Bonding clamp for shielding type micro-strip spacer ring assembly

By designing a bonding fixture for shielded microstrip spacer ring assemblies and utilizing a combination of a substrate limiting base and a bonding pressure block, precise positioning and efficient bonding of the permanent magnet are achieved, solving the problems of low efficiency and insufficient precision in traditional manual bonding and improving product consistency and qualification rate.

CN223406836UActive Publication Date: 2025-10-03株洲华毅微波技术科技有限公司
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Patent Information

Application Number
CN202422887464.0
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-11-26
Publication Date
2025-10-03
Estimated Expiration
2034-11-26

AI Technical Summary

Technical Problem

Traditional manual bonding of shielded microstrip spacer ring assemblies requires placing a polytetrafluoroethylene dielectric block to fix the position of the permanent magnet, resulting in low efficiency and inconsistent bonding positions, affecting product performance and qualification rate.

Method used

A bonding fixture is designed, which includes a substrate limiting base, a bonding pressure block and a gravity pressure block. The bonding pressure block made of industrial pure iron and the permanent magnet are used for limiting and fixed by locking screws to achieve precise positioning and efficient bonding of the permanent magnet.

Benefits of technology

It improves bonding efficiency and precision, enhances product consistency and qualification rate, simplifies the fixture disassembly process, and reduces work intensity.

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Abstract

The utility model discloses a bonding clamp for a shielding type micro-strip spacer ring assembly, which relates to the technical field of bonding clamps and comprises a substrate limiting base, a bonding pressing block arranged at the top end of the substrate limiting base and a gravity pressing block arranged at the top end of the bonding pressing block. And the gravity pressing block passes through the substrate limiting base through the back surface through hole and is pressed on the back surface of the microstrip substrate. The bonding clamp for the shielding type micro-strip spacer ring assembly is convenient to operate, capable of greatly improving production efficiency and permanent magnet bonding position precision, high in consistency, capable of being conveniently and rapidly detached and capable of improving use convenience.
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Description

Technical Field

[0001] The utility model relates to the technical field of bonding fixtures, in particular to a bonding fixture used for a shielded microstrip spacer ring assembly. Background Art

[0002] Microstrip spacer ring components are a key electronic component in the microwave industry. They are designed using the microwave gyromagnetic and non-reciprocal properties of ferrite materials and are used for inter-stage decoupling, impedance matching, duplexing and looping in microwave systems. They are widely used in the field of microwave communications.

[0003] With the rapid development and application of microwave communication technology in recent years, miniaturization and high performance have become inevitable development trends for microwave electronic components. To ensure stable operation and prevent external interference in microwave systems, microstrip isolator circulator components are often required to have magnetic shielding and a certain degree of anti-interference capability. This has also been a key development direction in the domestic and international isolator circulator industry in recent years.

[0004] Typically, a shielded microstrip spacer assembly is primarily composed of a microstrip substrate, a magnetic circuit, and multiple permanent magnets. During the manufacturing process, the back of the permanent magnets needs to be coated with glue before being bonded to the surface of the microstrip substrate. Suitable media must be used to separate the permanent magnets and the magnetic circuit to prevent them from attracting or repelling each other. The location and strength of the permanent magnet bonding also affect the performance and reliability of the spacer assembly.

[0005] Traditionally, shielded microstrip spacer ring assemblies are bonded manually. This manual bonding process has several drawbacks: First, one or more polytetrafluoroethylene (PTFE) blocks are required to secure the permanent magnets, preventing attraction between the magnets and the magnetic circuit, and between the magnets themselves. This process often requires repeated rework to adjust the permanent magnet position, resulting in low efficiency. Second, inconsistent bonding positions can lead to performance deviations, resulting in defective products in the cured product, reducing the yield rate. Utility Model Content

[0006] The main purpose of the utility model is to provide a bonding fixture for a shielded microstrip spacer ring assembly to solve the problem that one or more polytetrafluoroethylene dielectric blocks need to be placed during bonding to fix the position of the permanent magnet to prevent the permanent magnet from attracting the magnetic circuit and the permanent magnets. This process often requires repeated rework to adjust the position of the permanent magnet, which is inefficient. Inconsistent bonding positions lead to performance deviations, resulting in defective products in the finished product after curing, resulting in a reduced pass rate.

[0007] To achieve the above objectives, the present invention provides the following technical solutions:

[0008] A bonding fixture for a shielded microstrip spacer ring assembly comprises a substrate limiting base, a bonding pressing block arranged on the top of the substrate limiting base, and a gravity pressing block arranged on the top of the bonding pressing block.

[0009] Preferably, the bonding block is made of industrial pure iron, a plurality of permanent magnets are provided on the top of the substrate limiting base, and threaded holes are provided on both sides of the inside of the bonding block.

[0010] Preferably, a plurality of side-by-side substrate limiting holes are provided inside the substrate limiting base, a back through hole is provided on the back of the substrate limiting base, the back through hole is connected to the substrate limiting hole, and locking nail holes and pressure block limiting grooves are respectively provided on both sides of the substrate limiting base.

[0011] Preferably, the threaded holes on both sides of the bonding block are matched with the corresponding locking nail holes and the block limiting grooves, and locking screws are provided inside the threaded holes, and the bonding block and the substrate limiting base are tightly fitted through the locking screws.

[0012] Preferably, a plurality of plug-in posts are fixedly connected to the bottom end of the gravity pressing block, and one end of the plug-in posts is matched with the corresponding back through-holes.

[0013] Preferably, a plurality of permanent magnet limiting holes are provided inside the bonding pressing block, and the permanent magnet limiting holes are matched with corresponding permanent magnets.

[0014] Preferably, a microstrip substrate is provided on the top of the permanent magnet.

[0015] Compared with the prior art, the present invention has the following beneficial effects:

[0016] 1. In the present invention, the bonding fixture can effectively improve the bonding efficiency of the product, save time, and reduce work intensity. Compared with pure manual bonding, the use of this fixture can improve the bonding efficiency. At the same time, the use of the bonding fixture for bonding can also effectively improve the bonding accuracy of the permanent magnet position, making the product more consistent, which is also conducive to improving the qualified rate of the entire batch of products.

[0017] 2. In the present invention, through the setting of the locking screws, the bonding pressure block and the substrate limiting base are tightly fitted through the locking screws. The bonding pressure block and the substrate limiting base can be separated by removing multiple locking screws, and then the gravity pressure block is pulled to make the multiple plug-in columns on one side of the gravity pressure block disengage from the corresponding back through holes. In this way, the bonding clamp can be disassembled conveniently and quickly, thereby improving the convenience of use. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 Schematic diagram of the shielded microstrip substrate structure before bonding;

[0019] Figure 2 Schematic diagram of the shielded microstrip substrate structure after traditional manual bonding;

[0020] Figure 3 Schematic diagram of the substrate limiting base structure;

[0021] Figure 4 It is a schematic diagram of the bonding block structure;

[0022] Figure 5 Schematic diagram of gravity briquetting structure;

[0023] Figure 6 Schematic diagram of the bonding fixture structure.

[0024] In the picture:

[0025] 1. Substrate limiting base; 2. Adhesive pressure block; 3. Gravity pressure block; 4. Substrate limiting hole; 5. Back through hole; 6. Locking pin hole; 7. Pressure block limiting groove; 8. Permanent magnet limiting hole; 9. Microstrip substrate; 10. Permanent magnet; 11. Locking screw. DETAILED DESCRIPTION

[0026] In order to make the technical means, creative features, objectives and effects achieved by the present invention easier to understand, the present invention is further described below in conjunction with specific implementation methods. Example 1

[0027] like Figure 1-6 As shown, a bonding fixture for a shielded microstrip spacer ring assembly includes a substrate limiting base 1, a bonding pressing block 2 arranged on the top of the substrate limiting base 1, and a gravity pressing block 3 arranged on the top of the bonding pressing block 2.

[0028] The bonding block 2 is made of industrial pure iron with nickel plating on the surface, which has good corrosion resistance. A plurality of permanent magnets 10 are provided on the top of the substrate limiting base 1 , and threaded holes are provided on both sides of the inside of the bonding block 2 .

[0029] A plurality of parallel substrate limiting holes 4 are provided inside the substrate limiting base 1, a back through hole 5 is provided on the back of the substrate limiting base 1, the back through hole 5 is connected to the substrate limiting hole 4, and locking nail holes 6 and pressure block limiting grooves 7 are respectively provided on both sides of the substrate limiting base 1.

[0030] The threaded holes on both sides of the bonding block 2 are matched with the corresponding locking nail holes 6 and the block limiting grooves 7, and locking screws 11 are provided inside the threaded holes. The bonding block 2 and the substrate limiting base 1 are tightly fitted through the locking screws 11.

[0031] The bottom end of the gravity pressing block 3 is fixedly connected with a plurality of plug-in posts, and one end of the plug-in post is matched with the corresponding back through hole 5.

[0032] The gravity pressing block 3 passes through the substrate limiting base 1 through the back through hole 5 and presses on the back of the microstrip substrate 9;

[0033] A plurality of permanent magnet limiting holes 8 are provided inside the bonding pressing block 2 , and the permanent magnet limiting holes 8 are matched with corresponding permanent magnets 10 .

[0034] A microstrip substrate 9 is provided on the top of the permanent magnet 10 .

[0035] According to the size of the microstrip substrate 9 to be bonded, it is necessary to match the size of the substrate limiting hole 4. The substrate limiting hole size 4 needs to be 0.05mm wider than the microstrip substrate 9. The diameter of the permanent magnet 10 and the diameter of the permanent magnet limiting hole 8 must not differ by more than 0.03mm, so that the microstrip substrate 9 and the permanent magnet 10 can be smoothly placed in the corresponding limiting holes without getting stuck or being too loose, which affects the bonding accuracy.

[0036] This bonding fixture can effectively improve the bonding efficiency of the product, save time, and reduce work intensity. Compared with pure manual bonding, the use of this fixture can improve the bonding efficiency. At the same time, the use of the bonding fixture for bonding can also effectively improve the bonding accuracy of the permanent magnet position, making the product more consistent, which is also conducive to improving the qualified rate of the entire batch of products. Example 2

[0037] like Figure 1-6 As shown, a bonding fixture for a shielded microstrip spacer ring assembly includes a substrate limiting base 1, a bonding pressing block 2 arranged on the top of the substrate limiting base 1, and a gravity pressing block 3 arranged on the top of the bonding pressing block 2.

[0038] The material of the bonding block 2 is industrial pure iron. A plurality of permanent magnets 10 are provided on the top of the substrate limiting base 1 . Threaded holes are provided on both sides of the interior of the bonding block 2 .

[0039] A plurality of parallel substrate limiting holes 4 are provided inside the substrate limiting base 1, a back through hole 5 is provided on the back of the substrate limiting base 1, the back through hole 5 is connected to the substrate limiting hole 4, and locking nail holes 6 and pressure block limiting grooves 7 are respectively provided on both sides of the substrate limiting base 1.

[0040] The threaded holes on both sides of the bonding block 2 are matched with the corresponding locking nail holes 6 and the block limiting grooves 7, and locking screws 11 are provided inside the threaded holes. The bonding block 2 and the substrate limiting base 1 are tightly fitted through the locking screws 11.

[0041] The bottom end of the gravity pressing block 3 is fixedly connected with a plurality of plug-in posts, and one end of the plug-in post is matched with the corresponding back through hole 5.

[0042] A plurality of permanent magnet limiting holes 8 are provided inside the bonding pressing block 2 , and the permanent magnet limiting holes 8 are matched with corresponding permanent magnets 10 .

[0043] A microstrip substrate 9 is provided on the top of the permanent magnet 10 .

[0044] The bonding block 2 and the substrate limiting base 1 are tightly fitted together by the locking screws 11. The bonding block 2 and the substrate limiting base 1 can be separated by removing multiple locking screws 11, and then the gravity block 3 is pulled to make the multiple plug-in columns on one side of the gravity block 3 disengage from the corresponding back through holes 5. This makes it easy and quick to disassemble the bonding clamp, improving the convenience of use.

[0045] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions are merely illustrative of the principles of the present invention. Various changes and improvements may be made to the present invention without departing from the spirit and scope of the present invention. Such changes and improvements are intended to fall within the scope of the present invention. The scope of protection claimed in this invention is defined by the appended claims and their equivalents.

Claims

1. A bonding fixture for a shielded microstrip spacer ring assembly, characterized in that: It comprises a substrate limiting base (1), an adhesive pressing block (2) arranged at the top of the substrate limiting base (1), and a gravity pressing block (3) arranged at the top of the adhesive pressing block (2).

2. The bonding fixture for a shielded microstrip spacer ring assembly according to claim 1, characterized in that: The material of the bonding pressing block (2) is industrial pure iron, a plurality of permanent magnets (10) are provided on the top of the substrate limiting base (1), and threaded holes are provided on both sides of the interior of the bonding pressing block (2).

3. The bonding fixture for a shielded microstrip spacer ring assembly according to claim 2, characterized in that: The substrate limiting base (1) is provided with a plurality of parallel substrate limiting holes (4) inside, the back of the substrate limiting base (1) is provided with a back through hole (5), the back through hole (5) is connected to the substrate limiting hole (4), and locking nail holes (6) and pressure block limiting grooves (7) are respectively provided on both sides of the substrate limiting base (1).

4. The bonding fixture for a shielded microstrip spacer ring assembly according to claim 3, characterized in that: The threaded holes on both sides of the bonding pressure block (2) are matched with the corresponding locking nail holes (6) and the pressure block limiting grooves (7), and locking screws (11) are provided inside the threaded holes. The bonding pressure block (2) and the substrate limiting base (1) are tightly fitted through the locking screws (11).

5. The bonding fixture for a shielded microstrip spacer ring assembly according to claim 4, characterized in that: The bottom end of the gravity pressing block (3) is fixedly connected to a plurality of plug-in columns, and one end of the plug-in column is matched with the corresponding back through hole (5).

6. The bonding fixture for a shielded microstrip spacer ring assembly according to claim 5, characterized in that: A plurality of permanent magnet limiting holes (8) are provided inside the bonding pressing block (2), and the permanent magnet limiting holes (8) are matched with corresponding permanent magnets (10).

7. The bonding fixture for a shielded microstrip spacer ring assembly according to claim 6, characterized in that: A microstrip substrate (9) is provided at the top of the permanent magnet (10).