator 41 are arranged along a vertical direction perpendicular to the horizontal direction. The working medium accommodating chambers 4111 can also be arranged in an array on a vertical plane. In this case, the working medium accommodating chambers 4111 are preferably arranged in multiple rows. Preferably, by providing multiple working medium accommodating chambers 4111, the phase change working medium within the evaporator 41 is prevented from being concentrated in a single location, thereby improving heat dissipation uniformity.

[0085] At least one condenser 42A is connected to one or more working fluid accommodating chambers 4111, or at least one working fluid accommodating chamber 4111 is connected to one or more condensers 42A. For example, one condenser 42A can be connected to one working fluid accommodating chamber 4111 in a one-to-one correspondence. Multiple working fluid accommodating chambers 4111 can be arranged vertically, or horizontally, or multiple working fluid accommodating chambers 4111 can be arranged in an array in the vertical and horizontal directions. The extension direction and size of some working fluid accommodating chambers can be the same as or different from those of other working fluid accommodating chambers. To reduce processing difficulty, the overall shape of the working fluid accommodating chamber 4111 is a rectangular parallelepiped. Of course, to improve the temperature uniformity, two or more working fluid accommodating chambers 4111 can be connected to one condenser 42A at the same time; to improve the heat dissipation effect, one working fluid accommodating chamber 4111 can be connected to two or more condensers 42A at the same time.

[0086] In one embodiment, condenser 42A includes a plurality of first heat dissipating fins 423 arranged at intervals. Preferably, adjacent first heat dissipating fins 423 are evenly spaced. One end of each first heat dissipating fin 423 is connected to thermally conductive substrate 411 and extends a certain height away from thermally conductive substrate 411. The first heat dissipating fins 423 are solid or hollow fins. The provision of first heat dissipating fins 423 further enhances heat dissipation.

[0087] like Figure 2 and Figure 15 As shown, in one specific embodiment, the first heat dissipating fin 423 has an end facing away from the heat-conducting substrate 411 and bent toward the end facing the heat-conducting substrate 411. The first heat dissipating fin 423 may also have a straight plate structure. In a direction perpendicular to the arrangement of the first heat dissipating fins 423, the length of the curved first heat dissipating fin 423 is reduced compared to the straight first heat dissipating fin 423.

[0088] like Figure 3 As shown, in a specific embodiment, the condenser 42A includes a heat exchange channel 421 and a second heat dissipation fin 424. The heat exchange channel 421 has a height in the direction away from the evaporator 41 and has a hollow inner cavity. The second heat dissipation fin 424 is arranged between two adjacent heat exchange channels 421, and the second heat dissipation fin 424 is connected to the outer wall of the heat exchange channel 421. One end of the heat exchange channel 421 is connected to the heat conductive substrate 411, and the inner cavity of the heat exchange channel 421 is directly connected to the inner cavity of the heat conductive substrate 411, and the two are arranged in one body. Alternatively, as Figure 26As shown, the inner cavity of heat exchange channel 421 is connected to the inner cavity of heat conductive substrate 411 via intermediate channel 45. In this case, heat exchange channel 421 is provided separately from heat conductive substrate 411. During use, the vaporized phase-change working fluid can enter heat exchange channel 421. Because the second heat dissipation fins 424 are connected to the outer wall of heat exchange channel 421, the heat generated by the liquefaction of the phase-change working fluid in heat exchange channel 421 can be transferred to the second heat dissipation fins 424 and then dissipated into the airflow, further improving the heat dissipation effect.

[0089] In a specific embodiment, Figure 27 and Figure 28 As shown, the heat exchange channel 421 has a columnar inner cavity, and the outer wall of the heat exchange channel 421 is provided with second heat dissipation fins 424 .

[0090] In a specific embodiment, Figure 29 As shown, heat exchange channel 421 has a plate-shaped inner cavity. Specifically, heat exchange channel 421 can be a cavity with a uniform thickness. In a specific configuration, second heat dissipating fins 424 are spaced apart from heat exchange channel 421. Alternatively, second heat dissipating fins 424 can be connected to the outer wall of heat exchange channel 421. To improve assembly efficiency, second heat dissipating fins 424 and heat exchange channel 421 are integrally formed.

[0091] like Figure 27 and Figure 28 As shown, in one embodiment, the inner cavity of the heat exchange channel 421 is provided with second flow-disrupting structures 422 arranged at intervals, and the second flow-disrupting structures 422 are connected to the inner wall of the heat exchange channel 421. Specifically, the second flow-disrupting structures 422 are arranged in a columnar shape. In the specific arrangement, the two ends of the second flow-disrupting structures 422 are connected to two opposite surfaces of the heat exchange channel 421 in the thickness direction.

[0092] The second spoiler structure 422 is preferably a metal part. The second spoiler structure 422 can be arranged in an array. The second spoiler structure 422 not only separates the flow channel, but also strengthens the heat exchange and supports the pressure resistance of the heat exchange channel 421.

[0093] like Figure 10 As shown, in one specific embodiment, one end of the condenser 42A, away from the evaporator 41, is recessed toward the evaporator 41 to form a first fan accommodating space 43 for accommodating the fan 5. The number of first fan accommodating spaces 43 is the same as the number of fans 5, and they correspond one to one during installation. Alternatively, all fans 5 can be installed in the same first fan accommodating space 43. During assembly, the fan 5 can be installed in the first fan accommodating space 43. After overall assembly, the size of the radiator 4 along the direction from the condenser 42A to the evaporator 41 is reduced, making the overall layout more compact. Of course, the first fan accommodating space 43 can be formed by the recessed end surfaces of two or at least three condensers 42A arranged in an annular pattern.

[0094] like Figure 4 As shown, in another specific embodiment, the end surfaces of all condensers 42A away from the evaporator 41 are arranged flush. Such an arrangement facilitates the cold air to enter all condensers 42A more evenly.

[0095] like Figure 7 As shown, in one embodiment, condenser 42A has an air inlet channel 44. The inlet of air inlet channel 44 is used to receive airflow directed toward heat exchange module 42; the outlet of air inlet channel 44 is located near heat-conducting substrate 411. Specifically, fan 5 can be installed in air inlet channel 44, or upstream of air inlet channel 44 along the airflow direction. If multiple fans 5 are provided, they can be arranged horizontally in sequence within air inlet channel 44.

[0096] In a specific configuration, the air inlet channel 44 communicates with the gaps between adjacent first heat dissipation fins 423 in the condenser 42A, or communicates with the gaps between adjacent first heat dissipation fins 423. When the radiator 4 is in operation, cold air enters the condenser 42A and / or the gaps between the first heat dissipation fins 423 through the air inlet channel 44. The provision of the air inlet channel 44 improves the uniformity of air entering the condenser 42A and / or the gaps between the first heat dissipation fins 423.

[0097] In one embodiment, at least two condensers 42A are mounted on the same evaporator 41. Adjacent condensers 42A are spaced apart to form an air inlet channel 44. The airflow paths within the two condensers 42A are divided into different directions by the air inlet channel 44. For example, the condensers 42A on opposite sides of the air inlet channel 44 are arranged horizontally or vertically.

[0098] like Figure 1 、 Figure 8 、 Figure 14 and Figure 19 As shown, in a specific embodiment, the radiator 4 further includes an air duct housing 2, which is covered on the outside of the heat exchange module 42 so as to form an air duct at the location of the heat exchange module 42. Figures 30 to 32 As shown, the air duct housing 2 is provided with an air inlet 21 and an air outlet 22. Both the air inlet 21 and the air outlet 22 can be provided with at least two. Alternatively, one air inlet 21 can be provided and at least two air outlets 22 can be provided, with the at least two air outlets 22 being located on opposite sides of the air duct housing 2 facing away from each other. For example, the two air outlets 22 can be arranged vertically at opposite ends of the air duct housing 2, or the two air outlets 22 can be arranged horizontally at opposite ends of the air duct housing 2.

[0099] In a specific embodiment, in order to improve the heat dissipation effect, the number of air outlets 22 can be the same as the number of heat exchange modules 42, and each heat exchange module 42 corresponds to an air outlet 22, and the air flow in each heat exchange module 42 is discharged through the air outlet 22 at the corresponding position after heat exchange. Specifically, the air outlet 22 is preferably arranged on the wall adjacent to the air duct housing 2 and the chassis 1. The air inlet 21 is located on the wall of the air duct housing 2 facing the back of the chassis 1. At the same time, since the back air intake is the same as the air intake method of the existing chassis 1, there are fewer changes for subsequent product applications, and the overall layout is relatively compact. The shape and size of the air outlet 22 are determined according to actual needs. The positions of the air outlet 22 and the air inlet 21 are both formed by a plurality of hole structures arranged in an array, thereby preventing impurities from entering the air duct housing 2 through the air inlet 21 and the air outlet 22.

[0100] When it is necessary to dissipate heat for the heating components of the power conversion equipment, the radiator 4 is installed on the back of the chassis 1, where the back of the chassis 1 is the side away from the operator's operating end. Under the action of the fan 5, air enters from the back of the chassis 1, and the cold air enters the radiator 4. After exchange, it is discharged through two relatively arranged air outlets 22.

[0101] A power conversion device provided in the present application includes a chassis 1, a fan 5, a power module 6 and a radiator installed on the back outer wall of the chassis 1; the radiator is any one of the above-mentioned radiators 4. The specific structure of the radiator 4 is described above. The present application includes the above-mentioned radiator 4 and also has the above-mentioned technical effects.

[0102] like Figure 1 As shown, in the horizontal direction, the heat sink 4, the thermal conductive substrate 411, and the power module 6 are arranged in sequence from left to right. The heat sink 4 and the power module 6 are arranged on the two outer sides of the thermal conductive substrate 411. Of course, the heat sink 4 and the power module 6 can be arranged on the same outer side of the thermal conductive substrate 411. The installation position and number of the power modules 6 are determined according to actual needs. The side wall of the chassis 1 has an opening, and the thermal conductive substrate 411 is embedded in the opening of the side wall, which serves as a part of the chassis; or the thermal conductive substrate 411 is attached to the outer surface of the side wall of the chassis 1. Furthermore, the opening of the side wall of the chassis 1 is used for the power module 6 arranged on the thermal conductive substrate 411 to pass through the opening and extend into the interior of the chassis to protect the power module 6. In addition, the thermal conductive substrate 411 can be located as a whole inside the chassis 1, and a hole can be opened in the chassis 1 to allow the heat sink 4 to extend outside the chassis 1. In actual applications, when the thermal conductive substrate 411 is the evaporator 41 , the positional relationship and connection relationship of the radiator 4 , the power module 6 , the chassis 1 and the evaporator 41 can be the same as described above, the only difference being that the thermal conductive substrate 411 is replaced by the evaporator 41 .

[0103] Along the direction of the airflow, the fan 5 blows the airflow toward the heat exchange module 42, that is, along the direction of the airflow, the fan 5 is located upstream of the heat exchange module 42, and then the airflow is branched and blown upward and downward to the radiators 4 arranged above and below. Of course, if two or more radiators 4 are arranged horizontally on the left and right sides of the fan 5, the airflow is branched and blown left and right to the radiators 4 arranged on the left and right. Among them, the chassis 1 serves as the outer shell of the electrical equipment, which plays a role in protecting the internal components of the chassis 1, and at the same time carries the installation of internal / external components of certain electrical equipment and the installation of the entire machine. Specifically, the power conversion equipment can be an inverter, a wind power converter, an energy storage converter, etc.

[0104] like Figure 35 As shown, the evaporator 41 can be located inside the chassis 1, and the condenser 42A is set through the chassis or the two are connected through the intermediate channel 45. In this case, the evaporator 41 can absorb the heat in the air inside the chassis 1. During the specific assembly, heating devices such as capacitors, resistors or reactors can be set on the evaporator 41. Specifically, one or at least two fans 5 can be set. In order to improve the heat exchange efficiency, it is preferred that at least two fans 5 are set. Figure 19 As shown, preferably, all fans 5 are arranged in sequence perpendicular to the airflow direction.

[0105] like Figure 1 、 Figure 8 、 Figure 14 and Figure 19 As shown, in a specific embodiment, the power conversion device also includes a first heating device 3, and the airflow passes through the fan 5, the heat exchange module 42, and the first heating device 3 in sequence. As shown in the above figure, the first heating device 3 is arranged outside the chassis 1, but is located inside the air duct housing 2. At this time, the first heating device 3 exchanges heat with the airflow passing through the heat exchange module 42. The first heating device 3 is arranged outside the chassis 1, and the first heating device 3 does not occupy the internal space of the chassis 1, which is convenient for the internal structure layout of the chassis 1. At the same time, the first heating device 3 can be protected by the air duct housing 2. Specifically, the first heating device 3 can be a device with low heat dissipation requirements or heat-resistant components such as a reactor to avoid wasting space downstream of the heat exchange module 42. While ensuring the heat dissipation requirements, the overall structure of the power conversion device is compact.

[0106] like Figure 33 As shown, the first heating device 3 can be set outside the chassis 1 and at the same time outside the air duct shell 2. At this time, the first heating device 3 dissipates heat through external gas. The layout of the first heating device 3 is not affected by the internal structure of the chassis 1 and the air duct shell 2, and the layout position of the first heating device 3 is more flexible.

[0107] like Figure 34As shown, the first heating device 3 can be set in the chassis 1. At this time, the first heating device 3 is located outside the air duct housing 2. At this time, the first heating device 3 is protected by the chassis 1 and dissipated by the radiator 4.

[0108] In a specific embodiment, the power conversion device further includes a PCB board 7, which is located in the inner cavity of the chassis 1 and is isolated from the wall of the chassis 1. Specifically, a second heating device 8 is provided on the PCB board 7 as needed. Alternatively, other non-heating devices can also be installed on the PCB board 7. Specifically, when the two air outlets 22 are provided on the left and right sides, the first heaters are arranged on the left and right sides of the thermosiphon heat exchanger, and a plurality of first heaters are provided on each side, the first heaters on the same side of the thermosiphon heat exchanger are arranged in an array, specifically, the first heaters are arranged in a row from top to bottom.

[0109] In this specification, each specific embodiment is described in a progressive manner, and each specific embodiment focuses on the differences from other specific embodiments. The same and similar parts between the various specific embodiments can be referred to each other. The above description of the disclosed specific embodiments enables professionals and technicians in this field to implement or use the utility model. Various modifications to these specific embodiments will be obvious to professionals and technicians in this field. The general principles defined herein can be implemented in other specific embodiments without departing from the spirit or scope of the utility model. Therefore, the utility model will not be limited to these specific embodiments shown herein, but will conform to the widest range consistent with the principles and novel features disclosed herein.

Claims

1. A radiator, characterized in that: It includes a heat-conducting substrate (411) and a heat exchange module (42); The heat exchange module (42) is mounted on a first surface of the heat-conducting substrate (411), and the heat-conducting substrate (411) is used to receive heat; The airflow blowing toward the heat exchange module (42) is divided into at least two flow paths in different directions.

2. The radiator according to claim 1, characterized in that The heat-conducting substrate (411) has an inner cavity filled with a phase-change working medium to form an evaporator (41); the heat exchange module (42) is connected to the evaporator (41) as a condenser (42A); and the evaporator (41) is used to carry the power module (6) and absorb heat from the power module (6); In the height direction, the top of the condenser (42A) is higher than the top of the evaporator (41); and the projections of the condenser (42A) and the evaporator (41) in the horizontal direction overlap or are spaced apart.

3. The radiator according to claim 2, characterized in that The inner cavity of the evaporator (41) is provided with first flow-turbulating structures (4113) arranged at intervals; The wall of the evaporator (41) close to the heating area in the chassis (1) is a heat exchange wall, and the inner wall of the heat exchange wall includes a first wall (4114) directly opposite to the heating area in the chassis (1) and a second wall (4115) directly opposite to the non-heating area in the chassis (1); the first density of the first spoiler structure (4113) arranged at the position of the first wall (4114) is greater than the second density of the first spoiler structure (4113) arranged at the position of the second wall (4115), the first density being the area occupied by the first spoiler structure (4113) on the first wall (4114) divided by the total area of ​​the first wall (4114), and the second density being the area occupied by the first spoiler structure (4113) on the second wall (4115) divided by the total area of ​​the second wall (4115).

4. The radiator according to claim 2, characterized in that The inner cavity of the evaporator (41) is divided into at least two working medium accommodating chambers (4111), and each of the working medium accommodating chambers (4111) is filled with the phase-change working medium; At least one of the condensers (42A) is in communication with one or more working medium accommodating chambers (4111), or at least one working medium accommodating chamber (4111) is in communication with one or more of the condensers (42A).

5. The radiator according to claim 4, characterized in that: The working medium accommodating chamber (4111) provided in the evaporator (41) is arranged in a horizontal direction; Or the working medium accommodating chamber (4111) provided in the evaporator (41) is arranged in a vertical direction perpendicular to the horizontal direction.

6. The radiator according to claim 2, characterized in that The condenser (42A) comprises a plurality of first heat dissipation fins (423) arranged at intervals, one end of the first heat dissipation fin (423) is connected to the heat-conducting substrate (411), and has a certain height in a direction away from the heat-conducting substrate (411), and the first heat dissipation fin (423) is a solid fin or a hollow fin.

7. The radiator according to claim 6, characterized in that: One end of the first heat dissipation fin (423) facing away from the heat-conducting substrate (411) is bent toward one end of the heat-conducting substrate (411).

8. The radiator according to claim 2, characterized in that The condenser (42A) comprises a heat exchange channel (421) and a second heat dissipation fin (424); the heat exchange channel (421) has a height in a direction away from the evaporator (41); the second heat dissipation fin (424) is connected to the outer wall of the heat exchange channel (421); One end of the heat exchange channel (421) is connected to the heat conductive substrate (411), and the inner cavity of the heat exchange channel (421) is communicated with the inner cavity of the heat conductive substrate (411); or the inner cavity of the heat exchange channel (421) is communicated with the inner cavity of the heat conductive substrate (411) through an intermediate channel (45).

9. The radiator according to claim 8, characterized in that: The heat exchange channel (421) has a plate-shaped inner cavity, and the second heat dissipation fins (424) and the heat exchange channel (421) are arranged at intervals or the second heat dissipation fins (424) are connected to the outer wall of the heat exchange channel (421); Alternatively, the heat exchange channel (421) has a columnar inner cavity, and the second heat dissipation fins (424) are provided through the outer wall of the heat exchange channel (421).

10. The radiator according to claim 8, characterized in that The inner cavity of the heat exchange channel (421) is provided with second flow-disturbing structures (422) arranged at intervals, and the second flow-disturbing structures (422) are connected to the inner wall of the heat exchange channel (421).

11. The radiator according to claim 2, characterized in that One end of the condenser (42A) away from the evaporator (41) is concave toward the evaporator (41) to form a first fan accommodating space (43) for accommodating a fan (5).

12. The radiator according to any one of claims 6 to 10, characterized in that: The condenser (42A) has an air inlet channel (44); The inlet of the air inlet channel (44) is used for the air flow to enter and blow toward the heat exchange module (42); the outlet of the air inlet channel (44) is arranged close to the heat conductive substrate (411); The air inlet channel (44) is communicated with the gaps between adjacent first heat dissipation fins (423) in the condenser (42A), or the gaps between adjacent first heat dissipation fins (423) are communicated with.

13. The radiator according to any one of claims 2 to 11, characterized in that: It also includes an air duct housing (2), which is arranged to cover the outside of the heat exchange module (42); the air duct housing (2) is provided with an air inlet (21) and an air outlet (22).

14. The heat sink according to claim 13, characterized in that At least two air outlets (22) are provided, and the at least two air outlets (22) are respectively located on two opposite sides of the air duct housing (2) facing away from each other.

15. A power conversion device, characterized in that: The invention comprises a chassis (1), a fan (5), a power module (6), and a radiator mounted on the back outer wall of the chassis (1); the power module (6) is supported by a heat-conducting substrate (411) of the radiator; the radiator is a radiator (4) according to any one of claims 1 to 14; and the fan (5) blows the airflow toward the heat exchange module (42) along the airflow direction.

16. The power conversion device according to claim 15, characterized in that: It also includes a first heating device (3), and the airflow passes through the fan (5), the heat exchange module (42), and the first heating device (3) in sequence.

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