Automatic solder ball adding device

Abstract

The utility model provides an automatic solder ball adding device, and belongs to the field of semiconductor equipment material conveying. Comprising a mounting frame, when a solder ball needs to be overhauled or is not needed, an operation plate is pushed to drive a connecting rod, a second magnetic block, a first magnetic block and a blocking block to move towards a discharging port, the blocking block is blocked into the discharging port again, the solder ball can be better prevented from rolling out of the discharging port, then a T-shaped block is driven by an air pump to move, and the solder ball is prevented from rolling out of the discharging port. And the third magnetic block is moved to the first magnetic block, so that the first magnetic block and the third magnetic block attract each other, the first magnetic block can be better fixed, the blocking block blocked in the discharging port is more stable, and the problem that when maintenance is needed due to sudden shutdown and power failure, unused solder balls exist in the rotating mechanism, and the rotating mechanism cannot rotate is solved. And during maintenance, the machine shakes, so that the unused solder balls shake in the rotating mechanism and fall into the gear, and part of the solder balls are clamped in the gear.

Description

Technical Field

[0001] The utility model relates to the field of semiconductor equipment material transportation, in particular to an automatic solder ball adding device. Background Art

[0002] With the development of science and technology, electronic equipment has become more sophisticated and ultra-thin, and the requirements for welding quality are getting higher and higher. Among them, the tin balls can be quickly transported to the position where tin planting or soldering is required through the conveying device. The main function of the automatic tin ball adding mechanism is to automatically add the tin balls to the ball planting head. It is a structure in the field of semiconductor ball planting equipment.

[0003] In the published patent with authorization announcement number CN 220880872 U, the utility model relates to an efficient solder ball feeding mechanism, which aims to solve the technical problem that current staff, while paying attention to welding quality, lack observation of the materials stored in the solder ball feeding mechanism, resulting in the failure to timely discover and add materials when the materials are used up, thus affecting production. The utility model includes a motor provided inside the platform bracket, the motor output shaft is fixedly connected to a dividing mechanism for evenly distributing the solder balls, a collection bin for collecting solder balls is provided above the dividing mechanism, a pressure mechanism for reminding that there are insufficient solder balls is provided inside the collection bin, the top of the pressure mechanism is fixedly connected to the inner bin, and a rotating mechanism for pushing the solder balls is provided inside the inner bin. The utility model has the advantages of prompting insufficient materials while ensuring the uniform distribution of the solder balls and transmitting them for subsequent processing.

[0004] During the use of the above device, when a sudden power outage occurs and maintenance is required, there will be unused solder balls inside the rotating mechanism. When the machine shakes during maintenance, the unused solder balls will shake inside the rotating mechanism and fall into the gears, causing some solder balls to be stuck in the gears, thereby greatly increasing the maintenance workload and reducing the practicality of the device.

[0005] Therefore, the present application provides a solder ball automatic adding device to meet the needs. Utility Model Content

[0006] The technical problem to be solved by the present invention is to provide an automatic solder ball adding device to solve the problem raised in the above background technology that when a sudden power outage occurs and maintenance is required, there will be unused solder balls inside the rotating mechanism, and the machine will shake during maintenance, causing the unused solder balls to shake inside the rotating mechanism and fall into the gears, resulting in some solder balls being stuck in the gears, thereby greatly increasing the maintenance workload.

[0007] In order to solve the above technical problems, the present invention provides the following technical solutions:

[0008] A solder ball automatic adding device comprises a mounting frame, a ball storage mechanism is provided on the top of the mounting frame, a feeding mechanism is provided on the top of the ball storage mechanism, a feeding port is provided on the ball storage mechanism near the top of the feeding mechanism, a discharge plate is installed on one side of the ball storage mechanism, a discharge port inclined downward is provided on the surface of the discharge plate, a ball blocking mechanism is provided on one side of the discharge port, a first discharge pipe is installed on the bottom of the ball blocking mechanism, a circular opening is provided on the surface of the mounting frame and is located directly below the first discharge pipe, a discharge mechanism is provided inside the circular opening, a protective shell is installed on one side of the discharge plate, a vertical groove is provided on one side surface of the protective shell, and a detection mechanism is provided on the outside of the discharge mechanism;

[0009] The ball blocking mechanism includes a blocking block that blocks the inside of the discharge port, a first groove is provided on the surface of the blocking block, a first magnetic block is installed inside the first groove, a T-shaped block is fixedly connected to the side of the discharge plate close to the ball storage mechanism, a plurality of slide rails are fixedly connected to the side of the plurality of slide rails, a plurality of sliders are installed on the outside of the plurality of slide rails, and a plurality of the sliders are fixedly connected to the side close to the T-shaped block, an air pump is installed on one side of the discharge plate, the output end of the air pump is fixedly connected to the top of the T-shaped block, a through groove is provided on the surface of the T-shaped block away from the ball storage mechanism, and the through groove A connecting rod is slidably connected to the inside of the device, and one end of the connecting rod away from the discharge port extends to the outside of the vertical slot, and one end of the connecting rod away from the discharge port is fixedly connected to the operating plate, and a second groove is provided on the surface of one end of the connecting rod close to the discharge plate, and a second magnetic block is installed inside the second groove, and a receiving groove is provided on the side surface of the T-shaped block close to the discharge port, and a third magnetic block is installed inside the receiving groove, and the third magnetic block is magnetically attracted to the first magnetic block, and an opening is provided at the bottom of the T-shaped block, and the opening is located at the top of the first discharge pipe, and an outlet is provided inside the receiving groove for discharging solder balls.

[0010] As an optimal technical solution of the present utility model: the ball storage mechanism includes a ball storage bin fixedly connected to the top of the mounting frame, the top of the ball storage bin is provided with a delivery port, the inner bottom side of the ball storage bin is provided with a first inclined surface and a second inclined surface close to each other in a funnel shape, the first inclined surface and the second inclined surface are inclined toward the discharge port on the side close to the discharge plate, and a sealing plate is installed on the side of the ball storage bin away from the discharge plate; when it is necessary to store and deliver the tin balls, the tin balls are delivered to the interior of the ball storage bin, and the tin balls are gathered together by the first inclined surface and the second inclined surface inside the ball storage bin, and the first inclined surface and the second inclined surface are inclined toward the discharge port on the side close to the discharge plate, so that the tin balls roll out of the discharge port, which can better store and deliver the tin balls, reduce the workload of manual delivery, and thus improve the practicality of the device.

[0011] As a preferred technical solution of the present utility model: the delivery mechanism includes a delivery tube fixedly connected to the delivery port opened on the top of the ball storage bin, and a sealing cover is installed on the top of the delivery tube; when the solder balls need to be delivered into the ball storage bin, the sealing cover is opened and the solder balls are delivered into the ball storage bin through the delivery tube. The sealing cover can better prevent external impurities from entering the interior of the ball storage bin through the delivery tube, thereby improving the practicality of the device.

[0012] As an optimal technical solution of the present utility model: the discharging mechanism includes a funnel installed inside the circular mouth, and the bottom of the funnel is fixedly connected to a second discharging pipe; when the solder balls need to be discharged for use, the solder balls fall into the second discharging pipe through the funnel for discharging and use, which improves the convenience of discharging the solder balls and thus improves the practicality of the device.

[0013] As an optimal technical solution of the present utility model: the detection mechanism includes a mounting block installed on the outside of the second discharge pipe, and opposing optical fibers are installed on both sides of the mounting block; the opposing optical fibers can better detect the discharge of solder balls, thereby improving the practicality of the device.

[0014] As an optimal technical solution of the present utility model: a first chamfer is provided on the side of the block close to the discharge port, which is used to guide the block when blocking the discharge port; when the block needs to be blocked in the discharge port, by providing the first chamfer on the side of the block close to the discharge port, the block can be better guided when blocking the discharge port, so that the block can be more conveniently blocked in the discharge port, thereby improving the practicality of the device.

[0015] As an optimal technical solution of the present utility model: a second chamfer is provided on the side of the block away from the discharge port, which is used for the third magnetic block to guide the block when it moves; when the block is blocked in the discharge port, since the block has a part protruding to the outside of the discharge port, by providing the second chamfer, when the third magnetic block is moving, it can better guide the surface of the block that contacts the third magnetic block, preventing the sharp corners of the block from conflicting with the edge of the third magnetic block and causing it to be unable to move, so that the third magnetic block can be better moved to the surface of the block through the second chamfer, thereby improving the practicality of the device.

[0016] As an optimal technical solution of the present utility model: the third magnetic block is provided with a first inclined surface on the side close to the blocking block, which is used to cooperate with the second chamfer for guiding the third magnetic block when it moves, and the third magnetic block is provided with a second inclined surface on the side away from the blocking block, which is used to guide the solder balls coming out of the discharge port into the discharge port; when the blocking block is blocked in the discharge port, since the blocking block has a part protruding outside the discharge port, by setting the first inclined surface, when the third magnetic block is moving, the first inclined surface and the second chamfer cooperate with each other to guide the contact surface of the blocking block and the third magnetic block, preventing the corners of the blocking block from conflicting with the edges of the third magnetic block and causing it to be unable to move, so that the third magnetic block can be better moved to the surface of the blocking block through the second chamfer and the first inclined surface, thereby improving the practicality of the device, and the second inclined surface can better guide the solder balls coming out of the discharge port, preventing some solder balls from staying on the surface of the third magnetic block, thereby improving the practicality of the device.

[0017] Compared with the prior art, the present invention has at least the following beneficial effects:

[0018] The first magnetic block and the second magnetic block are attracted to each other, and the connecting rod is pulled out to drive the first magnetic block and the blocking block to move inside the T-shaped block, so that the blocking block is separated from the discharge port, and the outlet opened in the accommodating groove moves to the discharge port, which can better make the tin balls in the ball storage bin roll out through the discharge port. The material is discharged at the outlet. When maintenance is required or solder balls are not needed, the connecting rod, the second magnetic block, the first magnetic block and the blocking block are driven toward the discharge port by pushing the operating panel, and the blocking block is re-blocked in the discharge port, which can better prevent the solder balls from rolling out of the discharge port. The air pump then drives the T-shaped block to move, and the third magnetic block is moved to the first magnetic block, so that the first magnetic block and the third magnetic block are attracted to each other, which can better fix the first magnetic block, making the blocking block blocked in the discharge port more stable. This solves the problem that when a sudden power outage requires maintenance, there will be unused solder balls inside the rotating mechanism, and the machine shakes during maintenance, causing the unused solder balls to shake inside the rotating mechanism and fall into the gears, resulting in some solder balls being stuck in the gears, thereby greatly increasing the maintenance workload, thereby improving the practicality of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The accompanying drawings, which are incorporated herein and constitute a part of the specification, illustrate embodiments of the present disclosure and, together with the description, further serve to explain the principles of the present disclosure and to enable one skilled in the relevant art to make and use the present disclosure.

[0020] Figure 1 This is a schematic diagram of the three-dimensional structure of the automatic solder ball adding device;

[0021] Figure 2 This is a schematic diagram of the solder ball storage mechanism structure;

[0022] Figure 3 Schematic diagram of the protective shell removal and delivery mechanism;

[0023] Figure 4 It is a schematic diagram of the ball blocking mechanism and the discharge plate structure;

[0024] Figure 5 for Figure 4 Enlarged structural diagram at point A in the middle.

[0025] [Reference Signs]

[0026] 1. Mounting frame; 2. Ball storage mechanism; 21. Ball storage bin; 22. First inclined surface; 23. Second inclined surface; 24. Closing plate; 3. Dispensing mechanism; 31. Dispensing tube; 32. Closing cover; 4. Discharging plate; 5. Discharging port; 6. Ball blocking mechanism; 61. Blocking block; 62. First magnetic block; 63. T-shaped block; 64. Slide rail; 65. Slider; 66. Air pump; 67. Connecting rod; 68. Operating panel; 69. Second magnetic block; 610. Third magnetic block; 7. First discharging pipe; 8. Round mouth; 9. Discharging mechanism; 91. Funnel; 92. Second discharging pipe; 10. Protective shell; 11. Detection mechanism; 111. Mounting block; 112. Optical fiber.

[0027] As shown in the figure, in order to clearly implement the structure of the embodiment of the present invention, specific structures and devices are marked in the figure, but this is only for illustrative purposes and is not intended to limit the present invention to the specific structure, device and environment. According to specific needs, ordinary technicians in this field can adjust or modify these devices and environments, and the adjustments or modifications made are still included in the scope of the appended claims. DETAILED DESCRIPTION

[0028] The following describes in detail an automatic solder ball adding device provided by the present invention, with reference to the accompanying drawings and specific embodiments. It is also noted that, for the sake of completeness, the following embodiments are best and preferred embodiments, and those skilled in the art may employ alternative implementations for known technologies. Furthermore, the accompanying drawings are intended only to provide a more detailed description of the embodiments and are not intended to limit the present invention.

[0029] It should be noted that references in the specification to "one embodiment," "an embodiment," "exemplary embodiments," "some embodiments," etc. indicate that the described embodiments may include specific features, structures, or characteristics, but not necessarily every embodiment will include such specific features, structures, or characteristics. Furthermore, when specific features, structures, or characteristics are described in conjunction with an embodiment, it is within the knowledge of persons skilled in the relevant art to implement such features, structures, or characteristics in conjunction with other embodiments (whether or not explicitly described).

[0030] In general, terms can be understood, at least in part, from their use in context. For example, depending at least in part on the context, the term "one or more" as used herein can be used to describe any feature, structure, or characteristic in the singular sense, or can be used to describe a combination of features, structures, or characteristics in the plural sense. Additionally, the term "based on" can be understood as not necessarily intended to convey an exclusive set of factors, but can instead, depending at least in part on the context, allow for the presence of other factors that are not necessarily explicitly described.

[0031] like Figure 1 As shown, the embodiment of the present invention provides an automatic solder ball adding device, including a mounting frame 1, a ball storage mechanism 2 is provided on the top of the mounting frame 1, and the ball storage mechanism 2 includes a ball storage bin 21 fixedly connected to the top of the mounting frame 1, and a delivery port is opened on the top of the ball storage bin 21, and the inner bottom side of the ball storage bin 21 is provided with a first inclined surface 22 and a second inclined surface 23 close to each other in a funnel shape, and the first inclined surface 22 and the second inclined surface 23 are inclined toward the delivery port 5 on the side close to the discharge plate 4, and a sealing plate 24 is installed on the side of the ball storage bin 21 away from the discharge plate 4; when the solder balls need to be stored and delivered, the solder balls are delivered into the interior of the ball storage bin 21, and the solder balls are gathered together through the first inclined surface 22 and the second inclined surface 23 inside the ball storage bin 21, and the first inclined surface 22 and the second inclined surface 23 are inclined toward the delivery port 5 on the side close to the discharge plate 4, so that the solder balls roll out of the delivery port 5, which can better store and deliver the solder balls, reduce the workload of manual delivery, and thus improve the practicality of the device.

[0032] A feeding mechanism 3 is provided on the top of the ball storage mechanism 2, and a feeding port is opened near the top of the feeding mechanism 3 of the ball storage mechanism 2. The feeding mechanism 3 includes a feeding tube 31 fixedly connected to the feeding port opened on the top of the ball storage bin 21, and a sealing cover 32 is installed on the top of the feeding tube 31; when the tin balls need to be fed into the ball storage bin 21, the sealing cover 32 is opened and the tin balls are fed into the ball storage bin 21 through the feeding tube 31. The sealing cover 31 can better prevent external impurities from entering the interior of the ball storage bin 21 through the feeding tube 31, thereby improving the practicality of the device.

[0033] A discharge plate 4 is installed on one side of the ball storage mechanism 2, and a discharge port 5 inclined downward is provided on the surface of the discharge plate 4. A ball blocking mechanism 6 is provided on one side of the discharge port 5. A first discharge pipe 7 is installed at the bottom of the ball blocking mechanism 6. A circular opening 8 is provided on the surface of the mounting frame 1 and is located directly below the first discharge pipe 7. The ball blocking mechanism 6 includes a block 61 that blocks the inside of the discharge port 5. A first groove is provided on the surface of the block 61, and a first magnetic block 62 is installed inside the first groove. A T-shaped block 63 is fixedly connected to the side of the discharge plate 4 close to the ball storage mechanism 2, and a plurality of slide rails 64 are fixedly connected to the side of the discharge plate 4 close to the T-shaped block 63. A plurality of sliders 65 are installed on the outside of the plurality of slide rails 64, and the plurality of sliders 65 are fixedly connected to the side close to the T-shaped block 63. An air pump 66 is installed on one side of the discharge plate 4, and the output end of the air pump 66 is fixedly connected to the top of the T-shaped block 63. A through groove is provided on the surface of the T-shaped block 63 away from the ball storage mechanism 2. A connecting rod 67 is slidably connected to the inside of the through groove, and the end of the connecting rod 67 away from the discharge port 5 extends to the outside of the vertical groove. The end of the connecting rod 67 away from the discharge port 5 is fixedly connected to the operating plate 68. A second groove is provided on the surface of the end of the connecting rod 67 close to the discharge plate 4, and a second magnetic block 69 is installed inside the second groove. A receiving groove is provided on the surface of the side of the T-shaped block 63 close to the discharge port 5, and a third magnetic block 610 is installed inside the receiving groove, and the third magnetic block 610 is magnetically attracted to the first magnetic block 62. An opening is provided at the bottom of the T-shaped block 63, and the opening is located at the first At the top of a discharge pipe 7, an outlet is provided inside the receiving groove for discharging solder balls. When the solder balls need to be discharged from the ball storage bin 21, the air pump 66 drives the T-shaped block 63 and the slider 65 fixedly connected on the output end to move on the slide rail 64, and then the T-shaped block 63 drives the connecting rod 67, the second magnetic block 69 and the third magnetic block 610 to move, so that the blocking block 61 and the first magnetic block 62 are separated from the third magnetic block 610. At the same time, the second magnetic block 69 moves to the blocking block 61 and the first magnetic block 62. Then, the operating plate 68 is pushed to drive the connecting rod 67 to move toward the blocking block 61 and the first magnetic block 62, so that the first magnetic block 62 and the second magnetic block 69 are attracted to each other. By pulling out the connecting rod 67, the first magnetic block 62 and the blocking block 61 are driven to move inside the T-shaped block 63. , so that the blocking block 61 is separated from the discharge port 5, and at the same time, the outlet opened in the accommodating groove moves to the discharge port 5, which can better make the solder balls in the ball storage bin 21 roll down to the outlet through the discharge port 5 for discharge. When maintenance is required or the solder balls are not needed, the connecting rod 67, the second magnetic block 69, the first magnetic block 62 and the blocking block 61 are driven toward the discharge port 5 by pushing the operating panel 68, and the blocking block 61 is blocked in the discharge port 5 again, which can better prevent the solder balls from rolling out of the discharge port 5. The air pump 66 then drives the T-shaped block 63 to move, so that the third magnetic block 610 moves to the first magnetic block 62, so that the first magnetic block 62 and the third magnetic block 610 are attracted to each other, which can better fix the first magnetic block 62 and make the blocking block 61 blocked in the discharge port 5 more stable.

[0034] A discharge mechanism 9 is provided inside the circular opening 8, and the discharge mechanism 9 includes a funnel 91 installed inside the circular opening 8, and a second discharge pipe 92 is fixedly connected to the bottom of the funnel 91; when the solder balls need to be discharged for use, the solder balls fall into the second discharge pipe 92 through the funnel 91 for discharge and use, which improves the convenience of solder ball discharge and thus improves the practicality of the device.

[0035] A protective shell 10 is installed on one side of the discharge plate, and a vertical groove is opened on the surface of one side of the protective shell 10. A detection mechanism 11 is provided on the outside of the discharge mechanism 9; the detection mechanism 11 includes a mounting block 111 installed on the outside of the second discharge pipe 92, and opposing optical fibers 112 are installed on both sides of the mounting block 111; the opposing optical fibers 112 can better detect the discharge of solder balls, thereby improving the practicality of the device.

[0036] A first chamfer is provided on the side of the block 61 close to the discharge port 5, which is used to guide the block 61 when it blocks the discharge port 5; when the block 61 needs to be blocked in the discharge port 5, by providing the first chamfer on the side of the block 61 close to the discharge port 5, the block 61 can be better guided when blocking the discharge port 5, so that the block 61 can be more conveniently blocked in the discharge port 5, thereby improving the practicality of the device.

[0037] A second chamfer is provided on the side of the block 61 away from the discharge port, which is used for the third magnetic block 610 to guide the block 61 when it moves; when the block 61 is blocked in the discharge port 5, since the block 61 will have a part protruding to the outside of the discharge port 5, by providing the second chamfer, when the third magnetic block 610 is moving, it can better guide the surface of the block 61 that contacts the third magnetic block 610, preventing the corners of the block 61 from conflicting with the edges of the third magnetic block 610 and making it unable to move, so that the third magnetic block 610 can be better moved to the surface of the block 61 through the second chamfer, thereby improving the practicality of the device.

[0038] As a preferred technical solution of the present utility model: a first inclined surface is provided on the side of the third magnetic block 610 close to the blocking block 61, which is used to guide the third magnetic block 610 in conjunction with the second chamfer when it moves, and a second inclined surface is provided on the side of the third magnetic block 610 away from the blocking block 61, which is used to guide the solder balls coming out of the discharge port 5 to the outlet; when the blocking block 61 is blocked in the discharge port 5, the blocking block 61 will have a part protruding to the outside of the discharge port 5, and by providing the first inclined surface, when the third magnetic block 61 is moving, the first inclined surface The inclined surface and the second chamfer cooperate with each other to guide the contact surface of the block 61 and the third magnetic block 610, thereby preventing the corners of the block 61 from conflicting with the edges of the third magnetic block 610 and becoming unable to move, so that the third magnetic block 610 can be better moved to the surface of the block 61 through the second chamfer and the first inclined surface, thereby improving the practicality of the device. The second inclined surface can better guide the solder balls coming out of the discharge port 5, preventing some solder balls from staying on the surface of the third magnetic block 610, thereby improving the practicality of the device.

[0039] Working principle:

[0040] When it is necessary to store and release the solder balls, the air pump 66 drives the T-shaped block 63 and the slider 65 fixed on the output end to move on the slide rail 64, and then the T-shaped block 63 drives the connecting rod 67, the second magnetic block 69 and the third magnetic block 610 to move, so that the blocking block 61 and the first magnetic block 62 are separated from the third magnetic block 610. At the same time, the second magnetic block 69 moves to the blocking block 61 and the first magnetic block 62 out. Then, by pushing the operating plate 68, the connecting rod 67 is driven to move toward the blocking block 61 and the first magnetic block 62, so that the first magnetic block 62 and the second magnetic block 69 are attracted to each other. By pulling out the connecting rod 67, the first magnetic block 62 and the blocking block 61 are driven to move inside the T-shaped block 63, so that the blocking block 61 is separated from the discharge port 5. At the same time, the outlet opened in the accommodating tank moves to the discharge port 5. Then, by opening the sealing cover 32, the solder balls are dropped into the storage bin 21 through the delivery tube 31, and then the solder balls pass through the first magnetic block inside the storage bin 21. The inclined surface 22 and the second inclined surface 23 converge with each other, and the first inclined surface 22 and the second inclined surface 23 are inclined toward the discharge port 5 on one side close to the discharge plate 4, so that the solder balls roll out of the discharge port 5 and roll into the outlet opened in the receiving groove, and then fall into the funnel 91 through the outlet, and then fall into the second discharge pipe 92 through the funnel 91 to be discharged for use. When maintenance is required or the solder balls are not needed, the operating plate 68 is pushed to drive the connecting rod 67, the second magnetic block 69, the first magnetic block 62 and the blocking block 61 toward the discharge port 5, and the blocking block 61 is blocked in the discharge port 5 again, which can better prevent the solder balls from rolling out of the discharge port 5. The air pump 66 then drives the T-shaped block 63 to move, so that the third magnetic block 610 moves to the first magnetic block 62, so that the first magnetic block 62 and the third magnetic block 610 are attracted to each other, which can better fix the first magnetic block 62 and make the blocking block 61 blocked in the discharge port 5 more stable.

[0041] The present invention encompasses any substitutions, modifications, equivalent methods, and solutions that are not within the spirit and scope of the present invention. To provide a thorough understanding of the present invention, specific details are described in detail in the preferred embodiments of the present invention above, but those skilled in the art can fully understand the present invention without these detailed descriptions.

[0042] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present invention. These improvements and modifications should also be regarded as within the scope of protection of the present invention.

Claims

1. A solder ball automatic adding device, characterized in that: include: A mounting frame (1), a ball storage mechanism (2) is provided on the top of the mounting frame (1), a delivery mechanism (3) is provided on the top of the ball storage mechanism (2), a delivery port is provided on the ball storage mechanism (2) near the top of the delivery mechanism (3), a discharge plate (4) is provided on one side of the ball storage mechanism (2), a discharge port (5) inclined downward is provided on the surface of the discharge plate (4), a ball blocking mechanism (6) is provided on one side of the discharge port (5), a first discharge pipe (7) is provided on the bottom of the ball blocking mechanism (6), a circular opening (8) is provided on the surface of the mounting frame (1) and is located directly below the first discharge pipe (7), a discharge mechanism (9) is provided inside the circular opening (8), a protective shell (10) is provided on one side of the discharge plate, a vertical groove is provided on one side of the protective shell (10), and a detection mechanism (11) is provided on the outside of the discharge mechanism (9); The ball blocking mechanism (6) includes a blocking block (61) that blocks the inside of the discharge port (5), a first groove is provided on the surface of the blocking block (61), a first magnetic block (62) is installed inside the first groove, a T-shaped block (63) is fixedly connected to the side of the discharge plate (4) close to the ball storage mechanism (2), a plurality of slide rails (64) are fixedly connected to the side of the discharge plate (4) close to the T-shaped block (63), a plurality of sliders (65) are installed outside the plurality of slide rails (64), and the plurality of sliders (65) are fixedly connected to the side close to the T-shaped block (63), an air pump (66) is installed on one side of the discharge plate (4), the output end of the air pump (66) is fixedly connected to the top of the T-shaped block (63), and a surface of the T-shaped block (63) away from the ball storage mechanism (2) is provided. There is a through groove, the interior of the through groove is slidably connected to a connecting rod (67), and the end of the connecting rod (67) away from the discharge port (5) extends to the outside of the vertical groove, the end of the connecting rod (67) away from the discharge port (5) is fixedly connected to an operating plate (68), a second groove is provided on the surface of one end of the connecting rod (67) close to the discharge plate (4), a second magnetic block (69) is installed inside the second groove, a receiving groove is provided on the side surface of the T-shaped block (63) close to the discharge port (5), a third magnetic block (610) is installed inside the receiving groove, and the third magnetic block (610) is magnetically attracted to the first magnetic block (62), an opening is provided at the bottom of the T-shaped block (63), and the opening is located at the top of the first discharge pipe (7), and an outlet is provided inside the receiving groove for discharging solder balls.

2. The automatic solder ball adding device according to claim 1, characterized in that: The ball storage mechanism (2) includes a ball storage bin (21) fixedly connected to the top of the mounting frame (1), a delivery port is provided at the top of the ball storage bin (21), a first inclined surface (22) and a second inclined surface (23) close to each other in a funnel shape are provided on the inner bottom side of the ball storage bin (21), the first inclined surface (22) and the second inclined surface (23) are inclined toward the discharge port (5) on the side close to the discharge plate (4), and a sealing plate (24) is installed on the side of the ball storage bin (21) away from the discharge plate (4).

3. The automatic solder ball adding device according to claim 1, characterized in that: The delivery mechanism (3) comprises a delivery tube (31) fixedly connected to a delivery port opened at the top of the ball storage bin (21), and a sealing cover (32) is installed at the top of the delivery tube (31).

4. The automatic solder ball adding device according to claim 1, characterized in that: The discharge mechanism (9) comprises a funnel (91) installed inside the circular opening (8), and a second discharge pipe (92) is fixedly connected to the bottom of the funnel (91).

5. The automatic solder ball adding device according to claim 1, characterized in that: The detection mechanism (11) comprises a mounting block (111) mounted outside the second discharge pipe (92), with opposing optical fibers (112) mounted on both sides of the mounting block (111).

6. The automatic solder ball adding device according to claim 1, characterized in that: A first chamfer is provided on one side of the blocking block (61) close to the discharge port (5), for guiding the blocking block (61) when blocking the discharge port (5).

7. The automatic solder ball adding device according to claim 1, characterized in that: A second chamfer is provided on a side of the blocking block (61) away from the discharge port, for the third magnetic block (610) to guide the blocking block (61) when moving.

8. The automatic solder ball adding device according to claim 1, characterized in that: A first inclined surface is provided on a side of the third magnetic block (610) close to the blocking block (61), for guiding the third magnetic block (610) in conjunction with the second chamfer when moving, and a second inclined surface is provided on a side of the third magnetic block (610) away from the blocking block (61), for guiding the solder balls coming out of the discharge port (5) into the outlet.

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