Semiconductor device

Abstract

The utility model provides a semiconductor device, comprising a housing provided with an installation cavity; the substrate is arranged in the mounting cavity; the functional chip is arranged on the substrate; the thermocouple structure is arranged in the mounting cavity, the thermocouple structure is provided with a measuring end and a leading-out end, and the measuring end is connected to the surface, away from the substrate, of the functional chip; and the leading-out terminal structure is provided with a first connecting end located in the shell and a second connecting end extending out of the shell, and the leading-out terminal is electrically connected with the first connecting end. According to the technical scheme, the problem that an online junction temperature measurement method in the prior art cannot give consideration to measurement accuracy and low cost at the same time can be effectively solved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor device, specifically, relate to a kind of semiconductor device. BACKGROUND

[0002] Junction temperature is the basis of thermal characteristic test and reliability evaluation of power semiconductor device, and the working junction temperature of the on-line monitoring device can be monitored, so that the safe working area of the device can be fully utilized while avoiding thermal failure of the device. For multi-chip packaged power semiconductor modules, the maximum temperature difference between different chips can reach tens of degrees Celsius, so it is necessary to monitor the junction temperature of each chip inside the module.

[0003] Since the power semiconductor chip is packaged inside the module, its junction temperature is difficult to measure directly, and many domestic and foreign experts and scholars have conducted research on this issue and proposed many junction temperature measurement methods. These methods can be divided into physical contact method, optical non-contact method, thermosensitive electrical parameter method and model prediction method. However, due to the limitations of measurement principles and conditions, many methods still cannot meet the online measurement requirements of power device junction temperature, especially the online measurement of power module junction temperature distribution. At present, the power module junction temperature online measurement methods mainly include the following:

[0004] (1) Chip integrated temperature sensor: integrating a temperature sensor such as a PN diode on the chip can realize online measurement of the working junction temperature of the chip, but the integration of the temperature sensor requires adjusting the chip circuit diagram, which increases the process complexity and reduces the through-flow capacity of the chip.

[0005] (2) Thermosensitive electrical parameter method: using the power semiconductor device itself as a temperature sensor, by measuring temperature-sensitive electrical parameters such as saturated on-state voltage drop at the end of the device, the junction temperature of the device can be monitored online, but for multi-chip packaged power modules, measuring temperature-sensitive electrical parameters at the end can only obtain the average junction temperature of the module as a whole.

[0006] (3) Temperature measuring optical fiber: integrating a fiber grating temperature sensor inside the power module structure can measure the junction temperature of the chip online, but the cost of the fiber grating temperature sensor is relatively high, and the fiber grating temperature sensor is usually provided with an outer shell for mechanical support and strain isolation, and the response rate is low.

[0007] Therefore, the online junction temperature measurement method in the prior art cannot balance the measurement accuracy and low cost. UTILITY MODEL CONTENTS

[0008] The main purpose of the utility model is to provide a semiconductor device to solve the problem that the online junction temperature measurement method in the related art cannot balance the measurement accuracy and low cost.

[0009] In order to achieve the above object, the utility model provides a kind of semiconductor device, comprising: shell, with mounting cavity;Submount, is arranged in mounting cavity;Functional chip, is arranged on submount;Thermocouple structure, is arranged in mounting cavity, thermocouple structure has measurement end and lead-out end, measurement end is connected on the surface of functional chip away from submount;Lead-out terminal structure, with the first connecting end in shell and the second connecting end that protrudes from shell, lead-out end is electrically connected with the first connecting end.

[0010] Further, the thermocouple structure includes a first thermocouple wire and a second thermocouple wire, the first end of the first thermocouple wire and the first end of the second thermocouple wire are electrically connected and form the measurement end, the lead-out terminal structure includes a first terminal and a second terminal, the second end of the first thermocouple wire is electrically connected with the first terminal, and the second end of the second thermocouple wire is electrically connected with the second terminal.

[0011] Further, the first thermocouple wire and the second thermocouple wire are made of different materials, the first thermocouple wire and the first terminal are made of the same material, and the second thermocouple wire and the second terminal are made of the same material.

[0012] Further, the functional chip has an active region and a terminal region, and the measurement end is connected on the surface of the active region away from the submount.

[0013] Further, the distance between the middle part of the thermocouple structure and the submount is greater than the distance between the measurement end and the submount, and the distance between the middle part of the thermocouple structure and the submount is greater than the distance between the lead-out end and the submount.

[0014] Further, the lead-out terminal structure and the shell are formed by secondary injection molding.

[0015] Further, the measurement end is connected with the functional chip by bonding or welding, and / or the lead-out end is connected with the lead-out terminal structure by bonding or welding.

[0016] Further, the measurement end is connected with the functional chip by bonding or welding, and / or the lead-out end is connected with the lead-out terminal structure by bonding or welding.

[0017] Further, the semiconductor device further includes an insulating adhesive arranged in the mounting cavity.

[0018] Further, the semiconductor device includes a plurality of functional chips, a plurality of thermocouple structures, and a plurality of lead-out terminal structures, the number of functional chips, thermocouple structures, and lead-out terminal structures is the same and corresponds to connection.

[0019] By applying the technical solution of the present invention, the shell can provide an installation base for other components of the semiconductor device, and the substrate is arranged at the bottom of the installation cavity and provides an installation base for the functional chip. The thermocouple structure is arranged in the installation cavity, and the measuring end of the thermocouple structure is connected to the surface of the functional chip away from the substrate. The measuring end is in direct contact with the functional chip and can accurately measure the temperature of the functional chip. The first connection end of the lead-out terminal structure is connected to the lead-out end of the thermocouple structure, and the second connection end of the lead-out terminal structure extends outward from the shell and can be connected to the data acquisition unit to transmit the results measured by the thermocouple structure. In the present application, a low-cost thermocouple structure is integrated into the interior of the semiconductor device and is in direct contact with the functional chip, which improves the accuracy of the transient temperature measurement results of the functional chip and has little impact on the original function of the semiconductor device. Therefore, the technical solution of the present application can effectively solve the problem that the online junction temperature measurement method in the related art cannot take into account both measurement accuracy and low cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The drawings constituting part of this application are provided to provide a further understanding of the present invention. The exemplary embodiments of the present invention and their descriptions are provided to explain the present invention and do not constitute an improper limitation of the present invention. In the drawings:

[0021] Figure 1 A schematic diagram of the three-dimensional structure of a semiconductor device according to an embodiment of the present utility model is shown;

[0022] Figure 2 Shown Figure 1 A schematic side view of a partial structure of a semiconductor device;

[0023] Figure 3 Shown Figure 2 A schematic top view of a semiconductor device;

[0024] Figure 4 A simplified structural diagram of a calibration system for a thermocouple structure is shown.

[0025] The above drawings include the following reference numerals:

[0026] 10. Housing; 11. Mounting cavity;

[0027] 20. Substrate;

[0028] 30. Functional chip; 301. Active area; 302. Terminal area;

[0029] 40. Thermocouple structure; 401. Measuring end; 402. Lead end; 41. First thermocouple wire; 42. Second thermocouple wire;

[0030] 50, lead terminal structure; 501, first connection end; 502, second connection end; 51, first terminal; 52, second terminal;

[0031] 60. Copper-clad ceramic board; 61. Ceramic board; 62. Copper layer;

[0032] 70. Bonding wire;

[0033] 80. Power terminals;

[0034] 91. Extension cord; 92. Copper wire; 93. Data acquisition unit; 94. Bucket of ice water. DETAILED DESCRIPTION

[0035] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only some embodiments of the present invention, not all embodiments. The following description of at least one exemplary embodiment is actually only illustrative and is in no way intended to limit the present invention and its application or use. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0036] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, they indicate the presence of features, steps, operations, devices, components and / or combinations thereof.

[0037] Unless otherwise specifically stated, the relative arrangement of the parts and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present invention. At the same time, it should be understood that, for ease of description, the sizes of the various parts shown in the accompanying drawings are not drawn according to actual proportional relationships. The technology, methods and equipment known to those of ordinary skill in the relevant art may not be discussed in detail, but in appropriate cases, the technology, methods and equipment should be considered as part of the specification. In all examples shown and discussed here, any specific value should be interpreted as being merely exemplary, rather than as a limitation. Therefore, other examples of the exemplary embodiments may have different values. It should be noted that similar numbers and letters represent similar items in the following figures, and therefore, once an item is defined in one figure, it does not need to be further discussed in subsequent figures.

[0038] like Figures 1 to 3As shown, the application provides a semiconductor device, comprising: a shell 10, a substrate 20, a functional chip 30, a thermocouple structure 40 and a lead terminal structure 50. Wherein, the shell 10 has a mounting cavity 11; the substrate 20 is arranged in the mounting cavity 11; the functional chip 30 is arranged on the substrate 20; the thermocouple structure 40 is arranged in the mounting cavity 11, and the thermocouple structure 40 has a measurement end 401 and a lead end 402, the measurement end 401 is connected to the surface of the functional chip 30 away from the substrate 20; the lead terminal structure 50 has a first connecting end 501 located in the shell 10 and a second connecting end 502 extending out of the shell 10, and the lead end 402 is electrically connected with the first connecting end 501.

[0039] By applying the technical scheme of the embodiment, the shell 10 can provide a mounting basis for other components of the semiconductor device, and the substrate 20 is arranged at the bottom of the mounting cavity 11 and provides a mounting basis for the functional chip 30. The thermocouple structure 40 is arranged in the mounting cavity 11, the measurement end 401 of the thermocouple structure 40 is connected to the surface of the functional chip 30 away from the substrate 20, the measurement end 401 directly contacts the functional chip 30, and the temperature of the functional chip 30 can be accurately measured. The first connecting end 501 of the lead terminal structure 50 is connected with the lead end 402 of the thermocouple structure 40, the second connecting end 502 of the lead terminal structure 50 extends out of the shell 10, and can be connected with a data acquisition unit 93 to transmit the measurement result of the thermocouple structure 40. In the embodiment, the low-cost thermocouple structure 40 is integrated into the interior of the semiconductor device and directly contacts the functional chip 30, which improves the accuracy of the transient temperature measurement result of the functional chip 30 and has little effect on the original function of the semiconductor device. Therefore, the technical scheme of the embodiment can effectively solve the problem that the online junction temperature measurement method in the related art cannot balance the measurement accuracy and low cost.

[0040] In the embodiment, the thermocouple structure 40 is integrated into the interior of the semiconductor device, which can avoid damaging the packaging structure when the thermocouple structure is installed into the interior of the semiconductor device after packaging is completed, and can better ensure good contact between the thermocouple structure 40 and the functional chip 30.

[0041] Wherein, the functional chip 30 can be an IGBT chip, a MOSFET chip or a diode, etc.

[0042] As Figure 1 and Figure 3As shown, the thermocouple structure 40 includes a first thermocouple wire 41 and a second thermocouple wire 42. The first end of the first thermocouple wire 41 and the first end of the second thermocouple wire 42 are electrically connected to form a measuring end 401. The lead-out terminal structure 50 includes a first terminal 51 and a second terminal 52. The first terminal 51 is electrically connected to the second end of the first thermocouple wire 41, and the second terminal 52 is electrically connected to the second end of the second thermocouple wire 42. Specifically, in this embodiment, bare wires can be directly used as the first thermocouple wire 41 and the second thermocouple wire 42. The first end of the first thermocouple wire 41 and the first end of the second thermocouple wire 42 are electrically connected to form the measuring end 401, making the measuring end 401 smaller in size and having the advantage of a fast dynamic response rate. The first terminal 51 and the second terminal 52 are respectively connected to the first thermocouple wire 41 and the second thermocouple wire 42, enabling the transmission of the measurement signal.

[0043] In this embodiment, the first thermocouple wire 41 and the second thermocouple wire 42 are made of different materials. The first thermocouple wire 41 and the first terminal 51 are made of the same material, and the second thermocouple wire 42 and the second terminal 52 are made of the same material. Specifically, the first thermocouple wire 41 and the second thermocouple wire 42 can be made of a combination of nickel-chromium alloy / aluminum-nickel alloy, copper / constantan, iron / constantan, nickel-chromium alloy / constantan, or nickel-chromium-silicon alloy / nickel-silicon-magnesium alloy. A closed loop is formed between the first and second thermocouple wires 41 and 42. When a temperature gradient exists between the two ends, current flows through the loop, generating a thermoelectric potential between the two ends. The temperature of the functional chip 30 can be determined based on the thermocouple scale and the thermoelectric potential.

[0044] Specifically, the materials of the first thermocouple wire 41 and the second thermocouple wire 42 can be a combination of nickel-chromium alloy / aluminum-nickel alloy, copper / constantan, iron / constantan, nickel-chromium alloy / constantan, or nickel-chromium-silicon alloy / nickel-silicon-magnesium alloy. First and second thermocouple wires 41 and 42 can be made of different materials and wire diameters depending on the temperature measurement range and response rate requirements. The dimensions of the measuring end 401 can be adjusted by adjusting the wire bonding process parameters. The integration of the thermocouple structure 40 within the semiconductor device using a wire bonding process and providing a lead-out terminal structure 50 improves process compatibility and minimizes the impact on module packaging.

[0045] Specifically, in this embodiment, the wire diameters of the first thermocouple wire 41 and the second thermocouple wire 42 are between 0.01 mm and 2 mm, and the response time of the thermocouple structure 40 can reach millisecond level.

[0046] like Figures 1 to 3As shown, the functional chip 30 has an active area 301 and a terminal area 302, and the measurement end 401 is connected on the active area 301 away from the surface of the substrate 20. When the functional chip 30 is working, the active area 301 is the main heat generating area, and by connecting the measurement end 401 on the active area 301, the junction temperature of the functional chip 30 can be accurately measured.

[0047] As shown, Figure 2 As shown, the distance between the middle part of the thermocouple structure 40 and the substrate 20 is greater than the distance between the measurement end 401 and the substrate 20, and the distance between the middle part of the thermocouple structure 40 and the substrate 20 is greater than the distance between the lead end 402 and the substrate 20. That is, the thermocouple structure 40 forms a structure that protrudes on the middle part, which can achieve the suspended arrangement of other parts of the thermocouple structure 40 except the measurement end 401 and the lead end 402.

[0048] It should be noted that the "middle part of the thermocouple structure 40" above refers to a certain position between the measurement end 401 and the lead end 402, and is not limited to the middle part in the length direction of the thermocouple structure 40.

[0049] Specifically, in the embodiment, the lead terminal structure 50 and the shell 10 are connected by secondary injection molding. By connecting the lead terminal structure 50 on the shell 10 by secondary injection molding, the connection stability of the lead terminal structure 50 can be effectively ensured.

[0050] Of course, in the embodiment not shown in the figure, the lead terminal structure can also be fixed on the shell by adding a clamping fixing structure or using adhesive.

[0051] Specifically, the measurement end 401 is connected with the functional chip 30 by bonding or welding. The measurement end 401 is directly in contact with the active area 301 of the functional chip 30 by bonding or welding, which can ensure the accuracy and response speed of the measurement result. The measurement end 401 can also be connected with the functional chip 30 by insulating heat-conducting glue. By connecting the measurement end 401 and the functional chip 30 by insulating heat-conducting glue, the measurement end 401 and the functional chip 30 can be prevented from being in conduction, and the difficulty of subsequent processing of the measurement data can be reduced, but due to the blocking of the insulating heat-conducting glue, the response speed will be reduced compared with the bonding or welding connection mode. During actual manufacturing, one of the above connection modes can be selected as needed.

[0052] In the embodiment, the lead end 402 is connected with the lead terminal structure 50 by bonding or welding.

[0053] Preferably, a bonding connection is adopted to connect the measuring end 401 and the functional chip 30, and to connect the lead end 402 and the lead terminal structure 50. Since the first thermocouple wire 41 and the second thermocouple wire 42 are similar to the bonding wire 70 in wire diameter and material, a wire bonding process is adopted to realize the connection between the two ends of the thermocouple structure 40 and the corresponding structure, which can simplify the process and ensure good contact between the measuring end 401 and the functional chip 30.

[0054] The semiconductor device further includes an insulating colloid disposed in the mounting cavity 11 . The insulating colloid can insulate and protect the bare thermocouple wires (the first thermocouple wire 41 and the second thermocouple wire 42 ). Specifically, the insulating colloid is formed by encapsulating silicone gel in the mounting cavity 11 .

[0055] like Figure 1 As shown, the semiconductor device includes multiple functional chips 30, multiple thermocouple structures 40, and multiple lead terminal structures 50. The number of functional chips 30, thermocouple structures 40, and lead terminal structures 50 is the same and they are connected in a corresponding manner. The above-mentioned "corresponding connection" refers to the fact that each functional chip 30 is connected to a thermocouple structure 40 and a lead terminal structure 50. This arrangement enables separate temperature measurement of each functional chip 30, realizes simultaneous online temperature measurement of multiple functional chips 30, and ensures the accuracy of the measurement data.

[0056] like Figure 1 As shown, the semiconductor device of this embodiment includes a shell 10, the shell 10 has a mounting cavity 11 with a top opening, and a substrate 20 is arranged on the bottom wall of the mounting cavity 11. Two chipset units are arranged on the substrate 20 (specifically a copper-clad ceramic board). Each chipset unit includes a copper-clad ceramic board 60 and a plurality of functional chips 30 arranged on the copper-clad ceramic board 60. The copper-clad ceramic board 60 includes a ceramic board 61 and a copper layer 62 arranged on the ceramic board 61. The two chipset units are connected by bonding wires 70 or metal bridges. A power terminal 80 is also provided on the shell 10, and the power terminal 80 is connected to the copper layer 62 on the copper-clad ceramic board 60 through a bonding wire 70.

[0057] Specifically, the steps for preparing the semiconductor device of this embodiment are as follows:

[0058] S1: Prepare the functional chip 30, the copper-clad ceramic board 60, the substrate 20, the power terminal 80, the housing 10, the first thermocouple wire 41, and the second thermocouple wire 42, and complete the reflow soldering or sintering of the functional chip 30 and the copper-clad ceramic board 60;

[0059] S2: Wire bonding is performed between the functional chip 30 and the copper-clad ceramic board 60;

[0060] S3: The copper-clad ceramic plate 60 and the substrate 20 are welded by secondary reflow soldering;

[0061] S4: Using a wire bonding machine, connect the first end of the first thermocouple wire 41 and the first end of the second thermocouple wire 42 to the active area 301 of the functional chip 30 to form a measuring end 401 , connect the second end of the first thermocouple wire 41 to the first terminal 51 , and connect the second end of the second thermocouple wire 42 to the second terminal 52 ;

[0062] S5: Bonding other leads and bonding the power terminal 80;

[0063] S6: Fill the interior of the housing 10 with silicone gel and solidify it.

[0064] Figure 4 A simplified structural diagram of the calibration system of the thermocouple structure 40 is shown, wherein the temperature acquisition system includes a constant temperature box, an ice water bucket 94 , a thermal resistor, an extension line 91 , a copper conductor 92 and a data acquisition unit 93 , and the ice water bucket 94 contains ice water.

[0065] During verification, the packaged semiconductor device is placed in a constant temperature box, and the first terminal 51 and the second terminal 52 of each lead-out terminal structure 50 of the semiconductor device are respectively connected to two extension wires 91, wherein the material of the extension wire 91 connected to the first terminal 51 is the same as the material of the first terminal 51, and the material of the extension wire 91 connected to the second terminal 52 is the same as the material of the second terminal 52. The other ends of the two extension wires 91 are respectively connected to two copper wires 92, and the other ends of the two copper wires 92 are connected to a multi-channel data acquisition unit 93. The connection point of the extension wire 91 and the copper wire 92 is placed in ice water in an ice water bucket 94, and a thermistor is placed near the semiconductor device, and the output end of the thermistor is connected to the data acquisition unit 93.

[0066] Set different constant temperature chamber temperatures. After the RTD temperature displayed by the data acquisition unit 93 reaches the set constant temperature chamber temperature and remains stable, read and record the thermoelectric potential of each thermocouple structure 40 at the corresponding temperature. To reduce measurement error, read the thermoelectric potential three times at each temperature, and take the average value as the thermoelectric potential at that temperature.

[0067] The recorded result of the thermoelectric potential is then compared with the standard graduation table of the thermocouple structure 40 , and the deviation of the comparison is taken as the basic measurement error of the thermocouple structure 40 (deviation may be caused by the packaging process and signal extraction).

[0068] After that, online monitoring of the chip junction temperature inside the semiconductor device can be carried out: the first terminal 51 and the second terminal 52 of each lead-out terminal structure 50 of the semiconductor device are respectively connected to the multi-channel data acquisition unit 93 through two extension lines 91, and the data acquisition unit 93 samples at high frequency and outputs the real-time junction temperature.

[0069] The junction temperature conversion step of the data acquisition unit 93 is as follows:

[0070] The data acquisition unit 93 is built-in with a temperature measuring unit to measure the temperature (cold end temperature T CJ ) of the connection point of the extension line 91 and the data acquisition unit 93.

[0071] According to the thermocouple scale, the cold end temperature is converted into thermoelectric potential V CJ .

[0072] The converted thermoelectric potential V CJ is summed with the thermoelectric potential V TC output by the extension line 91.

[0073] According to the thermocouple scale, the summed thermoelectric potential is converted into temperature T J , which is the real-time junction temperature of the functional chip 30.

[0074] In the description of the utility model, it needs to be understood that the orientation words such as 'front, back, up, down, left, right', 'horizontal, vertical, perpendicular, horizontal' and 'top, bottom' and the like indicated orientation or position relationship is usually based on the orientation or position relationship shown in the drawings, only for the convenience of describing the utility model and simplifying the description, without making the opposite statement, these orientation words do not indicate and imply that the indicated device or element must have a specific orientation or be constructed and operated in a specific orientation, therefore, it cannot be understood as the limitation of the protection scope of the utility model; the orientation words 'inner, outer' refer to the inner and outer of the contour of each component itself.

[0075] For the convenience of description, spatial relative terms such as 'over', 'above', 'upper surface', 'upper' and the like can be used here to describe the spatial position relationship of one device or feature with other devices or features as shown in the drawings. It should be understood that the spatial relative terms are intended to include different orientations in use or operation in addition to the orientation of the device described in the drawings. For example, if the device in the drawing is inverted, the device described as 'above' or 'over' other devices or structures will be positioned 'below' or 'under' other devices or structures. Thus, the exemplary term 'above' can include both 'above' and 'below' orientations. The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used here are interpreted accordingly.

[0076] In addition, it needs to be explained that the use of 'first','second' and the like to limit the parts is only for the convenience of distinguishing the corresponding parts, and the above words have no special meaning unless otherwise stated, therefore, it cannot be understood as the limitation of the protection scope of the utility model.

[0077] The above merely describes preferred embodiments of the present application and is not intended to limit the present application. For those skilled in the art, the present application can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A semiconductor device, characterized in that: include: A housing (10) having a mounting cavity (11); A substrate (20) is disposed in the mounting cavity (11); A functional chip (30) is arranged on the substrate (20); a thermocouple structure (40) disposed in the mounting cavity (11), the thermocouple structure (40) having a measuring end (401) and a lead-out end (402), the measuring end (401) being connected to a surface of the functional chip (30) away from the substrate (20); The lead-out terminal structure (50) comprises a first connection end (501) located in the housing (10) and a second connection end (502) extending out of the housing (10), wherein the lead-out end (402) is electrically connected to the first connection end (501).

2. The semiconductor device according to claim 1, wherein The thermocouple structure (40) includes a first thermocouple wire (41) and a second thermocouple wire (42), wherein the first end of the first thermocouple wire (41) and the first end of the second thermocouple wire (42) are electrically connected to form the measuring end (401), and the lead terminal structure (50) includes a first terminal (51) and a second terminal (52), wherein the first terminal (51) is electrically connected to the second end of the first thermocouple wire (41), and the second terminal (52) is electrically connected to the second end of the second thermocouple wire (42).

3. The semiconductor device according to claim 2, wherein The first thermocouple wire (41) and the second thermocouple wire (42) are made of different materials, the first thermocouple wire (41) and the first terminal (51) are made of the same material, and the second thermocouple wire (42) and the second terminal (52) are made of the same material.

4. The semiconductor device according to any one of claims 1 to 3, wherein: The functional chip (30) has an active area (301) and a terminal area (302), and the measuring end (401) is connected to a surface of the active area (301) away from the substrate (20).

5. The semiconductor device according to any one of claims 1 to 3, wherein The distance between the middle of the thermocouple structure (40) and the substrate (20) is greater than the distance between the measuring end (401) and the substrate (20), and the distance between the middle of the thermocouple structure (40) and the substrate (20) is greater than the distance between the lead-out end (402) and the substrate (20).

6. The semiconductor device according to any one of claims 1 to 3, wherein: The lead-out terminal structure (50) and the housing (10) are formed by secondary injection molding.

7. The semiconductor device according to any one of claims 1 to 3, wherein: The measuring end (401) is connected to the functional chip (30) by bonding or welding; and / or the lead-out end (402) is connected to the lead-out terminal structure (50) by bonding or welding.

8. The semiconductor device according to any one of claims 1 to 3, wherein: The measuring end (401) is connected to the functional chip (30) via insulating heat-conducting adhesive.

9. The semiconductor device according to any one of claims 1 to 3, wherein: The semiconductor device further comprises an insulating colloid arranged in the mounting cavity (11).

10. The semiconductor device according to any one of claims 1 to 3, wherein: The semiconductor device comprises a plurality of the functional chips (30), a plurality of the thermocouple structures (40) and a plurality of the lead-out terminal structures (50), wherein the functional chips (30), the thermocouple structures (40) and the lead-out terminal structures (50) are of the same number and are connected correspondingly.

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