High-temperature-resistant optical packaging film

Abstract

The utility model belongs to the technical field of panel display, and particularly relates to a high-temperature-resistant optical packaging film which comprises a protective layer and an optical PET base film which are sequentially arranged from top to bottom, a packaging adhesive layer is further arranged on the side face, away from the protective layer, of the optical PET base film, and the packaging adhesive layer is used for being bonded with an external LED chip. And the packaging adhesive layer is made of high-temperature-resistant optical adhesive. The high-temperature-resistant anti-aging plastic has the effects of high temperature resistance and aging resistance.

Description

Technical Field

[0001] The utility model relates to the technical field of flat panel displays, in particular to a high-temperature resistant optical packaging film. Background Art

[0002] LED (semiconductor light-emitting diode) packaging refers to the packaging of light-emitting chips, which is quite different from integrated circuit packaging. LED packaging not only needs to protect the wick but also allow light to pass through, so LED packaging has special requirements for packaging materials.

[0003] In the related technology, mini-LED display devices, LED lighting fixtures, and LED light-emitting chips are packaged through optical packaging films. The existing technology is mainly divided into two categories. One is to use liquid glue for packaging and then adhere an optical film to provide mechanical strength. The production process is long and the pass rate is low. The other is to use adhesives such as epoxy resin and acrylic resin, which cannot meet the technical requirements for packaging electronic products such as LEDs, that is, they cannot meet the characteristics of high temperature resistance and aging resistance.

[0004] Therefore, the existing technology needs to be improved. Utility Model Content

[0005] In order to make up for the deficiencies of the existing technology, the present application proposes a high-temperature resistant optical packaging film.

[0006] The utility model solves the technical problem by adopting the following technical solutions:

[0007] A high-temperature resistant optical packaging film includes a protective layer and an optical PET base film arranged in sequence from top to bottom. The optical PET base film is also provided with a packaging adhesive layer on the side away from the protective layer. The packaging adhesive layer is used to bond with an external LED chip. The packaging adhesive layer is made of high-temperature resistant optical adhesive.

[0008] Preferably, the packaging adhesive layer is made of silicone resin.

[0009] Preferably, the thickness of the encapsulation adhesive layer is 100-200 microns.

[0010] Preferably, the protective layer is colorless and transparent.

[0011] Preferably, the thickness of the protective layer is less than 10 microns.

[0012] Preferably, it further comprises a release protective layer, wherein the release protective layer is provided with two layers, and the two release protective layers are detachably provided on the sides of the protective layer and the packaging adhesive layer that are away from each other.

[0013] In summary, this application includes at least one of the following beneficial technical effects:

[0014] 1. The high-temperature resistant optical packaging film of the present invention has an encapsulation adhesive layer connected to the optical PET base film. Since the encapsulation adhesive layer is made of organic silicone resin, the encapsulation adhesive layer has high-temperature resistance and anti-aging properties. Therefore, when the encapsulation film is installed on the LED chip, the LED electronic product achieves high-temperature resistance and anti-aging properties in the packaging.

[0015] 2. The setting of the protective layer can prevent the contamination of the optical PET base film by fingerprints, dust, etc., and can also prevent scratches. The protective layer is set to be colorless and transparent, which can provide a matte anti-glare effect;

[0016] 3. Due to the setting of the release protective layer, the optical packaging film can be temporarily protected when it leaves the factory. When in use, you only need to remove the release protective layer from the packaging film to avoid affecting the protective layer and the packaging adhesive layer when not in use. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0018] Figure 1 Schematic diagram of the optical packaging film in an embodiment of the present application.

[0019] Explanation of the accompanying symbols: 1. Optical PET base film; 2. Protective layer; 3. Encapsulation adhesive layer; 4. Release protective layer. DETAILED DESCRIPTION

[0020] The following will be combined with the accompanying drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0021] The embodiments of the present application disclose a high-temperature resistant optical packaging film.

[0022] Reference Figure 1A high-temperature resistant optical packaging film includes a protective layer 2 and an optical PET base film 1. The protective layer 2 and the optical PET base film 1 are distributed in a layer structure from top to bottom. The optical PET base film 1 is the bearing body of the packaging film and has good transmittance in the visible light range. The thickness of the optical PET base film 1 is between 10-75 microns. The protective layer 2 is made of acrylic polyurethane and silicone coating so that the protective layer 2 can prevent fingerprints, dust, etc. from contaminating the optical PET base film 1. At the same time, the protective layer 2 can provide mechanical scratch protection for the optical PET base film 1. In this embodiment, the protective layer 2 is applied once on one side surface of the cured optical PET base film 1 to achieve protection for the optical PET base film 1. A packaging adhesive layer 3 is provided on one side away from the protective layer 2. The packaging adhesive layer 3 is made of high-temperature resistant optical adhesive. The packaging adhesive layer 3 has a certain viscosity, one side of which is bonded to the external LED chip, and the other side is bonded to the optical PET base film 1 to achieve bonding between the optical PET base film 1 and the external LED chip. In this embodiment, the packaging adhesive layer 3 is made of silicone resin, and the thickness of the packaging adhesive layer 3 is between 100-200 microns. The silicone resin has the characteristics of high temperature resistance, high transparency, low shrinkage stress, high purity, etc., and also has excellent anti-aging properties, which can provide good performance for the encapsulated LED products. Therefore, when the packaging film is installed on the LED chip, the LED electronic product achieves high temperature resistance and anti-aging properties in the packaging.

[0023] Reference Figure 1 In this embodiment, the protective layer 2 is colorless and transparent, so the protective layer 2 has a certain matte degree to prevent glare from occurring on the packaging film, and the thickness of the protective layer 2 is less than 10 microns.

[0024] In this embodiment, the optical PET base film 1 can be dyed to provide a specific absorption coefficient for specific visible light wavelengths (including a combination of multiple wavelengths). For example, when the optical packaging film is used on a display module, the optical PET base film 1 needs to be dyed black, and when the optical packaging film is used on a lighting module, the optical PET base film 1 needs to be colorless and transparent.

[0025] In addition, it also includes a release protective layer 4. There are two groups of release protective layers 4. The two groups of release protective layers 4 are respectively arranged on the sides of the protective layer 2 and the encapsulation adhesive layer 3 away from each other, so that the entire optical packaging film is distributed in the order of release protective layer 4-protective layer 2-optical PET base film 1-encapsulation adhesive layer 3-release protective layer 4 from top to bottom. When the optical packaging film leaves the factory, the protective layer 2 and the encapsulation adhesive layer 3 are protected by the release protective layer 4, which plays a temporary protection role. When in use, it is only necessary to tear off the release protective layer 4 from the protective layer 2 and the encapsulation adhesive layer 3 to try to avoid affecting the effect of the optical packaging film during subsequent use.

[0026] The above are all preferred embodiments of the present application, and are not intended to limit the scope of protection of the present application. Therefore, any equivalent changes made based on the structure, shape, and principle of the present application should be included in the scope of protection of the present application.

Claims

1. A high-temperature resistant optical packaging film, comprising a protective layer and an optical PET base film arranged in sequence from top to bottom, characterized in that: The optical PET base film is further provided with an encapsulation adhesive layer on the side away from the protective layer. The encapsulation adhesive layer is used for bonding with the external LED chip, and the encapsulation adhesive layer is made of high-temperature resistant optical adhesive.

2. The high temperature resistant optical packaging film according to claim 1, characterized in that: The material of the packaging adhesive layer is silicone resin.

3. The high temperature resistant optical packaging film according to claim 1, characterized in that: The thickness of the packaging adhesive layer is 100-200 microns.

4. The high temperature resistant optical packaging film according to claim 1, characterized in that: The protective layer is colorless and transparent.

5. The high temperature resistant optical packaging film according to claim 1, characterized in that: The thickness of the protective layer is less than 10 microns.

6. The high temperature resistant optical packaging film according to claim 1, characterized in that: It also includes a release protective layer, which is provided with two layers. The two release protective layers are detachably provided on the sides of the protective layer and the packaging adhesive layer that are away from each other.

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