Fixing device for testing semiconductor chip module

Abstract

The utility model discloses a fixing device for testing a semiconductor chip module, and belongs to the technical field of chip testing. A fixing device for testing a semiconductor chip module comprises a device body. According to the fixing device for the semiconductor chip module test, a rotating rod rotates to drive a rotating ring to rotate, so that an internal thread is screwed into an external thread, a moving block drives moving seats and a sliding block to move in a sliding groove to extend a spring, and the four moving seats respectively move to drive a rotating plate, a mounting plate, a fixing rod, an insertion box and an elastic piece to move towards the center of a chip body; when the rotating plate makes contact with the boundary of the chip body, the rotating plate is extruded by the surface of the chip body to rotate on the surface of the spring shaft, the chip body is centered under the action of the rotating plate, the angle of the chip body is adjusted, the chip bodies with different thicknesses can be fixed and limited through the two elastic pieces, and the functions of the device body are increased; therefore, the test quality of the semiconductor chip by the test equipment is improved, and the test efficiency of the semiconductor chip by the test equipment is further improved.

Description

Technical Field

[0001] The utility model relates to the technical field of chip testing, and more particularly to a fixing device for testing a semiconductor chip module. Background Art

[0002] Semiconductor chips are essential core components of modern electronic devices. Their manufacturing materials require high predictability and stability, as any lattice defects can affect device performance. With technological advancements and the demands of the information age, the application of semiconductor chips is expanding, and their future development potential is enormous. In the face of increasingly fierce international competition, improving independent R&D and manufacturing capabilities is essential, which will help enhance China's position and influence in the global semiconductor industry.

[0003] Chinese patent application number CN202222618337.1 discloses an integrated circuit chip fracture strength test fixture, which belongs to the field of semiconductor chip physical testing. It includes a fixture base, a base guide rail, a left support module, a measuring ruler, a right support module, a spring, a right fixed module, a fixing screw, a spiral differential head, an adjusting screw and a push knife. The central area of ​​the fixture base in the width direction is a base guide rail that runs through the right side. The left support module is fixed to the left end of the base guide rail. The left end of the measuring ruler is fixed to the left support module, and the right side runs through the right support module. The right side of the right support module is connected to the right fixed module through a spring and an adjusting screw. The spiral differential head is fixed in the right fixed module and connected to the adjusting screw. The push knife is connected to the push-pull force device and is located directly above the chip on the left and right support modules.

[0004] This technical solution addresses the issues of existing chip fracture strength testers being unsuitable for testing chips of varying sizes and unable to intuitively read measurement span data. Widely used for fracture strength testing of integrated circuit chips, semiconductor chips require precise centering before testing. Misalignment can affect the test quality and, consequently, the efficiency of the test equipment. Semiconductor chips vary in thickness, necessitating the design of a fixture that can position chips of varying thicknesses. Utility Model Content

[0005] The purpose of this utility model is to provide a fixing device for testing a semiconductor chip module to solve the problems raised in the above background technology:

[0006] In order to achieve the above purpose, the present invention provides the following technical solutions:

[0007] A fixing device for testing a semiconductor chip module comprises a device body, wherein the surface of the device body has four slide grooves in a circumferential array, the interior of any of the slide grooves is slidably connected to a slider matching it, the surface of the slider is fixedly connected to a moving seat, one end surface of the moving seat is correspondingly provided with two spring shafts, the surfaces of the two spring shafts are provided with a rotating plate, the rotating plate is rotatably connected to the moving seat through the spring shaft, the surfaces of the two rotating plates are both provided with slots, the top surfaces of the two spring shafts are fixedly installed with a fixing plate, the surfaces of the two fixing plates are commonly fixedly connected to a mounting plate, the bottom surface of the mounting plate is fixedly connected to a fixing rod, one end of the fixing rod is fixedly connected to a plug-in box matching the slot, and the corresponding upper and lower inner walls of the plug-in box are fixedly installed with spring pieces.

[0008] By adopting the above technical solution, the rotating ring is rotated by the rotation of the rotating rod, so that the internal thread is screwed into the external thread. At this time, the moving block moves the moving seat and the slider in the slide groove to stretch the spring. The four moving seats move respectively with the rotating plate, the mounting plate, the fixing rod, the plug-in box and the spring clip to the center of the chip body. At this time, when the rotating plate contacts the boundary of the chip body, the rotating plate is squeezed by the surface of the chip body and rotates on the surface of the spring shaft. The chip body is centered and the angle is adjusted under the action of the rotating plate. The two spring clips can fix and limit the chip bodies of different thicknesses, thereby increasing the function of the device body, improving the test quality of the test equipment for semiconductor chips, and thus improving the test efficiency of the test equipment for semiconductor chips.

[0009] Preferably, a placement table is fixedly connected to the middle surface of the device body, and the chip body is placed on the end surface of the placement table.

[0010] Preferably, a moving block is fixedly mounted on the surface of the moving seat, an external thread is provided on the surface of the moving block, and the outer surfaces of the four moving blocks are connected to a rotating ring for common rotation, and an inner wall of the rotating ring is provided with an internal thread matching the external thread.

[0011] By adopting the above technical solution, the internal thread and the external thread are matched, thereby ensuring the stable rotation of the swivel.

[0012] Preferably, a fixing seat is fixedly mounted on the surface of the rotating ring, and a rotating rod is rotatably connected to the surface of the fixing seat.

[0013] Preferably, a spring is elastically connected between the slider and the slide groove, one end of the spring is fixedly connected to the surface of the slider, and the other end of the spring is fixedly connected to the inner wall of the slide groove.

[0014] By adopting the above technical solution, the slider can move stably under the action of the spring.

[0015] Preferably, the two spring sheets are correspondingly arranged, and the surfaces of the two spring sheets are fixedly connected with rubber sleeves, and the inner surfaces of the two rotating plates are fixedly connected with rubber sleeves.

[0016] By adopting the above technical solution, the inner surfaces of the two rotating plates are fixedly connected with rubber sleeves to prevent damage to the corners of the chip body during the test process.

[0017] Compared with the prior art, the beneficial effects of the present invention are:

[0018] 1) When the fixing device for testing the semiconductor chip module is in use, the rotating ring is rotated by rotating the rotating rod, so that the internal thread is screwed into the external thread. At this time, the moving block moves the moving seat and the slider in the slide groove to stretch the spring. The four moving seats move respectively with the rotating plate, the mounting plate, the fixing rod, the plug-in box and the spring clip to the center of the chip body. At this time, when the rotating plate contacts the boundary of the chip body, the rotating plate is squeezed by the surface of the chip body and rotates on the surface of the spring shaft. The chip body is centered and the angle is adjusted under the action of the rotating plate. The two spring clips can fix and limit the chip bodies of different thicknesses, which improves the test quality of the test equipment for semiconductor chips, thereby improving the test efficiency of the test equipment for semiconductor chips.

[0019] 2) When the fixing device for semiconductor chip module testing is in use, the two springs can fix and limit the chip bodies of different thicknesses, thereby increasing the functionality of the device body.

[0020] 3) When the semiconductor chip module test fixture is in use, the surfaces of the two springs are fixedly connected with rubber sleeves, and the inner surfaces of the two rotating plates are fixedly connected with rubber sleeves to prevent damage to the corners of the chip body during testing. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0022] Figure 2 This is a schematic diagram of the slider structure of the utility model;

[0023] Figure 3 This is a schematic diagram of the rotating plate structure of the present utility model;

[0024] Figure 4 This is a schematic diagram of the swivel structure of the utility model.

[0025] Explanation of the numbers in the figure: 1. Device body; 2. Slide groove; 3. Slider; 4. Moving seat; 5. Spring shaft; 6. Turn plate; 7. Notch; 8. Fixed plate; 9. Mounting plate; 10. Fixed rod; 11. Insert box; 12. Spring; 13. Placement table; 14. Chip body; 15. Moving block; 16. External thread; 17. Swivel; 18. Internal thread; 19. Fixed seat; 20. Turn rod; 21. Spring. DETAILED DESCRIPTION

[0026] Example 1

[0027] See also Figures 1 to 4 , a fixing device for testing a semiconductor chip module includes a device body 1, which is a chip body 14 fixing device in the prior art. The surface circumferential array of the device body 1 has four slide grooves 2, and the slider 3 matches the slide groove 2 to ensure the stable movement of the moving seat 4. The interior of any slide groove 2 is slidably connected with a slider 3 matching it, and the surface of the slider 3 is fixedly connected with the moving seat 4. One end surface of the moving seat 4 is correspondingly provided with two spring shafts 5, and the spring shaft 5 is a conventional elastic reset shaft in the prior art. The surfaces of the two spring shafts 5 are provided with a rotating plate 6. The chip body 14 is centered and the angle is adjusted under the action of the rotating plate 6. The rotating plate 6 is rotatably connected to the moving seat 4 through the spring shaft 5. The surfaces of the two rotating plates 6 are both provided with notches 7. The top surfaces of the two spring shafts 5 are fixedly installed with a fixing plate 8. The surfaces of the two fixing plates 8 are jointly fixedly connected with a mounting plate 9. The bottom surface of the mounting plate 9 is fixedly connected with a fixing rod 10. One end of the fixing rod 10 is fixedly connected with The slot 7 matches the plug box 11, and the corresponding upper and lower inner walls of the plug box 11 are fixedly installed with spring clips 12. The two spring clips 12 can fix and limit the chip bodies 14 of different thicknesses. The rotating ring 17 is rotated by the rotating rod 20, so that the internal thread 18 is screwed into the external thread 16. At this time, the moving block 15 moves the moving seat 4 and the slider 3 in the slide groove 2 to stretch the spring 21. The four moving seats 4 move respectively with the rotating plate 6, the mounting plate 9, the fixing rod 10, the plug box 11 and the spring clip 12 to move toward the center of the chip body 14. At this time, when the rotating plate 6 contacts the boundary of the chip body 14, the rotating plate 6 is squeezed by the surface of the chip body 14 and rotates on the surface of the spring shaft 5. The chip body 14 is centered and the angle is adjusted under the action of the rotating plate 6. The two spring clips 12 can fix and limit the chip bodies 14 of different thicknesses, which increases the function of the device body 1, improves the test quality of the test equipment for semiconductor chips, and thus improves the test efficiency of the test equipment for semiconductor chips.

[0028] A placement platform 13 is fixedly connected to the middle surface of the device body 1 , and a chip body 14 is placed on the end surface of the placement platform 13 . The chip body 14 is a conventional semiconductor chip in the prior art.

[0029] A moving block 15 is fixedly installed on the surface of the moving seat 4, and an external thread 16 is provided on the surface of the moving block 15. The outer surfaces of the four moving blocks 15 are connected to a swivel 17 for common rotation. The inner wall of the swivel 17 is provided with an internal thread 18 that matches the external thread 16. The internal thread 18 matches the external thread 16 to ensure the stable rotation of the swivel 17.

[0030] A fixing seat 19 is fixedly mounted on the surface of the rotating ring 17 , and a rotating rod 20 is rotatably connected to the surface of the fixing seat 19 .

[0031] A spring 21 is elastically connected between the slider 3 and the slide groove 2. One end of the spring 21 is fixedly connected to the surface of the slider 3, and the other end of the spring 21 is fixedly connected to the inner wall of the slide groove 2. Under the action of the spring 21, the slider 3 can move stably.

[0032] The two spring pieces 12 are arranged correspondingly, and the surfaces of the two spring pieces 12 are fixedly connected with rubber sleeves, and the inner surfaces of the two rotating plates 6 are fixedly connected with rubber sleeves. By fixing the surfaces of the two spring pieces 12 with rubber sleeves and the inner surfaces of the two rotating plates 6 with rubber sleeves, the chip body 14 is prevented from being damaged at the corners during the test.

[0033] The use steps of the present utility model are as follows: when the fixing device for testing the semiconductor chip module is in use, when testing the chip body 14, first, the chip body 14 is placed on the surface of the placement table 13 through external tweezers, and the rotating rod 20 is manually rotated. The rotating rod 20 rotates with the rotating ring 17 to rotate, thereby causing the internal thread 18 to be screwed into the external thread 16. At this time, the moving block 15 drives the moving seat 4 and the slider 3 to move in the slide groove 2 to stretch the spring 21. The four moving seats 4 move respectively with the rotating plate 6, the mounting plate 9, the fixing rod 10, the plug-in box 11 and the spring 12 to move toward the center of the chip body 14. At this time, when the rotating plate 6 contacts the boundary of the chip body 14, the rotating plate 6 is squeezed by the surface of the chip body 14 and rotates on the surface of the spring shaft 5. As the moving seat 4 continues to move, the corners of the chip body 14 are inserted between the two springs 12, and then the chip body 14 can be automatically centered. The two springs 12 fix and limit the chip body 14. This scheme rotates the rotating rod 20 with As the rotating ring 17 rotates, the internal thread 18 is screwed into the external thread 16. At this time, the moving block 15 carries the moving seat 4 and the slider 3 to move the tension spring 21 in the slide groove 2. The four moving seats 4 move respectively with the rotating plate 6, the mounting plate 9, the fixing rod 10, the plug-in box 11 and the spring 12 to move toward the center of the chip body 14. At this time, when the rotating plate 6 contacts the boundary of the chip body 14, the rotating plate 6 is squeezed by the surface of the chip body 14 and rotates on the surface of the spring shaft 5. The chip body 14 is centered and the angle is adjusted under the action of the rotating plate 6. The two springs 12 can fix and limit the chip bodies 14 of different thicknesses, increase the function of the device body 1, improve the test quality of the test equipment for semiconductor chips, and thus improve the test efficiency of the test equipment for semiconductor chips; the surfaces of the two springs 12 are fixedly connected with rubber sleeves, and the inner surfaces of the two rotating plates 6 are fixedly connected with rubber sleeves to prevent damage to the corners of the chip body 14 during the test.

[0034] The above shows and describes the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions are merely preferred examples of the present invention and are not intended to limit the present invention. Various changes and improvements may be made to the present invention without departing from the spirit and scope of the present invention, and such changes and improvements fall within the scope of the present invention. The scope of protection claimed in the present invention is defined by the appended claims and their equivalents.

Claims

1. A fixing device for testing a semiconductor chip module, comprising a device body (1), characterized in that: The surface circumference array of the device body (1) is provided with four slide grooves (2), and the interior of any one of the slide grooves (2) is slidably connected with a slider (3) matching it, and the surface of the slider (3) is fixedly connected with a moving seat (4), and one end surface of the moving seat (4) is correspondingly provided with two spring shafts (5), and the surfaces of the two spring shafts (5) are provided with a rotating plate (6), and the rotating plate (6) is rotatably connected to the moving seat (4) through the spring shaft (5), and the surfaces of the two rotating plates (6) are both provided with a notch (7), and the top surfaces of the two spring shafts (5) are fixedly installed with a fixing plate (8), and the surfaces of the two fixing plates (8) are fixedly connected with a mounting plate (9), and the bottom surface of the mounting plate (9) is fixedly connected with a fixing rod (10), and one end of the fixing rod (10) is fixedly connected with a plug-in box (11) matching the notch (7), and the corresponding upper and lower inner walls of the plug-in box (11) are fixedly installed with spring pieces (12).

2. The fixture for semiconductor chip module testing according to claim 1, characterized in that: A placement platform (13) is fixedly connected to the middle surface of the device body (1), and a chip body (14) is placed on the end surface of the placement platform (13).

3. The fixture for semiconductor chip module testing according to claim 1, wherein: A moving block (15) is fixedly mounted on the surface of the moving seat (4), and an external thread (16) is provided on the surface of the moving block (15). The outer surfaces of the four moving blocks (15) are connected to a rotating ring (17) for rotation therewith, and an internal thread (18) matching the external thread (16) is provided on the inner wall of the rotating ring (17).

4. The fixture for testing a semiconductor chip module according to claim 3, wherein: A fixing seat (19) is fixedly mounted on the surface of the rotating ring (17), and a rotating rod (20) is rotatably connected to the surface of the fixing seat (19).

5. The fixture for semiconductor chip module testing according to claim 1, wherein: A spring (21) is elastically connected between the slider (3) and the slide groove (2), one end of the spring (21) is fixedly connected to the surface of the slider (3), and the other end of the spring (21) is fixedly connected to the inner wall of the slide groove (2).

6. The fixture for semiconductor chip module testing according to claim 1, wherein: The two spring pieces (12) are correspondingly arranged, and the surfaces of the two spring pieces (12) are fixedly connected with rubber sleeves, and the inner surfaces of the two rotating plates (6) are fixedly connected with rubber sleeves.

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