Sensor aging test circuit, device and system

Abstract

The embodiment of the utility model discloses a sensor aging test circuit, device and system. The sensor aging test circuit comprises an acquisition module used for acquiring data of at least one target sensor; the power supply module is electrically connected with the acquisition module and is used for supplying power to the acquisition module; the switch module is electrically connected with the acquisition module and the upper computer and is used for controlling the on-off of the acquisition module and the upper computer according to the on-off state of the switch module; and the controller is electrically connected with the switch module and is used for receiving a control instruction of the upper computer and controlling the on-off of the switch module according to the control instruction so as to perform a static aging test and / or a dynamic aging test on the target sensor. According to the sensor aging test circuit, device and system provided by the embodiment of the utility model, the test efficiency can be improved.

Description

Technical Field

[0001] The embodiments of the utility model relate to sensor detection technology, and in particular to a sensor aging test circuit, device and system. Background Art

[0002] Sensors such as catalytic combustion gas sensors, which detect combustible gases, are widely used in combustible gas detection applications due to their excellent output signal linearity, reliable index, low price, and resistance to cross-contamination with other non-combustible gases. To stabilize sensor parameters and performance, they require aging testing using a sensor aging test circuit. Currently, existing sensor aging test circuits typically require manual assistance and have a low degree of automation, which affects test efficiency. Utility Model Content

[0003] The embodiments of the present invention provide a sensor aging test circuit, device and system to improve test efficiency.

[0004] In a first aspect, an embodiment of the present invention provides a sensor aging test circuit, comprising:

[0005] an acquisition module, configured to acquire data from a target sensor, where there is at least one target sensor;

[0006] a power supply module, electrically connected to the acquisition module and configured to supply power to the acquisition module;

[0007] A switch module, electrically connected to the acquisition module and the host computer, for controlling the on / off state of the acquisition module and the host computer according to its own on / off state;

[0008] The controller is electrically connected to the switch module and is used to receive control instructions from the host computer and control the on and off of the switch module according to the control instructions to perform a static aging test and / or a dynamic aging test on the target sensor.

[0009] Optionally, there are multiple acquisition modules and multiple switch modules, and the switch modules correspond to the acquisition modules one by one, and the switch modules are electrically connected to the corresponding acquisition modules.

[0010] Optionally, the acquisition module, the power module, the switch module and the controller are integrated on the same circuit board.

[0011] Optionally, there are multiple acquisition modules, and the acquisition modules are distributed in rows and columns on the circuit board.

[0012] Optionally, the sensor aging test circuit further includes a communication module, the controller is electrically connected to the communication module, and the communication module is communicatively connected to the host computer; the controller is configured to communicate with the host computer through the communication module.

[0013] Optionally, the target sensor is a catalytic combustion gas sensor.

[0014] In a second aspect, an embodiment of the present invention provides a sensor aging test device, comprising the sensor aging test circuit as described in the first aspect, and further comprising a box, wherein the acquisition module, the power module, the switch module and the controller are all located in the box.

[0015] Optionally, the sensor aging test device further includes a device bracket, which is used to support the box.

[0016] Optionally, a pulley is provided at the bottom of the device bracket.

[0017] In a third aspect, an embodiment of the present invention provides a sensor aging test system, comprising the sensor aging test device as described in the second aspect, and further comprising a host computer, wherein the host computer is communicatively connected to the controller.

[0018] The sensor aging test circuit, device, and system provided by the embodiments of the present invention include: an acquisition module for acquiring data from a target sensor, wherein the target sensor is at least one; a power supply module electrically connected to the acquisition module for supplying power to the acquisition module; a switch module electrically connected to the acquisition module and a host computer for controlling the connection and disconnection between the acquisition module and the host computer based on its own on / off state; and a controller electrically connected to the switch module for receiving control instructions from the host computer and controlling the on / off of the switch module according to the control instructions to perform static aging testing and / or dynamic aging testing on the target sensor. The sensor aging test circuit, device, and system provided by the embodiments of the present invention achieve data acquisition of the target sensor by controlling the conduction of the switch module through the controller, and perform static aging testing and / or dynamic aging testing on the target sensor based on the acquired data. The test process does not require manual assistance, thereby improving test efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 This is a structural block diagram of a sensor aging test circuit provided by an embodiment of the present utility model;

[0020] Figure 2 This is a structural diagram of a sensor aging test circuit provided by an embodiment of the present utility model;

[0021] Figure 3 This is a structural block diagram of another sensor aging test circuit provided by an embodiment of the present utility model;

[0022] Figure 4 It is a structural schematic diagram of a sensor aging test device provided by an embodiment of the present utility model. DETAILED DESCRIPTION

[0023] The present invention will be further described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are intended only to illustrate the present invention and are not intended to limit the present invention. It should also be noted that, for ease of description, the accompanying drawings only illustrate portions relevant to the present invention, not all of its components.

[0024] Figure 1 This is a structural block diagram of a sensor aging test circuit provided by an embodiment of the present utility model. Figure 2 This is a schematic diagram of the structure of a sensor aging test circuit provided by an embodiment of the present invention. Figure 1 and Figure 2 The sensor aging test circuit includes: an acquisition module 10, a power module 20, a switch module 30 and a controller 40.

[0025] Among them, the acquisition module 10 is used to collect data from the target sensor, and there is at least one target sensor; the power supply module 20 is electrically connected to the acquisition module 10, and is used to power the acquisition module 10; the switch module 30 is electrically connected to the acquisition module 10 and the host computer 100, and is used to control the on and off state of the acquisition module 10 and the host computer 100 according to its own on and off state; the controller 40 is electrically connected to the switch module 30, and the controller 40 is used to receive control instructions from the host computer 100, and control the on and off of the switch module 30 according to the control instructions, so as to perform static aging test and / or dynamic aging test on the target sensor.

[0026] Specifically, the power module 20 is also electrically connected to the controller 40, and the power module 20 supplies power to the acquisition module 10 and the controller 40. When the controller 40 receives a control instruction sent by the host computer 100, the controller 40 controls the switch module 30 to conduct, thereby controlling the acquisition module 10 to communicate with the host computer 100. If there are multiple target sensors, the acquisition module 10 collects data from each target sensor, such as power consumption data, and transmits the collected data to the host computer 100 through the conducting switch module 30. When the sensor aging test circuit performs a static aging test on the target sensor, the acquisition module 10 collects data from the target sensor in real time and continuously collects data for a long time. When the collected data is abnormal, such as exceeding a preset range, it indicates that the target sensor is aged or has a problem. When the sensor aging test circuit performs a dynamic aging test on the target sensor, the acquisition module 10 collects data from the target sensor, such as a catalytic combustion gas sensor (which may be concentration data), in real time and continuously collects data for a long time. When the collected data is abnormal, such as exceeding a preset range, it indicates that the target sensor is aged or has a problem with the accuracy of the target sensor.

[0027] The sensor aging test circuit provided in this embodiment includes: an acquisition module for acquiring data from a target sensor, wherein the target sensor is at least one; a power supply module electrically connected to the acquisition module and configured to supply power to the acquisition module; a switch module electrically connected to the acquisition module and a host computer and configured to control the connection and disconnection between the acquisition module and the host computer based on its own on / off state; and a controller electrically connected to the switch module and configured to receive control instructions from the host computer and control the on / off of the switch module based on the control instructions to perform a static aging test and / or a dynamic aging test on the target sensor. The sensor aging test circuit provided in this embodiment acquires data from the target sensor by controlling the switch module to be turned on by the controller, and performs a static aging test and / or a dynamic aging test on the target sensor based on the acquired data. The test process does not require manual assistance, thereby improving test efficiency.

[0028] Optionally, there are multiple acquisition modules 10 and multiple switch modules 30 , and the switch modules 30 correspond to the acquisition modules 10 one by one, and the switch modules 30 are electrically connected to the corresponding acquisition modules 10 .

[0029] Specifically, when there are multiple target sensors, each acquisition module 10 collects data from different target sensors, such as power consumption. The sensor aging test circuit can collect data from different target sensors at different times. For example, at the start of the test, the data from each target sensor is collected sequentially, and the controller sequentially controls the different switch modules 30 to turn on, thereby controlling the operation of the acquisition modules 10 corresponding to the turned-on switch modules 30. In addition, the acquisition sequence can be pre-set. For example, if data from a certain target sensor needs to be collected first, followed by data from another target sensor, the controller controls the different switch modules 30 to turn on at different times according to the pre-set acquisition sequence, thereby achieving data collection from each target sensor.

[0030] Furthermore, the switch module 30 includes a switch, such as a MOS transistor or an IGBT. The control terminal of the switch is electrically connected to the controller, and the two ends of the switch communicate with the acquisition module and the host computer, respectively. The controller sends a control signal to the control terminal of the switch to control the on and off of the switch, such as a high-level control signal to turn the switch on, and a low-level control signal to turn the switch off. In addition, MOS transistors and IGBTs have their own characteristics. For example, the gate of a MOS transistor consumes almost no current and has a high input impedance. Therefore, MOS transistors have lower requirements for drive signals, i.e., the aforementioned control signals, and can also reduce the impact on the preceding signal source. MOS transistors are majority carrier conductive devices and do not have the storage and recombination delay time of minority carriers. Therefore, they have fast switching speeds, can operate well in high-frequency circuits, and are widely used in applications with high switching speed requirements. The conductive mechanism of MOS transistors is different from that of ordinary transistors, and they generate relatively little heat. They also have a negative temperature coefficient characteristic, that is, when the temperature increases, the channel resistance increases and the current decreases, thereby self-limiting heat generation to a certain extent and having good thermal stability. The manufacturing process of MOS transistors is highly compatible with integrated circuit processes and can be easily integrated into large-scale integrated circuits, which is conducive to the miniaturization and intelligentization of circuits. In the on-state, the on-resistance of a MOS transistor is relatively small, especially in low-voltage, low-current applications. This results in low power consumption, making MOS transistors a significant advantage in circuits with stringent power requirements. The controller controls the gate voltage via a control signal, precisely controlling the on and off states of the MOS transistor and achieving precise control of current and voltage. The MOS transistor's gate voltage has a wide control range, meeting diverse circuit design requirements. Within a certain temperature range, even in the event of an abnormality such as overcurrent, the MOS transistor will not experience secondary breakdown, giving it a significant advantage in reliability.IGBTs can withstand high voltages and large currents, typically operating at voltages ranging from hundreds to thousands of volts, with currents reaching tens of amperes or even higher. This makes them irreplaceable in high-voltage, high-power power electronics applications and enables them to meet stringent control requirements. IGBTs have relatively low on-resistance and minimal power loss in the on-state, which helps improve energy efficiency and reduce energy waste. This is crucial for circuits that require long operating times and applications with high energy efficiency requirements. IGBTs have high input impedance and require low drive power, reducing circuit complexity and cost while improving reliability. As voltage-controlled devices, IGBTs can be easily turned on and off by controlling the gate voltage. They offer fast switching speeds and can operate at high frequencies, meeting circuit requirements for fast response and precise control. They also have strong immunity to electromagnetic interference, temperature fluctuations, and durability, enabling stable operation in harsh operating environments. This makes IGBTs widely used in applications requiring high reliability. IGBTs can be integrated with other components in a circuit, reducing circuit size, improving reliability, and lowering costs.

[0031] It should be noted that the types of switches in the above-mentioned switch module 30 are only for illustrative purposes and can be determined according to actual circuit requirements and are not limited here.

[0032] Optionally, the acquisition module 10, the power module 20, the switch module 30 and the controller 40 are integrated on the same circuit board.

[0033] Specifically, refer to Figure 2 , acquisition module 10, power module 20, switch module 30 ( Figure 2The integrated circuit board (not shown) is integrated with the controller 40 and distributed on the same circuit board. The integrated setting saves space, and integrating various devices on the same circuit board can greatly reduce the overall volume of the circuit. For application scenarios with limited space, the integrated circuit board can realize more functions in a limited space and meet complex application requirements. The integrated circuit board can achieve a more compact layout and reduce the length of the connection between devices, which can not only improve the reliability of the circuit, but also reduce the delay and loss of signal transmission. The compact layout can also facilitate the design and debugging of the circuit, so that the staff can more easily observe and analyze the working status of the circuit, and promptly discover and solve problems. Since the distance between the devices is shortened, the transmission path of the signal on the circuit board is shorter, and the attenuation and interference during the transmission process are also reduced accordingly, which helps to improve the quality and stability of the signal and ensure the normal operation of the circuit. The devices integrated on the same circuit board can dissipate heat through the same heat dissipation device to improve the heat dissipation efficiency. Through reasonable layout and heat dissipation design, the heat generated by the device can be effectively dissipated to prevent overheating from affecting the performance and life of the device. Integrated circuit boards can be mass-produced using automated production equipment, significantly improving production efficiency. Automated production equipment can quickly and accurately complete processes such as soldering and assembly, reducing the errors and uncertainties associated with manual operations. Integrated circuit boards can reduce the number and variety of components, lowering procurement costs. Furthermore, the use of automated production equipment can reduce labor costs and production management costs. Furthermore, integrated designs can reduce the number of layers and size of circuit boards, lowering manufacturing costs. Components integrated on a single circuit board are connected via printed circuits, which are more reliable and stable than traditional wire connections. Printed circuit connections reduce the number of connection points and the incidence of connection failures. For example, in harsh operating environments such as high temperature, high humidity, and vibration, integrated circuit boards can better ensure proper circuit operation and enhance circuit reliability. Integrated circuit boards can improve circuit immunity through rational layout and shielding. Furthermore, integrated designs can reduce electromagnetic radiation within the circuit, minimizing interference with other electronic devices. When a circuit malfunction occurs, integrated circuits facilitate fault detection and location, quickly pinpointing the faulty component and improving repair efficiency. With the development of technology, integrated circuit boards can be upgraded and improved more easily, and functional improvements can be achieved by simply replacing some devices or modules.

[0034] Optionally, there are multiple acquisition modules 10 and power supply modules 20, and the acquisition modules 10 are distributed in rows and columns on the circuit board.

[0035] Specifically, such as Figure 2 As shown, Figure 2The diagram shows twenty-four acquisition modules 10, which are distributed in six rows and four columns on the left side of the circuit board. Every four acquisition modules 10 are powered by a power module 20. There are six power modules that power the twenty-four acquisition modules 10. There is also a power module 20 that powers the controller 40. The power module 20 that powers the controller 40 is electrically connected to the controller 40 and is distributed on the right side of the circuit board. The six power modules 20 that power the acquisition modules 10 are distributed as shown in FIG. Figure 2 As shown, six power modules 20 are located between the rows and columns of the twenty-four acquisition modules 10. Four acquisition modules 10 are distributed around each power module 20. The distance from the center of the power module 20 to the center of the four acquisition modules 10 distributed around it is equal, ensuring power supply reliability.

[0036] Furthermore, the row and column distribution of the acquisition modules 10 can make the layout of the circuit board more neat and standardized, and the spacing between the acquisition modules is relatively uniform to avoid clutter; this distribution method helps to set up more modules in a limited circuit board space. Since the acquisition modules are arranged relatively closely, the area of ​​the circuit board can be minimized, thereby meeting the development needs of miniaturization and lightweight electronic products. The row and column distribution of the acquisition modules is conducive to the uniform dissipation of heat. When the acquisition module is working, the heat generated can be transferred to the surrounding environment more evenly through the heat dissipation channel on the circuit board, so that the heat can be quickly dissipated, avoiding local overheating that affects the performance and reliability of the circuit. The module layout with row and column distribution is suitable for assembly and welding by automated production equipment. Automated production equipment can accurately install each module on the circuit board through a preset program, thereby improving production efficiency and quality. The row and column distribution method makes the debugging of the circuit board more convenient. When the acquisition module needs to be debugged, the acquisition module is debugged in the order of rows and columns to ensure debugging efficiency.

[0037] It should be noted that Figure 2 The number and distribution of acquisition modules and the number and distribution of power modules illustrated in the figure are only for illustrative purposes and can be determined according to actual circuit requirements and are not limited here.

[0038] Figure 3 This is a structural block diagram of another sensor aging test circuit provided by an embodiment of the present invention. Figure 1-Figure 3 Optionally, the sensor aging test circuit further includes a communication module 50 , the controller 40 is electrically connected to the communication module 50 , and the communication module 50 is communicatively connected to the host computer 100 ; the controller 40 is used to communicate with the host computer 100 through the communication module 50 .

[0039] Specifically, the controller 40 sends data to the host computer 100 through the communication module 50, and the host computer 100 transmits data and instructions to the controller 40 through the communication module 50. The communication module 50 can be a wired communication module or a wireless communication module. The wired communication module is electrically connected to the host computer through a connecting line, and the wireless communication module communicates with the host computer through a wireless connection method such as wireless communication of WIFI, 4G, or 5G network. The wired communication module communicates with the host computer via a connecting cable, using a wired communication method. Therefore, it offers stable transmission signals, strong anti-interference capabilities, and the ability to maintain a stable transmission speed. It also produces no radiation, poses no health risks, and is both safe and reliable. Furthermore, wired communication utilizes technical means to provide dedicated network bandwidth, offering high stability for applications requiring large amounts of data transmission. Wired communication does not require broadcasting information across the network; network security can be ensured through hardware control. Wired communication also offers low wiring costs, including hardware devices like routers. Signal transmission strength is unaffected by structures like walls, resulting in no attenuation. Wired communication eliminates concerns about signal interference or eavesdropping, as it utilizes a guided medium, making eavesdropping more difficult. The wireless communication module, on the other hand, provides communication, data collection, and remote management functions. The communication function supports dual-channel data transmission and multi-center data communication; the data collection function collects serial port data; and the remote management function supports remote parameter setting and program upgrades. The wireless communication module features an industrial-grade design suitable for harsh outdoor environments. It features built-in hardware and software watchdogs to prevent freezes and disconnections. It supports transparent data transmission, domain name resolution, and various configuration software and user-developed software systems. The module boasts strong adaptability and scalability. It transmits data wirelessly, eliminating the need for cables and saving manpower and resources. In specialized applications, such as mountainous and forested areas, or where cabling is difficult, the module's wireless transmission method is virtually unaffected by geographical factors, making it highly adaptable. The module can communicate with host computers and other wireless-enabled devices, demonstrating its scalability. Furthermore, the module has a wide range of applications, including small wireless networks, industrial data acquisition systems, small wireless data terminals, and wireless data communications.

[0040] It should be noted that the wired communication module and the wireless communication module have their own characteristics. The specific type of the communication module in this embodiment can be determined according to actual circuit requirements and is not limited here.

[0041] Optionally, the target sensor is a catalytic combustion gas sensor.

[0042] Catalytic combustion gas sensors utilize the thermal effect of catalytic combustion. A detection element and a compensation element are paired to form a measuring bridge. Under certain temperature conditions, combustible gas undergoes flameless combustion on the surface of the detection element carrier and under the action of the catalyst. As the carrier temperature rises, the resistance of the platinum wire resistor inside the catalytic combustion gas sensor also increases accordingly, causing the balanced bridge to lose balance and output an electrical signal proportional to the combustible gas concentration. The concentration of the combustible gas is determined by measuring the change in the platinum wire resistor's resistance.

[0043] Furthermore, catalytic combustion gas sensors are primarily used for the detection of combustible gases, featuring good output signal linearity, reliable exponents, low price, and no cross-contamination with other non-combustible gases. Catalytic combustion gas sensors are constructed by applying two catalytic materials, black and white, to platinum wires, respectively, to create black and white elements. When a mixture of combustible gas and oxygen diffuses onto the black element, it rapidly undergoes flameless combustion and generates reaction heat, increasing the resistance of the platinum wire. The bridge outputs a varying voltage signal that is proportional to the concentration of the combustible gas. The white and black elements are paired, having the same resistance and performance, to offset the effects of factors such as temperature and humidity on the sensor signal. The black element in the catalytic combustion gas sensor has catalytic activity for combustible gases, while the white element, which has no catalytic activity, serves as a reference element. The two components are connected via a Wheatstone bridge. When combustible gas is present, a catalytic combustion exothermic reaction occurs on the surface of the black element, changing the resistance of the black element and, in turn, causing the output signal of the Wheatstone bridge to change. In addition, catalytic combustion gas sensors can quickly detect the leakage of combustible gas and are not affected by high and low temperatures and humidity. They have high reliability and high stability. With the development of micromachining technology, catalytic combustion gas sensors are developing towards miniaturization and low power consumption.

[0044] The sensor aging test circuit provided in this embodiment includes: an acquisition module for acquiring data of a target sensor, wherein the target sensor is at least one; a power supply module electrically connected to the acquisition module for supplying power to the acquisition module; a switch module electrically connected to the acquisition module and a host computer for controlling the on / off state of the acquisition module and the host computer according to its own on / off state; a controller electrically connected to the switch module for receiving a control instruction from the host computer and controlling the on / off of the switch module according to the control instruction to perform a static aging test and / or a dynamic aging test on the target sensor; there are multiple acquisition modules and multiple switch modules, each of which corresponds to the acquisition module one by one, and the switch module is electrically connected to the corresponding acquisition module. The sensor aging test circuit provided in this embodiment controls the switch module to be turned on by the controller to acquire data from the target sensor, and performs a static aging test and / or a dynamic aging test on the target sensor according to the collected data. The test process does not require manual assistance, thereby improving test efficiency. In addition, the system does not require manual operation, thereby solving the problems of tedious work, low accuracy, and low degree of automation caused by manual operation. The system is compatible with static aging test and dynamic parameter test of catalytic combustion gas sensors and can meet the needs of batch static aging / dynamic testing.

[0045] Figure 4 This is a schematic diagram of the structure of a sensor aging test device provided by an embodiment of the present invention. Figure 4The sensor aging test device includes the sensor aging test circuit as described in any embodiment of the present invention, and also includes a box 60, in which the acquisition module, power module, switch module and controller are all located. The sensor aging test device can be a device-level test device or a module-level test device, so as to be compatible with three forms: bare sensor, board-level sensor module and package-level sensor module, and can perform tests of all three forms simultaneously. All components in the sensor aging test circuit are arranged inside the box, so that the box can protect the sensor aging test circuit and effectively protect the circuit from physical damage such as collision and extrusion from the outside. For example, in the event of a heavy object being dropped or moved, the enclosure provides a solid barrier for the circuitry, ensuring its proper operation. It also blocks impurities such as dust, fibers, and metal particles from entering the circuitry. Excessive dust accumulation can cause short circuits, poor heat dissipation, or poor contact, making the enclosure's protective function particularly important in dusty environments. The enclosure prevents moisture from entering, protecting the circuitry from damage, thereby providing reliable waterproof protection, crucial for outdoor applications or humid indoor environments. The enclosure also acts as an insulator, effectively isolating the circuitry from the outside environment and preventing unauthorized access, minimizing the risk of misoperation. The enclosure also provides a degree of electromagnetic shielding, reducing the impact of external electromagnetic interference on the circuitry, preventing performance degradation, data transmission errors, or failures caused by electromagnetic interference. Furthermore, the enclosure is easy to install and arrange in various locations, saving space and improving circuit stability.

[0046] Furthermore, the enclosure can be transparent or opaque, and can be made of metal, alloy, or hard plastic. The enclosure can be made of metal or special electromagnetic shielding materials to effectively block the intrusion of external electromagnetic fields and ensure the normal operation of the circuit. The enclosure can also be made of flame-retardant materials to reduce the risk of fire to a certain extent. Even if a fire occurs, the enclosure can provide a certain degree of isolation. Furthermore, the enclosure can be rectangular or have other suitable configurations, which are not limited here.

[0047] Optionally, the sensor aging test device further includes a device bracket 70 , which is used to support the box 60 .

[0048] Specifically, such as Figure 4As shown, the device bracket 70 is located at the bottom of the box 60 near the edge, and the device bracket can be made of metal or alloy material to ensure sufficient support strength. In addition, the device bracket provides multiple support points for the box, making the box more stable when placed. The device bracket can be set as a height-adjustable bracket, which is convenient for adjusting the height of the box at any time to meet the actual height requirements. A support plate is provided at the bottom of the device bracket, on which test-related items can be placed, saving space and improving space utilization. The device bracket can isolate the box from the ground, preventing the box from direct contact with moisture, dust and dirt on the ground, effectively preventing the box from being contaminated and damaged, keeping the inside of the box clean and hygienic, and conducive to air circulation. Good air circulation can take away the heat generated by the circuit in the box, extend the service life of the circuit, and air circulation can also prevent the bottom of the box from getting damp.

[0049] Optionally, a pulley 80 is provided at the bottom of the device bracket 70 .

[0050] Among them, the pulley can be a universal wheel, which can drive the device bracket to move in all directions. For example, there are four pulleys, and the four pulleys are located at the four corners of the device bracket. The pulley is set at the bottom of the device bracket to facilitate movement and flexible adjustment of the position. There is no need to rely on complex handling equipment, which saves manpower and time costs. It can be moved at any time according to the change of the test position, which is convenient to use; and it can reduce friction with the ground, reduce the noise generated by movement, and reduce noise interference. The pulley can make it easier for the device bracket to cross small obstacles on the ground such as wires, thresholds, etc., ensure that the device bracket supports the box to move smoothly, improve work efficiency; reduce the need for manual handling, and at the same time, the pulley can also be provided with a brake component, which can be used to brake the pulley after the movement is completed.

[0051] The present invention provides a sensor aging test system. Figures 1-4 The sensor aging test system includes the sensor aging test device as described in any embodiment of the present invention, and also includes a host computer 100, which is communicatively connected to the controller 40. Specifically, the host computer 100 and the controller 40 communicate with each other, such as the host computer 100 transmitting a control instruction to the controller 40. When the controller 40 receives the control instruction, it controls the on and off of the switch module according to the control instruction. The specific control process can be referred to in any of the above embodiments and is not described in detail here.

[0052] The sensor aging test device and system provided in this embodiment belong to the same utility model concept as the sensor aging test circuit provided in any embodiment of the present invention, and have corresponding beneficial effects. For technical details not fully described in this embodiment, please refer to the sensor aging test circuit provided in any embodiment of the present invention.

[0053] Note that the above are only preferred embodiments of the present invention and the technical principles employed. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and that various obvious changes, readjustments, combinations, and substitutions are possible for those skilled in the art without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments and may include many other equivalent embodiments without departing from the scope of the present invention. The scope of the present invention is determined by the scope of the appended claims.

Claims

1. A sensor aging test circuit, characterized in that: include: an acquisition module, configured to acquire data from a target sensor, where there is at least one target sensor; a power supply module, electrically connected to the acquisition module and configured to supply power to the acquisition module; A switch module, electrically connected to the acquisition module and the host computer, for controlling the on / off state of the acquisition module and the host computer according to its own on / off state; The controller is electrically connected to the switch module and is used to receive control instructions from the host computer and control the on and off of the switch module according to the control instructions to perform a static aging test and / or a dynamic aging test on the target sensor.

2. The sensor aging test circuit according to claim 1, characterized in that: There are multiple acquisition modules and multiple switch modules, and each switch module corresponds to each acquisition module one by one. The switch module is electrically connected to the corresponding acquisition module.

3. The sensor aging test circuit according to claim 1, characterized in that: The acquisition module, the power module, the switch module and the controller are integrated on the same circuit board.

4. The sensor aging test circuit according to claim 3, characterized in that: There are multiple acquisition modules, and the acquisition modules are distributed in rows and columns on the circuit board.

5. The sensor aging test circuit according to claim 1, characterized in that: It also includes a communication module, the controller is electrically connected to the communication module, and the communication module is communicatively connected to the host computer; the controller is used to communicate with the host computer through the communication module.

6. The sensor aging test circuit according to claim 1, characterized in that: The target sensor is a catalytic combustion gas sensor.

7. A sensor aging test device, characterized in that: It comprises the sensor aging test circuit according to any one of claims 1 to 6, and also comprises a box, and the acquisition module, the power module, the switch module and the controller are all located in the box.

8. The sensor aging test device according to claim 7, characterized in that: It also includes a device bracket, which is used to support the box.

9. The sensor aging test device according to claim 8, characterized in that: A pulley is provided at the bottom of the device bracket.

10. A sensor aging test system, characterized in that: It comprises the sensor aging test device according to any one of claims 7 to 9, and further comprises a host computer, wherein the host computer is communicatively connected to the controller.

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