Energy-saving and environment-friendly air cooler for refrigeration house

By using a combination of semiconductor refrigeration sheets and heat conducting sheets in the cold storage, the waste heat waste and air pollution problems of the cold storage air cooler are solved, the uniform flow of air in the cold storage and the reuse of waste heat are achieved, and the effect of energy saving and environmental protection is achieved.

CN223412335UActive Publication Date: 2025-10-03ANHUI XINHE ELECTROMECHANICAL EQUIP CO LTD
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Patent Information

Application Number
CN202422928755.X
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-11-28
Publication Date
2025-10-03
Estimated Expiration
2034-11-28

AI Technical Summary

Technical Problem

Existing cold storage air coolers generate waste heat resources and air pollution during refrigeration, and the refrigerants used are not environmentally friendly.

Method used

It uses a combination of semiconductor refrigeration sheets and heat conducting sheets, uses the temperature difference effect of the semiconductor refrigeration sheets to cool down, and collects and reuses heat through the heat conducting sheets, eliminating the need for compressors, condensers and throttle valves, and uses exhaust fans to collect hot air.

Benefits of technology

It achieves uniform air flow in the cold storage, saves energy and protects the environment, reduces pollution to the environment, reduces maintenance costs, and reuses waste heat.

✦ Generated by Eureka AI based on patent content.

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Abstract

According to the energy-saving and environment-friendly air cooler for the refrigeration house, when a plurality of semiconductor chilling plates are started for refrigeration, a back row cooling fan is started to exhaust cold air, in the process, air in the refrigeration house flows due to the air circulation effect, and the progress that the cold air is evenly distributed in the refrigeration house is accelerated; meanwhile, the semiconductor chilling plate transmits heat to the heat-conducting fins, after the heat-conducting fins conduct the heat out of the refrigeration house, the multiple heat-conducting fins transmit a large amount of heat to air in the gaps, hot air exists in the gaps, and at the moment, an exhaust fan is started to exhaust the hot air in the gaps of the multiple heat-conducting fins and convey the hot air to a hot air collecting pipeline to the next procedure; the air cooler does not use any refrigerant, is environment-friendly, and saves the maintenance cost; the semiconductor chilling plate of the air cooler can generate heat during refrigeration, the heat is collected and reused through the collecting assembly, waste heat is developed and utilized, and the energy-saving and environment-friendly effects are achieved.
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Description

Technical Field

[0001] The utility model belongs to the technical field of cold storage air coolers, and in particular relates to an energy-saving and environment-friendly cold storage air cooler. Background Art

[0002] A cold storage air cooler is a type of cold storage evaporator (also known as an air cooler in the industry). The function of a cold storage air cooler is to vaporize the saturated refrigerant through the air cooler, which will act as the cold storage thermal expansion valve. This heat exchanger removes the heat from the cold storage. The principle is that the low-temperature, low-pressure liquid refrigerant vaporizes on one side of the evaporator's heat transfer wall, absorbing heat, thereby cooling the medium on the other side of the heat transfer wall. The cooled medium is usually water or air.

[0003] Existing air coolers for cold storage generate waste heat during refrigeration, and the existing air coolers directly discharge the waste heat into the atmosphere, resulting in a waste of resources; the existing air coolers use a compressor, condenser, evaporator and throttle valve to work together for refrigeration, and refrigerant needs to be added to the air cooler. The use of refrigerant will cause air pollution, which is not conducive to environmental protection; therefore, the utility model proposes an energy-saving and environmentally friendly air cooler for cold storage to solve the above problems. Utility Model Content

[0004] The utility model provides an energy-saving and environment-friendly air cooler for a cold storage, aiming to solve the problems raised by the background technology.

[0005] The utility model is realized as follows: an energy-saving and environmentally friendly cold air cooler for cold storage comprises a fixing plate, a refrigeration component and a collection component;

[0006] The fixing plate is fixedly arranged inside the wall of the cold storage, the refrigeration component is located inside the cold storage and connected to the fixing plate, and the collection component is located outside the cold storage and connected to the fixing plate;

[0007] The refrigeration assembly includes a frame, the frame is fixedly connected to the fixed plate, the frame is provided with a semiconductor refrigeration fin near the rear side, the semiconductor refrigeration fin includes a heat dissipation end and a cold dissipation end, the frame is provided with a cooling fan near the front side, and the cooling fan is close to the cold dissipation end of the semiconductor refrigeration fin;

[0008] The collecting assembly includes a mounting plate, which is fixedly mounted on the fixing plate. A heat conducting plate is provided on the mounting plate, and the heat conducting plate is connected to the heat dissipation end of the semiconductor refrigeration plate. An exhaust fan is provided on one side of the heat conducting plate.

[0009] Preferably, a plurality of the semiconductor refrigeration plates are provided, and the plurality of the semiconductor refrigeration plates are evenly spaced apart in the vertical direction.

[0010] Preferably, a plurality of cooling fans are provided, and the plurality of cooling fans are spaced apart in the vertical direction.

[0011] Preferably, a plurality of the heat conducting plates are provided, and the plurality of heat conducting plates are evenly spaced apart in the horizontal direction.

[0012] Preferably, the exhaust fan is connected to the hot air collection duct.

[0013] Compared with the prior art, the beneficial effects of the present invention are:

[0014] When multiple semiconductor refrigeration chips are started for cooling, the cooling end of the semiconductor refrigeration chip transports the cold air to the rear end of the exhaust fan, and the exhaust fan starts to discharge the cold air. In this process, the air in the cold storage flows due to the air circulation, which speeds up the process of evenly distributing the cold air in the cold storage. At the same time, the semiconductor refrigeration chip transfers heat to the heat dissipation end of the semiconductor refrigeration chip, and then the heat is transferred out of the cold storage through the heat conducting chip, which also changes the temperature difference between the heat dissipation end and the cooling end of the semiconductor refrigeration chip, so that the cooling can be carried out continuously. After the heat conducting chip conducts the heat outside the cold storage, a large amount of heat is transferred to the gap between the multiple heat conducting chips. The air in the gap is heated, and then the exhaust fan is started to extract the hot air in the gaps between the multiple heat conducting plates, and transport it to the hot air collection pipeline to the next process (that is, the hot air is sent to the heat collection equipment); the air cooler does not use any refrigerant when in use, which is not only environmentally friendly, but also saves the cost of maintaining the compressor, condenser, evaporator and throttle valve; the semiconductor refrigeration plate of the air cooler will generate a lot of heat during cooling, and the heat will be collected and reused through the collection component, which is not only beneficial to the cooling of the semiconductor refrigeration plate, but also can develop and utilize the waste heat, playing a role in energy saving and environmental protection. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a three-dimensional diagram of the overall structure of the utility model;

[0016] Figure 2 This is a front view of the overall structure of the utility model;

[0017] Figure 3 This is a left view of the overall structure of the utility model;

[0018] Figure 4 This is a three-dimensional diagram of the refrigeration component structure in this utility model.

[0019] In the picture:

[0020] 1. Fixed plate;

[0021] 2. Refrigeration assembly; 21. Frame; 22. Semiconductor refrigeration chip; 23. Cooling fan;

[0022] 3. Collection assembly; 31. Mounting plate; 32. Heat conducting sheet; 33. Exhaust fan. DETAILED DESCRIPTION

[0023] The technical solution of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.

[0024] The components of the embodiments of the present invention generally described and shown in the drawings herein may be arranged and designed in a variety of different configurations. Therefore, the following detailed description of the embodiments of the present invention provided in the drawings is not intended to limit the scope of the claimed invention, but rather merely represents selected embodiments of the present invention.

[0025] Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative work shall fall within the scope of protection of the present invention.

[0026] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating positions or relationships, are based on the positions or relationships shown in the accompanying drawings and are intended solely to facilitate the description of this utility model and simplify the description. They do not indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0027] In the description of this utility model, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections, electrical connections; direct connections, indirect connections through an intermediate medium, and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on the specific circumstances.

[0028] See also Figures 1 to 4The utility model provides a technical solution: an energy-saving and environmentally friendly air cooler for a cold storage, comprising a fixed plate 1, a refrigeration component 2 and a collecting component 3; the fixed plate 1 is fixedly arranged inside the wall of the cold storage, the refrigeration component 2 is located inside the cold storage and connected to the fixed plate 1, and the collecting component 3 is located outside the cold storage and connected to the fixed plate 1; the refrigeration component 2 comprises a frame 21, the frame 21 is fixedly connected to the fixed plate 1, a semiconductor refrigeration plate 22 is provided near the rear side of the frame 21, the semiconductor refrigeration plate 22 includes a heat dissipation end and a cold dissipation end, a cooling fan 23 is provided near the front side of the frame 21, and the cooling fan 23 is close to the cold dissipation end of the semiconductor refrigeration plate 22; the collecting component 3 comprises a mounting plate 31, the mounting plate 31 is fixedly mounted on the fixed plate 1, a heat conducting plate 32 is provided on the mounting plate 31, the heat conducting plate 32 is connected to the heat dissipation end of the semiconductor refrigeration plate 22, and an exhaust fan 33 is provided on one side of the heat conducting plate 32.

[0029] In the present embodiment, in principle, the semiconductor refrigeration plate 22 is a heat transfer tool. When current flows through a thermocouple pair formed by connecting an N-type semiconductor material and a P-type semiconductor material, heat transfer will occur between the two ends, and the heat will be transferred from one end to the other end, thereby generating a temperature difference to form hot and cold ends, namely the heat dissipation end and the cold end of the semiconductor refrigeration plate 22. In order to achieve a lower temperature, the temperature of the hot end can be reduced by heat dissipation or other methods, that is, the heat of the heat dissipation end of the semiconductor refrigeration plate 22 is conducted out through multiple heat conducting plates 32; when multiple semiconductor refrigeration plates 22 are started for cooling, the cold end of the semiconductor refrigeration plate 22 transports the cold air to the rear end of the exhaust fan 23, and the rear exhaust fan 23 is started to discharge the cold air. In this process, the air in the cold storage flows due to the air circulation effect, which speeds up the process of evenly distributing the cold air in the cold storage; at the same time, the semiconductor refrigeration plate 22 transfers the heat to the semiconductor refrigeration plate The heat dissipation end of the sheet 22, and then the heat is transferred out of the cold storage through the heat conducting sheet 32, which also causes the temperature difference between the heat dissipation end and the cold end of the semiconductor refrigeration sheet 22 to change, so that refrigeration can be carried out continuously. After the heat conducting sheet 32 ​​transfers the heat to the outside of the cold storage, multiple heat conducting sheets 32 transfer a large amount of heat to the air in the gap, so that there is hot air in the gap. At this time, the exhaust fan 33 is started to extract the hot air in the gap between the multiple heat conducting sheets 32, and transport it to the hot air collection pipeline to the next process (that is, the hot air is sent to the heat collection equipment); this air cooler does not use any refrigerant when in use, which is not only environmentally friendly, but also saves the cost of maintaining the compressor, condenser, evaporator and throttle valve; the semiconductor refrigeration sheet 22 of this air cooler will generate a lot of heat during cooling, and the heat is collected and reused through the collection component 3, which is not only beneficial to the refrigeration of the semiconductor refrigeration sheet 22, but also can develop and utilize the waste heat, playing a role in energy saving and environmental protection.

[0030] For further information, see Figure 4There are multiple semiconductor refrigeration plates 22, and the multiple semiconductor refrigeration plates 22 are evenly spaced along the vertical direction.

[0031] For further information, see Figure 4 There are multiple cooling fans 23, and the multiple cooling fans 23 are distributed at intervals along the vertical direction.

[0032] For further information, see Figure 1 There are multiple heat conducting plates 32, and the multiple heat conducting plates 32 are evenly spaced along the horizontal direction.

[0033] In this embodiment, multiple semiconductor refrigeration plates 22 evenly spaced along the vertical direction work simultaneously and can output a large amount of cold air and hot air at the same time, which is convenient for the cold storage to quickly cool down to the preset value; multiple exhaust fans 23 spaced along the vertical direction simultaneously send cold air into the cold storage. During this process, the air circulation causes the air in the cold storage to flow, which speeds up the process of evenly distributing the cold air in the cold storage; multiple heat conducting plates 32 evenly spaced along the horizontal direction can quickly extract the heat from the heat dissipation end of the semiconductor refrigeration plate 22 to avoid affecting the cooling effect.

[0034] Furthermore, the exhaust fan 33 is connected to the hot air collecting duct.

[0035] In this embodiment, after the heat conducting plate 32 conducts the heat to the outside of the cold storage, a large amount of heat is transferred to the air in the gaps between the multiple heat conducting plates 32, so that hot air exists in the gaps. At this time, the exhaust fan 33 is started to extract the hot air in the gaps between the multiple heat conducting plates 32 and transport it to the hot air collection pipe to the next process (i.e., sending the hot air into the heat collection equipment).

[0036] The working principle and use process of the present invention are as follows: when multiple semiconductor refrigeration sheets 22 are started for cooling, the cooling end of the semiconductor refrigeration sheet 22 transmits the cold air to the rear end of the cooling fan 23, and then the cooling fan 23 is started to discharge the cold air. In this process, the air in the cold storage flows due to the air circulation effect, which speeds up the process of evenly distributing the cold air in the cold storage; at the same time, the semiconductor refrigeration sheet 22 transfers heat to the heat dissipation end of the semiconductor refrigeration sheet 22, and then the heat is transferred out of the cold storage through the heat conducting sheet 32, which also causes the temperature difference between the heat dissipation end and the cooling end of the semiconductor refrigeration sheet 22 to change, so that cooling can be carried out continuously. After the heat conducting sheet 32 ​​conducts the heat outside the cold storage, the heat dissipation end is cooled by the heat conducting sheet 32. The sheet 32 ​​transfers a large amount of heat to the air in the gap, so that there is hot air in the gap. At this time, the exhaust fan 33 is started to extract the hot air in the gaps between the multiple heat-conducting sheets 32 and transport it to the hot air collection pipeline to the next process (that is, the hot air is sent to the heat collection equipment); this air cooler does not use any refrigerant when in use, which is not only environmentally friendly, but also saves the cost of maintaining the compressor, condenser, evaporator and throttle valve; the semiconductor refrigeration sheet 22 of this air cooler will generate a lot of heat during cooling, and the heat will be collected and reused through the collection component 3, which is not only beneficial to the cooling of the semiconductor refrigeration sheet 22, but also can develop and utilize the waste heat, playing a role in energy saving and environmental protection.

[0037] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. An energy-saving and environmentally friendly cold storage air cooler, characterized by: It comprises a fixing plate (1), a refrigeration component (2) and a collection component (3); The fixing plate (1) is fixedly arranged inside the wall of the cold storage, the refrigeration component (2) is located inside the cold storage and connected to the fixing plate (1), and the collection component (3) is located outside the cold storage and connected to the fixing plate (1); The refrigeration assembly (2) includes a frame (21), the frame (21) is fixedly connected to the fixed plate (1), a semiconductor refrigeration plate (22) is provided near the rear side of the frame (21), the semiconductor refrigeration plate (22) includes a heat dissipation end and a cooling end, and a cooling fan (23) is provided near the front side of the frame (21), and the cooling fan (23) is close to the cooling end of the semiconductor refrigeration plate (22); The collecting assembly (3) comprises a mounting plate (31), the mounting plate (31) being fixedly mounted on the fixing plate (1), a heat conducting plate (32) being provided on the mounting plate (31), the heat conducting plate (32) being connected to the heat dissipation end of the semiconductor refrigeration plate (22), and an exhaust fan (33) being provided on one side of the heat conducting plate (32).

2. The energy-saving and environmentally friendly cold storage air cooler according to claim 1, characterized in that: A plurality of the semiconductor refrigeration sheets (22) are provided, and the plurality of the semiconductor refrigeration sheets (22) are evenly spaced and distributed in the vertical direction.

3. The energy-saving and environmentally friendly cold storage air cooler according to claim 1, characterized in that: A plurality of the cooling fans (23) are provided, and the plurality of cooling fans (23) are distributed at intervals along the vertical direction.

4. The energy-saving and environmentally friendly cold storage air cooler according to claim 1, characterized in that: A plurality of the heat conducting plates (32) are provided, and the plurality of heat conducting plates (32) are evenly spaced and distributed in the horizontal direction.

5. The energy-saving and environmentally friendly cold storage air cooler according to claim 1, characterized in that: The exhaust fan (33) is connected to the hot air collection pipe.