Modular unit test socket device for combined direct-insertion pin chip

Abstract

The utility model provides a modular unit test socket device for a combined type direct-insertion pin chip, and belongs to the technical field of packaged chip aging test. Comprising a PCB, a plurality of unit miniature test seats are arranged on the PCB according to the pin layout, the pin number and the spacing of the in-line pin chip, and a pair of elastic test probes is arranged in each unit miniature test seat and correspondingly contacts with one pin of the in-line pin chip for testing. And each unit micro test seat is detachably and fixedly connected with the PCB. According to the utility model, aiming at the problems of a traditional direct-insertion type pin integral type test seat, a modularized design mode is adopted, each pin of a direct-insertion type pin chip is used as a minimum design unit, a miniature test seat with a reasonable structure is designed, rapid positioning, combination and installation are carried out on a PCB circuit board according to the multi-type layout of the pins, and the spacing and the number of the pins, and the test seat is simple in structure and convenient to use. Compatibility, economical efficiency and reliability of the testing device are improved, and modularization and standardization of the testing seat are achieved.

Description

TECHNICAL FIELD

[0001] The utility model belongs to the packaging chip aging test technical field, specifically relates to a modular unit test seat device for combined direct insertion pin chip. BACKGROUND

[0002] The packaging chip aging test is carried out through voltage test, current test, timing characteristic test and function test under the conditions of high temperature, constant voltage, constant current and the like to the chip,

[0003] Obtain the working life, failure rate and the like data of the chip, and then analyze and research the causes and mechanism of the failure of the chip, and continuously optimize the structure, process and material of the chip through the process to improve the reliability and stability thereof.

[0004] In order to avoid repeated soldering during chip testing, the general test method needs to design a test seat according to the packaging type of the chip, install the test seat on a test PCB circuit board for testing, and each test circuit board can arrange dozens or even hundreds of test seats. The array of the top pin under the test seat is matched with the packaging type of the chip. The pins of the chip introduce signals into the test circuit by means of the gold-plated elastic test probe installed in the test seat, so as to realize the input and output functions of the chip. The packaging form of the pins of the chip is divided into direct insertion pin type, horizontal pin type and surface mount type. For different packaging types, the positioning, contact and fixing mode of the pins of the chip in the test seat in the test scheme are different. The direct insertion pin relies on the horizontal clamping force of the test probe spring part of the test seat to be fixed and contacted, see Figure 10 and 11 ; the horizontal pin type and the surface mount pin rely on the vertical pressure of the test seat clamping mechanism to be fixed and contacted with the test probe, see Figure 12 .

[0005] Among them, the original installation scheme of the direct insertion multi-pin type: the test seat is provided with a guide hole and a probe insertion hole for installing the test probe. During testing, the test probe with different width and height is introduced into the insertion hole at the bottom of the test seat through the guide hole of the test seat, and is connected with the signal insertion hole of the PCB circuit board. The traditional direct insertion multi-pin test seat adopts an integral type, the test probe is corresponding to the pins of the chip, the layout mode, quantity and pin pitch thereof are integral mapping mode, that is, the pin insertion hole of the test seat needs to be accurately matched with the pins of the chip, the assembly position precision of the pin and the insertion hole is high, the overall test seat structure is complex, the manufacturing precision is high, see Figure 11 , only the insertion mode of the symmetric pins of a certain cross section of a certain packaging chip is shown in the figure. When the pins of the chip are inserted into the test seat, the elastic test probe in the test seat contacts the pin contact part, generates horizontal holding force, and ensures reliable contact of the two, for each type of direct insertion pin packaging chip.

[0006] The defects of the prior art test socket of the direct insertion multi-pin type: the original integral test socket is customized and designed according to the chip shape size, pin arrangement mode, pin spacing and quantity, the test probes of the test socket correspond to the chip pins one by one, with the increase of the chip integration function and the increase of the chip quantity and the decrease of the pin spacing, the complexity of the design layout of the test socket inner cavity is increased, meanwhile, the regular layout of the chip pins is affected by the integrated circuit space arrangement and develops into various irregular shapes, the mold design structure of the integral test socket is complex, the injection precision is high, the manufacturing cycle is long and the cost is high. With the rapid development of the chip packaging technology, the timely responsiveness requirement of the chip reliability test is higher and higher. The integral test socket with long cycle and high manufacturing cost has many disadvantages in the test technology. For the manufacturing mold of the integral test socket, due to the complexity of the test socket cavity, the existing mold design and manufacturing technology also becomes a restricting factor for the development of the integral test socket. Practical new type content

[0007] The technical problem solved by the utility model: a modular unit test socket device for a combined direct insertion pin chip is provided, the utility model aims at the existing problems of the traditional direct insertion pin integral test socket, adopts a modular design mode, takes each pin of the direct insertion pin chip as the smallest unit for design, designs a reasonable structure of a micro test socket, and quickly positions, combines and installs on a PCB circuit board according to the multi-type layout, pin spacing and quantity of the pins; the device solves the technical barriers existing in the complex structure test socket, improves the compatibility, economy and reliability of the test device, and realizes the modularization and standardization of the test socket.

[0008] In order to achieve the above object, the utility model adopts the technical scheme of:

[0009] The modular unit test socket device for the combined direct insertion pin chip comprises a PCB circuit board, a plurality of unit micro test sockets are arranged on the PCB circuit board according to the pin layout, pin quantity and spacing of the direct insertion pin chip, a pair of elastic test probes is arranged in each unit micro test socket and corresponds to one pin of the direct insertion pin chip for contact test, and each unit micro test socket is in detachable fixed connection with the PCB circuit board.

[0010] Further limitation of the above scheme, each unit micro test socket comprises a micro test socket body, a coaxial pin insertion hole and a guide hole are arranged on the micro test socket body, the pin insertion hole is arranged on the upper portion of the guide hole, and the pair of elastic test probes is installed in the guide hole.

[0011] Further limitation of the above scheme, the shape of the micro test socket body is provided with two types, which are an L-shaped ultra-thin test socket and a T-shaped thin test socket.

[0012] As a further limitation of the above solution, the thickness of the L-shaped ultra-thin test socket is 1.7 mm, and the thickness of the T-shaped thin test socket is 2.2 mm.

[0013] To further define the above scheme, a positioning pin is provided on the bottom surface of the micro test seat body, a fixing hole is provided on one side of the micro test seat body, and a positioning pin hole and a fixing screw hole corresponding to the positioning pin and the fixing hole are provided on the PCB circuit board according to the installation position of each micro test seat body. The positioning pin is adapted to be plugged into the positioning pin hole, and the fixing hole is connected to the fixing screw hole through a fixing screw.

[0014] As a further limitation of the above solution, the guide hole is a tapered hole with the large diameter end facing upward.

[0015] As a further limitation of the above solution, the pin jack and the guide hole are connected by an arc transition.

[0016] The advantages of this utility model compared with the prior art are:

[0017] 1. This solution adopts modular technology. After analyzing and calculating the layout, number of pins, and spacing dimensions of the direct-insert pin chip, it is determined that each pin of the packaged chip is used as the minimum test unit to produce a unit micro-test socket. Each unit micro-test socket is equipped with a pair of elastic test probes corresponding to one pin of the chip for testing. Each micro-test socket is detachably fixed to the PCB circuit board. This solves the problems of traditional integral test sockets, such as complex production, poor compatibility, and high economic cost. It is also applied to the mass production of direct-insert pin chip testing. In actual use, its fast combination response speed and compatibility have been fully verified for reliability testing of structures similar to special-shaped layouts and direct-insert multi-pin chips. It has a wide range of applications and good promotion value.

[0018] 2. The unit micro test socket in this solution adopts L-shaped and T-shaped structures. The thickness of the L-shaped ultra-thin test socket is 1.7mm, and the thickness of the T-shaped thin test socket is 2.2mm. This realizes the unitization and miniaturization design of the test socket, achieves accurate positioning during rapid assembly, and ensures that the position of the assembled test unit matches the chip pins;

[0019] 3. Positioning and assembly of the unit micro test sockets in this solution: The positioning method for the L-shaped ultra-thin test socket and the T-shaped thin test socket and the circuit measurement board all use a positioning pin, a positioning surface, and the assembly unit as a reference to solve the problem of accurate positioning of the test socket and measurement during the assembly process. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic diagram of the three-dimensional structure of the utility model;

[0021] Figure 2 This is the structural front view of the utility model;

[0022] Figure 3 This is a top view of the structure of the utility model;

[0023] Figure 4 This is the structural front view of the L-shaped ultra-thin test socket in the utility model;

[0024] Figure 5 For this utility model Figure 4 A cross-sectional view of an L-shaped ultra-thin test socket shown in the AA direction;

[0025] Figure 6 This is the rear view of the structure of the L-shaped ultra-thin test socket in the utility model;

[0026] Figure 7 This is the structural front view of the T-shaped thin test socket in the utility model;

[0027] Figure 8 For this utility model Figure 7 A cross-sectional view of a T-shaped thin test socket shown in the middle BB direction;

[0028] Figure 9 This is the rear view of the structure of the T-shaped thin test socket in the utility model;

[0029] Figure 10 A schematic diagram of the horizontal elastic clamping of a chip insertion pin test socket in the prior art;

[0030] Figure 11 It is a cross-sectional schematic diagram of a through-hole pin chip integrated test socket in the prior art;

[0031] Figure 12 A schematic diagram of the vertical elastic clamping of a chip horizontal pin test socket in the prior art;

[0032] Figure 13 This is an installation flow chart of the utility model. DETAILED DESCRIPTION

[0033] The following will be combined with the accompanying drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0034] It is to be understood that the terms "including", "comprising", or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but can also include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the statement "comprising a" does not exclude the presence of additional identical elements in the process, method, article, or apparatus that includes the stated element.

[0035] The utility model discloses to the problem that the traditional straight insertion type pin integral type test seat exists, adopts the modular design mode, analyzes the pin arrangement mode, quantity, spacing of various packaging chips of straight insertion pin type, divides the reasonable pin test unit, designs advanced, reasonable structure's micro test seat, designs and test seat, pin corresponding test probe array point matching PCB circuit board, realizes with test PCB circuit board accurate positioning, realizes fast in the combination assembly pin test unit on the PCB board. The utility model solves the technical barrier that the complex structure test seat exists, according to the multiple type layout of pin, the spacing and quantity of pin are positioned combination installation on test circuit, improve the compatibility, economy and reliability of test device, realize the modularization of test seat, standardization.

[0036] The utility model discloses a kelvin test design mode, and specific embodiment please refer to Figure 1-13 Detailed description.

[0037] Embodiment 1: modular unit test seat device for combined straight insertion pin chip, as shown in Figure 1-3 As shown, it comprises a PCB circuit board 1, a plurality of unit micro test seats 2 are arranged on the PCB circuit board 1 according to the pin layout, pin quantity and spacing of the straight insertion pin chip 4, a pair of elastic test probes 2-2 are arranged in each unit micro test seat 2 to correspondingly contact and test one pin on the straight insertion pin chip 4, and each unit micro test seat 2 is in detachable fixed connection with the PCB circuit board 1.

[0038] Specifically, each unit micro test seat 2 comprises a micro test seat body 2-1, a pin insertion hole 2-1-1 and a guide hole 2-1-2 are coaxially arranged on the micro test seat body 2-1, the pin insertion hole 2-1-1 is arranged at the upper portion of the guide hole 2-1-2, and the pair of elastic test probes 2-2 are installed in the guide hole 2-1-2. The guide hole 2-1-2 is a tapered hole with a large-diameter end upward. The pin insertion hole 2-1-1 and the guide hole 2-1-2 are circularly and arcuately connected. The pair of elastic test probes 2-2 are installed in the guide hole 2-1-2 and used for clamping the pin of the straight insertion pin chip 4 under the action of horizontal elasticity.

[0039] The pins of the direct insertion pin chip 4 introduce signals into the test circuit of the PCB circuit board 1 through the gold-plated elastic test probe 2-2 mounted in the unit micro test socket 2, realizing the input and output functions of the chip.

[0040] The test socket of the embodiment is designed by using modular technology, taking a single pin of the chip as the minimum test unit, and a pair of elastic test probes is arranged in each unit micro test socket and corresponds to a pin of the chip. The minimum pin test socket is combined according to the layout mode and number of the pins of the chip, and a unit micro test socket combination device corresponding to all the pins on the chip is formed. The device solves the problems of complex manufacturing, poor compatibility and high economic cost of the traditional integral test socket, and is applied to batch production of direct insertion pin chip testing. In actual use, the response speed and compatibility of the quick combination for the reliability testing of similar structures of the special-shaped arrangement and direct insertion multi-pin chip are fully verified, and the device has a wide application field and good popularization value.

[0041] Embodiment 2: Based on the structure of embodiment 1, the shape of the micro test socket body 2-1 can be provided in two structures, which are an L-shaped ultra-thin test socket 2-1A and a T-shaped thin test socket 2-1B.

[0042] Preferably, the thickness of the L-shaped ultra-thin test socket 2-1A is 1.7 mm, and the thickness of the T-shaped thin test socket 2-1B is 2.2 mm.

[0043] The structure of the L-shaped ultra-thin test socket 2-1A is as shown in Figure 4-6 The structure of the T-shaped thin test socket 2-1B is as shown in Figure 7-9

[0044] In the embodiment, the L-shaped and T-shaped unit micro test sockets belong to Kelvin test sockets, each pin is 2-point contact, and the chip and the pin contact structure of the chip test socket, the contact force, the probe lead-out structure, and the external fixing structure of the test socket and the PCB circuit board are comprehensively analyzed and verified. The inner cavity of the L-shaped and T-shaped unit test sockets is provided with a pin jack and a guide hole for mounting the elastic test probe, and the pin of the chip leads out two test signal contacts. Each test socket can meet the demand of two test signals of a single pin of the packaged chip.

[0045] According to the design model of the L-shaped and T-shaped micro test sockets, an injection mold is designed to manufacture the L-shaped and T-shaped micro test sockets.

[0046] According to the layout, spacing and number of the pins of a single packaged chip, the L-shaped and T-shaped pin test socket units are selected, and a matching PCB circuit board is designed according to the selected number and layout of the L-shaped and T-shaped micro test sockets. For example, Figure 1 ​In the illustrated embodiment, a T-shaped thin test socket is used on one side of the PCB circuit board, and an L-shaped ultra-thin test socket is used on the other side. Moreover, during the layout process, two adjacent T-shaped thin test sockets or two L-shaped ultra-thin test sockets can be arranged relative to each other so that the thin end of one of the two adjacent T-shaped thin test sockets or L-shaped ultra-thin test sockets is stuck in the T-shaped or L-shaped groove of the other, thereby adapting to installation conditions where the spacing between pins is small.

[0047] In this embodiment, L-shaped and T-shaped test socket designs are adopted to achieve accurate positioning during rapid assembly, ensuring that the positions of the assembled test unit and the chip pins match.

[0048] Example 3: Based on the implementation methods of the above-mentioned Examples 1 and 2, a positioning pin 2-1-3 is provided on the bottom surface of the micro test seat body 2-1, and a fixing hole 2-1-4 is provided on one side of the micro test seat body 2-1. The PCB circuit board 1 is provided with positioning pin holes and fastening screw holes corresponding to the positioning pin 2-1-3 and the fixing hole 2-1-4 according to the installation position of each micro test seat body 2-1. The positioning pin 2-1-3 is adapted to be inserted into the positioning pin hole, and the fixing hole 2-1-4 is connected to the fastening screw hole through a fixing screw 3.

[0049] This embodiment achieves the assembly and positioning of unit micro-test sockets, enabling modular unit assembly based on the pin layout of direct-plug pin chips and functional testing requirements for burn-in testing. In this embodiment, the unit micro-test sockets and circuit measurement board are positioned using a locating pin, a locating surface, and the combined unit as a reference, ensuring precise positioning of the test socket and measurement during assembly.

[0050] Furthermore, the L- and T-shaped micro-test sockets in this embodiment are ultra-thin. During the manufacturing and repeated verification process, it was necessary to break through the thin wall and complete the ultra-thin injection molding of the test sockets. Because the L- and T-shaped micro-test sockets are ultra-thin and thin-walled injection molded parts, appropriate tools were used to ensure installation accuracy and efficiency.

[0051] The installation steps of this test device are as follows:

[0052] Step A: Install the gold-plated elastic test probe 2-2 to the L-shaped ultra-thin test socket 2-1A and the T-shaped thin test socket 2-1B to form L-shaped and T-shaped needle-bearing test socket units respectively.

[0053] Step B: Install the L-shaped ultra-thin test socket 2-1A and the T-shaped thin test socket 2-1B on the PCB circuit board 1, use the positioning pins 2-1-3 at the bottom of the micro test socket to position it, and use the fixing screws 3 to install it on the PCB circuit board. Figure 1-3, each test circuit board can be arranged with dozens or even hundreds of test sockets, Figure 1 It is only a certain type of chip unit under test.

[0054] Step C: Solder the elastic test probe to the PCB circuit board.

[0055] Step D: Install the through-hole pin packaged chip into the assembled test socket, that is, insert the pins of the chip into the elastic test probes of the assembled test socket one by one, and make contact by relying on the elastic force of the elastic test probes.

[0056] Step E: Connect the PCB circuit board with the chip installed to the input and output signals, set the transformation environment, and perform aging test.

[0057] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the present invention can be embodied in other specific forms without departing from the spirit or essential characteristics of the present invention. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the present invention is defined by the appended claims, not the foregoing description, and all variations within the meaning and range of equivalents of the claims are intended to be encompassed within the present invention. Any reference sign in a claim should not be construed as limiting the claim to which it relates.

[0058] In addition, it should be understood that although this specification is described in terms of implementation methods, not every implementation method contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.

Claims

1. A modular unit test socket device for combined direct-insert pin chips, characterized by: The invention comprises a PCB circuit board (1), on which a plurality of unit micro test sockets (2) are arranged according to the pin layout, pin number and spacing of a direct-insert pin chip (4), a pair of elastic test probes (2-2) are provided in each of the unit micro test sockets (2) for contacting a corresponding pin of the direct-insert pin chip (4) for testing, and each of the unit micro test sockets (2) is detachably fixedly connected to the PCB circuit board (1).

2. The modular unit test socket device for combined direct-insertion pin chips according to claim 1, characterized in that: Each unit micro test socket (2) comprises a micro test socket body (2-1), the micro test socket body (2-1) being provided with a coaxial pin jack (2-1-1) and a guide hole (2-1-2), the pin jack (2-1-1) being located above the guide hole (2-1-2), and the pair of elastic test probes (2-2) being installed in the guide hole (2-1-2).

3. The modular unit test socket device for combined direct-insertion pin chips according to claim 2, characterized in that: The miniature test seat body (2-1) has two shapes, namely an L-shaped ultra-thin test seat (2-1A) and a T-shaped thin test seat (2-1B).

4. The modular unit test socket device for combined direct-insertion pin chips according to claim 3, characterized in that: The thickness of the L-shaped ultra-thin test seat (2-1A) is 1.7 mm, and the thickness of the T-shaped thin test seat (2-1B) is 2.2 mm.

5. The modular unit test socket device for combined direct-insertion pin chips according to claim 2, characterized in that: A positioning pin (2-1-3) is provided on the bottom surface of the micro test seat body (2-1), a fixing hole (2-1-4) is provided on one side of the micro test seat body (2-1), and a positioning pin hole and a fixing screw hole corresponding to the positioning pin (2-1-3) and the fixing hole (2-1-4) are provided on the PCB circuit board (1) according to the installation position of each micro test seat body (2-1), the positioning pin (2-1-3) is adapted to be plugged into the positioning pin hole, and the fixing hole (2-1-4) is connected to the fixing screw hole via a fixing screw (3).

6. The modular unit test socket device for combined direct-insertion pin chips according to claim 2, characterized in that: The guide hole (2-1-2) is a tapered hole with the large diameter end facing upward.

7. The modular unit test socket device for combined direct-insertion pin chips according to claim 2, characterized in that: The pin jack (2-1-1) and the guide hole (2-1-2) are connected in an arc transition.

Images