Camera module

Abstract

The utility model relates to a camera module. The camera module includes a housing that accommodates the lens barrel and a cover that covers the housing. The cover includes a connection portion connected to the first circuit board through a first welding portion to provide ground to the first circuit board. The connection portion has a first recessed portion having a recessed shape in a first direction from the first circuit board toward the housing.

Description

Technical Field

[0001] The present disclosure relates to a camera module. Background Art

[0002] With the remarkable development of information communication technology and semiconductor technology, the use of electronic devices has rapidly spread. As a result, cameras can be applied to portable electronic devices such as smartphones, tablet PCs, and laptop computers.

[0003] In particular, many electronic components may be installed in electronic devices such as smartphones. Therefore, it may be necessary to minimize the extent to which electromagnetic waves generated by the electronic components of the electronic device are released to the outside. Furthermore, it may be necessary to prevent the electronic components of the electronic device from being damaged by externally introduced noise currents, etc. Therefore, camera modules installed in electronic devices can be manufactured so that the cover and circuit board are substantially grounded to prevent electromagnetic waves from leaking to the outside and to prevent the electronic components from being damaged by external currents.

[0004] Conductive tape can be used to ground the camera module. However, the grounding method may require soldering to prevent the thickness of the conductive tape from affecting the thickness of the camera module. Soldering can cause cracks due to differences in thermal expansion rates, which can lead to the risk of grounding failure.

[0005] The above information is presented as background information only to assist in understanding the present disclosure. No determination has been made, and no assertion is made, as to whether any of the above content may be applicable as prior art with respect to the present disclosure. Utility Model Content

[0006] This summary is provided to introduce a selection of concepts in a simplified form that are further described in the following detailed description. This summary is not intended to identify key features or essential features of the claimed subject matter, nor is it intended to be used as an aid in determining the scope of the claimed subject matter.

[0007] In one general aspect, a camera module includes a housing that houses a lens barrel and a cover that covers the housing. The cover includes a connecting portion that is connected to a first circuit board via a first soldering portion to provide a ground to the first circuit board. The connecting portion has a first concave portion having a concave shape in a first direction from the first circuit board toward the housing.

[0008] The connection portion may be connected to a ground pad of the first circuit board through a first soldering portion to provide grounding to the first circuit board.

[0009] The first concave portion of the connection portion may be completely covered by the first welding part.

[0010] The connecting portion may further have a first convex portion and a second convex portion each having a convex shape in a direction from the housing toward the first circuit board, and the first concave portion may be provided between the first convex portion and the second convex portion.

[0011] The connecting portion may further have a second concave portion and a third concave portion, each having a concave shape in the first direction, the first convex portion may be disposed between the first concave portion and the second concave portion, and the second convex portion may be disposed between the first concave portion and the third concave portion.

[0012] An image sensor may be mounted on the first circuit board.

[0013] The connection portion may be connected to a dummy pad of the second circuit board through a first soldering portion, and an optical image stabilization (OIS) driving coil may be mounted on the second circuit board.

[0014] The signal pads of the first circuit board and the signal pads of the second circuit board may be connected via a second soldering portion.

[0015] The second welding portion may be spaced apart from the cover.

[0016] In another general aspect, a camera module includes a lens barrel housing a lens; a housing housing the lens barrel; a first circuit board on which the housing is seated; and a cover covering the housing. The cover includes a connecting portion connected to a ground pad of the first circuit board via a first soldering portion. The connecting portion includes a first concave portion having a concave shape in a first direction from the first circuit board toward the housing, and a convex portion having a convex shape in a direction from the housing toward the first circuit board.

[0017] The first concave portion of the connection portion may be completely covered by the first welding part.

[0018] The connection portion may further have a second concave portion having a concave shape in the first direction, and the convex portion may be provided between the first concave portion and the second concave portion.

[0019] The camera module may further include a second circuit board connected to the housing in a second direction intersecting the first direction. The connecting portion may be connected to the dummy pad of the second circuit board through the first soldering portion.

[0020] The first concave portion may overlap with a dummy pad of the second circuit board.

[0021] Other features and aspects will be apparent from the following detailed description, drawings, and claims. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 is a perspective view illustrating an appearance of a camera module according to one or more embodiments.

[0023] Figure 2 It is schematically shown Figure 1 Exploded perspective view of the camera module shown in .

[0024] Figure 3 It shows Figure 2 A perspective view of the autofocus (AF) unit and housing shown in FIG.

[0025] Figure 4 It shows Figure 2 A perspective view of some of the components shown in FIG.

[0026] Figure 5 It shows Figure 4 A perspective view from the other side.

[0027] Figure 6 It shows Figure 2 A perspective view of the cover shown in FIG.

[0028] Figures 7 to 9 is a view showing an exemplary shape of a connecting portion of a cover.

[0029] Figure 10 is a perspective view showing a cover, a housing, and an image module.

[0030] Figure 11 It is a side view showing the cover, the first circuit board, and the second circuit board of this embodiment.

[0031] Figure 12 is a side view showing a cover, a first circuit board, and a second circuit board of a comparative example.

[0032] Throughout the drawings and detailed description, unless otherwise described, the same reference numerals refer to the same elements. For clarity, illustration, and convenience, the drawings may not be drawn to scale, and the relative sizes, proportions, and depictions of elements in the drawings may be exaggerated. DETAILED DESCRIPTION

[0033] Hereinafter, although examples of the present disclosure will be described in detail with reference to the accompanying drawings, it is noted that the examples are not limited thereto.

[0034] The following detailed description is provided to help the reader gain a comprehensive understanding of the methods, devices and / or systems described herein. However, various changes, modifications and equivalents of the methods, devices and / or systems described herein will be apparent after understanding the present disclosure. For example, the order of operations described herein is merely an example and is not limited to the order set forth herein, but may be changed as will be apparent after understanding the present disclosure, except for operations that must occur in a certain order. In addition, descriptions of features known in the art may be omitted for clarity and brevity.

[0035] The features described herein may be implemented in different forms and are not to be construed as limited to the examples described herein. Rather, the examples described herein are provided merely to illustrate some of the many possible ways to implement the methods, devices, and / or systems described herein that will be apparent upon understanding the present disclosure.

[0036] As used herein, the term "and / or" includes any one of the associated listed items and any combination of any two or more of the associated listed items; similarly, "at least one of..." includes any one of the associated listed items and any combination of any two or more of the associated listed items.

[0037] Although terms such as "first," "second," and "third" may be used herein to describe various members, components, regions, layers, or portions, these members, components, regions, layers, or portions are not limited by these terms. Instead, these terms are used solely to distinguish one member, component, region, layer, or portion from another member, component, region, layer, or portion. Thus, a first member, first component, first region, first layer, or first portion mentioned in the examples described herein may also be referred to as a second member, second component, second region, second layer, or second portion without departing from the teachings of the examples.

[0038] Furthermore, throughout the specification, the wording “in a plan view” means viewing an object from above, and the wording “in a cross-sectional view” means viewing a cross section formed by vertically cutting the object from the side.

[0039] Throughout this specification, when an element (such as a layer, region, or substrate) is described as being “on,” “connected to,” or “coupled to” another element, it may be directly “on,” directly “connected to,” or directly “coupled to” the other element, or one or more other elements may be present between them. Conversely, when an element is described as being “directly on,” “directly connected to,” or “directly coupled to” another element, there are no other elements present between them. Furthermore, constituent elements are defined as different names depending on their position or function, but the constituent elements may be integrated together.

[0040] For ease of description, spatially relative terms such as "above," "upper," "below," "lower," etc. may be used herein to describe the relationship of one element to another element as shown in the accompanying drawings. In addition to the orientation depicted in the accompanying drawings, such spatially relative terms are intended to also include different orientations of the device in use or operation. For example, if the device in the accompanying drawings is turned over, an element described as being "above" or "upper" relative to another element will then be "below" or "lower" relative to the other element. Thus, the term "above" includes both the orientations of above and below, depending on the spatial orientation of the device. The device may also be oriented in other ways (e.g., rotated 90 degrees or in other orientations), and the spatially relative terms used herein will be interpreted accordingly.

[0041] The terms used herein are only used to describe various examples and are not intended to limit the present disclosure. The terms "a", "an", and "the" are intended to include plural forms as well, unless the context clearly indicates otherwise. The terms "include", "comprising", and "having" specify the presence of stated features, quantities, operations, components, elements, and / or combinations thereof, but do not preclude the presence or addition of one or more other features, quantities, operations, components, elements, and / or combinations thereof.

[0042] Due to manufacturing techniques and / or tolerances, the shapes shown in the drawings may vary. Therefore, the examples described herein are not limited to the specific shapes shown in the drawings but include variations in shape that occur during manufacturing.

[0043] In this document, it is noted that use of the term “may” with respect to an example, for example with respect to what an example may include or implement, means that there is at least one example that includes or implements this feature, and all examples are not limited thereto.

[0044] As will be apparent after understanding this disclosure, the features of the examples described herein may be combined in various ways. In addition, although the examples described herein have multiple configurations, other configurations are also possible, as will be apparent after understanding this disclosure.

[0045] Hereinafter, the optical axis may be defined as the central axis of the lens, perpendicular to the lens surface, and the optical axis direction refers to a direction parallel to the central axis. In the accompanying drawings, the optical axis is defined as the Z axis, and the X and Y axes are defined as directions perpendicular to the optical axis. In this case, the X and Y axes are perpendicular to each other, and the XY plane defined by the X and Y axes is a plane perpendicular to the optical axis.

[0046] According to one or more embodiments as described herein, the present disclosure provides a camera module capable of reducing the occurrence of a ground fault or preventing a ground fault.

[0047] Figure 1 is a perspective view showing the appearance of a camera module 10 according to one or more embodiments, and Figure 2 It is schematically shown Figure 1 1 is an exploded perspective view of the camera module 10 shown in FIG.

[0048] Reference Figure 1 and Figure 2 The camera module 10 according to the present embodiment includes a lens barrel 100, a lens driving device 12 configured to move the lens barrel 100, and an image module configured to convert light entering through the lens barrel 100 into an electrical signal. The lens barrel 100 and the lens driving device 12 are housed in a housing 400. The housing 400 may be covered by a cover 800, and the housing 400 may be placed on a first circuit board 730.

[0049] One or more lenses may be mounted in the lens barrel 100 to capture an image of a subject. The lens barrel 100 may have a hollow cylindrical shape, and one or more lenses may be housed in the lens barrel 100 having such a shape. Depending on the design of the lens barrel 100, a necessary number of lenses may be provided in the lens barrel 100. When a plurality of lenses are provided, each of the lenses may have unique optical properties. For example, the plurality of lenses may each have a different refractive index. In addition, the plurality of lenses may include lenses having the same refractive index.

[0050] An optical axis is set to describe the present embodiment. The optical axis can be set to the central axis of the lens housed in the lens barrel 100. The optical axis direction (Z-axis direction) means a direction parallel to the central axis of the lens. The Z-axis can be set to a direction opposite to the direction in which light propagates to the lens in the camera module 10. For example, the optical axis direction (Z-axis direction) can be a direction from the first circuit board 730 toward the housing 400. For ease of description, in the accompanying drawings, the direction pointed by the arrow along the Z-axis is set to an upward direction, and the direction opposite to the direction is set to a downward direction. That is, the light entering the camera module 10 moves from top to bottom in the optical axis direction (Z-axis direction). In addition, the plane direction is defined as a direction perpendicular to the optical axis direction (Z-axis direction).

[0051] The lens barrel 100 can be accommodated in the lens holder 220, and the lens holder 220 can be accommodated in the carrier 300. The lens holder 220 has a central opening, through which the lens barrel 100 can be inserted. The lens barrel 100 is coupled and fixed to the lens holder 220 through the central opening. The lens holder 220 together with the carrier 300 can be accommodated in the housing 400. For example, the lens holder 220 can have a frame shape with four edges. The housing 400 can have a frame shape with a central opening and four edges. The central opening of the lens holder 220 and the central opening of the housing 400 can be aligned in the optical axis direction (Z-axis direction).

[0052] For example, the lens holder 220 can move in a first direction (X-axis direction) and / or a second direction (Y-axis direction) relative to the carrier 300. In addition, the carrier 300 can move in an optical axis direction (Z-axis direction) relative to the housing 400. The lens holder 220 and the carrier 300 can move relative to each other via the lens driving device 12.

[0053] The lens driving device 12 is a device that moves the lens barrel 100. The lens driving device 12 includes an autofocus (AF) unit 14 and an optical image stabilization (OIS) unit 16. The AF unit 14 can move the lens barrel 100 in the optical axis direction (Z-axis direction). The OIS unit 16 can move the lens barrel 100 in a direction perpendicular to the optical axis (X-axis direction or Y-axis direction). For example, the lens driving device 12 can adjust the focus or implement a zoom function by moving the lens barrel 100 in the optical axis direction (Z-axis direction) using the AF unit 14. In addition, the lens driving device 12 can correct shaking when capturing an image by moving the lens barrel 100 in a direction perpendicular to the optical axis (X-axis direction or Y-axis direction) using the OIS unit 16.

[0054] Figure 3 It shows Figure 2 1 and 2. A perspective view of the AF unit 14 and the housing 400 shown in FIG.

[0055] Reference Figure 2 and Figure 3 , the AF unit 14 may include a carrier 300 and an AF driving section 140. The lens barrel 100 may be accommodated in the carrier 300. The AF driving section 140 may provide driving power for moving the carrier 300 in which the lens barrel 100 is accommodated in the optical axis direction (Z-axis direction). The AF driving section 140 may include an AF driving magnet 142 and an AF driving coil 144 (see Figure 4 ).

[0056] When power is applied to the AF drive coil 144, an electromagnetic force can be generated between the AF drive magnet 142 and the AF drive coil 144. Therefore, the carrier 300 can move in the optical axis direction (Z-axis direction). Since the lens barrel 100 is accommodated in the carrier 300, the lens barrel 100 can also move in the optical axis direction (Z-axis direction) by the movement of the carrier 300. Therefore, the focus can be adjusted.

[0057] The first rolling member 146 may be provided between the carrier 300 and the housing 400. When the carrier 300 moves in the optical axis direction (Z-axis direction), the first rolling member 146 may reduce friction between the carrier 300 and the housing 400. The first rolling member 146 may have a spherical shape.

[0058] The first guide groove 342 can be provided in the bearing portion 300 and accommodate the first rolling member 146. Multiple first rolling members 146 can be provided in the first guide groove 342 and arranged side by side in the optical axis direction (Z-axis direction). The multiple first rolling members 146 can have different sizes. For example, among the multiple first rolling members 146 provided in the first guide groove 342, the first rolling member 146 located at the uppermost and lowermost sides can have a larger size than the first rolling member 146 located between the first rolling members 146 located at the uppermost and lowermost sides.

[0059] For example, in the case where two first guide grooves 342 are provided, two first rolling members 146 may be provided in one first guide groove 342 , and three first rolling members 146 may be provided in the other first guide groove 342 .

[0060] The carrier 300 may have a frame shape. The first guide groove 342 may be provided in an edge portion of the frame-shaped carrier 300. A plurality of first guide grooves 342 may be provided. For example, two first guide grooves 342 may be provided at two opposite edges of one side surface of the carrier 300.

[0061] The OIS unit 16 can prevent image blur or video shakiness caused by factors such as user hand tremors during the process of capturing images or shooting videos. That is, when shakiness occurs when capturing an image, the OIS unit 16 can compensate for the shakiness by applying a relative displacement corresponding to the shakiness to the lens barrel 100. For example, the OIS unit 16 can correct the shakiness by moving the lens barrel 100 in a first direction (X-axis direction) and a second direction (Y-axis direction) perpendicular to the optical axis direction (Z-axis direction).

[0062] Figure 4 It shows Figure 2 A perspective view of the lens driving device 12 and the housing 400 shown in FIG. Figure 5 It shows Figure 4 A perspective view from the other side.

[0063] Reference Figure 2 、 Figure 4 and Figure 5 The OIS unit 16 includes a guide member 200 that guides the movement of the lens barrel 100 and an OIS driving portion 160 that supplies driving power to the guide member 200. By the driving power supplied by the OIS driving portion 160, the guide member 200 can move in a direction perpendicular to the optical axis direction (Z-axis direction).

[0064] The guide member 200 includes a lens holder 220 and a support frame 240. The lens holder 220 and the support frame 240 can be aligned in the optical axis direction (Z-axis direction) and accommodated in the bearing portion 300. The lens holder 220 and the support frame 240 can be used to guide the movement of the lens barrel 100 while operating in conjunction with each other. The lens holder 220 and the support frame 240 each have a central opening, and the lens barrel 100 is inserted into the central opening. The lens barrel 100 can be fixed by being connected to the lens holder 220 via the central opening. For example, the lens holder 220 can have a frame shape having four edges, and the support frame 240 can also have a frame shape having four edges and corresponding to the shape of the lens holder 220.

[0065] The OIS driving section 160 includes a first OIS driving section 170 and a second OIS driving section 180. The first OIS driving section 170 generates driving power in a first direction (X-axis direction) perpendicular to the optical axis direction (Z-axis direction), while the second OIS driving section 180 generates driving power in a second direction (Y-axis direction) perpendicular to both the optical axis direction (Z-axis direction) and the first direction (X-axis direction). The first OIS driving section 170 includes a first OIS driving magnet 171 and a first OIS driving coil 173, and the second OIS driving section 180 includes a second OIS driving magnet 181 and a second OIS driving coil 183.

[0066] The first OIS driving magnet 171 and the second OIS driving magnet 181 may be mounted on the lens holder 220. The first OIS driving coil 173 and the second OIS driving coil 183 may be provided in the housing 400. The first OIS driving coil 173 and the second OIS driving coil 183 may be mounted on the second circuit board 410 and provided in the housing 400 via the second circuit board 410. The first OIS driving magnet 171 and the first OIS driving coil 173 are provided to face each other, and the second OIS driving magnet 181 and the second OIS driving coil 183 are provided to face each other.

[0067] The second circuit board 410 can be coupled to the housing 400. The second circuit board 410 can be a circuit board having a wiring pattern, such as a flexible printed circuit board and a rigid flexible printed circuit board. For example, the second circuit board 410 can have a double-curved shape. For example, in the case where the housing 400 has a frame shape having four edges, the second circuit board 410 can cover three of the four side surfaces of the housing 400.

[0068] The second rolling member 176 can be disposed between the lens holder 220 and the support frame 240. The second rolling member 176 can function to maintain a gap between the lens holder 220 and the support frame 240. Also, the second rolling member 176 can guide movement of the lens holder 220. A second guide groove 344 can be formed on a surface of the support frame 240 facing the lens holder 220 in the optical axis direction (Z-axis direction). The second guide groove 344 can be formed only in the support frame 240, or in both the support frame 240 and the lens holder 220. The second rolling member 176 can be accommodated in the second guide groove 344 and disposed between the lens holder 220 and the support frame 240. In a state in which the lens holder 220 is supported by the second rolling member 176 accommodated in the second guide groove 344, movement of the lens holder 220 in the optical axis direction (Z-axis direction) and the second direction (Y-axis direction) can be restricted, and the lens holder 220 can move only in the first direction (X-axis direction) with respect to the support frame 240. Through the above-described movement of the lens holder 220, movement of the lens barrel 100 in the optical axis direction (Z-axis direction) and the second direction (Y-axis direction) can be restricted, and the lens barrel 100 can move only in the first direction (X-axis direction) with respect to the support frame 240.

[0069] The third rolling member 186 can be provided between the support frame 240 and the bearing portion 300. The third rolling member 186 can be used to maintain the interval between the support frame 240 and the bearing portion 300. In addition, the third rolling member 186 can guide the movement of the support frame 240. The third guide groove 346 can be formed on the surfaces of the bearing portion 300 and the support frame 240 facing each other in the optical axis direction (Z-axis direction). The third guide groove 346 can be formed only in either one of the support frame 240 and the bearing portion 300, or in both the support frame 240 and the bearing portion 300. The third rolling member 186 can be accommodated in the third guide groove 346 and assembled between the support frame 240 and the bearing portion 300. In a state in which the support frame 240 is supported by the third rolling member 186 accommodated in the third guide groove 346, the movement of the support frame 240 in the optical axis direction (Z-axis direction) and the first direction (X-axis direction) can be restricted, and the support frame 240 can move only in the second direction (Y-axis direction) relative to the carrier 300. Through the above-mentioned movement of the support frame 240 and the lens holder 220, the movement of the lens barrel 100 in the optical axis direction (Z-axis direction) can be restricted, and the lens barrel 100 can move only in the second direction (Y-axis direction) and the first direction (X-axis direction) relative to the carrier 300.

[0070] The lens barrel 100 and the lens driving device 12 may be accommodated in an inner space of the housing 400. For example, the housing 400 has a box shape opened at its upper and lower sides. An image module is provided below the housing 400.

[0071] The image module is a device that converts light entering through the lens barrel 100 into an electrical signal and transmits the electrical signal. The image module may include an image sensor 710 and a substrate portion.

[0072] The image sensor 710 converts light entering through the lens barrel 100 into an electrical signal. The image sensor 710 can be arranged below the lens barrel 100 in the optical axis direction (Z-axis direction). The image sensor 710 can be mounted on the first circuit board 730. The image sensor 710 can be electrically connected to the first circuit board 730. For example, the image sensor 710 can be, but is not limited to, any one of a charge coupled device (CCD), a metal oxide semiconductor (MOS), a complementary metal oxide semiconductor (CMOS), a CMOS photon detector (CPD), and a charge injection device (CID). The electrical signal converted by the image sensor 710 is output as an image through the display unit of the electronic device.

[0073] The substrate portion may transmit an electrical signal generated from the image sensor 710 to an electronic device such as a camera phone. The substrate portion may include a first circuit board 730, a connection substrate 750, and a connector 770.

[0074] The electrical signal generated by the image sensor 710 can be transmitted to the first circuit board 730. The first circuit board 730 can include a circuit board having a wiring pattern capable of electrical connection, such as a rigid printed circuit board, a flexible printed circuit board, or a rigid flexible printed circuit board.

[0075] The connector 770 can be electrically connected to the first circuit board 730. The connector 770 can include a port 773 that can be electrically connected to an external device. The connection substrate 750 can electrically connect the first circuit board 730 and the connector 770. The connection substrate 750 can include a flexible printed circuit board. The first circuit board 730 can be electrically connected to the lens driving part.

[0076] Although not shown, a filter can be located between the lens barrel 100 and the image sensor 710. The filter can prevent light beams having a specific frequency band among the light beams passing through the lens from entering the image sensor 710. The filter can be disposed in parallel with a direction perpendicular to the optical axis direction (Z-axis direction). The filter can include an infrared blocking filter.

[0077] Figure 6 is a perspective view showing Figure 2 the cover 800 shown in FIG.

[0078] Referring to Figure 1 and Figure 6 , the cover 800 can be coupled to the housing 400 and surround the outer surface of the housing 400. The cover 800 can have a frame shape in which four edges are open at a lower side thereof. The cover 800 protects internal configuration components in the camera module 10. In addition, the cover 800 can be used to block electromagnetic waves. For example, the cover 800 can block electromagnetic waves so that electromagnetic waves generated in the camera module 10 do not affect other electronic components in the electronic device. The cover 800 can be coupled to the first circuit board 730 and grounded. The cover 800 can have a central opening. The central opening of the lens holder 220, the central opening of the housing 400, and the central opening of the cover 800 can be aligned in the optical axis direction (Z-axis direction).

[0079] For example, the cover 800 can be formed as a plate made of a metal material. The cover 800 can be made of a material having a low corrosion rate, such as stainless steel. The cover 800 includes a cover upper surface part 810 disposed at an upper side based on the optical axis direction (Z-axis direction) and disposed in a planar direction, and a cover side surface part 830 extending from the cover upper surface part 810 in the optical axis direction (Z-axis direction).

[0080] The cover upper surface part 810 can have a quadrilateral shape and have a cover opening 811 formed at the center thereof. The middle part of the lens barrel 100 can be exposed through the cover opening 811, and the lens can also be exposed so that light can pass through the lens.

[0081] The cover side surface portion 830 can extend downward from the edge of the cover upper surface portion 810 in the optical axis direction (Z-axis direction). For example, the cover side surface portion 830 can have four surfaces, and adjacent surfaces can be perpendicular to each other. That is, the cover side surface portion 830 can have a quadrangular column shape that is open at its upper and lower sides. However, the shape of the cover side surface portion 830 is not limited thereto. For example, the cover side surface portion 830 can have a cylindrical or hemispherical shape that is open at its lower side.

[0082] The cover side surface portion 830 can include a seating portion 831, a spacer portion 833, and a connection portion 850.

[0083] The seating portion 831 is a portion that contacts the first circuit board 730. The seating portion 831 can extend downward from the cover upper surface portion 810 in the optical axis direction (Z-axis direction) and directly contact the first circuit board 730.

[0084] The spacer portion 833 is a portion that extends downward from the cover upper surface portion 810 in the optical axis direction (Z-axis direction) and does not directly contact the first circuit board 730. Accordingly, the seating portion 831 can have a longer length than the spacer portion 833, which is measured in the optical axis direction (Z-axis direction). For example, the seating portion 831 can be located at both opposite ends of the spacer portion 833.

[0085] The cover 800 and the housing 400 can be coupled to each other. For example, the cover side surface portion 830 can have a fastening groove 835. A fixing protrusion (not shown) of the housing 400 can be inserted into the fastening groove 835. The fixing protrusion of the housing 400 is inserted into the fastening groove 835 so that the cover 800 can be fixedly coupled to the housing 400.

[0086] The connection portion 850 is a portion that does not directly contact the first circuit board 730. The connection portion 850 is a portion that is coupled to the first solder portion 861. The connection portion 850 can have at least one concave portion. In addition, the connection portion 850 can further include a convex portion. The first solder portion 861 can contact the connection portion 850 and the first circuit board 730 to connect the first solder portion 861 and the first circuit board 730. The cover 800 and the first circuit board 730 can be electrically connected through the first solder portion 861. The first solder portion 861 can be connected to the ground pad 711 (see Figure 10 ) of the first circuit board 730. The connection portion 850 can be connected to the first circuit board 730 through the first solder portion 861 to provide a ground.

[0087] The first soldering portion 861 may contact the connection portion 850, the first circuit board 730, and the second circuit board 410 to connect them to each other. That is, the first soldering portion 861 may connect to the connection portion 850, the ground pad 711 of the first circuit board 730, and the dummy pad 411 of the second circuit board 410. The cover 800, the first circuit board 730, and the second circuit board 410 may be physically and electrically connected via the first soldering portion 861.

[0088] Figure 7 、 Figure 8 and Figure 9 It shows Figure 6 Views of various shapes of the connecting portion 850 are shown in part A1.

[0089] Reference Figure 1 、 Figure 7 、 Figure 8 and Figure 9 , the connecting portion 850 may have a first recessed portion 851. The first weld 861 may be provided to completely cover the first recessed portion 851. By completely covering the first recessed portion 851, the concentrated stress at the interface between the cover 800 and the weld can be dispersed. Stress may be caused by thermal deformation. Because the first weld 861 completely covers the first recessed portion 851, the possibility of cracks between the cover 800 and the weld can be reduced, thereby preventing ground faults.

[0090] refer to Figure 7 , the connecting portion 850 may further include a first protruding portion 856. The first weld 861 may completely cover the entire first concave portion 851 and also cover at least a portion of the first protruding portion 856. In this case, stress can be more widely dispersed compared to a case where the first weld 861 only covers the first concave portion 851. Therefore, the possibility of cracks between the cover and the weld can be further reduced.

[0091] The connecting portion 850 may further include a second concave portion 852. In this case, the first convex portion 856 may be located between the first concave portion 851 and the second concave portion 852. The second concave portion 852 may be a component required for easily forming the first convex portion 856 when manufacturing the cover 800. In other words, the first concave portion 851 and the second concave portion 852 each have a shape that is concave upward in the optical axis direction (Z-axis direction). In this case, the highest point of the first concave portion 851 and the highest point of the second concave portion 852 may be different from each other. For example, the highest point of the second concave portion 852 may be located above the highest point of the first concave portion 851 in the optical axis direction (Z-axis direction). However, the present disclosure is not limited thereto.

[0092] refer to Figure 8 and Figure 9 The connecting portion 850 can further have a first protruding portion 856 and a second protruding portion 857. The first recessed portion 851, the first protruding portion 856, and the second protruding portion 857 can be provided in the first direction (X-axis direction). In this case, the first recessed portion 851 can be positioned between the first protruding portion 856 and the second protruding portion 857. The first weld portion 861 can cover the first recessed portion 851, at least a portion of the first protruding portion 856, and at least a portion of the second protruding portion 857. In this case, compared to a case in which the first weld portion 861 covers the first recessed portion 851 and a portion of the first protruding portion 856, it is possible to further disperse concentrated stress. Thus, it is possible to further reduce the possibility of a crack occurring between the cover and the weld portion.

[0093] The connecting portion 850 can further have a second recessed portion 852 and a third recessed portion 853. The second recessed portion 852 and the third recessed portion 853 can be provided in the first direction (X-axis direction). In this case, the first protruding portion 856 can be positioned between the first recessed portion 851 and the second recessed portion 852, and the second protruding portion 857 can be positioned between the first recessed portion 851 and the third recessed portion 853. The third recessed portion 853 can be a component required to easily form the second protruding portion 857 when the cover 800 is manufactured. The highest point of the first recessed portion 851, the highest point of the second recessed portion 852, and the highest point of the third recessed portion 853 can be different from each other. For example, the highest point of the second recessed portion 852 can be higher than the highest point of the first recessed portion 851 and positioned at the same height as the highest point of the third recessed portion 853 (see Figure 8 ). As another example, in the optical axis direction (Z-axis direction), the highest point of the first recessed portion 851 can be positioned between the highest point of the second recessed portion 852 and the highest point of the third recessed portion 853 (see Figure 9 ). In the optical axis direction (Z-axis direction), the highest point of the first recessed portion 851, the highest point of the second recessed portion 852, and the highest point of the third recessed portion 853 can be different from each other. However, the positional relationship between the highest points is provided for the purpose of illustration only, and the present embodiment is not limited thereto.

[0094] Further, Figures 7 to 9 Examples of the shape of the connecting portion 850 are illustrated. However, the shape of the connecting portion 850 is not limited thereto, and the connecting portion 850 can have various shapes.

[0095] Figure 10 is a perspective view illustrating a state in which the cover 800, the housing 400, and the image module, which are coupled in Figure 1 , are disassembled.

[0096] Reference Figure 1 and Figure 10 The cover 800 , the second circuit board 410 , and the first circuit board 730 may be coupled to each other. The cover 800 , the second circuit board 410 , and the first circuit board 730 may be coupled by the first welding portion 861 .

[0097] The second circuit board 410 may have dummy pads 411 and signal pads 413. The dummy pads 411 and signal pads 413 may be located in a direction opposite to the direction in which the second circuit board 410 faces the housing 400. The first circuit board 730 may have ground pads 711 and signal pads 713. The ground pads 711 and signal pads 713 may be located in a direction opposite to the direction in which the first circuit board 730 faces the housing 400.

[0098] The connecting portion 850 may cover a portion of the dummy pad 411. The entire first recessed portion 851 may cover a portion of the dummy pad 411. The first soldering portion 861 may be formed to overlap the dummy pad 411. The first soldering portion 861 may be formed on the dummy pad 411 to completely cover the first recessed portion 851. The connecting portion 850, the second circuit board 410, and the first circuit board 730 may be connected to each other via the first soldering portion 861 formed on the dummy pad 411. The ground pad 711 of the first circuit board 730 and the dummy pad 411 of the second circuit board 410 may be connected via the first soldering portion 861. The first soldering portion 861 is formed on the dummy pad 411 so that the cover 800, the housing 400, and the first circuit board 730 can be coupled to each other via the second circuit board 410. The dummy pad 411 may be insulated from another circuit of the second circuit board 410.

[0099] The second soldering portion 863 may be formed to overlap the signal pad 413 of the second circuit board 410. The second circuit board 410 and the first circuit board 730 may be connected to each other via the second soldering portion 863 formed on the signal pad 413. The signal pad 713 of the first circuit board 730 and the signal pad 413 of the second circuit board 410 may be connected via the second soldering portion 863. The second circuit board 410 and the first circuit board 730 may be physically and electrically connected via the second soldering portion 863. The second soldering portion 863 is formed on the signal pad 413 so that the housing 400 and the first circuit board 730 may be coupled to each other via the second circuit board 410. The second soldering portion 863 may be spaced apart from the cover 800.

[0100] Figure 11 is a side view showing a state in which the cover 800a, the first circuit board 730a, and the second circuit board 410a are welded according to the present embodiment, and Figure 121 is a side view illustrating a state in which the cover 800 b , the first circuit board 730 b , and the second circuit board 410 b are soldered according to a comparative example.

[0101] refer to Figure 11 and Figure 12 In the present embodiment, first weld 861a is formed to completely cover the concave portion formed in cover 800a. In the comparative example of the prior art, first weld 861b having the same size as first weld 861a of the present embodiment covers the convex portion formed in cover 800b. At the interface between the cover and the first weld, the length PL of the interface according to the present embodiment is significantly longer than the length CL of the interface according to the comparative example.

[0102] The interface between the cover and the first soldering part may crack due to changes in the thermal environment surrounding the camera module. As the interface area between the cover and the first soldering part increases, the likelihood of cracks decreasing. Since the length PL of the interface between cover 800a and first soldering part 861a according to this embodiment is longer than the length CL of the interface between cover 800b and first soldering part 861b in the prior art, stress applied to the interface can be more widely distributed. Therefore, according to this embodiment, the likelihood of cracks decreasing, which can prevent ground faults.

[0103] [Experimental example]

[0104] By forming the connection portion 850 to have Figure 8 The camera modules of Examples 1 to 11 were manufactured in the shapes shown in . The first soldering portion was formed to cover the first concave portion, a portion of the first convex portion, a portion of the second convex portion, and the dummy pad, and the first soldering portion was connected to the ground pad of the first circuit board.

[0105] A cover was manufactured to have a convex portion formed at the location of the first concave portion instead of the first concave portion, and the camera modules of Comparative Examples 1 to 13 were manufactured so that the convex portion of the cover overlapped a portion of the dummy pad. A first soldering portion was formed to cover the convex portion of the cover and the dummy pad and extend to the first circuit board.

[0106] The camera modules according to Comparative Examples 1 to 13 and Examples 1 to 11 were measured for their initial state (initial value). The DC resistance (DCR) was measured after 100 and 200 cycles of a test to change the thermal environment from low to high temperatures. The results are shown in Table 1.

[0107] Table 1

[0108]

[0109]

[0110] As shown in Table 1, in Example 1 to Example 11, the DC resistance after 200 cycles is at a level roughly similar to the level of the DC resistance in the initial state. On the contrary, in Comparative Example 1 to Comparative Example 13, the DC resistance after 200 cycles is sometimes not measured (Comparative Example 3, Comparative Example 8 and Comparative Example 11). This is because the weld cracks and the cover and the first circuit board are disconnected. In addition, the DC resistance sometimes significantly increases (Comparative Example 6). This is because even if the cover and the first circuit board are not disconnected, the weld will also greatly crack.

[0111] Therefore, according to the present embodiment, it can be confirmed that by reducing the area where stress concentration may occur at the interface between the weld and the cover according to the thermal environment, the possibility of cracks occurring in the weld can be reduced and a ground fault can be prevented.

[0112] According to one or more embodiments described herein, concentrated stress applied to the interface between the cover and the weld can be dispersed, thereby reducing the possibility of cracks occurring between the cover and the weld, which can prevent ground faults.

[0113] However, the effects of one or more embodiments as described herein are not limited to the above-described effects, and it is apparent that they can be variously extended without departing from the spirit and scope of the present disclosure.

[0114] Although specific examples have been shown and described above, it will be apparent after understanding this disclosure that various changes in form and detail can be made in these examples without departing from the spirit and scope of the claims and their equivalents. The examples described herein are to be considered merely descriptive and not for purposes of limitation. The description of features or aspects in each example is considered to be applicable to similar features or aspects in other examples. Suitable results may also be obtained if the described techniques are performed in a different order, and / or if components in the described systems, architectures, devices, or circuits are combined in different ways and / or replaced or supplemented by other components or their equivalents. Therefore, the scope of the present disclosure is not limited by the specific embodiments, but by the claims and their equivalents, and all changes within the scope of the claims and their equivalents are to be construed as included in this disclosure.

Claims

1. A camera module, characterized in that: include: a housing for accommodating the lens barrel; as well as a cover covering the housing, wherein the cover includes a connecting portion connected to the first circuit board through a first soldering portion to provide grounding to the first circuit board, and The connecting portion includes a first concave portion having a concave shape in a first direction from the first circuit board toward the housing.

2. The camera module according to claim 1, wherein: The connection portion is connected to a ground pad of the first circuit board through the first soldering portion to provide the first circuit board with the ground.

3. The camera module according to claim 1, wherein: The first concave portion of the connecting portion is completely covered by the first welding part.

4. The camera module according to claim 1, wherein: The connecting portion further includes a first protruding portion and a second protruding portion, each of the first protruding portion and the second protruding portion having a protruding shape in a direction from the housing toward the first circuit board, and The first concave portion is disposed between the first convex portion and the second convex portion.

5. The camera module according to claim 4, wherein: The connecting portion further includes a second concave portion and a third concave portion, each of the second concave portion and the third concave portion having a concave shape in the first direction, The first convex portion is disposed between the first concave portion and the second concave portion, and The second convex portion is disposed between the first concave portion and the third concave portion.

6. The camera module according to claim 1, wherein: An image sensor is mounted on the first circuit board.

7. The camera module according to claim 1, wherein: The connecting portion is connected to a dummy pad of a second circuit board through the first soldering portion, and An optical image stabilization drive coil is mounted on the second circuit board.

8. The camera module according to claim 7, wherein: The signal pad of the first circuit board and the signal pad of the second circuit board are connected via a second soldering portion.

9. The camera module according to claim 8, wherein: The second welding portion is spaced apart from the cover.

10. A camera module, characterized in that: include: a lens barrel, which houses the lens; a housing for accommodating the lens barrel; a first circuit board, the housing being placed on the first circuit board; as well as a cover covering the housing, wherein the cover comprises a connecting portion connected to a ground pad of the first circuit board through a first soldering portion, and The connecting portion includes a first concave portion and a convex portion, wherein the first concave portion has a concave shape in a first direction from the first circuit board toward the housing, and the convex portion has a convex shape in a direction from the housing toward the first circuit board.

11. The camera module according to claim 10, wherein: The first concave portion of the connecting portion is completely covered by the first welding part.

12. The camera module according to claim 10, wherein: The connecting portion further includes a second concave portion having a concave shape in the first direction, and The convex portion is provided between the first concave portion and the second concave portion.

13. The camera module according to claim 10, wherein: Also includes: a second circuit board connected to the housing in a second direction intersecting the first direction, The connecting portion is connected to the dummy pad of the second circuit board through the first soldering portion.

14. The camera module according to claim 13, wherein: The first concave portion overlaps the dummy pad of the second circuit board.

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