Heat dissipation device

By decomposing the server cooling device into independent units and adopting a layered piping design and a dual-pump configuration, the problem of high maintenance difficulty caused by the complex structure of existing devices is solved, and efficient heat dissipation and space utilization are achieved.

CN223402730UActive Publication Date: 2025-09-30SHENZHEN ENVICOOL TECH
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Patent Information

Application Number
CN202422664856.0
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-10-31
Publication Date
2025-09-30
Estimated Expiration
2034-10-31

AI Technical Summary

Technical Problem

Existing server cooling devices have complex structures, which make maintenance difficult, occupy large space, and increase operation and maintenance costs.

Method used

The heat dissipation device is decomposed into independent air cooling unit, delivery unit and power supply unit, which are installed in different chambers respectively. Liquid cooling circulation is realized through the pump body module. Layered pipeline design and dual pump body configuration are adopted to improve efficiency and reliability.

Benefits of technology

It simplifies the maintenance process, reduces the maintenance difficulty, improves space utilization and system reliability, and reduces maintenance workload.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model belongs to the technical field of server heat dissipation, and discloses a heat dissipation device which comprises a cabinet, an air cooling unit and a conveying unit, and the cabinet is provided with a first cavity and a second cavity; the air cooling unit is mounted in the first cavity, and the air cooling unit is provided with a liquid inlet and a liquid outlet; the conveying unit comprises a pump body module, a first conveying pipeline and a second conveying pipeline, and the pump body module, the first conveying pipeline and the second conveying pipeline are all arranged in the second cavity; the first conveying pipeline is communicated with the liquid inlet, the second conveying pipeline is communicated with the liquid outlet, and the pump body module is arranged on the first conveying pipeline and / or the second conveying pipeline. The heat dissipation device can be miniaturized and modularized, the occupied space is small, the space utilization rate is high, and the maintenance difficulty and the maintenance cost are reduced.
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Description

Technical Field

[0001] The present application relates to the technical field of server heat dissipation, and more specifically, to a heat dissipation device. Background Art

[0002] With the advancement of information technology, data centers and high-performance computing facilities are increasingly demanding server performance. As servers incorporate more functional modules, the heat generated also increases dramatically. High temperatures can affect the efficiency of electronic components, slowing computing speeds and reducing overall system performance. Temperatures exceeding certain thresholds can cause servers to automatically shut down or enter safe mode to prevent data loss or service interruptions caused by overheating. Therefore, maintaining a stable temperature helps maintain a stable server operating environment and reduce the risk of system instability and failures caused by temperature fluctuations.

[0003] Currently, most server cooling systems on the market rely on complex cooling duct systems and large fans. These large fans and complex cooling duct structures often occupy valuable space in server cabinets. Space efficiency is particularly important in data centers, where real estate is at a premium. Furthermore, complex cooling systems often increase maintenance complexity and failure rates, increasing operational costs.

[0004] With respect to the above technical means, the existing heat dissipation device has the defect of complex system structure and high difficulty in maintenance. Utility Model Content

[0005] The embodiment of the present application provides a heat dissipation device, which reduces the difficulty of maintaining the heat dissipation device.

[0006] The heat dissipation device provided in this application adopts the following technical solution:

[0007] A heat dissipation device, comprising:

[0008] The cabinet is provided with a first chamber and a second chamber;

[0009] an air cooling unit installed in the first chamber, the air cooling unit being provided with a liquid inlet and a liquid outlet;

[0010] The delivery unit includes a pump body module, a first delivery pipe and a second delivery pipe, and the pump body module, the first delivery pipe and the second delivery pipe are all arranged in the second chamber; the first delivery pipe is connected to the liquid inlet, and the second delivery pipe is connected to the liquid outlet, and the pump body module is arranged in the first delivery pipe or the second delivery pipe.

[0011] Optionally, the pump body module includes a first pump body and a second pump body, the first pump body and the second pump body are both provided with a one-way valve, and the first pump body and the second pump body are connected in parallel to the first delivery pipeline.

[0012] Optionally, the first delivery pipe includes a first connecting pipe and a second connecting pipe, the first connecting pipe is installed and fixed close to the bottom wall of the second chamber, the second connecting pipe is installed and fixed close to the top wall of the second chamber, the first connecting pipe is connected to the second connecting pipe, and the second connecting pipe is connected to the liquid inlet away from the first connecting pipe.

[0013] Optionally, the liquid inlet and the liquid outlet are located at the same horizontal plane; the second delivery pipe includes a third connecting pipe and a fourth connecting pipe, the fourth connecting pipe and the first connecting pipe are located at the same horizontal plane, the third connecting pipe is connected to the fourth connecting pipe, and the end of the third connecting pipe away from the fourth connecting pipe is connected to the liquid outlet.

[0014] Optionally, the cabinet is arranged vertically, and the first chamber is located above the second chamber.

[0015] Optionally, the air cooling unit includes a mounting frame, a fan module and a cooling pipe, the fan module and the cooling pipe are both arranged on the mounting frame, the mounting frame is fixedly installed on the cabinet, the fan module is used to discharge the gas in the first chamber, and the liquid inlet and the liquid outlet are arranged at both ends of the cooling pipe.

[0016] Optionally, the cooling pipeline includes a water inlet main pipe, a water inlet branch pipe, a water outlet main pipe and a water outlet branch pipe;

[0017] One end of the water inlet main pipe is connected to the first conveying pipeline through the liquid inlet, the water inlet branch pipe is connected to the water inlet main pipe, one end of the water outlet main pipe is connected to the second conveying pipeline through the liquid outlet, the water outlet branch pipe is connected to the water outlet main pipe, and the water inlet branch pipe is connected to the water outlet branch pipe.

[0018] Optionally, the water inlet branch pipes and the water outlet branch pipes are each provided with multiple groups, and the multiple groups of water inlet branch pipes and the multiple groups of water outlet branch pipes are respectively arranged on both sides of the mounting frame, and the ends of the water inlet branch pipes and the water outlet branch pipes away from the fan module gradually converge toward the central axis surface of the mounting frame.

[0019] Optionally, the water inlet branch pipe and the water outlet branch pipe are serpentine pipe structures, and a uniform heat dissipation channel is formed between the water inlet branch pipe and the water outlet branch pipe arranged on the same side of the mounting frame.

[0020] Optionally, a power supply unit is further included, and the cabinet is further provided with a third chamber. The power supply unit is installed in the third chamber, and the power supply unit is electrically connected to the pump body module and the air cooling unit.

[0021] It can be seen from the above technical solutions that the embodiments of the present application have the following advantages:

[0022] The liquid enters from the first delivery pipe, is pumped to the liquid inlet through the pump body module, and then enters the air-cooling unit through the liquid inlet. The liquid cooled by the air-cooling unit flows through the liquid outlet to the second delivery pipe and out, thereby completing the cooling of the liquid; in the present application, the air-cooling unit and the delivery unit are installed in different chambers, which decomposes the complex heat dissipation system into smaller and independent units so that they can be stacked. When a problem occurs in a unit, it can be inspected or repaired directly in the space corresponding to the unit. It is easier to troubleshoot inside the corresponding unit. If a unit needs to be repaired, only the damaged unit needs to be replaced, which improves the debugging efficiency, reduces the overall maintenance workload and reduces the difficulty of maintenance. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments recorded in the present application. For ordinary technicians in this field, other drawings can also be obtained based on these drawings.

[0024] Figure 1 This is a schematic diagram of the overall structure of a heat dissipation device disclosed in an embodiment of the present application;

[0025] Figure 2 This is an exploded view of the structure of a heat dissipation device disclosed in an embodiment of the present application, highlighting the first chamber, the second chamber, and the third chamber;

[0026] Figure 3 This is a schematic diagram of the overall structure of a heat dissipation device disclosed in an embodiment of the present application, highlighting the conveying unit;

[0027] Figure 4 This is a structural schematic diagram of a heat dissipation device disclosed in an embodiment of the present application, highlighting a pump module, a first delivery pipe, and a second delivery pipe;

[0028] Figure 5 This is a structural schematic diagram of a heat dissipation device disclosed in an embodiment of the present application, highlighting an air cooling unit;

[0029] Figure 6 This is a structural schematic diagram of a heat dissipation device disclosed in an embodiment of the present application, highlighting the cooling pipe.

[0030] Description of reference numerals:

[0031] 1. Cabinet; 11. First chamber; 12. Second chamber; 13. Third chamber; 14. Cover; 15. Partition; 2. Air-cooling unit; 21. Liquid inlet; 22. Liquid outlet; 23. Mounting frame; 24. Fan module; 25. Cooling pipe; 251. Water inlet main pipe; 252. Water inlet branch pipe; 253. Water outlet main pipe; 254. Water outlet branch pipe; 3. Delivery unit; 31. Pump body module; 311. First pump body; 312. Second pump body; 32. First delivery pipe; 321. First connecting pipe; 322. Second connecting pipe; 33. Second delivery pipe; 331. Third connecting pipe; 332. Fourth connecting pipe; 34. Shell; 35. Connecting pipe; 36. Control valve; 37. Water tank; 38. Expansion block; 4. Power supply unit. DETAILED DESCRIPTION

[0032] The present application is further described in detail below with reference to the accompanying drawings.

[0033] An embodiment of the present application provides a heat dissipation device.

[0034] In order to enable those skilled in the art to better understand the solutions of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only embodiments of a part of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work should fall within the scope of protection of the present invention. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the ability of ordinary technicians in this field to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by this application.

[0035] The terms "first," "second," "third," "fourth," and the like in the specification and claims of the present invention and in the accompanying drawings are used to distinguish similar objects and are not necessarily used to describe a particular order or precedence. It should be understood that the terms used in this manner are interchangeable where appropriate so that the embodiments described herein can be implemented in an order other than that illustrated or described herein. In addition, the terms "including" and "having," and any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, method, system, product, or apparatus comprising a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0036] See also Figure 1 and Figure 2, is an embodiment of the heat dissipation device in the embodiment of the present application, including a cabinet 1, a delivery unit 3, an air cooling unit 2 and a power supply unit 4. The delivery unit 3 is used to transport liquid between the server and the air cooling unit 2 to realize the cooling circulation of the liquid; the air cooling unit 2 uses the air flow to take away the heat of the liquid, performs heat exchange, and reduces the temperature of the liquid; the power supply unit 4 serves as a backup power supply and can provide temporary support for the delivery unit 3 and the air cooling unit 2 in an emergency.

[0037] The cabinet 1 is vertically arranged, and has a first chamber 11, a second chamber 12, and a third chamber 13 arranged side by side. The first chamber 11 is located between the second chamber 12 and the third chamber 13, and the second chamber 12 is located at the bottom of the cabinet 1, and the first chamber 11 is located above the second chamber 12. In this embodiment, the cabinet 1 includes a housing 14 and two side-by-side partition plates 15. The housing 14 covers the first chamber 11, the second chamber 12, and the third chamber 13. The first chamber 11, the second chamber 12, and the third chamber 13 are separated by the two partition plates 15. The air cooling unit 2 is installed in the first chamber 11, and the conveying unit 3 is installed in the third chamber 13. In the present application, the air-cooling unit 2, the conveying unit 3 and the power supply unit 4 are installed in different chambers, which decomposes the complex heat dissipation system into smaller and independent units so that they can be stacked. When a problem occurs in a unit, inspection or maintenance operations can be performed directly in the space corresponding to the unit. It is easier to troubleshoot inside the corresponding unit. If a unit needs to be repaired, only the damaged unit needs to be replaced, which improves the debugging efficiency, reduces the overall maintenance workload and reduces the maintenance difficulty.

[0038] See also Figure 3 and Figure 4The delivery unit 3 includes a pump body module 31, a first delivery pipeline 32 and a second delivery pipeline 33. The pump body module 31, the first delivery pipeline 32 and the second delivery pipeline 33 are all arranged in the second chamber 12, and the pump body module 31 is electrically connected to the power supply unit 4. In order to facilitate the overall disassembly and assembly of the conveying unit 3, the conveying unit 3 also includes a shell 34. The shell 34 is arranged in a rectangular parallelepiped and encloses a closed space. The shell 34 can be detachably installed in the second chamber 12. The pump body module 31, the first conveying pipe 32 and the second conveying pipe 33 are located in the shell 34. One end of the first conveying pipe 32 is fixed to the shell 34 and is used to connect to the server end, and the other end is fixed to the shell 34 and is used to connect to the air-cooling unit 2 for circulation of liquid that needs to be cooled. One end of the second conveying pipe 33 is fixed to the shell 34 and is used to connect to the air-cooling unit 2, and the other end is fixed to the shell 34 and is used to connect to the server end for circulation of cooled liquid. The liquid enters from the first conveying pipe 32 and is pumped to the air-cooling unit 2 through the pump body module 31. The liquid cooled by the air-cooling unit 2 flows out through the second conveying pipe 33, thereby completing the cooling of the liquid. Since liquid cannot flow naturally like gas, the pump body module 31 is used to drive the circulation of the liquid in the first delivery pipe 32 and the second delivery pipe 33, overcome the resistance in the pipeline by increasing the pressure, and deliver the liquid that needs to be cooled to the air cooling unit 2 for cooling, or deliver the cooled liquid to the server. It is suitable for longer distances and higher flow rate requirements, and can effectively take away the heat generated by the server.

[0039] See also Figure 4 The pump module 31 is disposed in the first delivery pipe 32 and / or the second delivery pipe 33. Since the pump module 31 is disposed at the bottom layer of the cabinet 1, in this embodiment, to avoid unnecessary energy waste, the pump module 31 is disposed in the first delivery pipe 32. Liquid enters the first delivery pipe 32 and is pumped to the air cooling unit 2 via the pump module 31. After being cooled by the air cooling unit 2, the liquid flows out through the second delivery pipe 33, thereby completing the cooling of the liquid. Placing the pump module 31 close to the source helps reduce resistance at the suction port and facilitates maintaining a constant flow rate.

[0040] The pump module 31 includes a first pump body 311 and a second pump body 312, which are fixedly mounted on the bottom wall of the second chamber 12. Both the first pump body 311 and the second pump body 312 are equipped with a one-way valve, and are connected in parallel to the first delivery pipe 32. It is understood that the first pump body 311 and the second pump body 312 can operate simultaneously or control the operation of one of them. The provision of two pump bodies is intended to achieve higher efficiency. When the first pump body 311 and the second pump body 312 operate simultaneously, the flow rate of coolant can be increased, improving the cooling effect, especially in high-load or high-temperature environments. It also provides redundancy. If one pump body fails, the other can immediately take over and maintain basic functions, preventing the delivery unit 3 from ceasing operation. This enhances the fault tolerance of the entire system and improves the reliability and stability of the heat dissipation device. Furthermore, the dual-pump configuration reduces the load on a single pump, thereby extending the overhaul cycle and facilitating planned maintenance.

[0041] The first delivery pipeline 32 includes a first connecting pipeline 321 and a second connecting pipeline 322, which are connected. The first connecting pipeline 321 is fixed near the bottom wall of the second chamber 12, and the second connecting pipeline 322 is fixed near the top wall of the second chamber 12. The end of the first connecting pipeline 321 away from the second connecting pipeline 322 is connected to the server end. The second delivery pipeline 33 includes a third connecting pipeline 331 and a fourth connecting pipeline 332, which are connected. The end of the fourth connecting pipeline 332 away from the third connecting pipeline 331 is connected to the server end. The fourth connecting pipeline 332 is located on the same horizontal plane as the first connecting pipeline 321. The first connecting pipeline 321 and the third connecting pipeline 331 are fixed to the bottom wall of the housing 34 by pipe clamps, and the second connecting pipeline 322 and the fourth connecting pipeline 332 are fixed to the top wall of the housing 34 by pipe clamps. Liquid on the server side flows from the first connecting pipe 321 to the first pump body 311 and the second pump body 312. It is then pumped through the first pump body 311 and the second pump body 312 to the second connecting pipe 322. It is then transported to the air cooling unit 2 through the second connecting pipe 322. After being cooled by the air cooling unit 2, the liquid flows through the third connecting pipe 331 to the fourth connecting pipe 332 before flowing out. In this embodiment, the ends of the first connecting pipe 321 and the fourth connecting pipe 332 that communicate with the server are provided with connecting pipes 35. The connecting pipes 35 are located outside the housing 34. The first connecting pipe 321 and the fourth connecting pipe 332 are respectively connected to the connecting pipes 35 via connecting flanges.

[0042] It should be emphasized that by installing the first connecting pipe 321 and the second connecting pipe 322, and the third connecting pipe 331 and the fourth connecting pipe 332 in layers, the vertical space of the second chamber 12 can be effectively utilized, the overall volume of the conveying unit 3 can be reduced, the space utilization of the cabinet 1 can be improved, and the floor space of the overall heat dissipation device can be reduced; secondly, the layered installation of the pipes can reduce the risk of mutual collision and resonance between the pipes, reduce noise and vibration, and protect the structure inside the conveying unit 3.

[0043] In this embodiment, a control valve 36 is provided between the first delivery pipe 32 and the second delivery pipe 33. The control valve 36 is used to connect or block the first delivery pipe 32 and the second delivery pipe 33. The control valve 36 serves as a backup valve to provide flexibility and reliability. Specifically, when flow regulation is required between the first delivery pipe 32 and the second delivery pipe 33, or when a rapid switching between the operating states of the first and second delivery pipes is required, the control valve 36 is operated to open, allowing the flow of hot water entering the first delivery pipe 32 and the flow of cold water returning from the air-cooling unit 2 to the second delivery pipe 33 to be adjusted according to actual needs, thereby maintaining a constant temperature difference and ideal heat exchange efficiency. Secondly, the control valve 36 is used for fault isolation. Specifically, if the first delivery pipe 32 fails or requires maintenance, closing the control valve 36 can prevent hot water from leaking into the air-cooling unit 2, protecting the entire system from damage and facilitating fault location and repair.

[0044] The conveying unit 3 also includes a water tank 37 and an expansion block 38. The water tank 37 is fixedly installed on the shell 34, and the water tank 37 is connected to the first conveying pipe 32 for replenishing liquid. The expansion block 38 is fixedly installed on the shell 34 for maintaining the pressure in the pump body module 31, the first conveying pipe 32 and the second conveying pipe 33.

[0045] See also Figure 2 and Figure 5The air-cooling unit 2 includes a mounting frame 23, a fan module 24, and a cooling pipe 25. The fan module 24 and the cooling pipe 25 are both mounted on the mounting frame 23. The mounting frame 23 is fixedly mounted on the cabinet 1. The fan module 24 is disposed at one end of the mounting frame 23 to discharge the gas in the first chamber 11 to achieve a cooling treatment on the cooling pipe 25. The air-cooling unit 2 is provided with a liquid inlet 21 and a liquid outlet 22. The liquid inlet 21 and the liquid outlet 22 are arranged at the two ends of the cooling pipe 25. The first delivery pipe 32 is connected to the liquid inlet 21, and the second delivery pipe 33 is connected to the liquid outlet 22. Specifically, the liquid inlet 21 and the liquid outlet 22 are located in the same horizontal plane. The end of the second connecting pipe 322 away from the first connecting pipe 321 is connected to the liquid inlet 21, and the end of the third connecting pipe 331 away from the fourth connecting pipe 332 is connected to the liquid outlet 22. It can be understood that the liquid enters from the first delivery pipe 32 and is pumped to the liquid inlet 21 through the pump body module 31 and then enters the cooling pipe 25. When the air in the first chamber 11 passes through the cooling pipe 25, the heat of the cooling pipe 25 is transferred to the air for heat exchange. The fan module 24 discharges the hot air in the first chamber 11, forming convection to reduce the internal gas temperature of the first chamber 11. The continuously circulating cold air takes away the heat, thereby reducing the liquid temperature in the cooling pipe 25. The liquid cooled by the air-cooling unit 2 flows through the liquid outlet 22 to the second delivery pipe 33 and flows out, thereby completing the cooling of the liquid.

[0046] In this embodiment, the mounting frame 23 is arranged in a triangular prism shape, and the fan module 24 includes a plurality of fans. The plurality of fans can operate simultaneously, thereby increasing the air flow and providing a greater heat dissipation capacity.

[0047] See also Figure 6The cooling pipe 25 includes a water inlet main pipe 251, a water inlet branch pipe 252, a water outlet main pipe 253, and a water outlet branch pipe 254. One end of the water inlet main pipe 251 is connected to the first delivery pipe 32 through the liquid inlet 21, and the water inlet branch pipe 252 is connected to the water inlet main pipe 251. One end of the water outlet main pipe 253 is connected to the second delivery pipe 33 through the liquid outlet 22, and the water outlet branch pipe 254 is connected to the water outlet main pipe 253. The liquid enters from the liquid inlet 21, flows through the water inlet main pipe 251, the water inlet branch pipe 252, the water outlet branch pipe 254, and the water outlet main pipe 253, and then flows out through the liquid outlet 22. In this embodiment, multiple groups of water inlet branch pipes 252 and water outlet branch pipes 254 are provided. These groups of water inlet branch pipes 252 and water outlet branch pipes 254 are respectively arranged on both sides of the mounting frame 23. The ends of the water inlet branch pipes 252 and water outlet branch pipes 254 away from the fan module 24 gradually converge toward the central axis of the mounting frame 23. The provision of multiple groups of water inlet branch pipes 252 and water outlet branch pipes 254 effectively increases the heat exchange area between the cooling pipe 25 and the air. More heat exchange area means more contact points with the air in the first chamber 11, allowing for more rapid absorption of heat from high-temperature areas, accelerating heat transfer and achieving faster cooling of the cooling pipe 25. Furthermore, the larger area increases the potential for heat transfer per unit volume. Even if some areas are obstructed, overall heat dissipation is still improved.

[0048] Furthermore, the inlet branch pipe 252 and the outlet branch pipe 254 are serpentine pipe structures, and a uniform heat dissipation channel is formed between the inlet branch pipe 252 and the outlet branch pipe 254, which are arranged on the same side of the mounting frame 23. The heat dissipation channel helps maintain a balanced temperature distribution. The arrangement of the inlet branch pipe 252 and the outlet branch pipe 254 is intended to improve heat exchange efficiency. Due to their curved paths, the coolant undergoes multiple cycles when passing through the inlet branch pipe 252 and the outlet branch pipe 254, increasing the contact length between the liquid and the pipe wall, thereby increasing the contact area between the liquid and the pipe wall, facilitating heat exchange and enhancing convective heat transfer. At the same time, as the path bends, the flow rate increases in some areas and decreases in others. This unevenness helps force turbulence, changes the flow rate distribution, and further enhances the cooling effect. On the other hand, when arranged in a limited space, the serpentine pipeline of the inlet branch pipe 252 and the outlet branch pipe 254 can more effectively utilize vertical height and avoid occupying excessive horizontal length, making it suitable for space-constrained applications.

[0049] As described above, the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art should understand that the technical solutions described in the above embodiments can still be modified, or some of the technical features thereof can be replaced by equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A heat dissipation device, characterized in that: include: The cabinet is provided with a first chamber and a second chamber; an air cooling unit installed in the first chamber, the air cooling unit being provided with a liquid inlet and a liquid outlet; The delivery unit includes a pump body module, a first delivery pipe and a second delivery pipe, and the pump body module, the first delivery pipe and the second delivery pipe are all arranged in the second chamber; the first delivery pipe is connected to the liquid inlet, and the second delivery pipe is connected to the liquid outlet, and the pump body module is arranged in the first delivery pipe and / or the second delivery pipe.

2. A heat dissipation device according to claim 1, characterized in that: The pump body module includes a first pump body and a second pump body. The first pump body and the second pump body are both provided with a one-way valve, and the first pump body and the second pump body are connected in parallel to the first delivery pipeline.

3. A heat dissipation device according to claim 2, characterized in that: The first delivery pipeline includes a first connecting pipeline and a second connecting pipeline. The first connecting pipeline is installed and fixed close to the bottom wall of the second chamber, and the second connecting pipeline is installed and fixed close to the top wall of the second chamber. The first connecting pipeline is connected to the second connecting pipeline, and the end of the second connecting pipeline away from the first connecting pipeline is connected to the liquid inlet.

4. The heat dissipation device according to claim 3, characterized in that: The liquid inlet and the liquid outlet are located at the same horizontal plane; the second delivery pipeline includes a third connecting pipeline and a fourth connecting pipeline, the fourth connecting pipeline and the first connecting pipeline are located at the same horizontal plane, the third connecting pipeline is connected to the fourth connecting pipeline, and the end of the third connecting pipeline away from the fourth connecting pipeline is connected to the liquid outlet.

5. The heat dissipation device according to claim 1, characterized in that: The cabinet is arranged vertically, and the first chamber is located above the second chamber.

6. The heat dissipation device according to claim 1, characterized in that: The air cooling unit includes a mounting frame, a fan module and a cooling pipe. The fan module and the cooling pipe are both arranged on the mounting frame. The mounting frame is fixedly installed on the cabinet. The fan module is used to discharge the gas in the first chamber. The liquid inlet and the liquid outlet are arranged at both ends of the cooling pipe.

7. The heat dissipation device according to claim 6, characterized in that: The cooling pipeline includes a water inlet main pipe, a water inlet branch pipe, a water outlet main pipe and a water outlet branch pipe; One end of the water inlet main pipe is connected to the first conveying pipeline through the liquid inlet, the water inlet branch pipe is connected to the water inlet main pipe, one end of the water outlet main pipe is connected to the second conveying pipeline through the liquid outlet, the water outlet branch pipe is connected to the water outlet main pipe, and the water inlet branch pipe is connected to the water outlet branch pipe.

8. The heat dissipation device according to claim 7, characterized in that: The water inlet branch pipes and the water outlet branch pipes are each provided with multiple groups, and the multiple groups of water inlet branch pipes and the multiple groups of water outlet branch pipes are respectively arranged on both sides of the mounting frame, and the ends of the water inlet branch pipes and the water outlet branch pipes away from the fan module gradually converge toward the central axis surface of the mounting frame.

9. The heat dissipation device according to claim 7, characterized in that: The water inlet branch pipe and the water outlet branch pipe are serpentine pipe structures, and a uniform heat dissipation channel is formed between the water inlet branch pipe and the water outlet branch pipe arranged on the same side of the mounting frame.

10. The heat dissipation device according to claim 1, characterized in that: It also includes a power supply unit. The cabinet is also provided with a third chamber. The power supply unit is installed in the third chamber. The power supply unit is electrically connected to the pump body module and the air cooling unit.