Chip test seat

Abstract

The utility model provides a chip testing seat, and relates to the field of chip testing. Comprising a fixed seat, the top of which is provided with a test board; the test board is provided with a first through hole, and the top of the test board is provided with two groups of golden finger structures. The two groups of golden finger structures are oppositely positioned on two sides of the first through hole; the spring seat fixedly penetrates through the fixed seat and is connected with the first through hole, and a positioning seat is elastically arranged at the top of the spring seat in a penetrating manner; the positioning seat is positioned in the first through hole; the metal probe movably penetrates through the positioning seat and the spring seat and is elastically connected into the spring seat, and the top end of the metal probe protrudes out of the top of the positioning seat in a static state. According to the invention, the contact reliability between the chip pin and the golden finger can be greatly improved, good contact performance is ensured, and the conductive performance is further improved; the heat dissipation of the chip can be assisted, the chip is grounded, and the anti-interference performance and the safety performance are improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to chip test field, specifically, relate to a chip test seat. BACKGROUND

[0002] Chip test is the important procedure in chip production process, and the yield, function etc. of chip can be comprehensively understood through chip test, and only the chip through test can be put into market and applied. When detecting the chip, the chip test seat with gold finger is usually used to fix or position the chip, and the principle of detecting the performance of the chip is that the chip is fixed first, then the gold finger is connected with the corresponding pin on the chip, and the performance of the chip is judged according to the size of the current and other parameters after electrifying.

[0003] And the abutting end position of different gold fingers of the existing chip test device is fixed, when there is certain assembly error, the contact of part of the pins and the abutting end of the corresponding gold fingers is poor, and the chip is cooled during the test process, but the existing test equipment does not have the heat dissipation performance, in addition, the chip generates current and electromagnetic interference during the test conduction, but the existing test equipment has low anti-interference and safety performance. UTILITY MODEL CONTENT

[0004] The utility model discloses a chip test seat, can improve the contact reliability between chip pin and gold finger greatly, guarantees good contact performance, and then improves the conductivity, can assist the chip cooling, and improves the anti-interference and safety performance.

[0005] In order to solve the above technical problems, the utility model adopts the technical scheme that:

[0006] A chip test seat, comprising:

[0007] The fixed seat top is equipped with the test board, the test board is equipped with the first through hole, and the test board top is equipped with two groups of gold finger structures.

[0008] The spring seat is fixed and is penetrated in the fixed seat and is connected with the first through hole, the spring seat top is elastically penetrated with the locating seat, and the locating seat is located in the first through hole.

[0009] The metal probe is movably penetrated through the locating seat and the spring seat and is elastically connected in the spring seat, and the metal probe top end protrudes from the locating seat top in static state.

[0010] Further, in the utility model, the locating seat comprises:

[0011] A substrate is arranged on top of the spring seat;

[0012] A ceramic positioning block is arranged on top of the substrate, and a positioning groove is formed on top of the ceramic positioning block; one end of the metal probe penetrates through the substrate and the ceramic positioning block in sequence and protrudes into the positioning groove;

[0013] Linear bearings are arranged on the bottom of the substrate, and the linear bearings are movably arranged in the spring seat and elastically connected to the spring seat through the first spring.

[0014] Further, the ceramic positioning block is provided with an avoiding groove at both ends of the top of the ceramic positioning block, and the avoiding groove is communicated with the positioning groove and corresponds to the back of the chip to be measured.

[0015] Further, the ceramic positioning block is provided with an avoiding groove at both ends of the top of the ceramic positioning block, and the avoiding groove is communicated with the positioning groove and corresponds to the back of the chip to be measured.

[0016] Further, the ceramic positioning block is provided with an avoiding groove at both ends of the top of the ceramic positioning block, and the avoiding groove is communicated with the positioning groove and corresponds to the back of the chip to be measured.

[0017] Further, the ceramic positioning block is provided with an avoiding groove at both ends of the top of the ceramic positioning block, and the avoiding groove is communicated with the positioning groove and corresponds to the back of the chip to be measured.

[0018] Further, the ceramic positioning block is provided with an avoiding groove at both ends of the top of the ceramic positioning block, and the avoiding groove is communicated with the positioning groove and corresponds to the back of the chip to be measured.

[0019] Further, the ceramic positioning block is provided with an avoiding groove at both ends of the top of the ceramic positioning block, and the avoiding groove is communicated with the positioning groove and corresponds to the back of the chip to be measured.

[0020] Further, the ceramic positioning block is provided with an avoiding groove at both ends of the top of the ceramic positioning block, and the avoiding groove is communicated with the positioning groove and corresponds to the back of the chip to be measured.

[0021] Further, the ceramic positioning block is provided with an avoiding groove at both ends of the top of the ceramic positioning block, and the avoiding groove is communicated with the positioning groove and corresponds to the back of the chip to be measured.

[0022] The utility model has at least the following advantages or beneficial effects:

[0023] The utility model discloses a fixed spring seat in fixed seat, the elastic wear for locating the chip's locating seat of spring seat top, its locating seat is located in the first through -hole, makes the pin of chip when being placed on the top of locating seat, and the gold finger of both sides can be contacted, and in the process of pressing down chip, the locating seat has certain elasticity, makes the pin of chip and gold finger between certain contact stress, thereby guaranteeing the good contact cooperation between both, the protruding metal probe is worn on the top of locating seat, and the metal probe elastically passes through spring seat, and the probe of metal material can be elastically abutted with the fin of chip back, can assist chip heat dissipation while not influencing chip press contact, and the other end of metal probe can be grounded, is used for preventing electromagnetic interference or electric leakage, improves the safety performance. The application can improve the contact reliability between the pin of chip and gold finger greatly, guarantees good contact performance, and improves the conductivity in turn, can assist chip heat dissipation, and the chip grounding improves the anti -interference and safety performance. BRIEF DESCRIPTION OF DRAWINGS

[0024] In order to more clearly illustrate the technical scheme of the embodiment of the utility model, the following will be briefly introduced the drawing needed to be used in the embodiment, should understand, the following drawing only shows some embodiments of the utility model, therefore should not be regarded as the limited scope, for ordinary skilled person in the art, under the premise of not paying the creative labor, can also obtain other related drawings according to these drawings.

[0025] Figure 1 The overall structure schematic diagram of the chip test seat provided for the application embodiment is shown in the figure.

[0026] Figure 2 The side view partial sectional view of the chip test seat provided for the application embodiment is shown in the figure.

[0027] Figure 3 The side view of the locating seat provided for the application embodiment is shown in the figure.

[0028] Figure 4 The application embodiment Figure 1 The structure amplification schematic diagram of A in the application embodiment is shown in the figure.

[0029] Figure: 1-fixed seat, 2-test board, 21-first through -hole, 3-gold finger structure, 4-spring seat, 5-locating seat, 51-substrate, 52-ceramic locating block, 521-locating groove, 522-avoiding groove, 53-insulating block, 54-linear bearing, 55-first spring, 56-stacking sensor, 6-metal probe, 61-fixed block, 7-insulating plate, 8-fixing screw. DETAILED DESCRIPTION

[0030] In order to make the purpose, technical scheme and advantages of the embodiments of the present application clearer, the technical scheme of the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are some but not all of the embodiments of the present application. The components of the embodiments of the present application described and shown in the drawings herein can be arranged and designed in various different configurations.

[0031] Therefore, the detailed description of the embodiments of the present application provided in the drawings below is not intended to limit the scope of the claimed present application, but only represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative labor fall within the scope of protection of the present application. Embodiments

[0032] Please refer to Figures 1-4 , which is a structural schematic view of a chip test seat in the embodiments of the present application.

[0033] The present embodiment provides a chip test seat, comprising:

[0034] The fixed seat 1 is provided with a test plate 2 at the top; the test plate 2 is provided with a first through hole 21, and the test plate 2 is provided with two groups of gold finger structures 3 at the top; the two groups of gold finger structures 3 are located on the two sides of the first through hole 21 oppositely.

[0035] The spring seat 4 is fixedly provided through the fixed seat 1 and connected with the first through hole 21, and the spring seat 4 is elastically provided with a positioning seat 5 at the top; the positioning seat 5 is located in the first through hole 21.

[0036] The metal probe 6 movably penetrates the positioning seat 5 and the spring seat 4 and is elastically connected in the spring seat 4, and the top end of the metal probe 6 protrudes from the top of the positioning seat 5 in the static state.

[0037] Below, a chip test seat of the present exemplary embodiment will be further described.

[0038] In some embodiments of the present application, refer to Figure 1The top of the fixing base 1 is provided with a test plate 2, the test plate 2 is provided with a first through hole 21 near the middle position, the top of the test plate 2 is provided with two groups of gold finger structures 3, the two groups of gold finger structures 3 are located on the two sides of the first through hole 21, the abutting ends of the two groups of gold finger structures 3 are located on the two sides of the first through hole 21 and extend into the first through hole 21 by a part, for contacting the pins of the chip, and the chip is placed from above the first through hole 21. The spring seat 4 is fixedly penetrated in the fixing base 1 and connected with the first through hole 21, the top of the spring seat 4 is elastically penetrated with a positioning seat 5; the positioning seat 5 is located in the first through hole 21; the positioning seat 5 is used for placing and positioning the chip, the positioning seat 5 is located in the first through hole 21 so that the chip can contact the abutting end of the gold finger when placed thereon; the positioning seat 5 is elastically penetrated in the top of the spring seat 4, when the suction nozzle places the chip on the positioning seat 5 and presses downward, the positioning seat 5 can move downward until the pins of the chip contact and conduct with the gold finger, under the action of the elastic force, a certain contact stress is generated between the pins of the chip and the abutting end of the gold finger, so that the two are in good contact, thereby the conductivity between the pins of the chip to be tested and the gold finger can be effectively improved.

[0039] In some embodiments of the present application, the metal probe 6 is movably penetrated in the positioning seat 5 and the spring seat 4 and elastically connected in the spring seat 4, that is, the metal probe 6 can move up and down in the positioning seat 5 and the spring seat 4, under the action of the elastic force, the metal probe 6 is limited and has elasticity, the top end of the metal probe 6 protrudes from the top of the positioning seat 5 in the static state, so that when the chip is placed on the top of the positioning seat 5, the back heat dissipation fin thereof can contact the metal probe 6, the probe of metal material contacting the heat dissipation fin of the chip can assist in heat dissipation, and the other end of the metal probe 6 can be grounded after penetrating the elastic seat, so as to prevent electromagnetic interference or electric leakage, and the safety performance can be improved.

[0040] As a more preferred embodiment, refer to Figure 2 and Figure 3The positioning seat 5 comprises a base plate 51, a ceramic positioning block 52 and a linear bearing 54. The base plate 51 is arranged on the top of the spring seat 4. The ceramic positioning block 52 is arranged on the top of the base plate 51, and a positioning groove 521 is formed on the top of the ceramic positioning block 52. One end of the metal probe 6 penetrates through the base plate 51 and the ceramic positioning block 52 and protrudes into the positioning groove 521. The positioning groove 521 is used for positioning the chip, so that the chip can accurately contact the gold finger when being pressed down, and the positioning groove 521 can protect the metal probe 6 when not in use. The linear bearing 54 is arranged on the bottom of the base plate 51, and the linear bearing 54 movably penetrates into the spring seat 4 and is elastically connected with the spring seat 4 through the first spring 55. Specifically, the spring seat 4 is provided with a strip-shaped groove for the movement of the linear bearing 54. The linear bearing 54 penetrates into the strip-shaped groove, and the first spring 55 is arranged at the bottom of the strip-shaped groove and abuts against the bottom of the linear bearing 54, so as to generate a certain elastic force on the linear bearing 54 and the entire positioning seat 5.

[0041] As a preferred embodiment, the top surface area of the base plate 51 is greater than the bottom surface area of the first through hole 21, so that the base plate 51 is limited by the aperture of the first through hole 21, and the entire positioning seat 5 is prevented from penetrating out of the first through hole 21.

[0042] As a preferred embodiment, the top surface area of the base plate 51 is greater than the bottom surface area of the first through hole 21, so that the base plate 51 is limited by the aperture of the first through hole 21, and the entire positioning seat 5 is prevented from penetrating out of the first through hole 21. Figure 4 The top of the ceramic positioning block 52 is provided with an avoiding groove 522 which is in communication with the positioning groove 521 and corresponds to the tie bar on the back of the chip to be tested. The avoiding groove 522 can avoid the tie bar on the back of the chip, so as to improve the positioning accuracy. It should be noted that the tie bar refers to the connecting piece between chips during the manufacturing process of the chip, which is a linking part of the frame and generally has no actual benefit, but part of it is exposed.

[0043] As a preferred embodiment, the ceramic positioning block 52 is coated with a metal shielding layer. The metal shielding layer can avoid electromagnetic (EMI) interference during the test.

[0044] As a preferred embodiment, the ceramic positioning block 52 is coated with a metal shielding layer. The metal shielding layer can avoid electromagnetic (EMI) interference during the test. Figure 4 The ceramic positioning block 52 and the base plate 51 are provided with an insulating block 53. The insulating block 53 can avoid conduction between the ceramic positioning block 52 and the spring seat 4.

[0045] As a preferred embodiment, the ceramic positioning block 52 is coated with a metal shielding layer. The metal shielding layer can avoid electromagnetic (EMI) interference during the test. Figure 4The top of the ceramic positioning block 52 is provided with a stacking sensor 56 near the edge thereof. The stacking sensor 56 can be an optical sensor such as a laser sensor, which uses an emitting light beam and a receiving light signal to determine whether the chips are stacked together, thereby avoiding the influence of the stacked chips on the test.

[0046] As a preferred embodiment, referring to Figure 1 and Figure 3 The fixed seat 1 and the test plate 2 are provided with an insulating plate 7, which is provided with a second through hole opposite to and in communication with the first through hole 21. The insulating plate 7 is arranged between the fixed seat 1 and the test plate 2 to avoid the conduction between the test plate 2 and the fixed seat 1.

[0047] As a preferred embodiment, referring to Figure 2 The metal probe 6 is sleeved with a fixed block 61, which is connected with the spring seat 4 through a second spring. Specifically, the spring seat 4 is provided with a space for the up-and-down movement of the fixed block 61, and the width of the fixed block 61 is greater than that of the metal probe 6. The second spring is arranged in the space of the spring seat 4 and the end of the fixed block 61, so as to provide the elastic force for the up-and-down movement of the fixed block 61, and the fixed block 61 drives the metal probe 6 to move up and down.

[0048] As a preferred embodiment, referring to Figure 1 and Figure 3 The spring seat 4 and the fixed seat 1, the test plate 2 and the fixed seat 1, and the gold finger structure 3 and the test plate 2 are connected through a fixing screw 8. The various structural members are detachably connected through the fixing screw 8, so that the various structures can be detached, which facilitates the replacement or maintenance and improves the service life of the test seat as a whole.

[0049] The above is only a preferred embodiment of the present application and is not used to limit the present application. For those skilled in the art, the present application can have various changes and modifications. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A chip test socket, characterized in that: include: A fixing base, a test board is provided on the top of the fixing base; the test board is provided with a first through hole, and two sets of gold finger structures are provided on the top of the test board; the two sets of gold finger structures are relatively located on both sides of the first through hole; A spring seat, the spring seat is fixedly provided on the fixing seat and connected to the first through hole, a positioning seat is elastically provided on the top of the spring seat; the positioning seat is located in the first through hole; A metal probe movably passes through the positioning seat and the spring seat and is elastically connected to the spring seat, and the top end of the metal probe protrudes from the top of the positioning seat in a static state.

2. The chip test socket according to claim 1, characterized in that: The positioning seat includes: a base plate, the base plate being arranged on the top of the spring seat; a ceramic positioning block, the ceramic positioning block being arranged on the top of the substrate, the top of the ceramic positioning block being provided with a positioning groove; one end of the metal probe sequentially passes through the substrate and the ceramic positioning block and protrudes into the positioning groove; Linear bearings, at least two of which are provided, the two linear bearings are relatively fixed to the bottom of the base plate, and the linear bearings are movably arranged in the spring seat and elastically connected to the spring seat through a first spring.

3. The chip test socket according to claim 2, characterized in that: Both ends of the top of the ceramic positioning block are provided with avoidance grooves connected with the positioning grooves, and the avoidance grooves correspond to the connecting pieces on the back of the chip to be tested.

4. The chip test socket according to claim 2, characterized in that: The ceramic positioning block is externally coated with a metal shielding layer.

5. The chip test socket according to claim 2, characterized in that: An insulating block is provided between the ceramic positioning block and the substrate.

6. The chip test socket according to claim 2, characterized in that: A stacking sensor is provided on the top of the ceramic positioning block near its edge.

7. The chip test socket according to claim 2, characterized in that: The top surface area of ​​the substrate is larger than the bottom surface area of ​​the first through hole.

8. The chip test socket according to claim 1, characterized in that: An insulating plate is provided between the fixing seat and the test plate, and the insulating plate is provided with a second through hole which is opposite to and communicates with the first through hole.

9. The chip test socket according to claim 1 or 2, characterized in that: The metal probe outer shell is provided with a fixing block, and the fixing block is connected to the spring seat through a second spring.

10. The chip test socket according to claim 1, characterized in that: The spring seat and the fixing seat, the test board and the fixing seat, and the gold finger structure and the test board are all connected by fixing screws.

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