Ultrathin all-in-one computer heat dissipation structure

Abstract

The utility model discloses a heat dissipation structure of an ultrathin all-in-one computer. The heat dissipation structure comprises a front shell, a display panel, a mainboard, an independent graphics card, a CPU processor, a radiator, an interface module, a heat dissipation shield and a rear cover body, the independent graphics card and the CPU processor are respectively connected with the mainboard, the independent graphics card is provided with a first cooling fan, the radiator is abutted against the CPU processor, the heat dissipation shield is used for covering the mainboard, the area of the heat dissipation shield, which is positioned in the memory bank, is provided with an abutting part, and two sides of the rear cover body are provided with a first heat dissipation hole channel and a second heat dissipation hole channel. According to the all-in-one computer, the first cooling fan is arranged on the independent graphics card, and the radiator is arranged on the surface of the CPU, so that heat generated by the independent graphics card and the CPU can be quickly discharged to the outside, and the situation that the use performance is affected due to the fact that the internal temperature of the all-in-one computer is too high is avoided; and through the arrangement of the first heat dissipation hole channel and the second heat dissipation hole channel, heat can be discharged in different areas according to sources, so that the overall heat dissipation efficiency of the all-in-one computer is improved.

Description

Technical Field

[0001] The utility model relates to the field of all-in-one computers, in particular to an ultra-thin all-in-one computer heat dissipation structure. Background Art

[0002] An all-in-one computer is a computer device that integrates a computer host and a monitor. Compared with traditional desktop computers, all-in-one computers integrate hardware components inside the monitor body, eliminating the structure of an independent host, thereby achieving a simpler appearance and smaller space occupancy.

[0003] In the existing technology, due to the high degree of hardware integration within all-in-one computers, core components such as independent graphics cards and CPU processors will generate a large amount of heat during operation. In addition, all-in-one computers pursue a thin and light size, which leads to severe limitations on the heat dissipation space. Internal heat easily accumulates and causes temperature rise, thereby affecting the performance and life of the hardware.

[0004] Therefore, the existing technology has defects and needs to be improved. Utility Model Content

[0005] The technical problem to be solved by the utility model is to provide an ultra-thin all-in-one computer heat dissipation structure which has good heat dissipation effect and effectively improves product performance.

[0006] To achieve this purpose, the present invention adopts the following technical solutions: an ultra-thin all-in-one computer heat dissipation structure, comprising a front housing, a display panel, a mainboard, an independent graphics card, a CPU processor, a radiator, an interface module, a heat dissipation shield, and a rear cover;

[0007] The display panel is disposed in the front housing, the mainboard is disposed on the back of the display panel, the independent graphics card and the CPU processor are respectively connected to the mainboard, the independent graphics card is equipped with a first cooling fan, the radiator is in contact with the CPU processor, and the radiator is used to absorb heat generated by the CPU processor;

[0008] The interface module is arranged on the mainboard, the heat dissipation shield is used to cover the mainboard, and the heat dissipation shield is provided with an avoidance notch for the interface module to pass through;

[0009] The rear cover is connected to the front shell, and a first heat dissipation channel and a second heat dissipation channel are respectively provided on both sides of the rear cover. The first heat dissipation channel is used to discharge the heat generated by the independent graphics card to the outside, and the second heat dissipation channel is used to discharge the heat absorbed by the radiator to the outside.

[0010] According to the above technical solution, in the ultra-thin all-in-one computer heat dissipation structure, the radiator includes a heat-conducting seat, a copper tube, heat dissipation fins and a second heat dissipation fan;

[0011] The thermal seat is attached to the surface of the CPU processor, the second cooling fan is arranged on the side of the mainboard, and the heat dissipation fins are arranged at the air outlet end of the second cooling fan. The thermal seat and the heat dissipation fins are connected by the copper tube. The copper tube is used to conduct the heat generated by the CPU processor to the heat dissipation fins, and the second cooling fan is used to discharge the heat on the heat dissipation fins through airflow.

[0012] By adopting the above technical solution, the heat dissipation structure of the ultra-thin all-in-one computer further includes a thermally conductive copper sheet, which is arranged between the display panel and the mainboard and is used to absorb the heat generated by the display panel.

[0013] By adopting the above technical solution, in the heat dissipation structure of the ultra-thin all-in-one computer, a third heat dissipation channel is provided on the top of the rear cover body, and the third heat dissipation channel is used to discharge the heat absorbed by the thermally conductive copper sheet to the outside.

[0014] Using the above technical solution, the ultra-thin all-in-one computer heat dissipation structure also includes a memory stick, which is arranged on the mainboard. The heat dissipation shield is located in the area of ​​the memory stick and is provided with an inwardly recessed abutment portion, which is used to fit on the surface of the memory stick to absorb the heat generated by the memory stick.

[0015] By adopting the above technical solution, in the ultra-thin all-in-one computer heat dissipation structure, the radiator further includes an air outlet cover, and the air outlet cover is used to cover the heat dissipation fins.

[0016] By adopting the above technical solution, in the ultra-thin all-in-one computer heat dissipation structure, the heat dissipation shield is made of aluminum alloy, and the side wall of the heat dissipation shield is provided with a plurality of through holes.

[0017] Compared with the prior art, the present invention has the following beneficial effects:

[0018] The utility model configures a first cooling fan on the independent graphics card and sets a radiator on the surface of the CPU processor, which can quickly discharge the heat generated by the independent graphics card and the CPU processor to the outside, thereby preventing the internal temperature of the all-in-one computer from being too high and affecting the performance of the computer; by setting a first heat dissipation channel and a second heat dissipation channel on both sides of the rear cover body, the heat can be discharged in a zoned manner according to the source, thereby improving the overall heat dissipation efficiency of the all-in-one computer and preventing heat accumulation from affecting the performance of the device; the heat dissipation shield can cover the mainboard to protect the components on the mainboard from the influence of the external environment, and can also play a role in auxiliary heat dissipation; the overall structure is reasonably set up, with beneficial effects such as high heat dissipation efficiency and light and thin volume. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0020] The structures, proportions, sizes, etc. depicted in the drawings of this specification are only used to match the contents disclosed in this specification so as to facilitate understanding and reading by those familiar with this technology. They are not intended to limit the conditions under which the present invention can be implemented, and therefore have no substantive technical significance. Any structural modifications, changes in proportional relationships, or adjustments in size, without affecting the efficacy and objectives that can be achieved by the present invention, should still fall within the scope of the technical contents disclosed in the present invention.

[0021] Figure 1 This is a schematic diagram of the explosion structure of the utility model;

[0022] Figure 2 This is a schematic diagram of the installation structure between the heat dissipation shield and the mainboard of the utility model;

[0023] Figure 3 This is a schematic diagram of the radiator structure of the present utility model;

[0024] Figure 4 This is a schematic diagram of the exploded structure of the radiator of the present utility model. DETAILED DESCRIPTION

[0025] In order to make the purpose, features, and advantages of the present invention more obvious and easy to understand, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the embodiments described below are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0026] In the description of the present invention, it should be understood that the terms "upper," "lower," "top," "bottom," "inner," "outer," etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely to facilitate the description of the present invention and simplify the description. They are not intended to indicate or imply that the devices or elements referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on the present invention. It should be noted that when a component is considered to be "connected" to another component, it may be directly connected to the other component or there may be a centrally located component.

[0027] The technical solution of the present invention will be further described below with reference to the accompanying drawings and through specific implementation methods.

[0028] like Figures 1 to 4 As shown, an embodiment of the present invention provides an ultra-thin all-in-one computer heat dissipation structure, including a front shell 1, a display panel 2, a motherboard 3, an independent graphics card 4, a CPU processor 5, a radiator 6, an interface module 7, a heat dissipation shield 8 and a rear cover 9; the display panel 2 is arranged in the front shell 1, the motherboard 3 is arranged on the back of the display panel 2, the independent graphics card 4 and the CPU processor 5 are respectively connected to the motherboard 3, the independent graphics card 4 is configured with a first cooling fan 41, the radiator 6 is in contact with the CPU processor 5, and the radiator 6 is used to absorb the heat generated by the CPU processor 5; the independent graphics card 4 will generate a lot of heat when running. By configuring the first cooling fan 41 on the independent graphics card 4, the heat generated by the independent graphics card 4 can be quickly discharged to the outside to avoid the heat radiation effect on other components; and the CPU processor 5, as the core computing unit of the device, will generate a lot of heat when processing data. Through the radiator 6, which is in direct contact with the CPU processor 5, the heat on the surface of the CPU processor 5 can be efficiently absorbed to avoid the CPU processor 5 from being overheated and causing frequency reduction to affect the performance.

[0029] The interface module 7 is provided on the mainboard 3, and the heat dissipation shield 8 is used to cover the mainboard 3. The heat dissipation shield 8 is provided with an avoidance notch 80 for the interface module 7 to pass through. The heat dissipation shield 8 can cover the mainboard 3 to protect the components on the mainboard 3 from the influence of the external environment, and can also play a role in auxiliary heat dissipation. Specifically, the heat dissipation shield 8 is made of aluminum alloy, and the side wall of the heat dissipation shield 8 is provided with a plurality of through holes 81. Aluminum alloy has excellent thermal conductivity and can quickly transfer the heat generated by the mainboard 3 and core hardware components to the surface of the heat dissipation shield 8, and discharge it outward through the air circulation of the through holes 81.

[0030] like Figure 1 As shown, the rear cover 9 is connected to the front housing 1. A first heat dissipation duct 91 and a second heat dissipation duct 92 are provided on either side of the rear cover 9. The first heat dissipation duct 91 is used to discharge heat generated by the independent graphics card 4, and the second heat dissipation duct 92 is used to discharge heat absorbed by the radiator 6. When the rear cover 9 and the front housing 1 are connected, a closed internal structure is formed. By providing the first heat dissipation duct 91 and the second heat dissipation duct 92 on either side of the rear cover 9, heat can be discharged in zones according to its source, thereby improving the overall heat dissipation efficiency of the all-in-one computer and preventing heat accumulation from affecting device performance.

[0031] like Figure 1 、 Figure 3and Figure 4 As shown, further, the radiator 6 includes a thermal seat 61, a copper tube 62, heat dissipation fins 63 and a second heat dissipation fan 64, the thermal seat 61 is attached to the surface of the CPU processor 5, the second heat dissipation fan 64 is arranged on the side end of the motherboard 3, the heat dissipation fins 63 are arranged at the air outlet end of the second heat dissipation fan 64, the thermal seat 61 and the heat dissipation fins 63 are connected by the copper tube 62, the copper tube 62 is used to conduct the heat generated by the CPU processor 5 to the heat dissipation fins 63, and the second heat dissipation fan 64 is used to discharge the heat on the heat dissipation fins 63 through the action of airflow. The thermal seat 61 is attached to the surface of the CPU processor 5, which can contact and absorb the heat generated by the CPU processor 5 when it is running, and efficiently conduct the heat to the heat dissipation fins 63 through the copper tube 62. The heat dissipation fins 63 can increase the surface area of ​​heat exchange, thereby diffusing the heat to a larger range to improve the heat dissipation efficiency. The strong airflow generated by the second cooling fan 64 can quickly take away the heat on the heat dissipation fins 63 and discharge it outside the device. Such a setting can form an efficient heat dissipation path, ensuring that the all-in-one computer has both performance and stability while also meeting the structural requirements of the all-in-one computer for thinness and lightness.

[0032] like Figure 1 As shown, further, a thermally conductive copper sheet 21 is provided between the display panel 2 and the mainboard 3. The thermally conductive copper sheet 21 is used to absorb heat generated by the display panel 2. The display panel 2 generates a certain amount of heat during high-brightness operation and prolonged use. By providing the thermally conductive copper sheet 21 between the display panel 2 and the mainboard 3, the heat generated on the surface of the display panel 2 can be absorbed and transferred to the surface of the thermally conductive copper sheet 21 for diffusion. In this embodiment, a third heat dissipation channel 93 is also provided at the top of the rear cover 9. The third heat dissipation channel 93 is used to discharge the heat absorbed by the thermally conductive copper sheet 21.

[0033] like Figure 1 and Figure 2 As shown, the motherboard 3 further includes a memory stick 31, which is provided on the motherboard 3. The heat dissipation shield 8 is provided with an inwardly recessed abutment portion 82 in the area located on the memory stick 31. The abutment portion 82 is used to fit on the surface of the memory stick 31 to absorb heat generated by the memory stick 31. As an important component on the motherboard 3, the memory stick 31 generates a certain amount of heat when operating at a high frequency. By providing the abutment portion 82 in the corresponding area of ​​the heat dissipation shield 8, it can fit on the surface of the memory stick 31, thereby quickly transferring the heat generated by the memory stick 31 to the surface of the heat dissipation shield 8 for dissipation, thereby achieving auxiliary heat dissipation for the memory stick 31.

[0034] like Figure 3 and Figure 4As shown, the radiator 6 further includes an air outlet cover 65, which is used to cover the heat dissipation fins 63. The air outlet cover 65 can guide the airflow in a specific direction, thereby accelerating the discharge of heat; at the same time, the air outlet cover 65 can also prevent external dust or other impurities from directly entering the heat dissipation fins 63, thereby preventing dust accumulation from affecting the heat dissipation performance of the heat dissipation fins 63.

[0035] As described above, the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the above embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. An ultra-thin all-in-one computer heat dissipation structure, characterized in that: It includes a front housing, a display panel, a mainboard, an independent graphics card, a CPU processor, a radiator, an interface module, a heat dissipation shield, and a rear cover; The display panel is disposed in the front housing, the mainboard is disposed on the back of the display panel, the independent graphics card and the CPU processor are respectively connected to the mainboard, the independent graphics card is equipped with a first cooling fan, the radiator is in contact with the CPU processor, and the radiator is used to absorb heat generated by the CPU processor; The interface module is arranged on the mainboard, the heat dissipation shield is used to cover the mainboard, and the heat dissipation shield is provided with an avoidance notch for the interface module to pass through; The rear cover is connected to the front shell, and a first heat dissipation channel and a second heat dissipation channel are respectively provided on both sides of the rear cover. The first heat dissipation channel is used to discharge the heat generated by the independent graphics card to the outside, and the second heat dissipation channel is used to discharge the heat absorbed by the radiator to the outside.

2. The ultra-thin all-in-one computer heat dissipation structure according to claim 1, characterized in that: The radiator includes a heat conducting seat, a copper tube, heat dissipation fins and a second heat dissipation fan; The thermal seat is attached to the surface of the CPU processor, the second cooling fan is arranged on the side of the mainboard, and the heat dissipation fins are arranged at the air outlet end of the second cooling fan. The thermal seat and the heat dissipation fins are connected by the copper tube. The copper tube is used to conduct the heat generated by the CPU processor to the heat dissipation fins, and the second cooling fan is used to discharge the heat on the heat dissipation fins through airflow.

3. The ultra-thin all-in-one computer heat dissipation structure according to claim 1, characterized in that: The display panel further includes a heat-conducting copper sheet, which is arranged between the display panel and the main board and is used to absorb heat generated by the display panel.

4. The ultra-thin all-in-one computer heat dissipation structure according to claim 3, characterized in that: A third heat dissipation channel is provided on the top of the rear cover body, and the third heat dissipation channel is used to discharge the heat absorbed by the heat-conducting copper sheet to the outside.

5. The ultra-thin all-in-one computer heat dissipation structure according to claim 1, characterized in that: A memory stick is also included, which is arranged on the mainboard. The heat dissipation shield is located in the area of ​​the memory stick and is provided with an inwardly recessed abutment portion, which is used to fit on the surface of the memory stick to absorb heat generated by the memory stick.

6. The ultra-thin all-in-one computer heat dissipation structure according to claim 2, characterized in that: The radiator further comprises an air outlet cover, and the air outlet cover is used for covering the heat dissipation fins.

7. The ultra-thin all-in-one computer heat dissipation structure according to claim 1, characterized in that: The heat dissipation shield is made of aluminum alloy, and a plurality of through holes are provided on the side wall of the heat dissipation shield.

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