Multifunctional TSSOP packaging detection platform

Abstract

The utility model relates to the technical field of chip packaging detection, in particular to a multifunctional TSSOP packaging detection platform which comprises a workbench, a connecting shell is fixedly connected to the top of the workbench, a detection camera is arranged on the inner side of the connecting shell, and a control table is arranged on one side of the workbench; the auxiliary structure is arranged on the inner side of the workbench; the auxiliary structure comprises a conveying belt arranged on the inner side of the workbench, and the inner side of the workbench is fixedly connected with two guide plates which are symmetrically distributed. By arranging the auxiliary structure, the position of the chip can be adjusted in the conveying process under the action of the guide plate, the conveying belt and the limiting assembly, the chip can be located in the middle of the surface of the limiting assembly, the accuracy of follow-up detection is improved, meanwhile, the position of the chip can be limited through the limiting assembly in the conveying process, and the detection efficiency is improved. And the situation that the chips fall off in the conveying process is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of chip packaging detection, in particular to a multifunctional TSSOP packaging detection platform. Background Art

[0002] Chip is a general term for semiconductor component products. After manufacturing, chips are made into various packaging forms according to demand. After packaging, the chips need to be tested to test their packaging effect and whether there are any problems with the chip's internal circuits. TSSOP is the abbreviation of Thin Shrink Small Outline Package. It is thinner than SOP, has denser pins, and has a smaller package size for the same function.

[0003] After searching, a Chinese patent discloses a chip packaging detection system (Announcement No. CN221433993U). This patented technology uses a transportation device to start a drive motor to move the chip tray on the card board, which is beneficial to improving the speed of chip detection. However, it is inconvenient to adjust the position of the chip and is not conducive to subsequent detection. Therefore, those skilled in the art provide a multifunctional TSSOP packaging detection platform to solve the problems raised in the above background technology. Utility Model Content

[0004] The purpose of the present invention is to provide a multifunctional TSSOP package detection platform in order to solve the above problems, thereby improving the problem that it is inconvenient to adjust the position of the chip and is not conducive to subsequent detection.

[0005] The utility model achieves the above-mentioned purpose through the following technical solutions, a multifunctional TSSOP package detection platform, comprising:

[0006] A workbench, the top of which is fixedly connected to a connection shell, an inner side of which is provided with a detection camera, and one side of the workbench is provided with a console;

[0007] An auxiliary structure, the auxiliary structure being arranged on the inner side of the workbench;

[0008] The auxiliary structure includes a conveyor belt arranged on the inner side of the workbench, and two symmetrically distributed guide plates are fixedly connected to the inner side of the workbench. The two guide plates are both located above the conveyor belt, and a limit assembly is provided on the surface of the conveyor belt;

[0009] Among them, the limiting assembly includes several groups of mounting blocks arranged on the surface of the conveyor belt, each group of the mounting blocks has two mounting blocks, the surface of the mounting blocks is provided with two symmetrically distributed adsorption grooves, and the top surface height of the mounting blocks is lower than the bottom surface height of the guide plate.

[0010] Preferably, an adjustment cavity connected to the adsorption groove is opened inside the mounting block, and an adjustment plate is slidably connected to the inner wall of the adjustment cavity. The side of the adjustment plate away from the adsorption groove is fixedly connected to a connecting rod, and the other end of the connecting rod passes through the mounting block and the conveyor belt in sequence and is fixedly connected to a guide rod.

[0011] Preferably, a spring is fixedly connected to the bottom of the adjustment plate, and the other end of the spring is fixedly connected to the inner bottom wall of the adjustment cavity.

[0012] Preferably, a limiting rod is fixedly connected to the surface of one of the mounting blocks, and the other end of the limiting rod passes through the adjacent mounting block and is slidably connected to the inner wall of the mounting block.

[0013] Preferably, an adjusting screw is provided on the surface of one of the mounting blocks, and the other end of the adjusting screw is threadedly passed through the adjacent mounting block and is rotatably connected to the surface of the other mounting block.

[0014] Preferably, two symmetrically distributed guide plates are provided on the inner side of the workbench.

[0015] The beneficial effect of the present invention is that by setting up an auxiliary structure, the position of the chip can be adjusted during the transportation process under the action of the guide plate, the conveyor belt and the limiting component, so that it can be located in the middle of the surface of the limiting component, thereby improving the accuracy of subsequent detection. At the same time, the position of the chip can be limited by the limiting component during the transportation process, thereby avoiding the chip falling off during the transportation process. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a structural diagram of the utility model;

[0017] Figure 2 It is a cross-sectional schematic diagram of the utility model;

[0018] Figure 3 This is a schematic diagram of the connection between the limit assembly and the conveyor belt of the utility model;

[0019] Figure 4 This is a schematic diagram of the distribution of the guide plate and the guide plate of the utility model.

[0020] In the figure: 1. workbench; 101. connecting shell; 102. detection camera; 2. control console; 3. auxiliary structure; 301. guide plate; 302. conveyor belt; 31. limit assembly; 311. mounting block; 312. adsorption groove; 313. adjustment plate; 314. limit rod; 315. guide rod; 316. connecting rod; 317. adjusting screw; 318. guide plate; 319. spring. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0022] When implementing: Figure 1-4 As shown, a multifunctional TSSOP package inspection platform includes:

[0023] A workbench 1, a connection shell 101 is fixedly connected to the top of the workbench 1, a detection camera 102 is set on the inner side of the connection shell 101, and a console 2 is set on one side of the workbench 1;

[0024] Auxiliary structure 3, the auxiliary structure 3 is arranged on the inner side of the workbench 1;

[0025] The auxiliary structure 3 includes a conveyor belt 302 disposed inside the workbench 1. Two symmetrically distributed guide plates 301 are fixedly connected to the inside of the workbench 1. Both guide plates 301 are located above the conveyor belt 302. A limit assembly 31 is provided on the surface of the conveyor belt 302.

[0026] Among them, the limiting component 31 includes several groups of mounting blocks 311 arranged on the surface of the conveyor belt 302, and each group of mounting blocks 311 has two numbers. The surface of the mounting block 311 is provided with two symmetrically distributed adsorption grooves 312, and the top surface height of the mounting block 311 is lower than the bottom surface height of the guide plate 301.

[0027] The packaged chip is placed on two adjacent mounting blocks 311, and the conveyor belt 302 is activated to move the packaged chip to the inner side of the connection shell 101. The package surface and pins are photographed by the inspection camera 102, and the photographed images are transmitted to the control console 2 for comparison by the control staff. This can reduce the inspection of TSSOP chip appearance and pin missing and bending, achieve multiple inspection effects, and enable the device to realize multifunctional inspection;

[0028] When the conveyor belt 302 moves the chip, the guide plate 301 can move the chip to the middle of the mounting block 311, which is convenient for the subsequent detection camera 102 to shoot it, so that the captured image is centered for easy comparison by the staff.

[0029] like Figure 1-4As shown, an adjustment cavity connected to the adsorption groove 312 is opened inside the mounting block 311, and an adjustment plate 313 is slidably connected to the inner wall of the adjustment cavity. The side of the adjustment plate 313 away from the adsorption groove 312 is fixedly connected to a connecting rod 316, and the other end of the connecting rod 316 passes through the mounting block 311 and the conveyor belt 302 in sequence and is fixedly connected to a guide rod 315.

[0030] A spring 319 is fixedly connected to the bottom of the adjustment plate 313, and the other end of the spring 319 is fixedly connected to the inner bottom wall of the adjustment cavity;

[0031] Two symmetrically distributed guide plates 318 are provided on the inner side of the workbench 1 .

[0032] As the conveyor belt 302 drives the mounting block 311 to move, the connecting rod 316 moves synchronously with the guide rod 315, so that they can contact the bottom surface of the guide plate 318. As the conveyor belt 302 moves, the guide rod 315 is driven downward by the guide plate 318. In this process, the adjusting plate 313 can be pulled down on the inner wall of the adjusting cavity by the connecting rod 316, and the adsorption groove 312 is blocked by the chip. At this time, the space from the top of the adjusting plate 313 to the bottom surface of the chip can gradually form a low pressure, and then the chip is adsorbed through the adsorption groove 312 under the action of the air pressure difference, ensuring the stability of the chip during the transportation process, facilitating the subsequent detection camera 102 to shoot it, and avoiding the chip falling off during transportation. When the guide rod 315 is separated from the guide plate 318, it can drive the adjusting plate 313 to reset under the action of the spring 319, thereby contacting the adsorption of the chip to facilitate the removal of the chip.

[0033] like Figure 2 and Figure 3 As shown, a limiting rod 314 is fixedly connected to the surface of one of the mounting blocks 311 , and the other end of the limiting rod 314 passes through the adjacent mounting block 311 and is slidably connected to the inner wall of the mounting block 311 .

[0034] An adjusting screw 317 is provided on the surface of one of the mounting blocks 311 , and the other end of the adjusting screw 317 is threadedly passed through the adjacent mounting block 311 and is rotatably connected to the surface of the other mounting block 311 .

[0035] The mounting block 311 threaded by the adjusting screw 317 is fixedly connected to the surface of the conveyor belt 302. By rotating the adjusting screw 317, the adjacent mounting block 311 can be gradually penetrated and the other mounting block 311 can be pushed to move synchronously, thereby increasing the distance between the two adjacent mounting blocks 311, so that TSSOP packaged chips of different specifications can be transported, thereby improving the applicability of the device. The setting of the limit rod 314 is used to enhance the stability of the mounting block 311 during movement.

[0036] When the present invention is in use, the packaged chip is placed on two adjacent mounting blocks 311, and the packaged chip is driven to move to the inner side of the connecting shell 101 by starting the conveyor belt 302, and its package surface and pins are photographed by the detection camera 102, and the photographed image is transmitted to the control console 2 for comparison by the control staff, which can reduce the detection of TSSOP chip appearance and missing and bent pins, and achieve multiple detection effects, so that the device can realize multi-functional detection. As the conveyor belt 302 moves, the guide rod 315 is driven downward by the action of the guide plate 318. In this process, the adjustment plate 313 can be pulled down on the inner wall of the adjustment cavity by the connecting rod 316, and the adsorption groove 312 is blocked by the chip. At this time, the space from the top of the adjustment plate 313 to the bottom of the chip can gradually form a low pressure, and then the chip is adsorbed by the adsorption groove 312 under the action of the air pressure difference, thereby ensuring the stability of the chip during transportation.

[0037] In addition, it should be understood that although this specification is described in terms of implementation methods, not every implementation method contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.

Claims

1. A multifunctional TSSOP package detection platform, characterized in that: include: A workbench (1), wherein a connection shell (101) is fixedly connected to the top of the workbench (1), a detection camera (102) is provided on the inner side of the connection shell (101), and a control console (2) is provided on one side of the workbench (1); An auxiliary structure (3), the auxiliary structure (3) being arranged on the inner side of the workbench (1); The auxiliary structure (3) comprises a conveyor belt (302) arranged on the inner side of the workbench (1); two symmetrically distributed guide plates (301) are fixedly connected to the inner side of the workbench (1); the two guide plates (301) are both located above the conveyor belt (302); and a limit assembly (31) is provided on the surface of the conveyor belt (302); The limiting assembly (31) includes a plurality of groups of mounting blocks (311) arranged on the surface of the conveyor belt (302), each group of the mounting blocks (311) includes two mounting blocks, the surface of the mounting blocks (311) is provided with two symmetrically distributed adsorption grooves (312), and the top surface height of the mounting blocks (311) is lower than the bottom surface height of the guide plate (301).

2. A multifunctional TSSOP package detection platform according to claim 1, characterized in that: An adjustment cavity connected to the adsorption groove (312) is provided inside the mounting block (311); an adjustment plate (313) is slidably connected to the inner wall of the adjustment cavity; a connecting rod (316) is fixedly connected to the side of the adjustment plate (313) away from the adsorption groove (312); the other end of the connecting rod (316) passes through the mounting block (311) and the conveyor belt (302) in sequence and is fixedly connected to a guide rod (315).

3. A multifunctional TSSOP package detection platform according to claim 2, characterized in that: A spring (319) is fixedly connected to the bottom of the adjustment plate (313), and the other end of the spring (319) is fixedly connected to the inner bottom wall of the adjustment cavity.

4. A multifunctional TSSOP package detection platform according to claim 3, characterized in that: A limiting rod (314) is fixedly connected to the surface of one of the mounting blocks (311), and the other end of the limiting rod (314) passes through the adjacent mounting block (311) and is slidably connected to the inner wall of the mounting block (311).

5. A multifunctional TSSOP package detection platform according to claim 4, characterized in that: An adjusting screw (317) is provided on the surface of one of the mounting blocks (311), and the other end of the adjusting screw (317) is threadedly passed through the adjacent mounting block (311) and is rotatably connected to the surface of the other mounting block (311).

6. A multifunctional TSSOP package detection platform according to claim 1, characterized in that: Two symmetrically distributed guide plates (318) are provided on the inner side of the workbench (1).

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