Cooling system

Abstract

The utility model provides a cooling system which is connected with liquid cooling equipment, and the cooling system comprises a water chilling unit which comprises a plate-type evaporator, a compressor and a dry cooler; wherein the plate-type evaporator, the compressor and the dry cooler form a first medium loop, a refrigerant medium circulates in the first medium loop, the plate-type evaporator and a cold water source form a second medium loop, and cooling water provided by the cold water source circulates in the second medium loop; in the first medium loop, a heat load of the liquid cooling equipment exchanges heat with a refrigerant medium in the plate-type evaporator; and in the second medium loop, the heat load of the liquid cooling equipment exchanges heat with the cooling water in the plate-type evaporator.

Description

Technical Field

[0001] The present disclosure relates to cooling technology, and in particular to a cooling system. Background Art

[0002] Currently, liquid cooling equipment generates heat loads when cooling electronic equipment such as data centers and servers. Excessively high heat load temperatures can affect the cooling efficiency of the liquid cooling equipment.

[0003] To further improve the cooling efficiency of liquid cooling equipment, the heat load within the equipment can be further cooled. Typically, the type of cooling equipment is determined based on the application scenario of the liquid cooling equipment to achieve the optimal cooling solution. However, the application scenarios of liquid cooling equipment are complex and diverse, and no cooling equipment can be adapted to all application scenarios. Related technologies often combine multiple cooling devices, resulting in higher equipment costs and larger space requirements for the cooling system. Summary of the Invention

[0004] The present disclosure provides a cooling system, which is connected to a liquid cooling device. The cooling system includes: a chiller, which includes a plate evaporator, a compressor, and a dry cooler; wherein the plate evaporator, the compressor, and the dry cooler form a first medium circuit, in which a refrigerant medium circulates; the plate evaporator and a cold water source form a second medium circuit, in which cooling water provided by the cold water source circulates; in the first medium circuit, a heat load of the liquid cooling device undergoes heat exchange with the refrigerant medium in the plate evaporator; and in the second medium circuit, the heat load of the liquid cooling device undergoes heat exchange with the cooling water in the plate evaporator.

[0005] In some embodiments, when power resources are sufficient, the first medium circuit is connected and the second medium circuit is disconnected; or, when cooling water provided by the cold water source is sufficient, the first medium circuit is controlled to be disconnected and the second medium circuit is connected.

[0006] In some embodiments, in the first medium loop, the refrigerant medium is input into the plate evaporator to exchange heat with the heat load. The refrigerant medium after the heat exchange is compressed by the compressor and cooled by the dry cooler in turn, and then input into the plate evaporator again; in the second medium loop, cooling water is input into the plate evaporator from the cold water source to exchange heat with the heat load, and the cooling water after the heat exchange is output to the cold water source.

[0007] In some embodiments, the heat load is output from the liquid cooling device to the plate evaporator, and heat exchange is performed in the plate evaporator. The heat load after heat exchange is returned to the liquid cooling device.

[0008] In some embodiments, the chiller further includes a water tank; the heat load after heat exchange undergoes secondary heat exchange through the water tank and returns to the liquid cooling device.

[0009] In some embodiments, the chiller further includes: a liquid storage tank connected to the plate evaporator, wherein the liquid storage tank stores a refrigerant medium; when the first medium circuit is connected, the liquid storage tank outputs the refrigerant medium to the plate evaporator; or, when the first medium circuit is disconnected, the liquid storage tank stops outputting the refrigerant medium to the plate evaporator.

[0010] In some embodiments, the chiller further includes: a power supply module connected to the compressor; when the first medium circuit is connected, the power supply module supplies power to the compressor.

[0011] In some embodiments, the chiller further comprises: a water pump connected to the plate evaporator; when the second medium loop is connected, the water pump pumps cooling water from the cold water source and outputs it to the plate evaporator.

[0012] In some embodiments, the heat load is output from the liquid cooling device to the dry cooler, and heat exchange is performed in the dry cooler. After the heat exchange, the heat load returns to the liquid cooling device.

[0013] In some embodiments, the cooling system further includes a cooling tower, which includes a spray assembly; the heat load is output from the liquid cooling device to the cooling tower, and heat exchange is performed in the cooling tower by the spray assembly through the spray cooling medium, and the heat load after heat exchange is returned to the liquid cooling device.

[0014] In some embodiments, the heat load is input from the liquid cooling device into the plate evaporator for heat exchange; or, the heat load is input from the liquid cooling device into the dry cooler for heat exchange; or, the heat load is input from the liquid cooling device into the cooling tower for heat exchange.

[0015] The embodiments of the present disclosure have the following beneficial effects:

[0016] In the embodiment of the present disclosure, the plate evaporator in the chiller can form a first medium circuit with the compressor and the dry cooler in the chiller, and the plate evaporator in the chiller can form a second medium circuit with the cold water source, so that the plate evaporator can be in different medium circuits. When the first medium circuit and the second medium circuit are in different on-off states, the heat load output by the liquid cooling device can be heat exchanged with the refrigerant in the first medium circuit, or can be heat exchanged with the cooling water in the second medium circuit. In this process, by switching the refrigerant and cooling water, the type of cooling source used by the chiller can be changed, so that the chiller can be suitable for different application scenarios. There is no need to add other cooling equipment to the cooling system in the embodiment of the present disclosure, which effectively reduces equipment costs and saves space.

[0017] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and, together with the description, serve to explain the principles of the present disclosure.

[0019] Figure 1 This is a schematic diagram of the first cooling structure of the cooling system provided by the embodiment of the present disclosure.

[0020] Figure 2 is a schematic diagram of a second cooling structure of a cooling system provided by an embodiment of the present disclosure;

[0021] Figure 3 is a schematic diagram of a third cooling structure of a cooling system provided by an embodiment of the present disclosure;

[0022] Figure 4 is a schematic diagram of a fourth cooling structure of a cooling system provided by an embodiment of the present disclosure;

[0023] Figure 5 is a schematic diagram of a fifth cooling structure of a cooling system provided by an embodiment of the present disclosure;

[0024] Figure 6 It is a schematic diagram of the sixth cooling structure of the cooling system provided in an embodiment of the present disclosure.

[0025] Description of reference numerals:

[0026] 100. Cooling system; 40. Chiller; 41. Plate evaporator; 42. Compressor; 43. Dry cooler; 44. Control device; 54. Water tank; 55. Liquid storage tank; 56. First valve; 57. Second valve; 58. Third valve; 59. Fourth valve; 80. Cooling tower. DETAILED DESCRIPTION

[0027] Exemplary embodiments will be described in detail herein, examples of which are illustrated in the accompanying drawings. In the following description, when referring to the drawings, identical numerals in different figures represent identical or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments are not intended to represent all embodiments consistent with the present disclosure. Rather, they are merely examples of devices consistent with certain aspects of the present disclosure, as detailed in the appended claims.

[0028] Liquid cooling equipment generates heat loads when cooling electronic equipment such as data centers and servers. Excessively high heat load temperatures can affect the cooling efficiency of the liquid cooling equipment.

[0029] To further improve the cooling efficiency of liquid cooling equipment, the heat load within the equipment can be further cooled. Typically, the type of cooling equipment is determined based on the application scenario of the liquid cooling equipment to achieve the optimal cooling solution. However, the application scenarios of liquid cooling equipment are complex and diverse, and no cooling equipment can be adapted to all application scenarios. Related technologies often combine multiple cooling devices, resulting in higher equipment costs and larger space requirements for the cooling system.

[0030] In order to solve the above technical problems, an embodiment of the present disclosure provides a cooling system.

[0031] Figure 1 Schematic diagram of the first cooling structure of the cooling system provided by the embodiment of the present disclosure. Figure 1 As shown, cooling system 100 can be connected to a liquid cooling device. The liquid cooling device can be used to cool electronic equipment such as data centers and servers. The coolant in the liquid cooling device heats up after exchanging heat with the electronic equipment, generating a heat load. The liquid cooling device can then feed the heated coolant into the cooling system, which then cools the heated coolant, thereby further cooling the heat load. The cooled coolant can then be fed back into the liquid cooling device to exchange heat with the electronic equipment again.

[0032] In some embodiments, cooling system 100 may include a chiller 40 and a control device 44. Chiller 40 may include a plate evaporator 41, a compressor 42, and a dry cooler 43. Plate evaporator 41 is connected to compressor 42 and dry cooler 43 to form a first medium loop; plate evaporator 41 is connected to a cold water source to form a second medium loop.

[0033] In one embodiment, the heated coolant may be understood as the heat load output by the liquid cooling device, or may also be understood as the heat load of the liquid cooling device.

[0034] In one embodiment, the coolant in the liquid cooling device may be ultrapure water, deionized water, or the like.

[0035] In one embodiment, the liquid cooling device may include a water pump station, where a water pump in the water pump station is used to pump the heat load of the liquid cooling device out of the liquid cooling device.

[0036] In some embodiments, the cooling system 100 may include a chiller 40 and a control device 44. The chiller 40 is used to perform heat exchange with the heat load of the liquid cooling device. The control device 44 is used to control the chiller 40 to operate in one or more operating modes.

[0037] In some embodiments, the chiller 40 may include a plate evaporator 41, a compressor 42, and a dry cooler 43. The plate evaporator 41, the compressor 42, and the dry cooler 43 form a first medium loop in which a refrigerant medium circulates.

[0038] It is understood that the first medium circuit can be a refrigeration circuit formed by the plate evaporator 41, the compressor 42, and the dry cooler 43. The refrigerant flows into the plate evaporator 41, flows through the compressor 42 and the dry cooler 43 in sequence, and then returns to the plate evaporator 41, thus forming the first medium circuit.

[0039] In some embodiments, the connection between the plate evaporator 41, the compressor 42, and the dry cooler 43 can be achieved through pipes. In some embodiments, the material, shape, position, size and other parameters of the pipes can be set according to actual needs, and the embodiments of the present disclosure are not limited thereto.

[0040] In one embodiment, the working principle of the plate evaporator 41 is to utilize the narrow channels between multiple plates to allow the heat load to flow on one side of the plate and the refrigerant to flow on the other side of the plate. In this way, the heat load and the refrigerant exchange heat through the plates, so that the heat load transfers heat to the refrigerant and the refrigerant absorbs heat.

[0041] In one embodiment, the working principle of the compressor 42 is to compress the volume of the refrigerant by the reciprocating motion of the piston in the cylinder. In one embodiment, the compressor 42 compresses the low-temperature refrigerant to increase the temperature of the refrigerant.

[0042] In one embodiment, the dry cooler 43 operates by allowing the refrigerant to flow through the pipes and exchange heat with the air outside the pipes to reduce the temperature of the refrigerant. In one embodiment, a fan may be provided outside the pipes of the dry cooler 43 to reduce the temperature of the air outside the pipes, thereby improving cooling efficiency. In one example, the fan may be a fan, an air cooler, or the like.

[0043] In one embodiment, the plate evaporator 41 includes a first channel and a second channel. The first channel is the channel for the refrigerant within the plate evaporator 41 and may be part of the first medium circuit. The second channel is the channel for the heat load of the liquid cooling device within the plate evaporator 41.

[0044] In one embodiment, the heat load can be output from the liquid cooling device to the second channel of the plate evaporator 41, where it undergoes heat exchange with the refrigerant in the first channel. After the heat exchange, the heat load is output from the second channel and returned to the liquid cooling device. After absorbing heat in the first channel, the refrigerant continues to circulate in the first medium circuit.

[0045] In one embodiment, the refrigerant may be a Freon (such as chlorodifluoromethane (R22), difluoromethane (R32), tetrafluoroethane (R134a), etc.). Freon can absorb or release heat when its state changes. In one embodiment, the refrigerant may circulate in the first medium circuit in the form of a gas. In some embodiments, the refrigerant may circulate in the first medium circuit in the form of a liquid. In this case, the compressor 42 may compress the gaseous refrigerant into a liquid state. The liquid refrigerant may be converted from liquid to gaseous state after absorbing heat from the heat load in the plate evaporator 41.

[0046] In one embodiment, when the refrigerant circulates in the first medium loop in a gaseous form, the plate evaporator 41 can use the gaseous refrigerant to perform heat exchange with the heat load, thereby forming a gas-liquid heat exchange.

[0047] In one embodiment, the chiller 40 may be an air-cooled chiller, wherein components such as a plate evaporator 41, a compressor 42, a dry cooler 43, and a refrigerant medium of the air-cooled chiller work in coordination to achieve an effective cooling effect.

[0048] In some embodiments, in the first medium circuit, the refrigerant is input into the plate evaporator 41 to exchange heat with the heat load. After the heat exchange, the refrigerant is compressed by the compressor 42 and cooled by the dry cooler 43 before being input into the plate evaporator 41 again.

[0049] In one embodiment, after the refrigerant undergoes heat exchange with the heat load in the plate evaporator 41, it absorbs heat from the heat load, causing its temperature to rise. The heated refrigerant then enters the compressor 42, which compresses it to reduce its volume, increase its pressure, and raise its temperature, thereby forming a high-temperature, high-pressure refrigerant. The high-temperature, high-pressure refrigerant is first cooled in the dry cooler 43. After cooling, the refrigerant passes through a pressure relief valve within the dry cooler 473, where it is depressurized, forming a low-temperature, low-pressure refrigerant. The low-temperature, low-pressure refrigerant is then re-introduced into the plate evaporator 41 for heat exchange with the heat load.

[0050] In some embodiments, the chiller 40 further includes a power supply module connected to the compressor 42. It is understood that the power supply module can supply power to the compressor 42.

[0051] In some embodiments, the plate evaporator 41 and the cold water source form a second medium loop, and cooling water provided by the cold water source circulates in the second medium loop.

[0052] In one embodiment, the second medium circuit can be a cooling water refrigeration circuit. In one embodiment, the cooling water flows into the plate evaporator 41, then flows from the plate evaporator 41 into the cold water source, and the cooling water in the cold water source flows into the plate evaporator 41 again, thus forming the second medium circuit.

[0053] In some embodiments, the connection between the plate evaporator 41 and the cold water source can be achieved through a pipe. In one embodiment, the material, shape, position, length and other parameters of the pipe can be set according to actual needs, and the embodiment of the present disclosure is not limited to this.

[0054] In one embodiment, the first channel in the plate evaporator 41 may also be a channel for cooling water in the plate evaporator 41. In this case, the first channel may be part of the second medium circuit. The second channel is a channel for the heat load of the liquid cooling device in the plate evaporator 41.

[0055] In one embodiment, the heat load can be output from the liquid cooling device to the second channel of the plate evaporator 41, where it undergoes heat exchange with the cooling water in the first channel. After the heat exchange, the heat load is output from the second channel and returned to the liquid cooling device. After absorbing heat in the first channel, the cooling water continues to circulate in the second medium circuit.

[0056] In one embodiment, the cold water source may be a natural water source, such as a lake, an ocean, or the like.

[0057] In one embodiment, the chiller 40 further includes a water pump connected to the plate evaporator 41 . The water pump is used to pump cooling water from a cold water source and output the cooling water to the plate evaporator 41 .

[0058] In one embodiment, when the cooling water circulates in the second medium loop, the plate evaporator 41 can use the cooling water to perform heat exchange with the heat load, thereby forming liquid-liquid heat exchange.

[0059] In some embodiments, after the heat load enters the plate evaporator 41, the control device 44 can control the connection and disconnection of the first medium circuit and the second medium circuit so that the heat load is cooled using different heat exchange methods. In one embodiment, the control device 44 can control the connection of the first medium circuit and the disconnection of the second medium circuit. In this case, the heat load of the liquid cooling device undergoes gas-liquid heat exchange with the refrigerant circulating in the first medium circuit within the plate evaporator 41. In one embodiment, the control device 44 can also control the disconnection of the first medium circuit and the connection of the second medium circuit. In this case, the heat load of the liquid cooling device undergoes liquid-liquid heat exchange with the cooling water in the second medium circuit within the plate evaporator 41.

[0060] In the embodiment of the present disclosure, the control device 44 controls the connection of one of the first medium circuit and the second medium circuit and the disconnection of one circuit so that the heat load of the liquid cooling equipment can be heat exchanged with different cooling media (such as refrigerant or cooling water) in the plate evaporator 41. In this way, the type of cooling media used by the plate evaporator 41 can be changed, thereby utilizing the plate evaporator 41 to provide a variety of cooling methods to adapt to different application scenarios.

[0061] In one embodiment, the control device 44 may be a combination of software and / or hardware that implements a predetermined function. In some embodiments, the control device 44 may be a processor in the form of a hardware decoding processor that is programmed to perform control of the first medium circuit and the second medium circuit. For example, the processor in the form of a hardware decoding processor may be one or more application specific integrated circuits (ASICs), digital signal processors (DSPs), programmable logic devices (PLDs), complex programmable logic devices (CPLDs), field-programmable gate arrays (FPGAs), or other electronic components, and the present disclosure does not specifically limit this.

[0062] In one embodiment, valves may be provided on the first medium circuit and the second medium circuit, and the control device 44 may control the on / off of the first medium circuit and the on / off of the second medium circuit by controlling the opening and closing of the valves.

[0063] In one embodiment, the valves in the first medium circuit and the second medium circuit may be one-way valves. The control device 44 may control the opening and closing of the one-way valve on the first medium circuit and / or the one-way valve on the second medium circuit, respectively, to control the opening and closing of the first medium circuit and the second medium circuit.

[0064] In one embodiment, the valves on the first medium circuit and the second medium circuit may be multi-way valves, with different ports of the multi-way valves connected to the first medium circuit and the second medium circuit, respectively. The control device 44 can control the opening and closing of the different ports of the multi-way valve to control the on-off of the first medium circuit and the on-off of the second medium circuit.

[0065] In some embodiments, the valves on the first medium circuit and the second medium circuit may be solenoid valves. The control device 44 adjusts the flow of the refrigerant in the first medium circuit and / or the cooling water in the second medium circuit by controlling the opening of the solenoid valves, thereby adjusting the refrigeration efficiency.

[0066] In one embodiment, when the first medium circuit is connected, the control device 44 controls the power supply module to supply power to the compressor 42 so that the refrigerant circulates in the first medium circuit.

[0067] In one embodiment, when the second medium circuit is connected, the control device 44 controls the water pump to pump cooling water from the cold water source and output it to the plate evaporator 41, so that the cooling water circulates in the second medium circuit.

[0068] In some embodiments, when sufficient power resources are available, the control device 44 controls the first medium circuit to be connected and the second medium circuit to be disconnected. In this way, the refrigerant medium is used to complete heat exchange with the heat load in the plate evaporator 41, reducing the demand for natural water resources. In some embodiments, when sufficient cooling water is provided by the cold water source, the control device 44 controls the first medium circuit to be disconnected and the second medium circuit to be connected. In this way, the cooling water is used to complete heat exchange with the heat load in the plate evaporator 41, reducing the demand for power resources.

[0069] In one embodiment, when sufficient power resources are available, the control device 44 can control the first medium circuit to be connected and the second medium circuit to be disconnected, utilizing the compression refrigeration of the compressor 42 to cool the refrigerant, causing the cooled refrigerant to circulate through the plate evaporator 41, removing heat from the heat load and completing heat exchange with the heat load. In one embodiment, when sufficient cooling water is provided by the cold water source, the control device 44 can control the second medium circuit to be connected and the first medium circuit to be disconnected, utilizing the cooling water to circulate through the plate evaporator 41, removing heat from the heat load and completing heat exchange with the heat load.

[0070] In one embodiment, the cooling system 100 may include a detection component that can be connected to the plate evaporator 41 to detect the water level of the cold water source. In this case, the control device 44 can also select whether to open or close the first medium circuit and the second medium circuit based on the water level of the cold water source.

[0071] In one embodiment, when the water level of the cold water source is below a threshold, the control device 44 controls the first medium circuit to be connected and the second medium circuit to be disconnected, thereby using electrical resources to cool the heat load of the liquid cooling equipment, thereby improving cooling efficiency. In one embodiment, when the water level of the cold water source is above a threshold, the control device 44 controls the second medium circuit to be connected and the first medium circuit to be disconnected, thereby using natural water resources to cool the heat load of the liquid cooling equipment, thereby saving costs.

[0072] In some embodiments, the chiller 40 further includes a water tank containing cooling water. The heat load after heat exchange in the plate evaporator 41 can be collected in the water tank for further heat exchange, and the heat load after further heat exchange can be returned to the liquid cooling device.

[0073] In one embodiment, a water tank can be connected to the end of the plate evaporator 41 that outputs the heat load after heat exchange. The water tank can reheat the heat load after heat exchange, further improving the cooling efficiency of the cooling system. Furthermore, the water tank can buffer the heat load after heat exchange, evenly distributing the heat load temperature so that the heat load after heat exchange can be input into the liquid cooling device at an appropriate temperature.

[0074] In one embodiment, the chiller 40 further includes a liquid storage tank connected to the plate evaporator 41. The liquid storage tank stores a refrigerant. When the first medium circuit is connected, the control device 44 can control the liquid storage tank to supply the refrigerant to the plate evaporator 41. When the first medium circuit is disconnected, the control device 44 can control the liquid storage tank to stop supplying the refrigerant to the plate evaporator 41.

[0075] In one embodiment, a liquid storage tank may be connected to the refrigerant input end of the plate evaporator 41. The liquid storage tank may store a refrigerant, such as a liquid refrigerant. In one embodiment, when the first medium circuit is connected, the control device 44 controls the liquid storage tank to output the refrigerant to the plate evaporator 41 so that the refrigerant exchanges heat with the heat load of the liquid cooling device. In one embodiment, when the first medium circuit is disconnected, the control device 44 controls the liquid storage tank to stop outputting the refrigerant to the plate evaporator 41, allowing cooling water to be input into the plate evaporator 41 for heat exchange with the heat load of the liquid cooling device.

[0076] In the embodiment of the present disclosure, the plate evaporator in the chiller can form a first medium circuit with the compressor and dry cooler in the chiller, and the plate evaporator in the chiller can form a second medium circuit with the cold water source, so that the plate evaporator can be in different medium circuits. The first medium circuit and the second medium circuit are controlled by the control device to be in different on-off states, and the heat load output by the liquid cooling device can be heat exchanged with the refrigerant in the first medium circuit, or can be heat exchanged with the cooling water in the second medium circuit. In this process, by switching the refrigerant and cooling water, the type of cooling source used by the chiller can be changed, so that the chiller can be suitable for different application scenarios. There is no need to add other cooling equipment to the cooling system in the embodiment of the present disclosure, which effectively reduces equipment costs and saves space.

[0077] Figure 2 Schematic diagram of the second cooling structure of the cooling system provided by the embodiment of the present disclosure. Figure 2 As shown, cooling system 100 may include a chiller 40. The liquid cooling equipment may include a heat sink, a power distribution cabinet, and a water pump station. The power distribution cabinet can supply power to the heat sink, which, through the action of a water pump within the water pump station, allows the coolant to exchange heat with the server. This heat exchange heats up the coolant, creating a heat load. The liquid cooling equipment may also be connected to the plate evaporator 41 within chiller 40 via a pipeline.

[0078] In one embodiment, the water pump in the water pump station can pump the heat load of the liquid cooling device into the first input interface of the plate evaporator 41 in the chiller 40 through the output interface of the liquid cooling device. After the heat load undergoes heat exchange in the plate evaporator 41, it can be output to the water tank 54 through the first output interface of the plate evaporator 41. After the heat load undergoes secondary heat exchange in the water tank, it re-enters the liquid cooling device through the input interface of the liquid cooling device.

[0079] In one embodiment, the chiller 40 may include: a plate evaporator 41, a compressor 42, a dry cooler 43, a liquid storage tank 55, a water tank 54, a water pump, a first valve 56, and a second valve 57. The second output interface of the plate evaporator 41 is connected to the first interface of the first valve 56, the first interface of the first valve 56 is connected to the second interface of the first valve 56, the second interface of the first valve 56 is connected to the compressor 42, the compressor 42 is connected to the dry cooler 43, the dry cooler 43 is connected to the liquid storage tank 55 and then connected to the first interface of the second valve 57, the first interface of the second valve 57 is connected to the second interface of the second valve 57, and the second interface of the second valve 57 is connected to the second input interface of the plate evaporator 41, forming a first medium circuit. The second output interface of the plate evaporator 41 is connected to the first interface of the first valve 56, the first interface of the first valve 56 is connected to the third interface of the first valve 56, the third interface of the first valve 56 is connected to the cold water source, the cold water source is connected to the third interface of the second valve 57, the third interface of the second valve 57 is connected to the second interface of the second valve 57, and the second interface of the second valve 57 is connected to the second input interface of the plate evaporator 41 to form a second medium loop.

[0080] In one embodiment, the control device 44 controls the first port of the first valve 56 to connect to the second port of the first valve 56 and disconnect the first port of the first valve 56 from the third port of the first valve 56. It also controls the first port of the second valve 57 to connect to the second port of the second valve 57 and disconnect the second port of the second valve 57 from the third port of the second valve 57, thereby connecting the first medium circuit and disconnecting the second medium circuit. The control device 44 controls the liquid storage tank 55 to output the refrigerant to the plate evaporator 41 and the power supply module to power the compressor 42. The refrigerant enters the plate evaporator 41 through the second input port of the plate evaporator 41, exchanges heat with the heat load of the liquid cooling equipment, and heats up. It then enters the compressor 42 through the second output port of the plate evaporator 41. The compressor 42 compresses the refrigerant, resulting in a refrigerant with high temperature and high pressure characteristics. The high temperature and high pressure refrigerant can then be cooled in the dry cooler 43. After the cooling, the refrigerant is depressurized to become a low temperature refrigerant, which can then be re-introduced into the plate evaporator 41, repeating the above process.

[0081] In one embodiment, the control device 44 controls the first interface of the first valve 56 to disconnect the second interface of the first valve 56 and the first interface of the first valve 56 from the third interface of the first valve 56. It also controls the first interface of the second valve 57 to disconnect the second interface of the second valve 57 and the second interface of the second valve 57 from the third interface of the second valve 57, thereby connecting the second medium circuit and disconnecting the first medium circuit. The control device 44 controls the water pump to cause the cold water source to output cooling water to the plate evaporator 41. The cooling water enters the plate evaporator 41 through the second input interface of the plate evaporator 41, undergoes heat exchange with the heat load of the liquid cooling equipment, and heats up. It then enters the cold water source through the second output interface of the plate evaporator 41. The cooling water in the cold water source can be re-injected into the plate evaporator 41, thus repeating the above process.

[0082] In the embodiment of the present disclosure, the plate evaporator 41 in the chiller 40 can achieve refrigeration in different application scenarios, thereby eliminating the need to add other cooling equipment to the cooling system, effectively reducing equipment costs and saving space.

[0083] Figure 3 Schematic diagram of the third cooling structure of the cooling system provided by the embodiment of the present disclosure. Figure 3 As shown, the heat load of the liquid cooling device can also be output by the liquid cooling device to the dry cooler 43 of the chiller 40, and heat exchange is performed in the dry cooler 43, and the heat load after heat exchange is returned to the liquid cooling device.

[0084] It is understandable that the dry cooler 43 includes a dry cooling pipe, and the heat load of the liquid cooling device can flow in the dry cooling pipe and exchange heat with the air outside the dry cooling pipe to achieve cooling of the heat load.

[0085] In some embodiments, the control device 44 can control the heat load to be input from the liquid cooling device to the dry cooler 43 for heat exchange. In some embodiments, the control device 44 can control the heat load to be input from the liquid cooling device to the plate evaporator 41 for heat exchange. In some embodiments, the control device 44 can control the heat load to be input from the liquid cooling device to the plate evaporator 41 for heat exchange, and simultaneously control the heat load to be input from the liquid cooling device to the plate evaporator 41 for heat exchange.

[0086] In one embodiment, a valve may be provided between the liquid cooling device and the chiller 40. The control device 44 may control whether the heat load is input to the dry cooler 43 for heat exchange by controlling the opening and closing of the valve. The control device 44 may control whether the heat load is input to the plate evaporator 41 for heat exchange by controlling the opening and closing of the valve.

[0087] In one embodiment, the valve between the liquid cooling device and the chiller 40 may be a one-way valve. The control device 44 may control the opening and closing of the one-way valve between the liquid cooling device and the dry cooler 43 and / or the opening and closing of the one-way valve between the liquid cooling device and the plate evaporator 41, thereby controlling the connection and disconnection between the liquid cooling device and the dry cooler 43 and between the liquid cooling device and the plate evaporator 41.

[0088] In some embodiments, the valve between the liquid cooling device and the chiller 40 may be a multi-way valve, with different ports of the multi-way valve connected to the dry cooler 43 and the plate evaporator 41, respectively. The control device 44 can control the opening and closing of the different ports in the multi-way valve to control the connection and disconnection between the liquid cooling device and the dry cooler 43, and between the liquid cooling device and the plate evaporator 41.

[0089] In some embodiments, the valve between the liquid cooling device and the chiller 40 can be a solenoid valve, and the control device 44 adjusts the flow of the heat load input to the dry cooler 43 by controlling the opening of the solenoid valve, thereby adjusting the cooling efficiency; or, by controlling the opening of the solenoid valve, adjusts the flow of the heat load input to the plate evaporator 41, thereby adjusting the cooling efficiency.

[0090] In one embodiment, the dry cooler 43 may include a fan, and the cooling efficiency of the dry cooler 43 may be adjusted by controlling the operating frequency of the fan.

[0091] It is understood that in application scenarios where the temperature is not very high but water is relatively scarce, the dry cooler 43 can be used for heat exchange. The cooling system 100 can use the dry cooler 43 to exchange heat with the heat load in a water-scarce environment, use the cooling water in the plate evaporator 41 to exchange heat with the heat load in a water-rich environment, and use the refrigerant in the plate evaporator 41 to exchange heat with the heat load in an electricity-rich environment. This allows the chiller 40 to be applied to a wider range of application scenarios, effectively reducing equipment costs and saving space.

[0092] Figure 4 Schematic diagram of the fourth cooling structure of the cooling system provided by the embodiment of the present disclosure. Figure 4 As shown, the liquid cooling device can be connected to the plate evaporator 41 of the chiller 40 through a pipeline, and can also be connected to the dry cooler 43 of the chiller 40 through a pipeline.

[0093] In one embodiment, the water pump can input the heat load of the liquid cooling device into the dry cooler 43 of the chiller 40 through the output interface of the liquid cooling device. After the heat load undergoes heat exchange in the dry cooler 43, it can be output by the dry cooler 43 to the input interface of the liquid cooling device to re-enter the liquid cooling device.

[0094] In one embodiment, the chiller 40 may further include a third valve 58 and a fourth valve 59. The output interface of the liquid cooling device is connected to the first interface of the third valve 58, which in turn is connected to the second interface of the third valve 58. The second interface of the third valve 58 is connected to the first input interface of the plate evaporator 41. The first output interface of the plate evaporator 41 is connected to the first interface of the fourth valve 59, which in turn is connected to the second interface of the fourth valve 59. The second interface of the fourth valve 59 is connected to the input interface of the liquid cooling device, forming a circuit between the liquid cooling device and the plate evaporator 41. The output interface of the liquid cooling device is connected to the first interface of the third valve 58, which in turn is connected to the third interface of the third valve 58. The third interface of the third valve 58 is connected to the dry cooler 43, which in turn is connected to the third interface of the fourth valve 59. The third interface of the fourth valve 59 is connected to the second interface of the fourth valve 59, which in turn is connected to the input interface of the liquid cooling device, forming a circuit between the liquid cooling device and the dry cooler 43.

[0095] In one embodiment, the control device 44 controls the first interface of the third valve 58 to connect to the second interface of the third valve 58 and disconnects the first interface of the third valve 58 from the third interface of the third valve 58. It also controls the first interface of the fourth valve 59 to connect to the second interface of the fourth valve 59 and disconnects the third interface of the fourth valve 59 from the second interface of the second valve 57, so that the heat load of the liquid cooling system is input into the plate evaporator 41 for heat exchange. The heat load of the liquid cooling system enters the plate evaporator 41 through the output interface of the liquid cooling system and the first input interface of the plate evaporator 41. After heat exchange within the plate evaporator 41, the heat load can be output from the first output interface of the plate evaporator 41 to the water tank 54. Thereafter, the heat load is output from the water tank 54 and re-enters the liquid cooling system through the input interface of the liquid cooling system.

[0096] It can be understood that when the control device 44 inputs the heat load of the liquid cooling equipment into the plate evaporator 41 for heat exchange, it can also control one of the first medium circuit or the second medium circuit to be connected so that the heat load can exchange heat with the refrigerant medium or cooling water in the plate evaporator 41.

[0097] In one embodiment, the control device 44 controls the first interface of the third valve 58 to disconnect from the second interface of the third valve 58 and the first interface of the third valve 58 to disconnect from the third interface of the third valve 58. It also controls the first interface of the fourth valve 59 to disconnect from the second interface of the fourth valve 59 and the third interface of the fourth valve 59 to connect to the second interface of the second valve 57, so that the heat load of the liquid cooling system is input into the dry cooler 43 for heat exchange. The heat load of the liquid cooling system enters the dry cooler 43 through the output interface of the liquid cooling system. After heat exchange with external air in the dry cooler 43, the heat load can be output from the dry cooler 43 and re-enter the liquid cooling system through the input interface of the liquid cooling system.

[0098] It should be noted that when the control device 44 controls the heat load of the liquid cooling equipment and simultaneously inputs it into the plate evaporator 41 and the dry cooler 43 for heat exchange, the control device 44 should also control the first interface of the first valve 56 to disconnect the second interface connected to the first valve 56 and the first interface of the first valve 56 to connect to the third interface of the first valve 56, and control the first interface of the second valve 57 to disconnect the second interface connected to the second valve 57 and the second interface of the second valve 57 to connect to the third interface of the second valve 57, so that the second medium circuit is connected and the first medium circuit is disconnected.

[0099] In the embodiment of the present disclosure, the dry cooler 43 in the chiller 40 can achieve cooling in different application scenarios, thereby eliminating the need to add other cooling equipment to the cooling system, effectively reducing equipment costs and saving space.

[0100] Figure 5 Schematic diagram of the fifth cooling structure of the cooling system provided by the embodiment of the present disclosure. Figure 5 As shown, the cooling system further includes a cooling tower 80, which includes a spray assembly. The heat load of the liquid cooling device can also be output from the liquid cooling device to the cooling tower 80, where the spray assembly performs heat exchange within the cooling tower 80 by spraying a cooling medium. The heat load after heat exchange is then returned to the liquid cooling device.

[0101] It can be understood that the cooling tower 80 includes a cooling pipe and a spray assembly. The spray assembly sprays cooling medium into the cooling pipe, so that the heat load inside the cooling pipe is heat-exchanged with the cooling medium outside the cooling pipe to achieve cooling of the heat load.

[0102] In some embodiments, cooling tower 80 may be a closed circuit cooler.

[0103] In one embodiment, the cooling medium may be deionized water, ultrapure water, etc.

[0104] In some embodiments, the control device 44 can control the heat load to be input from the liquid cooling device to the cooling tower 80 for heat exchange. In some embodiments, the control device 44 can control the heat load to be input from the liquid cooling device to the cooling tower 80 for heat exchange, and at the same time control the heat load to be input from the liquid cooling device to the plate evaporator 41 for heat exchange and / or control the heat load to be input from the liquid cooling device to the dry cooler 43 for heat exchange.

[0105] In one embodiment, a valve may be provided between the liquid cooling device and the cooling tower 80 , and the control device 44 may control whether the heat load is input into the cooling tower 80 for heat exchange by controlling the opening and closing of the valve.

[0106] In one embodiment, the valve between the liquid cooling device and the cooling tower 80 may be a one-way valve. The control device 44 may control the opening and closing of the one-way valve between the liquid cooling device and the cooling tower 80 to control the connection between the liquid cooling device and the dry cooler 43.

[0107] In some embodiments, the valve between the liquid cooling device and the cooling tower 80 can be a multi-way valve, with different ports of the multi-way valve connected to the cooling tower 80, the dry cooler 43, and the plate evaporator 41, respectively. The control device 44 can control the opening and closing of the different ports in the multi-way valve to control the connection between the liquid cooling device and the dry cooler 43, the connection between the liquid cooling device and the plate evaporator 41, and the connection between the liquid cooling device and the dry cooler 43.

[0108] In some embodiments, the valve between the liquid cooling device and the cooling tower 80 may be a solenoid valve. The control device 44 adjusts the flow of the heat load input into the cooling tower 80 by controlling the opening of the solenoid valve, thereby adjusting the cooling efficiency.

[0109] In some embodiments, the control device 44 can adjust the flow of heat load input into any two of the plate evaporator 41, the dry cooler 43 and the cooling tower 80 by controlling the opening of the multi-way valve, thereby adjusting the cooling efficiency.

[0110] In one embodiment, the cooling tower 80 may include a fan, and the cooling efficiency of the cooling tower 80 may be adjusted by controlling the operating frequency of the fan.

[0111] In one embodiment, the chiller 40 and the cooling tower 80 may be combined and arranged in a container, so that the structure of the cooling system 100 is more compact.

[0112] It is understandable that in application scenarios with higher temperatures, cooling tower 80 can be used for heat exchange, thereby saving refrigeration costs. After adding cooling tower 80 to the cooling system, cooling tower 80 can be used to exchange heat with the heat load in high-temperature environments, dry cooler 43 can be used to exchange heat with the heat load in low-temperature environments, cooling water in plate evaporator 41 can be used to exchange heat with the heat load in environments with abundant water resources, and refrigerant in plate evaporator 41 can be used to exchange heat with the heat load in environments with abundant electricity resources. This allows cooling system 100 to be applied to more application scenarios and meet user needs.

[0113] Figure 6 Schematic diagram of the sixth cooling structure of the cooling system provided by the embodiment of the present disclosure. Figure 6 As shown, the liquid cooling device can be connected to the plate evaporator 41 of the chiller 40 through a pipeline, can be connected to the dry cooler 43 of the chiller 40 through a pipeline, and can also be connected to the cooling tower 80 through a pipeline.

[0114] In one embodiment, the water pump can input the heat load of the liquid cooling device into the cooling tower 80 through the output interface of the liquid cooling device. After the heat load undergoes heat exchange in the cooling tower 80, it can be output by the cooling tower 80 to the input interface of the liquid cooling device to re-enter the liquid cooling device.

[0115] In one embodiment, the chiller 40 may further include a third valve 58 and a fourth valve 59. The output interface of the liquid cooling device is connected to the first interface of the third valve 58, which in turn is connected to the second interface of the third valve 58. The second interface of the third valve 58 is connected to the first input interface of the plate evaporator 41. The first output interface of the plate evaporator 41 is connected to the first interface of the fourth valve 59, which in turn is connected to the second interface of the fourth valve 59. The second interface of the fourth valve 59 is connected to the input interface of the liquid cooling device, forming a circuit between the liquid cooling device and the plate evaporator 41. The output interface of the liquid cooling device is connected to the first interface of the third valve 58, which in turn is connected to the third interface of the third valve 58. The third interface of the third valve 58 is connected to the dry cooler 43, which in turn is connected to the third interface of the fourth valve 59. The third interface of the fourth valve 59 is connected to the second interface of the fourth valve 59, which in turn is connected to the input interface of the liquid cooling device, forming a circuit between the liquid cooling device and the dry cooler 43. The output interface of the liquid cooling device is connected to the first interface of the third valve 58, which is connected to the fourth interface of the third valve 58. The fourth interface of the third valve 58 is connected to the cooling tower 80, which is connected to the fourth interface of the fourth valve 59. The fourth interface of the fourth valve 59 is connected to the second interface of the fourth valve 59, which is connected to the input interface of the liquid cooling device, forming a loop between the liquid cooling device and the cooling tower 80.

[0116] In one embodiment, the control device 44 controls the first interface of the third valve 58 to connect to the fourth interface of the third valve 58 and to disconnect the first interface of the third valve 58 from the second interface and the third interface of the third valve 58. The control device 44 controls the second interface of the fourth valve 59 to connect to the fourth interface of the fourth valve 59 and to disconnect the second interface of the fourth valve 59 from the first interface and the third interface of the fourth valve 59, so that the heat load of the liquid cooling system is input into the cooling tower 80 for heat exchange. The heat load of the liquid cooling system enters the cooling tower 80 through the output interface of the liquid cooling system. After heat exchange in the cooling tower 80, the heat load can be output from the cooling tower 80 and then re-enter the liquid cooling system through the input interface of the liquid cooling system.

[0117] It is understood that when the control device 44 controls the heat load of the liquid cooling device to be input to the cooling tower 80 for heat exchange, it can also control the heat load of the liquid cooling device to be input to the plate evaporator 41 and / or the dry cooler 43. When the control device 44 controls the heat load of the liquid cooling device to be input to the plate evaporator 41 and / or the dry cooler 43, the opening and closing of the third valve 58 and the fourth valve 59 can be referred to the description of one or more of the above embodiments, and for the sake of brevity, they are not repeated here.

[0118] In the embodiments of the present disclosure, the cooling system can achieve refrigeration in different application scenarios, thereby effectively reducing equipment costs and saving space.

[0119] Other embodiments of the present disclosure will readily occur to those skilled in the art after considering the specification and practicing the invention disclosed herein. This disclosure is intended to cover any variations, uses, or adaptations of the present disclosure that follow the general principles of the present disclosure and include common knowledge or customary techniques in the art not disclosed herein. The description and examples are to be considered as exemplary only, with the true scope and spirit of the present disclosure being indicated by the following claims.

[0120] It should be understood that the present disclosure is not limited to the exact structures that have been described above and shown in the drawings, and that various modifications and changes can be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

Claims

1. A cooling system connected to a liquid cooling device, characterized in that: The cooling system comprises: A chiller comprising a plate evaporator, a compressor, and a dry cooler; wherein the plate evaporator, the compressor, and the dry cooler form a first medium circuit in which a refrigerant medium circulates; and the plate evaporator and a cold water source form a second medium circuit in which cooling water provided by the cold water source circulates. In the first medium circuit, the heat load of the liquid cooling device exchanges heat with the refrigerant medium in the plate evaporator; in the second medium circuit, the heat load of the liquid cooling device exchanges heat with the cooling water in the plate evaporator.

2. The cooling system according to claim 1, characterized in that When power resources are sufficient, the first medium circuit is connected and the second medium circuit is disconnected; or when the cooling water provided by the cold water source is sufficient, the first medium circuit is disconnected and the second medium circuit is connected.

3. The cooling system according to claim 1, characterized in that In the first medium circuit, the refrigerant is input into the plate evaporator to perform heat exchange with the heat load. After the heat exchange, the refrigerant is heated by the compressor and cooled by the dry cooler, and then input into the plate evaporator again. In the second medium loop, the cooling water is input from a cold water source into the plate evaporator to perform heat exchange with the heat load, and the cooling water after the heat exchange is output to the cold water source.

4. The cooling system according to claim 1, wherein: The heat load is output from the liquid cooling device to the plate evaporator, and heat exchange is performed in the plate evaporator. The heat load after the heat exchange is returned to the liquid cooling device.

5. The cooling system according to claim 4, characterized in that The chiller also includes a water tank; the heat load after the heat exchange is subjected to secondary heat exchange through the water tank and returned to the liquid cooling device.

6. The cooling system according to claim 1, wherein: The chiller further comprises: a liquid storage tank connected to the plate evaporator, wherein the refrigerant medium is stored in the liquid storage tank; When the first medium circuit is connected, the liquid storage tank outputs the refrigerant medium to the plate evaporator; or, when the first medium circuit is disconnected, the liquid storage tank stops outputting the refrigerant medium to the plate evaporator.

7. The cooling system according to claim 1, characterized in that The chiller further includes: a power supply module connected to the compressor, and when the first medium circuit is connected, the power supply module supplies power to the compressor.

8. The cooling system according to claim 1, wherein: The heat load is output from the liquid cooling device to the dry cooler, and heat exchange is performed in the dry cooler. The heat load after the heat exchange is returned to the liquid cooling device.

9. The cooling system according to claim 1, wherein: The cooling system also includes a cooling tower, which includes a spray assembly; the heat load is output by the liquid cooling device to the cooling tower, and the spray assembly performs heat exchange in the cooling tower by spraying a cooling medium, and the heat load after heat exchange is returned to the liquid cooling device.

10. The cooling system according to any one of claims 4 to 8, characterized in that: The heat load is input from the liquid cooling device into the plate evaporator for heat exchange; or, the heat load is input from the liquid cooling device into the dry cooler for heat exchange.

11. The cooling system according to claim 9, characterized in that The heat load is input from the liquid cooling device into the plate evaporator for heat exchange; or, the heat load is input from the liquid cooling device into the dry cooler for heat exchange; or, the heat load is input from the liquid cooling device into the cooling tower for heat exchange.

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