Vehicle-mounted PCB circuit board

Abstract

The utility model relates to the technical field of PCBs, in particular to a vehicle-mounted PCB which comprises a circuit board body, a connecting frame is arranged on the outer side of the circuit board body, heat dissipation assemblies are arranged at the two ends of the connecting frame and located on the outer side of the circuit board body, and buffering assemblies are arranged on the periphery of the bottom of the circuit board body. The heat dissipation assembly is used for carrying out heat dissipation treatment on the circuit board main body, the heat dissipation assembly is composed of a conduction plate and cooling fins, the conduction plate is located on the outer side of the connecting frame, and the multiple sets of cooling fins are all located at the end, away from the connecting frame, of the conduction plate; the circuit board comprises a circuit board main body and a conduction plate, the circuit board main body is provided with a buffer assembly, the buffer assembly is used for carrying out buffer processing on vibration suffered by the circuit board main body, the conduction plate is a metal conduction plate, a plurality of groups of through grooves are formed in the conduction plate, and the plurality of groups of through grooves are distributed in the conduction plate at equal intervals. According to the utility model, the overall practicability of the PCB circuit board can be improved through the design.

Description

Technical Field

[0001] The utility model relates to the technical field of PCB circuit boards, in particular to a vehicle-mounted PCB circuit board. Background Art

[0002] PCB stands for printed circuit board, also known as printed circuit board. It is an important electronic component, a carrier of electronic components, and a carrier for the electrical connection of electronic components. Because it is made using electronic printing technology, it is called a printed circuit board. With the continuous development of automobile technology, automobile intelligence and automation are also enhanced. Therefore, a carrier for installing electronic components such as automobile systems is installed inside the car, that is, an on-board PCB circuit board.

[0003] Since PCB circuit boards generate heat during operation, their bottoms are in close contact with the equipment after installation, resulting in the inability to dissipate the heat accumulated inside the circuit board in a timely manner. If this heat cannot be dissipated, it will seriously affect the lifespan and even cause damage to the PCB circuit board over time. Therefore, it is particularly important to improve existing PCB circuit boards and design a new type of automotive PCB circuit board to address the above technical defects and improve the practicality of the entire PCB circuit board. Utility Model Content

[0004] The purpose of the present utility model is to provide a vehicle-mounted PCB circuit board. Through the design of a heat dissipation component, heat is dissipated at the upper and lower ends of the circuit board body. The circuit board body is suspended in the air, which improves the heat dissipation efficiency. This solves the problem that the circuit board body generates heat during operation. If this heat cannot be dissipated, it will seriously shorten the lifespan and even cause damage to the PCB circuit board over time. This solves the problems raised in the above-mentioned background technology.

[0005] To achieve the above objectives, the present invention provides the following technical solutions:

[0006] A vehicle-mounted PCB circuit board comprises a circuit board body, a connecting frame is provided on the outside of the circuit board body, heat dissipation components are provided at both ends of the connecting frame and located on the outside of the circuit board body, and buffer components are provided around the bottom of the circuit board body;

[0007] The heat dissipation assembly is used to dissipate heat from the circuit board body, and the heat dissipation assembly is composed of a conductive plate and heat sinks. The conductive plate is located outside the connecting frame, and the plurality of heat sinks are located at an end of the conductive plate away from the connecting frame.

[0008] The buffer assembly is used to buffer the vibrations received by the circuit board body.

[0009] As a preferred solution of the present invention, the conductive plate is a metal conductive plate, and a plurality of through slots are provided inside the conductive plate, and the plurality of through slots are distributed at equal intervals inside the conductive plate.

[0010] As a preferred solution of the present invention, a plurality of groups of heat dissipation holes are provided inside the heat sink, and the plurality of groups of heat dissipation holes are distributed at equal intervals inside the heat sink.

[0011] As a preferred solution of the present invention, the plurality of groups of heat sinks are designed to be expanded in an arc shape on the outside of the conductive plate, and the plurality of groups of heat sinks are distributed at equal intervals on the outside of the conductive plate.

[0012] As a preferred solution of the present invention, the conductive plate is connected to the circuit board body via a connecting frame, and one end of the conductive plate away from the heat sink is in contact with the outer side of the circuit board body.

[0013] As a preferred solution of the present invention, the buffer assembly consists of a moving rod, a sleeve, a damping spring, a connecting plate, a first elastic ball and a second elastic ball. The moving rod is located at the bottom of the circuit board body, the sleeve is located at the end of the moving rod away from the circuit board body, the damping spring is located on the outside of the moving rod and inside the sleeve, the connecting plate is located at the end of the damping spring away from the moving rod, multiple groups of the first elastic balls are all located at the end of the connecting plate away from the damping spring, and multiple groups of the second elastic balls are all located inside the sleeve and close to one end of the first elastic balls.

[0014] As a preferred solution of the present invention, a sliding groove is provided inside the sleeve and outside the movable rod. The internal structure size of the sliding groove is designed to correspond to the external structure size of the movable rod. The movable rod is connected to the sleeve through the sliding groove.

[0015] As a preferred solution of the present invention, the two ends of the damping spring are fixedly connected to the moving rod and the connecting disk respectively, and a plurality of connecting rods are provided at one end of the connecting disk close to the first elastic ball, and the connecting disk is connected to the first elastic ball through the connecting rods.

[0016] As a preferred solution of the present invention, a accommodating block is provided inside the sleeve and at one end of the second elastic ball, and a accommodating groove is provided inside the accommodating block. The internal structure size of the accommodating groove is designed to correspond to the external structure size of the first elastic ball and the second elastic ball.

[0017] Compared with the prior art, the beneficial effects of the present invention are:

[0018] 1. In the present invention, the heat dissipation component is designed to dissipate heat at the upper and lower ends of the circuit board body, and the circuit board body is suspended in the air, which improves the heat dissipation efficiency and solves the problem that the circuit board body generates heat when working. If the heat cannot be dissipated, it will seriously affect the life of the circuit board and will cause damage to the PCB circuit board over time.

[0019] 2. In the present invention, the design of the buffer component allows the circuit board body to be buffered when it is vibrated, thereby preventing the circuit board body installed inside the vehicle from being damaged to a certain extent during use or in the event of a traffic accident, thereby affecting the normal starting of the vehicle and even affecting the driving safety of the vehicle. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 This is a schematic diagram of the overall structure of the utility model;

[0021] Figure 2 This is a schematic diagram of the structure of the connecting frame of the utility model;

[0022] Figure 3 This is a schematic diagram of the structure of the heat dissipation component of the utility model;

[0023] Figure 4 This is a schematic diagram of the structure of the buffer component of the utility model.

[0024] In the figure: 1. Circuit board body; 2. Connecting frame; 3. Heat dissipation assembly; 4. Buffer assembly; 5. Conducting plate; 6. Heat sink; 7. Through slot; 8. Heat dissipation hole; 9. Moving rod; 10. Sleeve; 11. Damping spring; 12. Connecting plate; 13. First elastic ball; 14. Second elastic ball; 15. Receiving block; 16. Receiving slot. DETAILED DESCRIPTION

[0025] The following will combine the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention. Example

[0026] See also Figures 1-4 , the utility model provides a technical solution:

[0027] A vehicle-mounted PCB circuit board includes a circuit board body 1, a connecting frame 2 is provided on the outside of the circuit board body 1, heat dissipation components 3 are provided at both ends of the connecting frame 2 and located on the outside of the circuit board body 1, and buffer components 4 are provided around the bottom of the circuit board body 1;

[0028] The heat dissipation assembly 3 is used to dissipate heat from the circuit board body 1, and the heat dissipation assembly 3 is composed of a conductive plate 5 and heat sinks 6. The conductive plate 5 is located outside the connecting frame 2, and multiple groups of heat sinks 6 are located at the end of the conductive plate 5 away from the connecting frame 2;

[0029] The buffer assembly 4 is used to buffer the vibrations received by the circuit board body 1 .

[0030] Furthermore, the conductive plate 5 is a metal conductive plate, and a plurality of through slots 7 are provided inside the conductive plate 5. The plurality of through slots 7 are evenly spaced inside the conductive plate 5. The metal material of the conductive plate 5 and the plurality of through slots 7 can conduct the heat dissipated by the circuit board body 1 into the interior of the heat sink 6.

[0031] The heat sink 6 has a plurality of heat dissipation holes 8 formed inside, and the plurality of heat dissipation holes 8 are evenly spaced inside the heat sink 6. The plurality of heat dissipation holes 8 are designed to be expanded in an arc shape on the outside of the conductive plate 5. The plurality of heat dissipation fins 6 are evenly spaced on the outside of the conductive plate 5. The conductive plate 5 is connected to the circuit board body 1 through the connecting frame 2, and the end of the conductive plate 5 away from the heat dissipation fins 6 is in contact with the outside of the circuit board body 1. When the heat emitted by the circuit board body 1 is introduced into the heat sink 6 through the conductive plate 5, the heat dissipation fins 6 are expanded to absorb the heat without conducting the heat back to the circuit board body 1. At the same time, the heat dissipation holes 8 facilitate ventilation, thereby achieving a better heat dissipation effect. The heat can be dissipated to the upper and lower ends of the circuit board body 1 at the same time. The circuit board body 1 is suspended in the air, and the heat dissipation efficiency is improved. This solves the problem that the circuit board body 1 generates heat during operation. If the heat cannot be dissipated, the service life will be seriously affected, and the PCB circuit board will be damaged over time.

[0032] Furthermore, the buffer assembly 4 is composed of a moving rod 9, a sleeve 10, a damping spring 11, a connecting plate 12, a first elastic ball 13 and a second elastic ball 14. The moving rod 9 is located at the bottom of the circuit board body 1, the sleeve 10 is located at the end of the moving rod 9 away from the circuit board body 1, the damping spring 11 is located on the outside of the moving rod 9 and inside the sleeve 10, the connecting plate 12 is located at the end of the damping spring 11 away from the moving rod 9, multiple groups of first elastic balls 13 are all located at the end of the connecting plate 12 away from the damping spring 11, and multiple groups of second elastic balls 14 are all located inside the sleeve 10 and close to one end of the first elastic balls 13. When the circuit board body 1 is vibrated, the buffer assembly 4 can buffer the vibration of the circuit board body 1, thereby preventing the circuit board body 1 installed inside the vehicle from being damaged to a certain extent during use due to vehicle driving or traffic accidents, thereby affecting the normal starting of the vehicle and even affecting the driving safety of the vehicle during driving.

[0033] Furthermore, a sliding groove is provided inside the sleeve 10 and on the outside of the moving rod 9. The internal structure and size of the sliding groove are designed to correspond to the external structure and size of the moving rod 9. The moving rod 9 is connected to the sleeve 10 through the sliding groove. The moving rod 9 is slidably connected to the sliding groove so that the moving rod 9 can be connected to the sleeve 10. When the circuit board body 1 is vibrated, the moving rod 9 can be driven to move.

[0034] Furthermore, the two ends of the damping spring 11 are fixedly connected to the moving rod 9 and the connecting disk 12 respectively. A plurality of connecting rods are provided at one end of the connecting disk 12 close to the first elastic ball 13, and the connecting disk 12 is connected to the first elastic ball 13 through the connecting rod. The two ends of the damping spring 11 are connected to the moving rod 9 and the connecting disk 12 respectively. When the moving rod 9 is displaced, the connecting disk 12 can be driven to displace by the damping spring 11, so that the connecting disk 12 drives the first elastic ball 13 to displace through the connecting rod.

[0035] Furthermore, a receiving block 15 is provided inside the sleeve 10 and at one end of the second elastic ball 14, and a receiving groove 16 is provided inside the receiving block 15. The internal structure and size of the receiving groove 16 are designed to correspond to the external structure and size of the first elastic ball 13 and the second elastic ball 14. When the first elastic ball 13 is displaced, it is displaced to the inside of the receiving groove 16 and contacts the second elastic ball 14 inside the receiving groove 16, squeezing the second elastic ball 14, so that the first elastic ball 13 and the second elastic ball 14 are deformed. The deformed first elastic ball 13 and the second elastic ball 14 squeeze the inner wall of the receiving groove 16, and the first elastic ball 13 and the second elastic ball 14 can buffer the force applied to the connecting plate 12, and cooperate with the damping spring 11 to absorb the force applied, thereby buffering the vibration applied to the circuit board body 1.

[0036] In this embodiment, the implementation scenario is specifically as follows: in actual use, the metal material of the conductive plate 5 cooperates with the multiple groups of through grooves 7 to conduct the heat dissipated by the circuit board body 1 into the interior of the heat sink 6. When the heat emitted by the circuit board body 1 is conducted into the interior of the heat sink 6 through the conductive plate 5, the heat sink 6 is unfolded to absorb the heat while not conducting the heat to the circuit board body 1 again. At the same time, the heat dissipation holes 8 facilitate ventilation, which has a better heat dissipation effect and can dissipate heat at the upper and lower ends of the circuit board body 1 at the same time. The circuit board body 1 is suspended in the air, which has a better heat dissipation efficiency and solves the problem that the circuit board body 1 generates heat when it is working. If this heat cannot be dissipated, it will seriously affect the service life and will cause damage to the PCB circuit board over time. When the circuit board body 1 is vibrated, it can drive the moving rod 9 to move. When the moving rod 9 is moved When displacing, the damping spring 11 can drive the connecting plate 12 to displace, so that the connecting plate 12 drives the first elastic ball 13 to displace through the connecting rod. When the first elastic ball 13 is displaced, it is displaced to the inside of the accommodating groove 16, and contacts the second elastic ball 14 inside the accommodating groove 16, squeezing the second elastic ball 14, so that the first elastic ball 13 and the second elastic ball 14 are deformed. The deformed first elastic ball 13 and the second elastic ball 14 squeeze the inner wall of the accommodating groove 16. The first elastic ball 13 and the second elastic ball 14 can buffer the force applied to the connecting plate 12, and cooperate with the damping spring 11 to absorb the applied force, thereby buffering the vibration applied to the circuit board main body 1. Compared with the existing PCB circuit board, the utility model can improve the overall practicality of the PCB circuit board through design.

[0037] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A vehicle-mounted PCB circuit board, comprising a circuit board body (1), characterized in that: A connecting frame (2) is provided on the outside of the circuit board body (1), heat dissipation components (3) are provided at both ends of the connecting frame (2) and located on the outside of the circuit board body (1), and buffer components (4) are provided around the bottom of the circuit board body (1); The heat dissipation component (3) is used to dissipate heat from the circuit board body (1), and the heat dissipation component (3) is composed of a conductive plate (5) and heat sinks (6), the conductive plate (5) is located outside the connecting frame (2), and multiple groups of heat sinks (6) are located at one end of the conductive plate (5) away from the connecting frame (2); The buffer component (4) is used to buffer the vibrations received by the circuit board body (1).

2. The vehicle-mounted PCB circuit board according to claim 1, characterized in that: The conductive plate (5) is a metal conductive plate, and a plurality of through slots (7) are provided inside the conductive plate (5). The plurality of through slots (7) are distributed at equal intervals inside the conductive plate (5).

3. The vehicle-mounted PCB circuit board according to claim 1, characterized in that: A plurality of groups of heat dissipation holes (8) are provided inside the heat dissipation fin (6), and the plurality of groups of heat dissipation holes (8) are distributed at equal intervals inside the heat dissipation fin (6).

4. The vehicle-mounted PCB circuit board according to claim 1, characterized in that: The plurality of groups of heat sinks (6) are designed to be expanded in an arc shape on the outside of the conductive plate (5), and the plurality of groups of heat sinks (6) are distributed at equal intervals on the outside of the conductive plate (5).

5. The vehicle-mounted PCB circuit board according to claim 1, characterized in that: The conductive plate (5) is connected to the circuit board body (1) via a connecting frame (2), and one end of the conductive plate (5) away from the heat sink (6) is attached to the outer side of the circuit board body (1).

6. The vehicle-mounted PCB circuit board according to claim 1, characterized in that: The buffer assembly (4) is composed of a moving rod (9), a sleeve (10), a damping spring (11), a connecting plate (12), a first elastic ball (13) and a second elastic ball (14), wherein the moving rod (9) is located at the bottom of the circuit board body (1), the sleeve (10) is located at the end of the moving rod (9) away from the circuit board body (1), the damping spring (11) is located outside the moving rod (9) and inside the sleeve (10), the connecting plate (12) is located at the end of the damping spring (11) away from the moving rod (9), multiple groups of the first elastic balls (13) are all located at the end of the connecting plate (12) away from the damping spring (11), and multiple groups of the second elastic balls (14) are all located inside the sleeve (10) and close to one end of the first elastic balls (13).

7. The vehicle-mounted PCB circuit board according to claim 6, characterized in that: A sliding groove is provided inside the sleeve (10) and outside the moving rod (9). The internal structure and size of the sliding groove are designed to correspond to the external structure and size of the moving rod (9). The moving rod (9) is connected to the sleeve (10) via the sliding groove.

8. The vehicle-mounted PCB circuit board according to claim 6, characterized in that: The two ends of the damping spring (11) are fixedly connected to the moving rod (9) and the connecting disk (12), respectively. The connecting disk (12) is provided with a plurality of connecting rods at one end close to the first elastic ball (13), and the connecting disk (12) is connected to the first elastic ball (13) via the connecting rods.

9. The vehicle-mounted PCB circuit board according to claim 6, characterized in that: A receiving block (15) is provided inside the sleeve (10) and at one end of the second elastic ball (14). A receiving groove (16) is provided inside the receiving block (15). The internal structure and size of the receiving groove (16) are designed to correspond to the external structure and size of the first elastic ball (13) and the second elastic ball (14).

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