Ceramic substrate damage detection device

Abstract

The utility model discloses a ceramic substrate damage detection device, which relates to the technical field of damage detection, and comprises a shell, an internal frame is arranged in the shell, a pin electrode is arranged on the internal frame, a camera module is arranged on one side of the internal frame, a limiting carrier plate is slidably mounted at the front end of the shell, and the limiting carrier plate is connected with the pin electrode. A limiting support plate is arranged in the shell, a plate electrode is fixedly installed on the limiting support plate, an adjustable light window is formed in one side of the shell, a power interface is formed in the other side of the shell, the camera module comprises a camera body and a sliding support, the camera body is movably installed on the sliding support, and the inner frame comprises an exoskeleton frame. According to the ceramic substrate damage detection device, weak light spots on the surface of the ceramic substrate can be detected to judge whether the substrate is damaged or not, and the illumination intensity of the internal test environment can be finely controlled through the adjustable light window to determine the optimal imaging condition, so that the weak light spots on the surface of the ceramic substrate can be clearly presented.

Description

Technical Field

[0001] The utility model relates to the technical field of damage detection, in particular to a ceramic substrate damage detection device. Background Art

[0002] Ceramic substrates are an important electronic material, made of ceramic materials and commonly used in the manufacture of electronic components. They possess high strength, hardness, and wear resistance, as well as excellent insulation and thermal stability. Therefore, they are widely used in electronic components such as integrated circuits, power modules, and radio frequency devices. Ceramic substrates effectively block the flow of current, preventing interference and loss between electronic components. Their high thermal conductivity effectively transfers and dissipates heat, maintaining a stable operating temperature for electronic components. Furthermore, they exhibit excellent dimensional and chemical stability, enabling them to maintain stable performance in harsh environments such as high temperature and high humidity.

[0003] Copper-clad ceramic substrates are widely used in electronic device packaging due to their excellent thermal conductivity, outstanding heat resistance, low thermal expansion coefficient, high mechanical strength, good insulation properties, and superior corrosion and radiation resistance. During the sintering process, differences in thermal expansion coefficients between different materials can cause damage to the internal structure of the ceramic, forming microcracks. These microcracks can negatively impact the overall performance of the product, reducing its reliability. Therefore, a device for detecting ceramic substrate damage is proposed. Utility Model Content

[0004] The purpose of the utility model is to provide a ceramic substrate damage detection device to solve the problem of inconvenience in crack detection on ceramic substrates in the prior art.

[0005] To achieve the above-mentioned purpose, the present invention provides the following technical solution: a ceramic substrate damage detection device, comprising a shell, an internal frame is provided in the shell, a needle electrode is provided on the internal frame, a camera module is provided on one side of the internal frame, a limit carrier is slidably installed on the front end of the shell, a plate electrode is fixedly installed on the limit carrier, an adjustable light window is provided on one side of the shell, and a power interface is provided on the other side of the shell, and a power cord is connected to the power interface.

[0006] Preferably, the bottom of the limiting carrier is provided with sliding feet, the limiting carrier is slidably installed on the parallel guide rails through the sliding feet, the limiting carrier is movably installed on the bottom plate through the parallel guide rails, the limiting carrier extends into the shell through the carrier inlet and outlet, and the limiting carrier can slide along the parallel guide rails.

[0007] Preferably, the bottom of the limiting carrier is provided with sliding feet, the limiting carrier is slidably installed on the parallel guide rails through the sliding feet, the limiting carrier is movably installed on the bottom plate through the parallel guide rails, and the limiting carrier extends into the shell through the carrier inlet and outlet.

[0008] Preferably, a limiting carrier plate baffle is fixedly mounted on the limiting carrier plate.

[0009] Preferably, the internal frame includes an exoskeleton frame, a socket plate is fixedly mounted on the exoskeleton frame, and the upper end of the needle electrode is connected to the upper end socket of the socket plate.

[0010] Preferably, the camera module includes a camera body and a sliding bracket, and the camera body is movably mounted on the sliding bracket.

[0011] Preferably, a connecting plate is fixedly installed at the bottom of the sliding bracket, the sliding bracket is installed on the bottom plate through the connecting plate, and the camera module is installed on one side of the internal frame through the sliding bracket.

[0012] Compared with the prior art, the beneficial effects of the present invention are:

[0013] 1. In this application, a camera body is used to image a ceramic substrate, converting the captured image signal into a digital signal and transmitting it to a professional image processing system. The system performs a series of signal processing operations based on parameters such as pixel distribution, brightness, and color to extract target features. Subsequently, the system detects faint light spots on the surface of the ceramic substrate based on a preset brightness threshold range to determine whether the substrate is damaged.

[0014] 2. In the present application, during the testing process, the ceramic substrate is positioned at the predetermined position of the plate electrode, and then the limiting carrier is pushed forward to introduce the ceramic substrate into the shell. The light intensity of the internal test environment can be precisely controlled through the adjustable light window to determine the optimal imaging conditions, so that the micro-light spots on the surface of the ceramic substrate can be clearly presented, thereby more accurately evaluating the performance of the ceramic substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0016] Figure 2 This is a schematic diagram of the shell structure of the utility model;

[0017] Figure 3 This is a schematic diagram of a position limiting carrier plate of the present utility model;

[0018] Figure 4 This is a schematic diagram of the bottom plate structure of the utility model;

[0019] Figure 5This is a schematic diagram of the internal framework of the present utility model;

[0020] Figure 6 This is a schematic diagram of the camera module of the present invention.

[0021] Numbers in the figure: 1. Shell; 11. Pull-up cover; 111. Buckle; 12. Observation window; 13. Carrier board inlet and outlet; 14. Dimmable window; 15. Power interface; 16. Bottom foot pad; 2. Bottom plate; 21. Parallel guide rail; 3. Limit carrier board; 31. Limit carrier board baffle; 4. Plate electrode; 5. Needle electrode; 6. Internal frame; 61. Exoskeleton frame; 62. Socket board; 7. Camera module; 71. Camera body; 72. Sliding bracket. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0023] like Figure 1 、 Figure 3 and Figure 4 As shown, the utility model provides a technical solution for a ceramic substrate damage detection device, including a shell 1, an internal frame 6 is provided in the shell 1, a needle electrode 5 is provided on the internal frame 6, a camera module 7 is provided on one side of the internal frame 6, a limit carrier plate 3 is slidably installed on the front end of the shell 1, a plate electrode 4 is fixedly installed on the limit carrier plate 3, an adjustable light window 14 is opened on one side of the shell 1, and a power interface 15 is provided on the other side of the shell 1.

[0024] like Figure 2 、 Figure 3 and Figure 5As shown, an internal frame 6 is provided in the shell 1, and a needle electrode 5 is provided on the internal frame 6. A limit carrier plate 3 is slidably installed at the front end of the shell 1, and a plate electrode 4 is fixedly installed on the limit carrier plate 3. An adjustable window 14 is provided on one side of the shell 1, and a power interface 15 is provided on the other side of the shell 1. An upper pull-up cover 11 is fixedly installed on the upper end of the shell 1, and a snap 111 is provided on the upper pull-up cover 11. An observation window 12 is provided at the front end of the shell 1, and a carrier plate inlet and outlet 13 is provided at the front end of the shell 1 below the observation window 12. A base plate 2 is fixedly installed at the bottom of the shell 1, and bottom foot pads 16 are fixedly installed at the four corners of the bottom of the base plate 2. Parallel guide rails 21 are fixedly installed on the upper surface of the base plate 2. Sliding feet are provided at the bottom of the limit carrier plate 3, and the limit carrier plate 3 is slidably installed on the parallel guide rails 21 through the sliding feet. The limit carrier plate 3 is movably installed on the base plate 2 through the parallel guide rails 21. The limit carrier plate 3 extends into the shell 1 through the carrier plate inlet and outlet 13, and a limit carrier plate baffle 31 is fixedly installed on the limit carrier plate 3.

[0025] Specifically, during the testing process, the ceramic substrate must first be placed in the designated position of the plate electrode 4. Subsequently, by pushing the limiting carrier plate 3 forward, the ceramic substrate can be smoothly inserted into the interior of the housing 1. To ensure the required brightness level of the test environment, the light intensity of the internal test environment can be adjusted by rotating the adjustable light window 14. This method can find the optimal imaging conditions, making the micro-light spots on the surface of the ceramic substrate more prominent and enabling a more accurate assessment of the ceramic substrate's performance.

[0026] like Figure 1 、 Figure 5 and Figure 6 As shown, a camera module 7 is provided on one side of the internal frame 6, and the internal frame 6 includes an exoskeleton frame 61, a socket plate 62 is fixedly mounted on the exoskeleton frame 61, and the upper end of the needle electrode 5 is connected to the socket at the upper end of the socket plate 62, the camera module 7 includes a camera body 71 and a sliding bracket 72, and the camera body 71 is movably mounted on the sliding bracket 72, a connecting plate is fixedly mounted on the bottom of the sliding bracket 72, the sliding bracket 72 is mounted on the bottom plate 2 through the connecting plate, and the camera module 7 is mounted on one side of the internal frame 6 through the sliding bracket 72.

[0027] Specifically, the camera body 71 is used to image the ceramic substrate. The acquired image signal is converted and transmitted to a dedicated image processing system. Within this system, the image signal is further converted into a digital signal based on parameters such as pixel distribution, brightness, and color. The image processing system performs a series of algorithmic operations on these digital signals to extract target features. The system then detects the faint light spots emitted from the surface of the ceramic substrate within a preset brightness threshold range to determine whether the ceramic substrate is damaged.

[0028] Working principle: Before conducting the test, first, you need to plug the power interface 15 on one side of the shell 1 into the corresponding plug to ensure that the power connection is normal. Then, place the ceramic substrate to be tested on the designated position of the plate electrode 4 to ensure that it is placed flat on the electrode surface. Then, the operator needs to push the limit carrier 3 forward along the parallel guide rail 21 until the baffle of the limit carrier 3 is completely in contact with the carrier inlet and outlet 13 on the shell 1 to ensure that the limit carrier 3 has been fully pushed into place. After the ceramic substrate to be tested is placed in the test area of ​​the equipment, the operator needs to lower the observation window 12 to ensure the airtightness of the entire test area to prevent external light from interfering with the test results. Next, the operator needs to power on the power supply, start the equipment for testing, and take a picture of the ceramic substrate through the camera body 71. The captured picture is converted into an image signal, which is then sent to a dedicated image processing system to convert it into a digital signal based on pixel distribution, brightness, color and other information. The image system performs various operations on these signals to extract the characteristics of the target, and then checks the weak light spots emitted from the surface of the ceramic substrate according to the preset allowable brightness range to determine whether the ceramic substrate is damaged. To ensure that the observed image is clear, the operator needs to adjust the brightness of the internal test environment by rotating the adjustable light window 14. By carefully adjusting the light window, the optimal imaging conditions can be found, making the micro-light spots on the surface of the ceramic substrate more obvious, thereby more accurately judging the performance of the ceramic substrate.

[0029] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the present invention can be implemented in other specific forms without departing from the spirit or essential characteristics of the present invention. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the present invention is defined by the appended claims, not the foregoing description, and all variations within the meaning and range of equivalents of the claims are intended to be encompassed within the present invention. Any reference sign in a claim should not be construed as limiting the claim to which it relates.

Claims

1. A ceramic substrate damage detection device, comprising a housing (1), characterized in that: An internal frame (6) is provided in the shell (1), a needle electrode (5) is provided on the internal frame (6), a camera module (7) is provided on one side of the internal frame (6), a limit carrier plate (3) is slidably mounted on the front end of the shell (1), a plate electrode (4) is fixedly mounted on the limit carrier plate (3), an adjustable light window (14) is provided on one side of the shell (1), and a power supply interface (15) is provided on the other side of the shell (1).

2. The ceramic substrate damage detection device according to claim 1, characterized in that: The upper end of the shell (1) is fixedly mounted with an upper pull-up cover (11), the upper pull-up cover (11) is provided with a snap fastener (111), the front end of the shell (1) is provided with an observation window (12), the front end of the shell (1) is provided with a carrier plate inlet and outlet (13) below the observation window (12), the bottom of the shell (1) is fixedly mounted with a bottom plate (2), the bottom four corners of the bottom of the bottom plate (2) are fixedly mounted with bottom foot pads (16), and the upper surface of the bottom plate (2) is fixedly mounted with parallel guide rails (21).

3. The ceramic substrate damage detection device according to claim 2, characterized in that: The bottom of the position-limiting carrier (3) is provided with a sliding foot, and the position-limiting carrier (3) is slidably mounted on the parallel guide rail (21) via the sliding foot. The position-limiting carrier (3) is movably mounted on the bottom plate (2) via the parallel guide rail (21), and the position-limiting carrier (3) extends into the housing (1) through the carrier plate inlet and outlet (13).

4. The ceramic substrate damage detection device according to claim 3, characterized in that: A limiting carrier baffle (31) is fixedly mounted on the limiting carrier (3).

5. The ceramic substrate damage detection device according to claim 4, characterized in that: The internal frame (6) comprises an exoskeleton frame (61), a socket plate (62) is fixedly mounted on the exoskeleton frame (61), and the upper end of the needle electrode (5) is connected to the socket at the upper end of the socket plate (62).

6. The ceramic substrate damage detection device according to claim 3, characterized in that: The camera module (7) comprises a camera body (71) and a sliding bracket (72), wherein the camera body (71) is movably mounted on the sliding bracket (72).

7. The ceramic substrate damage detection device according to claim 6, characterized in that: A connecting plate is fixedly mounted on the bottom of the sliding bracket (72), the sliding bracket (72) is mounted on the bottom plate (2) via the connecting plate, and the camera module (7) is mounted on one side of the internal frame (6) via the sliding bracket (72).

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