Vehicle-mounted charger

Abstract

The utility model discloses a vehicle-mounted charger. The vehicle-mounted charger comprises a cabinet and an OBC module. A mounting surface is arranged on the inner side of the case; the OBC module comprises a heat dissipation shell and an OBC device, the OBC device is arranged on the heat dissipation shell, and the heat dissipation shell is detachably connected with the mounting surface; and when the heat dissipation shell is connected with the mounting surface, the OBC device is accommodated in the case. According to the vehicle-mounted charger, the mounting surface is arranged on the inner side of the case, the OBC device is integrated on the heat dissipation shell to form an independent module, the heat dissipation shell is designed to be detachably connected with the mounting surface on the inner side of the case, and the OBC device is accommodated in the case when the heat dissipation shell is connected with the mounting surface, so that the OBC device is prevented from being damaged. Therefore, the OBC device of the OBC module can be adapted to different cases, and the optional performance of the cases is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of vehicle-mounted chargers, and in particular to a vehicle-mounted charger. Background Art

[0002] An on-board charger (OBC) is a device installed in electric vehicles. Its primary function is to convert alternating current (AC) from the power grid or an AC charging station into the DC power required by the power battery, thereby charging the battery. To meet heat dissipation requirements, current OBC modules, such as inductors and MOS transistors, are typically directly fixed to the chassis, forming an integral part of the OBC module. This integration achieves heat dissipation. This means that a single chassis can only accommodate one fixed-power OBC module, resulting in limited chassis compatibility. Requirement for higher power levels often requires redesigning the chassis to accommodate the module, which is very cumbersome. Utility Model Content

[0003] The embodiment of the present utility model provides an on-board charger, which solves the problem that the OBC module of a traditional on-board charger cannot be adapted to different chassis.

[0004] In a first aspect, an embodiment of the present invention provides a vehicle-mounted charger, comprising:

[0005] a chassis having a mounting surface on an inner side thereof;

[0006] The OBC module includes a heat dissipation housing and an OBC device, wherein the OBC device is disposed in the heat dissipation housing, and the heat dissipation housing is detachably connected to the mounting surface;

[0007] Wherein, when the heat dissipation housing is connected to the mounting surface, the OBC device is accommodated in the chassis.

[0008] In the on-board charger provided in an embodiment of the present utility model, the OBC device includes a magnetic device and a power device. The power device is arranged on the outer side wall of the heat dissipation shell in the horizontal direction. A mounting groove is formed on one side of the heat dissipation shell in the vertical direction, and the magnetic device is accommodated in the mounting groove.

[0009] In the on-board charger provided by an embodiment of the present utility model, the OBC module also includes an OBC mainboard, an assembly surface is formed on one side of the OBC mainboard, and the OBC mainboard is provided with a welding portion on the assembly surface. The side of the heat dissipation housing on which the mounting groove is formed is connected to the assembly surface, and the pins of the magnetic device and the power device are connected to the welding portion.

[0010] In the on-board charger provided by the embodiment of the present utility model, an energy storage device is provided on the OBC mainboard. The energy storage device is located at the edge of the assembly surface and is spaced apart from the power device.

[0011] In the on-board charger provided in an embodiment of the present utility model, the OBC module also includes an upper cover, which is arranged on the side of the heat dissipation shell where the mounting groove is provided and covers the mounting groove, and the assembly surface is attached to the side of the upper cover facing away from the heat dissipation shell, and the upper cover is provided with a through hole, and the pins of the magnetic device pass through the through hole and extend out of the outside of the upper cover.

[0012] In the on-board charger provided by an embodiment of the present invention, the OBC module further includes a spring, the power device is abutted against the outer side wall of the heat dissipation housing in the horizontal direction, and the spring is arranged on one side of the heat dissipation housing in the horizontal direction and elastically presses the power device.

[0013] In the on-board charger provided in an embodiment of the present utility model, the OBC module also includes a fixing bracket, which includes a pressure plate and a positioning pin. A positioning hole is provided on the outside of the power device. The pressure plate is arranged between the spring sheet and the power device with one side abutting against the spring sheet and the other side abutting against the outside of the power device. The positioning pin is fixed to the side of the pressure plate abutting against the power device and is inserted into the positioning hole.

[0014] In the on-board charger provided by an embodiment of the present invention, the fixing bracket further includes a limiting arm, which is fixed to a side of the pressing plate facing the power device and abuts against both sides of the power device in the horizontal direction.

[0015] In the on-board charger provided by an embodiment of the present utility model, the OBC module further includes a thermally conductive insulating film, which is provided between the power device and the outer side wall of the heat dissipation housing.

[0016] In the on-board charger provided in the embodiment of the present invention, a water channel is provided on the inner side of the chassis, and the water channel is adjacent to the installation surface.

[0017] The embodiment of the present invention provides an on-board charger, which includes a chassis and an OBC module; the chassis is provided with a mounting surface on its inner side; the OBC module includes a heat dissipation housing and an OBC device, the OBC device is provided in the heat dissipation housing, and the heat dissipation housing is detachably connected to the mounting surface; wherein, when the heat dissipation housing is connected to the mounting surface, the OBC device is accommodated in the chassis. The on-board charger provided by the embodiment of the present application is provided with a mounting surface on the inner side of the chassis, and the OBC device is integrated into the heat dissipation housing to form an independent module. The heat dissipation housing and the mounting surface on the inner side of the chassis are designed to be detachably connected. When the heat dissipation housing is connected to the mounting surface, the OBC device is accommodated in the chassis, thereby making the OBC device of the OBC module adaptable to different chassis, effectively improving the selectivity of the chassis. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0019] Figure 1 An exploded view of the vehicle charger provided by an embodiment of the present utility model;

[0020] Figure 2 Another exploded view of the on-board charger provided by an embodiment of the present utility model;

[0021] Figure 3 A three-dimensional diagram of a chassis provided by an embodiment of the present utility model;

[0022] Figure 4 A three-dimensional diagram of a vehicle-mounted charger provided in an embodiment of the present utility model;

[0023] Figure 5 A three-dimensional diagram of a heat dissipation housing provided in an embodiment of the present utility model;

[0024] Figure 6 An axonometric diagram of an OBC module provided in an embodiment of the present utility model;

[0025] Figure 7 for Figure 6 A magnified view of part A;

[0026] Figure 8 An exploded view of an OBC module provided in an embodiment of the present utility model;

[0027] Figure 9 An exploded view of the OBC module provided by an embodiment of the present utility model;

[0028] Figure 10 A bottom view of the OBC mainboard provided by an embodiment of the present utility model;

[0029] Figure 11 A bottom view of the OBC module provided in an embodiment of the present utility model;

[0030] Figure 12 A three-dimensional diagram of an OBC module provided in an embodiment of the present utility model;

[0031] Figure 13 An exploded view of an OBC module provided in an embodiment of the present utility model;

[0032] Figure 14 An axonometric diagram of an OBC module provided in an embodiment of the present utility model;

[0033] Figure 15 A three-dimensional diagram of a spring provided in an embodiment of the present utility model;

[0034] Figure 16 A three-dimensional diagram of a fixing bracket provided in an embodiment of the present utility model;

[0035] Figure 17 A three-dimensional diagram of a power device provided in an embodiment of the present utility model;

[0036] The reference numerals in the figures are:

[0037] 10. Chassis; 101. Mounting surface; 100. OBC module; 11. Heat dissipation housing; 110. Mounting slot; 20. OBC device; 21. Magnetic device; 22. Power device; 2201. Positioning hole; 30. OBC mainboard; 301. Assembly surface; 31. Welding part; 32. Energy storage device; 40. Spring clip; 50. Fixed bracket; 51. Pressure plate; 52. Positioning pin; 53. Limiting arm; 60. Thermal insulation film; 70. Upper cover; 701. Through hole. DETAILED DESCRIPTION

[0038] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0039] Directional terms used in this disclosure, such as "upper," "lower," "front," "rear," "left," "right," "inner," "outer," and "side," refer only to directions in the accompanying drawings. Therefore, these directional terms are intended to illustrate and facilitate understanding of this disclosure and are not intended to limit this disclosure. Furthermore, in the accompanying drawings, similar or identical structures are denoted by the same reference numerals.

[0040] Reference Figures 1 to 17 , please refer to Figures 1 to 4 , which shows an embodiment of the on-board charger provided by the utility model. The structure and working principle of the on-board charger are described in detail below with reference to the drawings in the specification. The on-board charger includes a chassis 10 and an OBC module 100; the chassis 10 has a mounting surface 101 on its inner side; the OBC module 100 includes a heat dissipation housing 11 and an OBC device 20, the OBC device 20 being mounted in the heat dissipation housing 11 and detachably connected to the mounting surface 101; wherein, when the heat dissipation housing 11 is connected to the mounting surface 101, the OBC device 20 is accommodated in the chassis 10.

[0041] In a specific implementation, the on-board charger includes a chassis 10 and an OBC module 100. The chassis 10 is the outer shell structure of the entire on-board charger, used to carry and install various components. A mounting surface 101 is provided on the inner side of the chassis 10. The mounting surface 101 is a flat surface provided on the inner side of the chassis 10. The OBC module 100 is the core component for realizing the functions of the on-board charger and is essentially a switching power supply. The OBC module 100 includes a heat dissipation housing 11 and an OBC device 20, in addition to other components. The heat dissipation housing 11 is independent of the chassis 10 and is detachably mounted on the mounting surface 101 on the inner side of the chassis 10. Specifically, corresponding screw holes are provided on the mounting surface 101. The heat dissipation housing 11 can be fixed to the mounting surface 101 on the inner side of the chassis 10 by screws. The heat dissipation housing 11 is designed as a whole using aluminum with good thermal conductivity, which can provide good heat dissipation. The OBC device 20 primarily consists of components that generate significant heat during operation, including but not limited to inductors and power transistors. The OBC device 20 is integrally mounted on the heat dissipation housing 11. Specifically, the OBC device 20 can be positioned on both the interior and exterior sides of the heat dissipation housing 11. Overall, the OBC device 20 and the heat dissipation housing 11 are integrated into a single, independent module. When the heat dissipation housing 11 is connected to the heat dissipation surface inside the chassis 10, the OBC device 20 and the heat dissipation housing 11 are housed within the chassis 10, completing assembly with the chassis. In actual applications, the heat generated by the OBC device 20 during operation can be directly dissipated through the heat dissipation housing 11. The OBC device 20 can also dissipate heat without direct contact with the chassis 10. Since the heat dissipation housing 11 is detachably connected to the mounting surface 101 on the inner side of the chassis 10, the heat dissipation housing 11 and the OBC device 20 constitute an independent module that can be freely disassembled relative to the chassis 10. The OBC device 20 of the OBC module 100 can be adapted to different chassis 10, thereby realizing the portability of the OBC device 20 of the OBC module 100. The selectivity of the chassis 10 of the on-board charger is improved, which can improve the utilization rate of the chassis 10.

[0042] The on-board charger of this embodiment is provided with a mounting surface on the inner side of the chassis, and the OBC device is integrated into the heat dissipation shell to form an independent module. The heat dissipation shell and the mounting surface on the inner side of the chassis are designed to be detachably connected. When the heat dissipation shell is connected to the mounting surface, the OBC device is accommodated in the chassis, so that the OBC device of the OBC module can be adapted to different chassis, thereby improving the selectivity of the chassis.

[0043] In one embodiment, referring to Figures 5 to 8The OBC device 20 includes a magnetic device 21 and a power device 22. The power device 22 is arranged on the outer side wall of the heat dissipation housing 11 in the horizontal direction. A mounting groove 110 is formed on one side of the heat dissipation housing 11 in the vertical direction. The magnetic device 21 is accommodated in the mounting groove 110. In a specific implementation, the OBC device 20 includes a magnetic device 21 and a power device 22. Here, the magnetic device 21 is mainly a large inductor, while the power device 22 is mainly a power tube such as a MOS tube and an IGBT. A mounting groove 110 is formed on one side of the heat dissipation housing 11 in the vertical direction. The mounting groove 110 is a groove structure on one side of the heat dissipation housing 11 in the vertical direction. The shape of the mounting groove 110 is adapted to the outer shape of the magnetic device 21. The magnetic device 21 is entirely accommodated in the mounting groove 110. The magnetic device 21 is fixed to the heat dissipation housing 11 by filling the mounting groove 110 with thermal conductive glue. The magnetic device 21 is relatively large, so it is housed in the mounting slot 110 on one side of the heat dissipation housing 11 in the vertical direction, thus minimizing space in the heat dissipation housing 11. The power device 22 is typically relatively small, and the power device 22 is disposed entirely on the horizontal outer wall of the heat dissipation housing 11. The power device 22 is positioned entirely outside the magnetic device 21, making the devices more compact and reducing the size of the heat dissipation housing 11. Furthermore, the placement of the magnetic device 21 on one side of the heat dissipation housing 11 in the vertical direction, while the power device 22 is located on the horizontal outer wall of the heat dissipation housing 11, effectively prevents interference between the two devices and improves the stability of the on-board charger during operation.

[0044] Further, refer to Figures 9 to 12The OBC module 100 also includes an OBC mainboard 30. An assembly surface 301 is formed on one side of the OBC mainboard 30. The OBC mainboard 30 is provided with a welding portion 31 on the assembly surface 301. The heat dissipation housing 11 is formed with a side of the mounting groove 110 connected to the assembly surface 301. The pins of the magnetic device 21 and the power device 22 are connected to the welding portion 31. In a specific implementation, the OBC module 100 also includes an OBC mainboard 30. The OBC mainboard 30 is composed of a PCB and various small components and is the main carrier for realizing the circuit loop. An assembly surface 301 is formed on one side of the OBC mainboard 30. The assembly surface 301 is a flat area on the OBC mainboard 30. No components are set in this area, forming a avoidance position for the heat dissipation housing 11. A welding portion 31 is provided on the assembly surface 301. The welding portion 31 is a corresponding number of welding pads or welding holes reserved on the assembly surface 301 of the OBC mainboard 30. The heat dissipation shell 11 is formed with a mounting groove 110 on one side connected to the assembly surface 301. The position of the welding portion 31 corresponds to the position of the magnetic device 21 and the power device 22. The pins of the magnetic device 21 and the power device 22 are welded to the corresponding welding portion 31 to complete the electrical connection with the OBC mainboard 30. On the whole, the OBC mainboard 30, the heat dissipation shell 11, the magnetic device 21 and the power device 22 together form a single module. Through the detachable design of the heat dissipation shell 11 and the mounting surface 101 on the inner side of the chassis 10, the single module composed of the OBC mainboard 30, the heat dissipation shell 11, the magnetic device 21 and the power device 22 can be adapted to different chassis 10, and the OBC mainboard 30 can also be optionally matched with different chassis 10.

[0045] Furthermore, refer to Figures 10 to 12 The OBC mainboard 30 is provided with an energy storage device 32, which is located at the edge of the assembly surface 301 and is spaced apart from the power device 22. In a specific implementation, the OBC mainboard 30 is provided with an energy storage device 32, which mainly includes capacitors and some small inductors. These energy storage devices 32 generate little heat when working and are arranged at the edge of the mounting surface 101 and spaced apart from the power device 22. The energy storage device 32 is spaced apart from the power device 22 mainly to prevent the power device 22 from being burned by the high temperature generated during operation. In actual application, the heat generated by the energy storage device 32 during operation can be transferred to the heat dissipation housing 11 for dissipation, thereby effectively cooling the OBC mainboard 30.

[0046] In one embodiment, referring to Figure 8 、 Figure 13 as well as Figure 14The OBC module 100 further includes an upper cover 70, which is disposed on the side of the heat dissipation housing 11 where the mounting slot 110 is disposed and covers the mounting slot 110. The assembly surface 301 is attached to the side of the upper cover 70 facing away from the heat dissipation housing 11. The upper cover 70 is provided with a through hole 701, through which the pins of the magnetic device 21 extend out of the outer side of the upper cover 70. In a specific embodiment, the upper cover 70 is designed using a plastic material. The upper cover 70 is entirely disposed on the side of the heat dissipation housing 11 where the mounting slot 110 is disposed, that is, on the upper side of the heat dissipation housing 11. The upper cover 70 entirely covers the mounting slot 110, so that the magnetic device 21 housed in the mounting slot 110 is blocked and cannot escape from the mounting slot 110. The upper cover 70 is provided with through holes 701, which pass through both sides of the upper cover 70. The position and number of the through holes 701 correspond to the position and number of the pins of the magnetic device 21. The pins of the magnetic device 21 pass through the through holes 701 and extend to the outside of the upper cover 70, that is, the side of the upper cover 70 facing away from the mounting groove 110. The pins of the magnetic device 21 are then led out from the through holes 701. After passing through the through holes 701, the pins of the magnetic device 21 are welded to the welding parts 31 on the OBC main board 30. As a whole, the upper cover 70 separates the magnetic device 21 from the OBC main board 30, which can effectively prevent the direct contact between the magnetic device 21, which generates a lot of heat, and the OBC main board 30, which may affect the performance of the OBC main board 30.

[0047] In one embodiment, referring to Figures 6 to 8 as well as Figure 15 The OBC module 100 further includes a spring clip 40. The power device 22 is abutted against the horizontal outer wall of the heat dissipation housing 11. The spring clip 40 is disposed on one side of the heat dissipation housing 11 in the horizontal direction and elastically presses against the power device 22. In a specific embodiment, the spring clip 40 is primarily used to secure the power device 22. The power device 22 is entirely abutted against the horizontal outer wall of the heat dissipation housing 11, and there is no fixed connection between the power device 22 and the heat dissipation housing 11. The spring clip 40 is a sheet-like structure with a resilient nature. The spring clip 40 is disposed on one side of the heat dissipation housing 11 in the horizontal direction, with one end connected to the outer wall of the heat dissipation housing 11 and the other end elastically pressing against the power device 22. The power device 22 is entirely located between the heat dissipation housing 11 and the spring clip 40, and is pressed and fixed to the horizontal outer wall of the heat dissipation housing 11 by the spring clip 40. The power device 22 can be removed from the heat dissipation housing 11 by applying force to push the spring clip 40 outward, making it very convenient to install or replace the power device 22.

[0048] Further, refer to Figures 6 to 8 as well as Figure 16 and Figure 17The OBC module 100 also includes a fixing bracket 50, which includes a pressure plate 51 and a positioning pin 52. A positioning hole 2201 is provided on the outside of the power device 22. The pressure plate 51 is arranged between the spring piece 40 and the power device 22, with one side abutting against the spring piece 40 and the other side abutting against the outside of the power device 22. The positioning pin 52 is fixed to the side of the pressure plate 51 abutting against the power device 22 and is inserted into the positioning hole 2201. In a specific embodiment, the fixing bracket 50 is primarily used to support the power device 22 so that it maintains a stable connection with the heat dissipation housing 11 and prevents it from tilting. The fixing bracket 50 is made of plastic with good insulation properties. The fixing bracket 50 as a whole includes a pressure plate 51 and a positioning pin 52. The pressure plate 51 is a plate-shaped structure, and the positioning pin 52 is a columnar structure raised on one side of the pressure plate 51. The pressure plate 51 is entirely disposed between the spring 40 and the power component. One side of the pressure plate 51 abuts the spring 40, and the other side abuts the outside of the power device 22. The positioning pin 52 is entirely fixed to the side of the pressure plate 51 abutting the power device 22. A positioning hole 2201 is provided on the outside of the power device 22 to match the positioning pin 52. The length of the positioning pin 52 is less than or equal to the depth of the positioning hole 2201, and the positioning pin 52 is entirely inserted into the positioning hole 2201. As a whole, the spring piece 40 directly presses the pressing plate 51, and the pressing plate 51 presses the outer side of the power device 22. The power device 22 is evenly stressed. At the same time, under the action of the positioning pin 52, the movement of the power device 22 is restricted and cannot move relative to the heat dissipation housing 11, so that the power device 22 remains stable on the horizontal outer wall of the heat dissipation housing 11.

[0049] Furthermore, refer to Figure 8 and Figure 16 The fixing bracket 50 further includes a limiting arm 53, which is fixed to the side of the pressure plate 51 facing the power device 22 and abuts against both sides of the power device 22 in the horizontal direction. In a specific embodiment, the fixing bracket 50 further includes a limiting arm 53, which is connected and fixed to the side of the pressure plate 51 facing the power device 22 and abuts against both sides of the power device 22 in the horizontal direction, thereby clamping the power device 22. The power device 22 is restricted by the limiting arm 53 and cannot tilt. The power device 22 is further stabilized on the horizontal outer wall of the heat dissipation housing 11. The number of limiting arms 53 is set according to the number of power devices 22. When multiple power devices 22 are arranged in a straight line, one limiting arm 53 is set between two adjacent power devices 22. While stabilizing the power devices 22, it can also separate the multiple power devices 22 from each other to prevent interference between the power devices 22.

[0050] In one embodiment, referring to Figure 7 and Figure 8The OBC module 100 also includes a thermally conductive insulating film 60, which is disposed between the power device 22 and the outer wall of the heat dissipation housing 11. Specifically, the thermally conductive insulating film 60 is disposed between the power device 22 and the outer wall of the heat dissipation housing 11. The thermally conductive insulating film 60 is made of an insulating material with excellent thermal conductivity, specifically silicone. The heat dissipation housing 11 is metal, and the thermally conductive insulating film 60 integrally separates the power device 22 from the heat dissipation housing 11, preventing short circuits in the power device 22 while also allowing heat generated by the power device 22 during operation to be transferred to the surface of the heat dissipation housing 11 for dissipation.

[0051] In one embodiment, a water channel (not shown) is provided on the inner side of the chassis 10, and the water channel is adjacent to the mounting surface 101. In a specific implementation, a water channel is provided on the inner side of the chassis 10. The water channel is a cooling channel provided on the inner side of the chassis 10, which is formed by connecting the water inlet and the water outlet on the chassis 10. The water channel is used to circulate coolant, thereby effectively removing the heat from the chassis 10. The water channel on the inner side of the chassis 10 is adjacent to the mounting surface 101, that is, the mounting surface 101 is the outer wall surface of the water channel on the inner side of the chassis 10. When the heat dissipation housing 11 is connected and installed with the mounting surface 101, the heat dissipation housing 11 is equivalent to being attached to the outer wall surface of the water channel. The heat on the heat dissipation housing 11 can be removed by the circulation of coolant in the water channel, thereby achieving more efficient heat dissipation.

[0052] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in the present invention, and such modifications or substitutions should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be based on the scope of protection of the claims.

Claims

1. A vehicle-mounted charger, characterized in that: include: a chassis having a mounting surface on an inner side thereof; The OBC module includes a heat dissipation housing and an OBC device, wherein the OBC device is disposed in the heat dissipation housing, and the heat dissipation housing is detachably connected to the mounting surface; Wherein, when the heat dissipation housing is connected to the mounting surface, the OBC device is accommodated in the chassis.

2. The on-board charger according to claim 1, characterized in that: The OBC device includes a magnetic device and a power device. The power device is arranged on the outer side wall of the heat dissipation housing in the horizontal direction. A mounting groove is formed on one side of the heat dissipation housing in the vertical direction. The magnetic device is accommodated in the mounting groove.

3. The on-board charger according to claim 2, characterized in that: The OBC module also includes an OBC mainboard, an assembly surface is formed on one side of the OBC mainboard, and a welding portion is provided on the assembly surface. The side of the heat dissipation shell where the mounting groove is formed is connected to the assembly surface, and the pins of the magnetic device and the power device are connected to the welding portion.

4. The on-board charger according to claim 3, characterized in that: An energy storage device is provided on the OBC mainboard. The energy storage device is located at the edge of the assembly surface and is spaced apart from the power device.

5. The on-board charger according to claim 3, characterized in that: The OBC module also includes an upper cover, which is arranged on the side of the heat dissipation shell where the mounting groove is provided and covers the mounting groove. The assembly surface is attached to the side of the upper cover facing away from the heat dissipation shell. The upper cover is provided with a through hole, and the pins of the magnetic device pass through the through hole and extend out of the outside of the upper cover.

6. The on-board charger according to any one of claims 2 to 5, characterized in that: The OBC module further includes a spring sheet. The power device is attached to the outer side wall of the heat dissipation housing in the horizontal direction. The spring sheet is provided on one side of the heat dissipation housing in the horizontal direction and elastically presses the power device.

7. The on-board charger according to claim 6, characterized in that: The OBC module also includes a fixing bracket, which includes a pressure plate and a positioning pin. A positioning hole is provided on the outside of the power device. The pressure plate is arranged between the spring sheet and the power device with one side resting against the spring sheet and the other side resting against the outside of the power device. The positioning pin is fixed to the side of the pressure plate resting against the power device and is inserted into the positioning hole.

8. The on-board charger according to claim 7, characterized in that: The fixing bracket further includes a limiting arm, which is fixed to a side of the pressing plate facing the power device and abuts against two side edges of the power device in a horizontal direction.

9. The on-board charger according to any one of claims 2 to 5, characterized in that: The OBC module further includes a heat-conducting insulating film, which is provided between the power device and the outer side wall of the heat dissipation housing.

10. The on-board charger according to any one of claims 1 to 5, characterized in that: A water channel is provided on the inner side of the chassis, and the water channel is adjacent to the mounting surface.

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