Heating disc and thin film deposition equipment

Abstract

The utility model discloses a heating disc and thin film deposition equipment, the heating disc comprises: a disc body, a disc handle and at least one group of exhaust flow channel, the disc handle is connected to the center of the disc body, the center of the disc body is provided with a disc handle projection area in the vertical projection direction of the disc body, and the disc handle projection area is provided with an exhaust flow channel. The disc body is provided with a disc handle, the disc handle is provided with an air suction flow channel, the air suction flow channel comprises a first air suction hole, a second air suction hole and a connecting flow channel, the first air suction hole is formed in the disc body, the second air suction hole is formed in the disc handle, the connecting flow channel is formed in the disc body and / or the disc handle, and the first air suction hole is communicated with the second air suction hole through the connecting flow channel; wherein the first air exhaust hole is formed outside the disc handle projection area. Therefore, the first air exhaust hole is far away from the second air exhaust hole and avoids the disc handle projection area, heat brought away by gas flowing is reduced, the situation that the temperature of the disc handle projection area is low is improved, and the heating disc is prevented from being broken due to the fact that the outside is hot and the inside is cold.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, in particular to a heating disk and thin film deposition equipment. Background Art

[0002] In the design of the vacuum adsorption heating plate (Vacuum Chuck Heater, hereinafter referred to as VC Heater), ensuring that the gas between the wafer and the plate body can be effectively extracted is the key to achieving precise control of back pressure and then realizing vacuum adsorption and desorption functions. To this end, the VC Heater is equipped with a carefully designed Vacuum Chuck Channel (VC Channel, i.e. vacuum adsorption flow channel) and Pump Hole (extraction hole). These structures allow the gas on the back of the wafer to pass through the flow channel of the plate body and eventually be extracted by the vacuum pump through the Shaft Pump Hole located on the side wall of the Shaft (plate handle). However, this ingenious design also brings two significant technical challenges. First, since the Pump Hole is located in the relatively small Shaft area, the heat carried away during the gas flow is difficult to be effectively compensated by only increasing the density of the heating wire, which results in a relatively low temperature in the Shaft area, forming the so-called "Center Cool" phenomenon. Secondly, to accommodate the heating wire electrode and create the Shaft PumpHole, the shaft's cross-sectional area must be large enough. However, this also makes the shaft itself the primary channel for heat conduction, accelerating heat loss in the shaft area of ​​the disk and further exacerbating "Center Cool." The combined effect of these two issues causes the temperature in the shaft area of ​​the VCHeater to be significantly lower. For ceramic heating disks, this uneven temperature distribution can cause compressive stress inside the heater. Over long-term operation or frequent cycling, this compressive stress can accumulate and exceed the ceramic material's crack resistance, ultimately causing the heater to crack and fail. Utility Model Content

[0003] The embodiments of the present invention provide a heating plate and a thin film deposition device, which aim to solve the problem that the temperature of the shaft area of ​​the existing heating plate is relatively low, resulting in cracking of the heating plate.

[0004] In a first aspect, the present invention provides a heating plate, comprising: a plate body, a plate handle, and at least one set of air extraction channels, wherein the plate handle is connected to the center of the plate body, and the center of the plate body has a plate handle projection area in a vertical projection direction of the plate body, the air extraction channels comprising a first air extraction hole, a second air extraction hole, and a connecting channel, wherein the first air extraction hole is provided on the plate body, the second air extraction hole is provided on the plate handle, and the connecting channel is provided on the plate body and / or the plate handle, and the first air extraction hole is connected to the second air extraction hole through the connecting channel;

[0005] Wherein, the first air extraction hole is arranged outside the projection area of ​​the disk handle.

[0006] Furthermore, the first air extraction hole is arranged on the upper surface of the disk body, and the connecting flow channel is arranged on the side facing away from the upper surface of the disk body. One end of the connecting flow channel is connected to the first air extraction hole outside the disk handle projection area, and the other end of the connecting flow channel is connected to the second air extraction hole within the disk handle projection area.

[0007] Furthermore, the connecting flow channel includes a first flow channel and a second flow channel, the first flow channel extends axially along the disk body, the second flow channel extends radially along the disk body and the disk handle, the upper end of the first flow channel is connected to the first air extraction hole, the lower end of the first flow channel is connected to the outer end of the second flow channel, and the inner end of the second flow channel is connected to the second air extraction hole.

[0008] Furthermore, the second flow channel includes a first radial section provided on the disk body and a second radial section provided on the disk handle, one end of the first radial section is connected to the lower end of the first flow channel, the other end of the first radial section is connected to one end of the second radial section, and the other end of the second radial section is connected to the second air extraction hole.

[0009] Furthermore, the second air extraction hole is opened on the side wall of the disk handle and extends along the axial direction of the disk handle and passes through the top surface of the disk handle. The second radial section extends radially outward from the second air extraction hole toward the disk handle to the edge of the top surface.

[0010] Furthermore, an adsorption channel for adsorbing wafers is provided on the upper surface of the disk, and the first air extraction hole is provided on the adsorption channel.

[0011] Furthermore, the interior of the disk handle is hollow, and a receiving hole for accommodating the electrode is formed in the center of the cross section of the disk handle, and the two second air extraction holes are symmetrically arranged outside the edge of the receiving hole relative to the center of the receiving hole; wherein the wall thickness at the two second air extraction holes is greater than the wall thickness at the receiving hole.

[0012] Furthermore, the cross section of the disk handle is approximately rhombus-shaped.

[0013] Furthermore, two groups of the air exhaust ducts are provided, and the two groups of the air exhaust ducts are symmetrically arranged relative to the center of the heating plate.

[0014] In a second aspect, the present invention further provides a thin film deposition device, comprising the heating plate of the first aspect.

[0015] The utility model provides a heating plate and thin film deposition equipment, the heating plate comprising: a plate body, a plate handle and at least one group of exhaust gas channels, the plate handle is connected to the center of the plate body, the center of the plate body is the projection area of ​​the plate handle, the exhaust gas channels comprise a first exhaust hole provided on the plate body, a second exhaust hole provided on the plate handle and a connecting flow channel provided on the plate body and / or the plate handle, the first exhaust hole is connected to the second exhaust hole through the connecting flow channel, the first exhaust hole is arranged outside the projection area of ​​the plate handle, thereby making the first exhaust hole away from the second exhaust hole and avoiding the projection area of ​​the plate handle, reducing the heat carried away by the gas flow, improving the situation where the temperature in the projection area of ​​the plate handle is relatively low, and avoiding the fragmentation of the heating plate due to external heat and internal cold. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0017] Figure 1 A schematic diagram of a prior art heating plate is shown;

[0018] Figure 2 Shown Figure 1 A partial enlarged schematic diagram;

[0019] Figure 3 A perspective schematic diagram of a heating plate according to an embodiment of the present invention is shown;

[0020] Figure 4 Shown Figure 3 A partial enlarged schematic diagram;

[0021] Figure 5 A perspective schematic diagram showing a handle of a heating plate according to an embodiment of the present invention is shown;

[0022] Figure 6 Shown Figure 5 A partial enlarged schematic diagram;

[0023] Figure 7 A cross-sectional perspective diagram of a heating plate handle of an embodiment of the present invention is shown;

[0024] Figure 8 A schematic cross-sectional top view of a heating plate handle according to an embodiment of the present invention is shown;

[0025] Reference numerals:

[0026] 1. Disk body; 11. First air extraction hole; 12. Adsorption channel; 121. Large annular channel; 122. Medium annular channel; 123. Small annular channel; 124. Straight channel; 13. Projection area of ​​disk handle; 14. First channel; 15. First radial section; 2. Disk handle; 21. Second air extraction hole; 22. Second radial section; 23. Accommodation hole; 24. Electrode. DETAILED DESCRIPTION

[0027] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0028] Directional terms used in this disclosure, such as "upper," "lower," "front," "rear," "left," "right," "inner," "outer," and "side," refer only to directions in the accompanying drawings. Therefore, these directional terms are intended to illustrate and facilitate understanding of this disclosure and are not intended to limit this disclosure. Furthermore, in the accompanying drawings, similar or identical structures are denoted by the same reference numerals.

[0029] There are two problems in the process of the gas on the back of the wafer passing through the flow channel of the heater plate and finally being pumped away through the pump hole on the side wall of the shaft. Figure 1 and 2As shown, firstly, since the Pump Hole on the disk body is coaxial with the Pump Hole on the Shaft and is located on the same straight line, the position of the Pump Hole on the disk body is in a relatively small Shaft area. This design makes it difficult to effectively compensate for the heat carried away by the gas flow simply by increasing the density of the heating wire, resulting in the problem of low temperature in the Shaft area (also known as Center Cool). Secondly, in order to meet the installation requirements of the heating wire electrode, sufficient space must be reserved inside the Shaft. However, the traditional cylindrical Shaft, due to its large cross-sectional area, easily becomes the main channel for heat conduction, which accelerates the loss of heat in the Shaft area of ​​the disk body. This phenomenon further aggravates the temperature drop in the Shaft area and affects the stability and uniformity of the overall heating effect. In summary, the two problems work together to cause the phenomenon of low temperature in the Shaft area. For a vacuum adsorption heating disk made of ceramic material, this uneven temperature distribution may cause internal compressive stress, thereby increasing the risk of cracking.

[0030] To this end, an embodiment of the present invention proposes a heating plate and a thin film deposition device, which solves the problem of the low shaft area. By moving the first exhaust hole away from the shaft area, the heat carried away by the gas flow is reduced, and the low temperature in the center of the heating plate is avoided, thereby largely avoiding the risk of the heating plate breaking due to external heat and internal coldness.

[0031] The embodiment of the present invention aims to solve the problem of low temperature in the shaft area. The specific ideas are as follows:

[0032] On the one hand, the pump hole of the disk body and the pump hole of the shaft are designed to be non-coaxial, so that the pump hole of the disk body can be far away from the center area of ​​the heating disk (also known as the shaft area). This can reduce the heat carried away by the gas flow, thereby improving the Center Cool problem caused by setting the pump hole in the center area. On the other hand, the cross-sectional shape of the outer surface of the shaft adopts a near-diamond design. Under the premise of determining the position of the shaft exhaust hole, the wall thickness and cross-sectional area can be reduced, which means that the heat dissipation area is reduced, thereby reducing the heat dissipation of the shaft, further improving the Center Cool problem caused by excessive heat dissipation of the shaft.

[0033] In order to better understand the above technical solution, the above technical solution will be described in detail below with reference to the accompanying drawings and specific implementation methods.

[0034] See also Figure 3-Figure 8, an embodiment of the present utility model shows a heating plate, comprising: a plate body 1, a plate handle 2 and at least one group of air exhaust channels, the plate handle 2 is connected to the center of the plate body 1, the center of the plate body 1 has a plate handle projection area 13 in the vertical projection direction of the plate body 1, the air exhaust channel comprises a first air exhaust hole 11, a second air exhaust hole 21 and a connecting channel, the first air exhaust hole 11 is provided on the plate body 1, the second air exhaust hole 21 is provided on the plate handle 2, the connecting channel is provided on the plate body 1 and / or the plate handle 2, the first air exhaust hole 11 is connected to the second air exhaust hole 21 through the connecting channel; wherein, the first air exhaust hole 11 is provided outside the plate handle projection area 13.

[0035] Reference Figure 3Specifically, the disk body 1 is in the form of a disk structure as a whole, and the disk handle 2 is in the form of a cylindrical structure as a whole. The disk handle 2 is connected to the center of the disk body 1, and the disk handle 2 is perpendicular to the disk body 1. The heating disk is provided with at least one set of air exhaust channels. In this embodiment, there are two sets of air exhaust channels, and the two sets of air exhaust channels are symmetrically arranged relative to the center of the heating disk so as to generate symmetrical adsorption forces, ensure the stable adsorption of the wafer, and improve the effect of thin film deposition. Of course, it is understandable that other numbers are also possible. The upper surface of the disk body 1 is an adsorption surface, which is used to adsorb the back of the wafer. In order to improve the stability of wafer adsorption, the upper surface of the disk body 1 is provided with an adsorption channel 12 for adsorbing the wafer. Adsorbing the wafer through the adsorption channel 12 can effectively increase the adsorption area, thereby improving the stability of wafer adsorption. The adsorption channel 12 can be of various structures. For example, it can be composed of two annular channels and multiple straight channels 124. The two annular channels are respectively a large annular channel 121 and a small annular channel 123. The large annular channel 121 is arranged on the outer ring of the small annular channel 123. The large annular channel 121 and the small annular channel 123 are connected by multiple straight channels 124. Of course, it can be other channel structures as long as it can increase the effective adsorption area. It is not limited here. Each set of exhaust channels includes a first exhaust hole 11, a second exhaust hole 21 and a connecting channel. The first exhaust hole 11 is opened on the adsorption channel 12 on the upper surface of the disk body 1. The first exhaust hole 11 is connected to the adsorption channel 12. The first exhaust hole 11 can generate negative pressure so that the entire adsorption channel 12 can also have adsorption force and thus adsorb the back side of the wafer. The second exhaust hole 21 is opened on the side wall of the disk handle 2. The second exhaust hole 21 extends along the axial direction of the disk handle 2 to form a channel structure. The connecting flow channel serves as a flow channel connecting the first air extraction hole 11 and the second air extraction hole 21. The connecting flow channel can be of various structures. No matter what structure it is, as long as it can connect the first air extraction hole 11 with the second air extraction hole 21, it can be used. For example, the connecting flow channel can be set on the disk body 1, or on the disk handle 2, or on both the disk body 1 and the disk handle 2, which is not limited here. In the vertical projection direction of the disk body 1, the center of the disk body 1 has a disk handle projection area 13. The disk handle projection area 13 is the area occupied by the disk handle 2 on the disk body 1, specifically a small circular area. The existing pump hole of the disk body 1 and the pump hole on the disk handle 2 are both within the disk handle projection area 13. The pump hole of the disk body 1 and the pump hole on the disk handle 2 are coaxial and on the same straight line. The flow of gas will take away heat, resulting in a low temperature in the disk handle projection area 13. The temperature distribution on the upper surface of the heating disk is uneven, with a hot outside and a cold inside distribution, resulting in a Center Cool problem.In order to improve the Center Cool situation, in this embodiment, the first air extraction hole 11 is arranged outside the disk handle projection area 13, so that the first air extraction hole 11 and the second air extraction hole 21 are staggered in the vertical projection direction. They are connected through the connecting flow channel. The two are not coaxial and are not on the same straight line. In this way, the first air extraction hole 11 can be kept away from the disk handle projection area 13, reducing the heat carried away by the gas flow, improving the Center Cool situation, and thus avoiding the problem of fragmentation of the heating plate due to external heat and internal coldness to a large extent. Specifically, the adsorption flow channel 12 may include three annular flow channels, namely a large annular flow channel 121, a medium annular flow channel 122 and a small annular flow channel 123. The large annular flow channel 121, the medium annular flow channel 122 and the small annular flow channel 123 are nested in a ring, that is, the large annular flow channel 121 is located on the outer circle of the medium annular flow channel 122, and the medium annular flow channel 122 is located on the outer circle of the small annular flow channel 123. The large annular flow channel 121, the medium annular flow channel 122 and the small annular flow channel 123 are connected by a straight flow channel 124. The small annular flow channel 123 is located in the disk handle projection area 13, and the large annular flow channel 121 and the medium annular flow channel 122 are located outside the disk handle projection area 13. In this embodiment, the first air extraction hole 11 can be set on the medium annular flow channel 122, and the two first air extraction holes 11 are symmetrically arranged on the medium annular flow channel 122 relative to the center of the disk body 1.

[0036] Through this embodiment, the first air extraction hole 11 of the disk body 1 and the second air extraction hole 21 of the disk handle 2 are made not coaxial. In this way, the position of the first air extraction hole 11 of the disk body 1 can be changed to be away from the axis of the heating disk and avoid the central area, thereby improving the problem of Center Cool in the central area and avoiding the problem of the heating disk being broken due to external heat and internal coldness to a large extent.

[0037] In one embodiment, the first air extraction hole 11 is provided on the upper surface of the disk body 1, and the connecting flow channel is provided on the side facing away from the upper surface of the disk body 1. One end of the connecting flow channel is connected to the first air extraction hole 11 outside the disk handle projection area 13, and the other end of the connecting flow channel is connected to the second air extraction hole 21 inside the disk handle projection area 13. Specifically, the connecting flow channel of this embodiment serves as a connecting flow channel connecting the first air extraction hole 11 and the second air extraction hole 21. The connecting flow channel has a first connecting end and a second connecting end. The first connecting end is provided outside the disk handle projection area 13 and connected to the first air extraction hole 11, and the second connecting end is provided inside the disk handle projection area 13 and connected to the second air extraction hole 21. The first air extraction hole and the second air extraction hole 21 inside and outside the disk handle projection area 13 are connected through the connecting flow channel, so that the gas can be extracted by the vacuum pump to form a negative pressure to generate adsorption force. The connecting flow channel is arranged on the side facing away from the upper surface of the disk body 1. It can be arranged in the lower half of the inside of the disk body 1 or on the back of the disk body 1, as long as it is away from the upper surface of the disk body 1. In this way, the connecting flow channel has little effect on the upper surface temperature of the disk body 1 and will not affect the temperature uniformity.

[0038] In this embodiment, the connecting flow channel includes a first flow channel 14 and a second flow channel. The first flow channel 14 extends along the axial direction of the disk body 1, and the second flow channel extends along the radial direction of the disk body 1 and the disk handle 2. The upper end of the first flow channel 14 is connected to the first air extraction hole 11, the lower end of the first flow channel 14 is connected to the outer end of the second flow channel, and the inner end of the second flow channel is connected to the second air extraction hole 21. Specifically, the connecting flow channel has two sections, one section is a vertical first flow channel 14, and the other section is a horizontal second flow channel. The first flow channel 14 and the second flow channel are connected to form a vertical corner, thereby away from the upper surface of the disk body 1. The first flow channel 14 is opened on the disk body 1 and arranged along the axial direction of the disk body 1, that is, perpendicular to the upper surface of the disk body 1. It has an upper end and a lower end. The upper end is connected to the first air extraction hole 11 on the upper surface of the disk body 1, and the lower end is connected to the outer end of the second flow channel. The second flow channel can be provided on the disk body 1 and the disk handle 2, arranged radially along the disk body 1 and the disk handle 2. The second flow channel has an outer end outside the disk handle projection area 13 and an inner end inside the disk handle projection area 13. The outer end of the second flow channel connects to the lower end of the first flow channel 14 outside the disk handle projection area 13, while the inner end of the second flow channel connects to the second air extraction hole 21 inside the disk handle projection area 13. In this way, the connecting flow channel forms an internal connecting flow channel that curves downward and inward, away from the upper surface of the disk body 1, to avoid affecting temperature uniformity, and has a simple structure and is easy to manufacture.

[0039] Reference Figure 4In a specific embodiment, the second flow channel includes a first radial segment 15 provided on the disk body 1 and a second radial segment 22 provided on the disk handle 2. One end of the first radial segment 15 is connected to the lower end of the first flow channel 14, the other end of the first radial segment 15 is connected to one end of the second radial segment 22, and the other end of the second radial segment 22 is connected to the second air extraction hole 21. Specifically, the second flow channel includes two parts, namely the first radial segment 15 and the second radial segment 22. The first radial segment 15 is provided on the disk body 1, and the second radial segment 22 is provided on the disk handle 2. The first radial segment 15 and the second radial segment 22 are both arranged radially along the heating disk. When the disk body 1 and the disk handle 2 are assembled, the first radial segment 15 and the second radial segment 22 are aligned and face each other. The first radial segment 15 and the second radial segment 22 form a flow channel extending radially along the heating disk. The first air extraction hole 11 and the second air extraction hole 21 are connected through the first flow channel 14, the first radial segment 15, and the second radial segment 22. The first exhaust hole 11 is moved away from the disk handle projection area 13, improving the Center Cool problem. At the same time, the first radial section 15 and the second radial section 22 are moved away from the upper surface of the disk body 1, avoiding affecting the temperature of the upper surface of the disk body 1, improving temperature uniformity, and improving the quality of thin film deposition.

[0040] Reference Figure 5 and Figure 6 Furthermore, the second air extraction hole 21 is provided on the side wall of the disk handle 2 and extends along the axial direction of the disk handle 2 and passes through the top surface of the disk handle 2. The second radial section 22 extends radially outward from the second air extraction hole 21 toward the disk handle 2 to the edge of the top surface. Specifically, the disk handle 2 has an upper flange and a lower flange, and the upper flange is used to connect with the center of the disk body 1. The second air extraction hole 21 is a long channel structure. The second air extraction hole 21 is provided on the side wall of the disk handle 2 and extends along the axial direction of the disk handle 2. One end of the second air extraction hole 21 passes through the top surface of the upper flange. The second radial section 22 is provided on the top surface of the upper flange. One end of the second radial section 22 is connected to the second air extraction hole 21 on the upper flange. The other section of the second radial section 22 extends radially outward to the edge of the upper flange. The second radial section 22 is directly exposed for easy assembly. The structure of the second radial section 22 of this embodiment is simple to process, easy to assemble, and low in cost.

[0041] Reference Figure 7In one embodiment, the interior of the disk handle 2 is hollow, and a receiving hole 23 for receiving the electrode 24 is formed at the center of the cross section of the disk handle 2. The two second air extraction holes 21 are symmetrically arranged outside the edge of the receiving hole 23 relative to the center of the receiving hole 23; wherein the wall thickness of the two second air extraction holes 21 is greater than the wall thickness of the receiving hole 23. Specifically, the disk handle 2 is a hollow cylindrical structure, and an axially arranged receiving hole 23 is opened in the center of the disk handle 2. The receiving hole 23 is used to accommodate the heating wire electrode 24, and the receiving hole 23 can be a circular hole. There are two second air extraction holes 21, which are two symmetrical second air extraction holes 21 of two air extraction channels. The two second air extraction holes 21 are opened on the side wall of the disk handle 2, and the two are symmetrically arranged outside the edge of the receiving hole 23 relative to the center of the disk handle 2. Because the area near the second air extraction hole 21 has more material support, the wall thickness in other areas of the cross-section can be reduced. Specifically, the wall thickness near the second air extraction hole 21 is greater, while the wall thickness near the receiving hole 23 is smaller. This is equivalent to removing the thickness of the sidewalls other than the second air extraction hole 21 from the cylindrical handle 2. This reduces the cross-sectional area of ​​the handle 2 compared to a traditional cylindrical shape, and heat loss due to heat conduction through the sidewalls of the handle 2 is also reduced. This reduces heat dissipation from the handle 2 and further improves the problem of "center cool" caused by excessive heat dissipation from the handle 2.

[0042] Reference Figure 8 In this embodiment, the cross-section of the disk handle 2 is approximately rhombus-shaped. Specifically, the cross-section of the disk handle 2 includes a accommodating hole 23 and two second air extraction holes 21. The accommodating hole 23 is a large circular hole, and the two second air extraction holes 21 are small circular holes. The two small circular holes are symmetrically arranged outside the edge of the large circular hole relative to the center of the large circular hole. In the cross-section, the two small circular holes occupy two opposite vertices, and the two vertices are connected by an arc. By adopting an approximately rhombus-shaped design for the cross-sectional shape of the outer surface of the disk handle 2, the wall thickness and cross-sectional area can be reduced under the premise that the position of the second air extraction hole 21 is determined, thereby reducing the heat dissipation of the disk handle 2 and avoiding the problem of Center Cool caused by excessive heat dissipation of the disk handle 2.

[0043] The present invention also provides a thin film deposition device including the heating plate of the above embodiment. The heating plate has been described in detail in the above embodiment and will not be described again for the sake of brevity.

[0044] By adopting the heating plate of the present embodiment, the first air exhaust hole 11 of the plate body 1 and the second air exhaust hole 21 of the plate handle 2 are designed to be non-coaxial, so that the first air exhaust hole 11 of the plate body 1 can be away from the plate handle projection area 13 of the plate body 1, thereby avoiding the Center Cool problem caused by setting the first air exhaust hole 11 in the plate handle projection area 13; at the same time, the cross-sectional shape of the outer surface of the plate handle 2 is designed to be approximately diamond-shaped. Under the premise that the position of the second air exhaust hole 21 is determined, the wall thickness and cross-sectional area can be reduced, thereby reducing the heat dissipation of the plate handle 2, and avoiding the Center Cool problem caused by excessive heat dissipation of the plate handle 2.

[0045] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in the present invention, and such modifications or substitutions are intended to be within the scope of protection of the present invention. Therefore, the scope of protection of the present invention shall be subject to the scope of protection of the claims.

Claims

1. A heating plate, characterized in that: include: A disk body, a disk handle, and at least one set of air extraction channels, wherein the disk handle is connected to the center of the disk body, and the center of the disk body has a disk handle projection area in the vertical projection direction of the disk body, the air extraction channels include a first air extraction hole, a second air extraction hole, and a connecting channel, the first air extraction hole is provided on the disk body, the second air extraction hole is provided on the disk handle, the connecting channel is provided on the disk body and / or the disk handle, and the first air extraction hole is connected to the second air extraction hole through the connecting channel; Wherein, the first air extraction hole is arranged outside the projection area of ​​the disk handle.

2. The heating plate according to claim 1, wherein: The first air extraction hole is arranged on the upper surface of the disk body, and the connecting flow channel is arranged on the side facing away from the upper surface of the disk body. One end of the connecting flow channel is connected to the first air extraction hole outside the disk handle projection area, and the other end of the connecting flow channel is connected to the second air extraction hole within the disk handle projection area.

3. The heating plate according to claim 2, characterized in that The connecting flow channel includes a first flow channel and a second flow channel, the first flow channel extends along the axial direction of the disk body, and the second flow channel extends along the radial direction of the disk body and the disk handle. The upper end of the first flow channel is connected to the first air extraction hole, the lower end of the first flow channel is connected to the outer end of the second flow channel, and the inner end of the second flow channel is connected to the second air extraction hole.

4. The heating plate according to claim 3, characterized in that The second flow channel includes a first radial section provided on the disk body and a second radial section provided on the disk handle, one end of the first radial section is connected to the lower end of the first flow channel, the other end of the first radial section is connected to one end of the second radial section, and the other end of the second radial section is connected to the second air extraction hole.

5. The heating plate according to claim 4, characterized in that The second air extraction hole is opened on the side wall of the disk handle and extends axially along the disk handle and passes through the top surface of the disk handle. The second radial section extends radially outward from the second air extraction hole toward the disk handle to the edge of the top surface.

6. The heating plate according to claim 1, wherein: An adsorption flow channel for adsorbing wafers is provided on the upper surface of the disk, and the first air extraction hole is provided on the adsorption flow channel.

7. The heating plate according to claim 1, wherein: The interior of the disk handle is hollow, and a receiving hole for receiving the electrode is formed at the center of the cross section of the disk handle, and the two second air extraction holes are symmetrically arranged outside the edge of the receiving hole relative to the center of the receiving hole; wherein the wall thickness at the two second air extraction holes is greater than the wall thickness at the receiving hole.

8. The heating plate according to claim 7, wherein: The cross section of the disk handle is approximately rhombus-shaped.

9. The heating plate according to any one of claims 1 to 8, characterized in that: The air exhaust ducts are provided in two groups, and the two groups of air exhaust ducts are symmetrically arranged relative to the center of the heating plate.

10. A thin film deposition device, characterized in that: The heating plate comprises the heating plate according to any one of claims 1 to 9.

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