Electrical test system

Abstract

The utility model provides an electrical property test system, comprising a carrier plate used for placing a substrate to be tested; the electrical property test probe is arranged above the carrier plate and is used for testing the electrical property of the substrate to be tested; the laser scanner is arranged above the carrier plate and is used for acquiring the surface height of the substrate to be measured; wherein the distance between the carrier plate and the electrical test probe is adjusted according to the surface height of the substrate to be tested. Thus, the height information of the surface of the to-be-tested substrate is obtained through the laser scanner, and the distance between the carrier plate and the electrical test probe is adjusted, so that on one hand, collision between the electrical test probe and the to-be-tested substrate can be avoided, and the probe or the substrate is prevented from being damaged; and on the other hand, poor contact between the electrical test probe and the substrate to be tested can be avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor packaging, in particular to an electrical testing system. Background Art

[0002] After the new chip is manufactured, electrical test probes are used to test the electrical properties of each unit on the chip. Figure 1 , a new chip may have multiple units that need to be tested. Therefore, it is necessary to change the position of the chip relative to the electrical test probe so that the electrical test probe can perform electrical tests on components on different units. (The electrical test unit here is pre-set, see Figure 2 As shown by the dotted lines on the left chip, a first unit under test 03, a second unit under test 04, a third unit under test 05, and a fourth unit under test 06 can be set on the chip; as shown by the dotted lines on the right chip, a fifth unit under test 07, a sixth unit under test 08, a seventh unit under test 09, a tenth unit under test 10, and an eleventh unit under test 11 can also be set on the chip.

[0003] However, there are height differences within the components themselves (see, for example, Figure 1 The height difference between the first test point 01 and the second test point 02), chip warping may also cause height differences (for example, see Figure 3 The height difference between the third test point 12 and the fourth test point 13). When the probe switches from one unit to be tested to another unit to be tested, if these height differences cannot be identified, a collision may occur, resulting in damage to the component or the probe (for example, see Figure 1 Alternatively, a poor contact may occur, causing the electrical test to fail (e.g., see Figure 1 The second test point 02 or Figure 3 The fourth test point 13). Utility Model Content

[0004] The utility model proposes an electrical testing system, comprising:

[0005] A carrier plate, the carrier plate is used to place the substrate to be tested;

[0006] An electrical test probe, disposed above the carrier board, for testing the electrical properties of the substrate to be tested;

[0007] A laser scanner is provided above the carrier plate and is used to obtain the surface height of the substrate to be measured;

[0008] The distance between the carrier and the electrical test probe is adjusted according to the surface height of the substrate to be tested.

[0009] As a possible implementation, the system further includes:

[0010] A probe bracket, on which the electrical test probe is arranged.

[0011] As a possible implementation manner, the laser scanner is arranged on the probe bracket.

[0012] As a possible implementation, the system further includes:

[0013] Laser scanner bracket, the laser scanner is arranged on the laser scanner bracket.

[0014] As a possible implementation, the bottom of the laser scanner is higher than the bottom of the ASEConfidential / Security-B of the electrical test probe.

[0015] As a possible implementation, the system further includes:

[0016] A first image sensor is disposed above the carrier plate and is used to obtain the position of a point to be measured on the substrate to be measured;

[0017] The second image sensor is disposed below the electrical test probe and is used to obtain the position of the probe on the electrical test probe.

[0018] As a possible implementation, the system further includes:

[0019] The carrier plate supporting component is arranged below the carrier plate and is used to support the movement of the carrier plate.

[0020] As a possible implementation manner, the carrier support component is used to carry the carrier to move up and down according to the surface height of the substrate to be measured.

[0021] As a possible implementation manner, the carrier support component is used to support the carrier to rotate according to the position of the test point on the test substrate and the position of the probe.

[0022] As a possible implementation manner, the probes on the electrical testing probe are configured to adjust their lengths according to the surface height of the substrate to be tested.

[0023] As a possible implementation manner, the substrate to be tested includes a plurality of units to be tested.

[0024] As a possible implementation manner, the laser scanner and the carrier support component are electrically connected.

[0025] As a possible implementation, the first image sensor, the second image sensor, and the carrier support component are electrically connected.

[0026] As a possible implementation, the laser scanner and the electrical test probe are electrically connected.

[0027] As a possible implementation, the system further comprises:

[0028] a control module, the control module being electrically connected to the first image sensor, the second image sensor, the laser scanner, and the carrier support component through signal lines.

[0029] As a possible implementation, the control module is configured to control the distance between the carrier and the electrical test probe.

[0030] As a possible implementation, the substrate under test is a wafer or a package panel.

[0031] As a possible implementation, the electrical test probe is configured to test the electrical property of the substrate under test after adjusting the distance between the carrier and the electrical test probe according to the surface height of the substrate under test.

[0032] As a possible implementation, the surface height of the substrate under test comprises a first height and a second height, and the electrical test probe is configured to test the electrical property of the substrate under test after adjusting the distance between the carrier and the electrical test probe according to the first height, and to test the electrical property of the substrate under test after adjusting the distance between the carrier and the electrical test probe according to the second height.

[0033] In order to achieve electrical testing without damaging the elements, the utility model provides an electrical testing system, which comprises: a carrier, which is used for placing a substrate under test; an electrical test probe, which is arranged above the carrier and is used for testing the electrical property of the substrate under test; and a laser scanner, which is arranged above the carrier and is used for obtaining the surface height of the substrate under test; wherein the distance between the carrier and the electrical test probe is adjusted according to the surface height of the substrate under test.

[0034] In this way, the height information of the surface of the substrate under test obtained by the laser scanner is used to adjust the distance between the carrier and the electrical test probe, which can avoid collision between the electrical test probe and the substrate under test, prevent the probe or the substrate from being damaged, and avoid poor contact between the electrical test probe and the substrate under test. BRIEF DESCRIPTION OF DRAWINGS

[0035] Other features, objects and advantages of the present invention will become more apparent from the detailed description of the non-limiting embodiments made with reference to the following drawings:

[0036] Figure 1 It is a fault diagram of an existing electrical test system;

[0037] Figure 2 It is a schematic diagram of the existing electrical test points;

[0038] Figure 3 This is another fault diagram of an existing electrical test system;

[0039] Figure 4 1 is a schematic structural diagram of an electrical testing system 100 according to an embodiment of the present invention;

[0040] Figure 5 1 is a schematic structural diagram of a probe support 105 according to an embodiment of the present invention;

[0041] Figure 6 is a plan view of a carrier moving in an electrical testing system 100 according to an embodiment of the present invention;

[0042] Figure 7 is a perspective view of the carrier movement of the electrical testing system 100 according to one embodiment of the present invention;

[0043] Figures 8-13 FIG. 1 is a flow chart of an electrical test performed by an electrical test system 200 according to an embodiment of the present invention.

[0044] Description of reference numerals / symbols:

[0045] 01-first point to be tested; 02-second point to be tested; 03-first unit to be tested; 04-second unit to be tested; 05-third unit to be tested; 06-fourth unit to be tested; 07-fifth unit to be tested; 08-sixth unit to be tested; 09-seventh unit to be tested; 10-tenth unit to be tested; 11-eleventh unit to be tested; 12-third point to be tested; 13-fourth point to be tested; 101-carrier; 102-substrate to be tested; 1021-point to be tested; 1022-unit to be tested; 103-electrical test probe; 1031-probe; 104-laser scanner; 105-probe bracket; 106-first image sensor; 107-second image sensor; 108-carrier support component; 109-signal line; 110-laser scanner bracket, 111-control module. DETAILED DESCRIPTION

[0046] The following describes the specific embodiments of the present invention in conjunction with the accompanying drawings and examples. Those skilled in the art will readily understand the technical problems solved by the present invention and the technical effects it produces through the contents of this specification. It should be understood that the specific embodiments described herein are intended only to illustrate the invention and are not intended to limit the invention. Furthermore, for ease of description, only the portions relevant to the invention are shown in the accompanying drawings.

[0047] It should be readily understood that the meanings of “on,” “over,” and “over…” in the present invention should be interpreted in the broadest sense, such that “on” not only means “directly on something,” but also means “on something” including intermediate components or layers therebetween.

[0048] Furthermore, for ease of description, spatially relative terms such as "below," "beneath," "lower," "above," and "upper" may be used herein to describe the relationship of one element or component to another element or component illustrated in the drawings. Spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The device may be otherwise oriented (rotated 90° or at other orientations), and the spatially relative descriptors used herein should be interpreted accordingly.

[0049] As used herein, the term "layer" refers to a portion of a material comprising an area having a certain thickness. A layer may extend over the entire underlying or superstructure, or may have an extent that is less than the extent of the underlying or superstructure. In addition, a layer may be an area of ​​a homogeneous or inhomogeneous continuous structure, the thickness of which is less than the thickness of the continuous structure. For example, a layer may be located between the top and bottom surfaces of a continuous structure or between any pair of horizontal planes therebetween. A layer may extend horizontally, vertically and / or along a tapered surface. A substrate may be a layer, may include one or more layers therein, and / or may have one or more layers thereon, above and / or below. A layer may include multiple layers. For example, a semiconductor layer may include one or more doped or undoped semiconductor layers, and may have the same or different materials.

[0050] As used herein, the term "substrate" refers to the material onto which subsequent material layers are added. The substrate itself can be patterned. The material added on top of the substrate can be patterned or can remain unpatterned. In addition, the substrate can include a variety of semiconductor materials, such as silicon, silicon carbide, gallium nitride, germanium, gallium arsenide, indium phosphide, etc. Alternatively, the substrate can be made of a non-conductive material, such as glass, plastic, or sapphire wafer. Further alternatively, the substrate can have semiconductor devices or circuits formed therein.

[0051] It should be noted that the structures, proportions, sizes, etc. illustrated in the drawings of the specification are only used to match the contents recorded in the specification for the understanding and reading of those skilled in the art, and are not used to limit the limiting conditions for the implementation of the present invention. Therefore, they have no substantial technical significance. Any modification of the structure, change in the proportional relationship, or adjustment of the size should still fall within the scope of the technical content disclosed in the present invention without affecting the efficacy and purpose that can be achieved by the present invention. At the same time, terms such as "on", "first", "second" and "one" quoted in this specification are only for the convenience of description and are not used to limit the scope of the implementation of the present invention. Changes or adjustments in their relative relationships should also be regarded as the scope of the implementation of the present invention without substantially changing the technical content.

[0052] It should also be noted that the longitudinal cross-section corresponding to the embodiment of the present invention may be a cross-section corresponding to the front view direction, the transverse cross-section may be a cross-section corresponding to the right view direction, and the horizontal cross-section may be a cross-section corresponding to the top view direction.

[0053] In addition, the embodiments and features of the embodiments of the present invention can be combined with each other without conflict. The present invention will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0054] See also Figure 4 The present invention relates to an electrical testing system 100, comprising:

[0055] The carrier 101 is used to place a substrate 102 to be tested. The substrate 102 to be tested is a wafer or a package panel, and may include at least one unit 1022 to be tested, each of which may have a test point 1021. The test point 1021 is the point where electrical testing is required.

[0056] The electrical test probe 103 is disposed above the carrier 101 and is used to test the electrical properties of the substrate 102 to be tested, specifically, to test the electrical properties of the test point 1021;

[0057] The laser scanner 104 is also disposed above the carrier 101 and is used to obtain the surface height of the substrate 102 to be measured, including the height of the point 1021 to be measured.

[0058] On this basis, combined with Figure 6 and Figure 7 As shown, the distance between the carrier 101 and the electrical test probe 103 is adjustable. This adjustment can be based on the surface height of the substrate to be tested 102 obtained by the laser scanner 104, thereby changing the distance between the substrate to be tested 102 placed on the carrier 101 and the electrical test probe 103.

[0059] When using the electrical test probe 103 to test the electrical properties of the substrate 102 under test, the distance between the carrier 101 and the electrical test probe 103 can be adjusted based on the surface height of the substrate 102 under test obtained by the laser scanner 104 before the electrical test is performed. This can avoid poor contact caused by an excessive distance between the electrical test probe 103 and the substrate 102 under test, and can also avoid a collision between the electrical test probe 103 and the substrate 102 under test caused by an excessively small distance, thereby avoiding damage to the electrical test probe 103 or components on the substrate 102 under test.

[0060] As a possible implementation, the electrical testing system 100 may further include:

[0061] The probe holder 105, the electrical test probe 103 and the laser scanner 104 can all be arranged on the probe holder 105 (see Figure 5 As an alternative, the probe holder 105 can also be used only to set the electrical test probe 103, and then additionally add a laser scanner holder (see Figure 12 The laser scanner bracket 110 shown is used to set up the laser scanner 104.

[0062] To improve testing efficiency, the electrical test probe 103 can be equipped with multiple probes 1031 to simultaneously perform electrical tests on multiple test points 1021. During electrical testing, the electrical test probes 103 and the test points 1021 must be in one-to-one contact. Therefore, precise alignment of the multiple probes 1031 with the test points 1021 is required before electrical testing.

[0063] As a possible implementation, the electrical testing system 100 may further include:

[0064] The first image sensor 106 is disposed above the carrier 101 and is used to obtain the position of the test point 1021 on the test substrate 102;

[0065] The second image sensor 107 is disposed below the electrical testing probe 103 and is used to obtain the position of the probe 1031 on the electrical testing probe 103 .

[0066] In this way, the positions of the test point 1021 and the probe 1031 are acquired by using the first image sensor 106 and the second image sensor 107 , which is beneficial for subsequent alignment operations based on the acquired positions.

[0067] On this basis, if the alignment operation is performed by adjusting the position of the to-be-tested substrate 102, the position of the carrier plate 101 on which the to-be-tested substrate 102 is placed can be adjusted. If the position of the carrier plate 101 is to be adjusted, the electrical testing system 100 can further include:

[0068] The carrier plate supporting component 108 is arranged below the carrier plate 101 and is used to support and move the carrier plate 101, that is, the carrier plate supporting component 108 is responsible for supporting and moving the carrier plate 101. It should be noted that the movement can include horizontal movement, vertical movement, and rotational movement.

[0069] Specifically, the carrier plate supporting component 108 can move up and down according to the height of the to-be-tested point 1021 to adjust the distance between the to-be-tested substrate 102 and the electrical testing probe 103. For example, if the height of the to-be-tested point 1021 for the next test is +10 μm compared with the current position, the carrier plate supporting component 108 needs to move the carrier plate 101 downward by 10 μm.

[0070] The carrier plate supporting component 108 can also rotate horizontally according to the position of the to-be-tested point 1021 on the to-be-tested substrate 102 and the position of the probe 1031, thereby rotating the carrier plate 101 to align the to-be-tested point 1021 and the probe 1031. For example, referring to Figure 11 If multiple to-be-tested points 1021 have a certain angular offset compared with multiple probes 1031, the carrier plate supporting component 108 needs to rotate by the corresponding angle to rotate the carrier plate 101, thereby aligning the multiple to-be-tested points 1021 and the multiple probes 1031.

[0071] If the alignment operation is performed by adjusting the electrical testing probe 103, the electrical testing probe 103 can be designed to include multiple probes 1031 that have independent up-and-down movement functions. Each probe 1031 can adjust the distance between itself and the corresponding to-be-tested point 1021 based on the height of the to-be-tested point 1021. The laser scanner 104 can be electrically connected to the electrical testing probe 103 to facilitate information exchange.

[0072] To achieve the above alignment operation, the carrier plate supporting component 108 can be electrically connected to the laser scanner 104, the first image sensor 106, and the second image sensor 107, and the electrical testing probe 103 can also be electrically connected to the laser scanner 104, the first image sensor 106, and the second image sensor 107 to facilitate information exchange.

[0073] Further, the electrical testing system 100 can further include:

[0074] The control module 111 is electrically connected to one or more components of the first image sensor 106, the second image sensor 107, the laser scanner 104, the carrier support component 108, and the electrical test probe 103 through the signal line 109, and is used to control them to implement corresponding functions, including but not limited to adjusting the distance between the carrier 101 and the electrical test probe 103.

[0075] The control module 111 may include various processing devices (e.g., a central processing unit, a graphics processing unit, etc.), which are not limited here. It can perform various appropriate actions and processes based on the various programs and data stored therein for controlling various components to achieve their corresponding functions.

[0076] It should be noted that after obtaining the surface height of the substrate 102 to be tested, the position of the test point 1021 on the substrate 102 to be tested, and the position of the probe 1031 on the electrical test probe 103, the control module 111 can calculate the shortest distance between the probe 1031 and the current substrate 102 to be tested, facilitating direct adjustment of the carrier 101 or the electrical test probe 103 to the desired alignment position, thereby improving electrical testing efficiency. In this way, because the position calculated by the control module 111 is relatively accurate, even if the corresponding component produces slight up and down vibration after the movement is completed, it is within the redundancy range and will not cause damage to the component.

[0077] In addition, combined Figure 6 and Figure 7 As shown, the control module 111 can first control the carrier 101 to move to position ①, allowing the laser scanner 104 to obtain the surface height of the test point 1021 on the test substrate 102; then control the carrier 101 to move to position ②, calculate the height, position, shortest moving path and other information of the test point 1021 for this electrical test; finally, control the carrier 101 to move directly to position ③ where the electrical test can be performed this time, and perform the electrical test.

[0078] It should be noted that test points 1021 on the surface of the substrate 102 under test that have the same height can be tested in a single electrical test. That is, if the surface height of the substrate 102 under test includes a first height and a second height, the electrical test can be performed by first adjusting the distance between the carrier 101 and the electrical test probes 103 based on the first height; then, performing an electrical test on the substrate 102 under test using the electrical test probes 103; then, adjusting the distance between the carrier 101 and the electrical test probes 103 based on the second height; and performing another electrical test on the substrate 102 under test.

[0079] The following combination Figures 8-13The following describes the process of performing electrical testing using an electrical testing system 200 according to an embodiment of the present invention (the electrical testing system 200 is similar to the electrical testing system 100, except that the laser scanner 104 is mounted on a laser scanner support 110 in the electrical testing system 200, while the laser scanner 104 is mounted on a probe support 105 in the electrical testing system 100):

[0080] Step 1, see Figure 8 , the relevant personnel place the substrate 102 to be tested on the carrier 101;

[0081] Step 2, see Figure 9 , the carrier support component 108 moves the carrier 101 to the initial position;

[0082] It should be noted that the initial position allows the first image sensor 106 to obtain the positions of the unit under test 1022 and the point under test 1021 on the substrate under test 102 , and the second image sensor 107 to obtain the position of the probe 1031 on the electrical test probe 103 without causing collision.

[0083] Optionally, before step 2, a plurality of test points 1021 may be defined, and then preliminary alignment may be performed on the test points 1021 to be tested this time, and the current positions of the various components may be recorded.

[0084] Step 3, see Figure 10 , the first image sensor 106 obtains the position of the test point 1021 on the test substrate 102 , and the second image sensor 107 obtains the position of the probe 1031 on the electrical test probe 103 ;

[0085] Optionally, after step 3, the angle between the test point 1021 and the probe 1031 can be roughly calculated based on the positions of the test unit 1022, the test point 1021 and the position of the probe 1031 on the electrical test probe 103, and the test substrate 102 can be rotated to eliminate the angle.

[0086] Step 4, see Figure 11 , based on the test point 1021 to be tested this time, rotate the test substrate 102 (see Figure 10 ), perform secondary correction;

[0087] It should be noted that step 4 can be based on obtaining the test points 1021 at the left and right ends of the test, and calculating the distance between the test points 1021 and the probes 1031 (see Figure 10 based on the angle, the substrate to be measured 102 is rotated and a secondary correction is performed to eliminate the angle.

[0088] Optionally, the above steps 3 and 4 may adopt other rotation methods to align the substrate to be tested and the electrical test probe on the xy plane, which is not limited here.

[0089] Step 5, see Figure 12 , the laser scanner 104 obtains the surface height of the substrate 102 to be measured;

[0090] Step 6, see Figure 13 , calculate the height of the test point 1021 to be tested this time, the carrier support component 108 (see Figure 9 ) drives the carrier board 101 (see Figure 9 ) moves vertically to adjust the vertical distance between the substrate to be tested 102 and the electrical test probe 103 to perform electrical testing.

[0091] It should be noted that the calculation process can be performed in the control module, and the surface height of the test point 1021 of the entire unit under test can be obtained first, and then the height of the test point 1021 to be tested this time can be calculated. The specific calculation method is not limited here.

[0092] Experimental data show that the success rate of electrical testing based on the above electrical testing system is greatly improved and the component loss rate is greatly reduced.

[0093] As used herein, the terms "substantially," "substantial," "approximately," and "about" are used to indicate and explain minor variations. For example, when used in conjunction with a numerical value, the above terms may refer to a variation range of less than or equal to ±10% of the corresponding numerical value, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%. As another example, a film or layer having a thickness that is "substantially uniform" may refer to a film or layer having an average thickness that has a standard deviation of less than or equal to ±10%, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%. The term "substantially coplanar" may refer to two surfaces that are within 50 μm along the same plane, such as within 40 μm, 30 μm, 20 μm, 10 μm, or 1 μm along the same plane. Two components may be considered "substantially aligned" if, for example, they overlap or are within 200 μm, 150 μm, 100 μm, 50 μm, 40 μm, 30 μm, 20 μm, 10 μm, or 1 μm. Two surfaces or components may be considered "substantially perpendicular" if the angle between them is, for example, 90° ± 10°, such as ± 5°, ± 4°, ± 3°, ± 2°, ± 1°, ± 0.5°, ± 0.1°, or ± 0.05°. When used in conjunction with an event or circumstance, the terms "substantially," "substantial," "approximately," and "about" may refer to both situations where the event or circumstance occurs exactly and situations where the event or circumstance occurs very approximately.

Claims

1. An electrical testing system, characterized in that: The system comprises: A carrier plate, the carrier plate being used to place the substrate to be tested; An electrical test probe, disposed above the carrier, for testing the electrical properties of the substrate to be tested; A laser scanner, disposed above the carrier plate, for obtaining the surface height of the substrate to be measured; Wherein, the distance between the carrier and the electrical test probe is adjusted according to the surface height of the substrate to be tested.

2. The system according to claim 1, wherein: The system further comprises: A probe bracket, on which the electrical test probe is arranged.

3. The system according to claim 2, characterized in that The laser scanner is arranged on the probe bracket.

4. The system according to claim 1, wherein: The system further comprises: a first image sensor, the first image sensor being disposed above the carrier plate and configured to acquire a position of a point to be measured on the substrate to be measured; A second image sensor is disposed below the electrical test probe and is used to obtain positions of probes on the electrical test probe.

5. The system according to claim 4, characterized in that The system further comprises: The carrier support component is arranged below the carrier and is used to carry the carrier to move. The carrier support component is used to carry the carrier to move up and down according to the surface height of the substrate to be measured.

6. The system according to claim 5, characterized in that The carrier support component is used to support the carrier to rotate according to the position of the test point on the test substrate and the position of the probe.

7. The system according to claim 1, wherein: The probes on the electrical testing probe are used to adjust the length according to the surface height of the substrate to be tested.

8. The system according to claim 6, wherein: The system further comprises: A control module is electrically connected to the first image sensor, the second image sensor, the laser scanner, and the carrier support component through signal lines, and is used to control the distance between the carrier and the electrical test probe.

9. The system according to claim 1, wherein: The electrical testing probe is used to test the electrical properties of the substrate to be tested after adjusting the distance between the carrier and the electrical testing probe according to the surface height of the substrate to be tested.

10. The system according to claim 9, characterized in that The surface height of the substrate to be tested includes a first height and a second height. The electrical test probe is used to test the electrical properties of the substrate to be tested after adjusting the distance between the carrier and the electrical test probe according to the first height, and is also used to test the electrical properties of the substrate to be tested after adjusting the distance between the carrier and the electrical test probe according to the second height.

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