Current detection device for welding type power module

Abstract

The utility model provides a current detection device used for a welding type power module, the power module comprises a substrate, a conductive part and a plurality of chips, the conductive part is arranged on the substrate, the plurality of chips are arranged on the conductive part, the current detection device used for the welding type power module comprises a detection member and a transmission member, the detection part is arranged on the side, away from the substrate, of the conductive part and is in insulation fit with the conductive part, the detection part is provided with a plurality of through holes, the through holes are formed in the peripheries of the chips in a one-to-one correspondence mode, the periphery of each through hole is provided with a detection coil for detecting the corresponding chip, bonding wires of the chips penetrate through the through holes, and the detection part is in signal connection with the transmission part. Through the technical scheme provided by the invention, the problem that the whole silicon carbide power module is damaged due to breakdown of a part of chips with overlarge current because the current distribution of each chip in the silicon carbide power module in the related technology is not uniform and the current of each chip cannot be measured can be solved.

Description

TECHNICAL FIELD

[0001] The utility model relates to a semiconductor technical field, specifically, relate to a kind of current detection device for welding type power module. BACKGROUND

[0002] Silicon carbide power module has multiple parallel silicon carbide MOSFET chips inside. In ideal state, the current in power module is evenly distributed, i.e. the current of each chip is equal. In fact, affected by chip parameters and packaging parasitic parameters, the current distribution in power module is not uniform, and some chips must flow through current exceeding rated value. Overcurrent chip is prone to failure and thus causes failure of the entire power module.

[0003] However, the current distribution of each chip in the silicon carbide power module in the related art is not uniform, and the current of each chip cannot be measured, which can cause breakdown of some chips with excessive current, resulting in damage to the entire silicon carbide power module. SUMMARY

[0004] The utility model provides a kind of current detection device for welding type power module to solve the current distribution of each chip in the silicon carbide power module in the related art is not uniform, and the current of each chip cannot be measured, which can cause breakdown of some chips with excessive current, resulting in damage to the entire silicon carbide power module Problem.

[0005] The utility model provides a kind of current detection device for welding type power module, and the power module includes substrate, conducting part and multiple chips, the conducting part is arranged on the substrate, and the multiple chips are arranged on the conducting part, the current detection device for welding type power module includes detection piece and transmission piece, the detection piece is arranged on the side of conducting part away from substrate, and is insulated with conducting part, the detection piece is provided with multiple through holes, and the multiple through holes are one-to-one correspondingly arranged on the outer periphery of multiple chips, the outer periphery of each through hole is provided with detection coil for detecting corresponding chip, and the bonding wire of chip passes through the through hole, and the detection piece is signal connected with transmission piece.

[0006] Further, the detection piece includes PCB plate, the PCB plate includes connected plug-in plate segment and connecting plate segment, the plug-in plate segment is arranged in the power module, the plug-in plate segment is located on the side of conducting part away from substrate, the multiple through holes are arranged on the plug-in plate segment, the connecting plate segment is located on the outside of power module, and the connecting plate segment is signal connected with transmission piece.

[0007] Further, multiple pin pads are arranged on the connecting plate segment, the multiple pin pads and the multiple detection coils are one-to-one correspondingly arranged, a connector is correspondingly arranged on each pin pad, and the connector is electrically connected with transmission piece.

[0008] Further, the transmission member comprises a signal transmission line, an integrator and a controller, the first end of the signal transmission line is connected with the connecting plate segment, the second end of the signal transmission line is connected with the integrator so that the integrator receives the detection signal of the detection coil, and the controller is electrically connected with the integrator so that the controller controls the driving signal of the power module according to the signal of the integrator.

[0009] Further, the power module further comprises a shell, the substrate is arranged in the shell, or a part of the shell forms the substrate, a communication slot is arranged on the side wall of the shell, and the plug-in plate segment is inserted into the communication slot.

[0010] Further, an adhesive layer is arranged between the slot wall of the communication slot and the plug-in plate segment to fix the plug-in plate segment.

[0011] Further, the through hole is of a rectangular structure.

[0012] Further, an insulating plate is arranged between the plug-in plate segment and the chip, the insulating plate is provided with a relief hole matched with the through hole to avoid the bonding wire.

[0013] Further, the material of the insulating plate is ceramic.

[0014] Further, the detection coil is a Rogowski coil.

[0015] Further, the connecting plate segment of the PCB is provided with a shell, the shell and the shell have a clamping structure to limit and fix the shell on the shell.

[0016] Further, the clamping structure comprises a clamping block arranged on the side wall of the shell facing the power module, the clamping block has a clamping hole, a clamping hook, both sides of the clamping hook are provided with connecting columns, the outer side wall of the shell is provided with a mounting recess, opposite two inner side walls of the mounting recess are symmetrically provided with mounting grooves, two connecting columns and two mounting grooves are correspondingly arranged, and the clamping hook is rotatably arranged in the mounting recess.

[0017] Further, the clamping structure further comprises a torsion spring sleeved on the connecting column, the first end of the torsion spring is connected with the shell, and the second end of the torsion spring is connected with the connecting column.

[0018] The utility model discloses a technical scheme, and power module includes substrate, conductive cloth and a plurality of chips, and the conductive cloth sets up on the substrate, and a plurality of chips set up on the conductive part, utilize the current detection device for welding type power module to detect the current on a plurality of chips, and then can real -time detection current on the chip, avoid the current too big and lead to chip breakdown and then cause power module damage. Among them, the current detection device for welding type power module includes detection piece and transmission piece, and the detection piece sets up on the side of the conductive part away from the substrate, and the detection piece and the conductive part insulating cooperation, like this in utilizing detection piece to set up a plurality of chips on the conductive part and detect. Specifically, a plurality of through -holes are formed on the detection piece, and the through -holes are correspondingly arranged with the plurality of chips, and a detection coil is arranged on the outer periphery of each through -hole, the bonding wire of the chip passes through the through -hole, and the detection coil is used to detect the current flowing through the bonding wire of the chip, and the detection piece and the transmission piece are signal connected, so that the size of the current flowing through the bonding wire can be obtained by using the transmission piece, and the current of the chip can be detected in real time. Among them, the detection piece and the conductive part are insulatingly matched to ensure that the current of the chip cannot be introduced into the detection piece, and the accuracy of the detection current result of the detection piece is ensured. The current detection device with the above structure, one end of the bonding wire of the chip is arranged at the upper end of the chip, and the other end of the bonding wire is arranged in the through -hole on the detection piece. In this way, the detection coil on the outer periphery of the through -hole can detect the current flowing through the bonding wire in real time, so that the problem of excessive current on the chip and damage to the power module can be avoided. BRIEF DESCRIPTION OF DRAWINGS

[0019] The drawings accompanying the specification of this application form a part thereof, serve to provide further understanding of the present application, and together with the description of the application, serve to explain the present application. In the drawings:

[0020] Figure 1 A schematic view of the current detection device for the welding type power module is shown according to the embodiment of the utility model;

[0021] Figure 2 A schematic view of the PCB is shown according to the embodiment of the utility model;

[0022] Figure 3 A schematic view of the structure of the PCB fixedly arranged in the power module is shown according to the embodiment of the utility model;

[0023] Figure 4 A schematic view of the bonding wire of the chip arranged in the PCB is shown according to the embodiment of the utility model;

[0024] Figure 5 A schematic view of the PCB fixedly arranged on the power module is shown according to the embodiment of the utility model.

[0025] The above drawings include the following reference numerals:

[0026] 10. Detection component; 11. PCB board; 111. Plug-in board section; 112. Connector board section; 1121. Pin pad; 12. Through hole; 13. Detection coil;

[0027] 20. Transmission element; 21. Signal transmission line; 22. Integrator; 23. Controller;

[0028] 30. Power module; 31. Conductive portion; 32. Chip; 321. Bonding wire; 33. Housing. DETAILED DESCRIPTION

[0029] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only some embodiments of the present invention, not all embodiments. The following description of at least one exemplary embodiment is actually only illustrative and is in no way intended to limit the present invention and its application or use. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0030] like Figures 1 to 5 As shown, an embodiment of the present invention provides a current detection device for a welding-type power module, wherein the power module 30 includes a substrate, a conductive portion 31 and a plurality of chips 32, wherein the conductive portion 31 is arranged on the substrate, and the plurality of chips 32 are arranged on the conductive portion 31. The current detection device for the welding-type power module includes a detection member 10 and a transmission member 20, wherein the detection member 10 is arranged on a side of the conductive portion 31 away from the substrate and is insulated from the conductive portion 31, the detection member 10 is provided with a plurality of through holes 12, and the plurality of through holes 12 are arranged one-to-one at the periphery of the plurality of chips 32, and a detection coil 13 for detecting the corresponding chip 32 is provided at the periphery of each through hole 12, the bonding wire 321 of the chip 32 passes through the through hole 12, and the detection member 10 is signal-connected to the transmission member 20.

[0031] The current detection device for the welding type power module is used to detect the current on the plurality of chips 32, and the current on the chip 32 can be detected in real time, so that the chip 32 is prevented from being broken down due to the excessive current and the power module 30 is prevented from being damaged. The current detection device for the welding type power module 30 comprises a detection piece 10 and a transmission piece 20. The detection piece 10 is arranged on the side of the conductive part 31 away from the substrate, and the detection piece 10 is insulated from the conductive part 31. In this way, the plurality of chips 32 arranged on the conductive part 31 are detected by the detection piece 10. Specifically, a plurality of through holes 12 are arranged on the detection piece 10, and the plurality of through holes 12 are arranged in one-to-one correspondence with the plurality of chips 32. A detection coil 13 is arranged on the outer periphery of each through hole 12. The bonding wire 321 of the chip 32 passes through the through hole 12, and the detection coil 13 is used to detect the current flowing through the bonding wire 321 of the chip 32. The detection piece 10 is signal connected with the transmission piece 20, so that the size of the current flowing through the bonding wire 321 can be obtained by the transmission piece 20, and the current of the chip 32 can be detected in real time. The detection piece 10 is insulated from the conductive part 31, so that the current of the chip 32 cannot be introduced to the detection piece 10, and the accuracy of the detection current result of the detection piece 10 is ensured. The current detection device with the above structure is used. One end of the bonding wire 321 of the chip 32 is arranged at the upper end of the chip 32, and the other end of the bonding wire 321 passes through the through hole 12 on the detection piece 10. In this way, the current flowing through the bonding wire 321 can be detected in real time by the detection coil 13 on the outer periphery of the through hole 12. In this way, the problem that the power module 30 is damaged due to the excessive current on the chip 32 can be avoided.

[0032] As Figure 2 and Figure 3As shown, the detection piece 10 includes a PCB board 11, the PCB board 11 includes a plug-in plate segment 111 and a connecting plate segment 112 connected with each other, the plug-in plate segment 111 is arranged in the power module 30, the plug-in plate segment 111 is located on the side of the conductive part 31 away from the base plate, a plurality of through holes 12 are arranged on the plug-in plate segment 111, the connecting plate segment 112 is located on the outer side of the power module 30, and the connecting plate segment 112 is signal connected with the transmission piece 20. By adopting the above structure of the detection piece 10, the plug-in plate segment 111 of the PCB board 11 is arranged in the power module 30, the through holes 12 and the detection coils 13 are arranged on the plug-in plate segment 111, the connecting plate segment 112 of the PCB board 11 is located on the outer side of the power module 30, and the connecting plate segment 112 is signal connected with the transmission piece 20. In this way, the plug-in plate segment 111 can be fixedly arranged in the power module 30, which can facilitate integrated integration and detection of the bonding wire 321 of the chip 32 by the plug-in plate segment 111. The signal detected is transmitted to the connecting plate segment 112, and the connecting plate segment 112 is signal connected with the transmission piece 20. In this way, the size of the current flowing through the bonding wire 321 can be detected in real time.

[0033] As shown in Figure 2 and Figure 3 As shown, a plurality of pin pads 1121 are arranged on the connecting plate segment 112, the plurality of pin pads 1121 and the plurality of detection coils 13 are arranged one by one in a corresponding manner, a connector is arranged on each pin pad 1121 in a corresponding manner, and the connector is electrically connected with the transmission piece 20. By adopting the above structure, a plurality of pin pads 1121 are arranged on the connecting plate segment 112, and the plurality of pin pads 1121 and the plurality of detection coils 13 are arranged one by one in a corresponding manner. In this way, a connector is arranged on each pin pad 1121, so that each pin pad 1121 is signal connected with the detection coil 13 around the corresponding through hole, and then the signal is transmitted to the transmission piece 20 through the connector arranged on the pin pad 1121. In this way, the detection coil 13 can be signal connected with the transmission piece 20 by the connector, so as to facilitate detection of the signal of the size of the current flowing through the bonding wire 321 by the detection coil 13, and transmission of the signal to the transmission piece 20 by the connector. In this way, signal transmission can be facilitated, and the size of the current of each chip 32 can be obtained.

[0034] As shown in Figure 1As shown, the transmission member 20 comprises a signal transmission line 21, an integrator 22 and a controller 23, the first end of the signal transmission line 21 is connected with the connecting plate segment 112, the second end of the signal transmission line 21 is connected with the integrator 22 so that the integrator 22 receives the detection signal of the detection coil 13, the controller 23 is electrically connected with the integrator 22 so that the controller 23 controls the driving signal of the power module 30 according to the signal of the integrator 22. By adopting the above-mentioned structure of the transmission member 20, the first end of the signal transmission line 21 is connected with the connecting plate segment 112, the second end of the signal transmission line 21 is connected with the integrator 22, so that the connecting plate segment 112 and the integrator 22 are connected, which facilitates the transmission of the signal of the current size of each chip 32 detected to the integrator 22, and then the integrator 22 receives the detection signal of the detection coil 13, and the controller 23 is electrically connected with the integrator 22, which facilitates the controller 23 to control the driving signal of the power module 30 according to the signal of the integrator 22, and facilitates the normal operation of the power module 30.

[0035] In the embodiment, the power module 30 further comprises a shell 33, the substrate is arranged in the shell 33, or a part of the shell 33 forms the substrate, a communication groove is arranged on the side wall of the shell 33, and the plug-in plate segment 111 is inserted in the communication groove. By adopting the above-mentioned structure of the power module 30, the substrate is arranged in the shell 33, the communication groove is arranged on the side wall of the shell 33, and the plug-in plate segment 111 is inserted in the communication groove, so that the plug-in plate segment 111 is integrated with the power module 30.

[0036] In the embodiment, an adhesive layer is arranged between the groove wall of the communication groove and the plug-in plate segment 111 to fix the plug-in plate segment 111. By adopting the above-mentioned structure, the adhesive layer is arranged between the groove wall of the communication groove and the plug-in plate segment 111, so that after the plug-in plate segment 111 is inserted in the communication groove of the shell 33, the adhesive layer is applied, which can ensure that the plug-in plate segment 111 is connected and fixed with the shell 33.

[0037] In the embodiment, the through hole 12 is in a rectangular structure. By adopting the above-mentioned structure, the through hole 12 is arranged in a rectangular structure, which facilitates the arrangement of the detection coil 13 on the outer periphery of the through hole 12.

[0038] In the embodiment, an insulating plate is arranged between the plug-in plate segment 111 and the chip 32, and the insulating plate is provided with a clearance hole matched with the through hole 12 to avoid the bonding wire 321. By adopting the above-mentioned structure, the insulating plate is arranged between the plug-in plate segment 111 and the chip 32, which can realize the insulation of the plug-in plate segment 111 by the insulating plate, and the clearance hole is arranged on the insulating plate, which can avoid the bonding wire 321 by the clearance hole, and then the bonding wire 321 can pass through the clearance hole of the insulating plate and the through hole 12 on the PCB 11.

[0039] In the embodiment, the material of the insulating plate is ceramic. By using the insulating plate with the above structure, the insulating plate can be used to insulate the plug-in plate segment 111 and the chip 32.

[0040] In the embodiment, the detection coil 13 is a Rogowski coil. By setting the detection coil 13 as a Rogowski coil, the current flowing through the bonding wire 321 can be detected.

[0041] It should be noted that the Rogowski coil can measure the current on the bonding wire 321 and output a voltage signal proportional to the differential of the current. The signal transmission line 21 transmits the voltage signal output by the Rogowski coil to the integrator 22. The integrator 22 integrates the signal, thereby restoring the voltage signal proportional to the differential of the current to a signal proportional to the amplitude of the current. Then, the signal is transmitted to the controller 23. The controller 23 summarizes the signals to obtain the current distribution of the power module 30.

[0042] In the embodiment, the connecting plate segment 112 of the PCB 11 is provided with a shell. The shell and the shell 33 have a clamping structure to limit and fix the shell on the shell 33. By using the above structure, the clamping structure is provided between the shell and the shell 33. When the detection piece 10 is inserted into the shell 33 and located above the conductive part 31, the clamping structure is used to limit and fix the detection piece 10 and the power module 30. Then, the bonding wire 321 of the chip 32 is inserted into the through hole 12. Thus, the current flowing through the bonding wire 321 can be detected. In this way, the detection piece 10 can be limited and fixed by the clamping structure after the bonding wire 321 passes through the through hole 12. Thus, the stability of the detection piece 10 can be ensured by the clamping structure during the integration process of inserting the detection piece 10 into the shell 33 and inserting the bonding wire 321 into the through hole 12. Thus, the detection piece 10 is prevented from moving relative to the conductive part 31.

[0043] In the embodiment, the clamping structure includes a clamping block and a clamping hook. The clamping block is arranged on the side wall of the shell facing the power module 30. The clamping block has a clamping hole. The clamping hook has two connecting columns arranged on both sides. The outer side wall of the shell 33 is provided with a mounting recess. The opposite two inner side walls of the mounting recess are symmetrically provided with mounting grooves. The two connecting columns and the two mounting grooves are arranged one by one. The clamping hook is rotatably arranged in the mounting recess. By using the above structure, the clamping block is arranged on the side wall of the shell. The clamping block is provided with a clamping hole. The mounting recess is arranged on the outer side wall of the shell 33. The mounting recess is provided with two inner side walls symmetrically arranged with mounting grooves. The connecting column of the clamping hook is rotatably arranged in the mounting groove. In this way, the clamping hook can be rotatably arranged. Thus, under the action of the shell 33 and the shell, the detection piece 10 can be limited and fixed when it is inserted into the shell 33. Thus, the detection piece 10 is prevented from shaking.

[0044] In the embodiment, the clamping structure further comprises a torsion spring sleeved on the connecting column, a first end of the torsion spring being connected with the shell 33, and a second end of the torsion spring being connected with the connecting column. By adopting the above structure, the clamping hook can be conveniently ensured to extend into the clamping hole of the clamping block by arranging the torsion spring on the connecting column, the first end of the torsion spring being connected with the shell 33, and the second end of the torsion spring being connected with the connecting column.

[0045] It is to be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprise" and / or "include" when used in this specification, specify the presence of stated features, steps, operations, devices, components and / or combinations thereof.

[0046] The relative arrangement of components and steps, numerical expressions, and numerical values set forth in these embodiments do not limit the scope of the present application unless otherwise specifically stated. At the same time, it should be understood that the sizes of the various parts shown in the drawings are not drawn in accordance with the actual proportional relationship. The technology, methods and equipment known to those skilled in the related art can not be discussed in detail, but under appropriate circumstances, the technology, methods and equipment should be considered as part of the specification. In all examples shown and discussed herein, any specific value should be interpreted as merely exemplary, and not as a limitation. Therefore, other examples of exemplary embodiments can have different values. It should be noted that similar reference numbers and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further discussed in subsequent drawings.

[0047] In the description of the present application, it should be understood that the orientation words such as "front, rear, upper, lower, left, right", "transverse, vertical, perpendicular, horizontal" and "top, bottom" and the like indicate the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and in the absence of contrary statements, these orientation words do not indicate and imply that the devices or elements referred to must have a particular orientation or be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the scope of protection of the present application; the orientation words "inner, outer" refer to the inner and outer of the contour of each component itself.

[0048] For purposes of the description hereinafter, spatial relative terms, such as "above", "below", "upper", "lower", and the like, can be used to describe the relative position of one element or feature to another as illustrated in the figures. It will be understood that the spatial relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientations depicted in the figures. For example, if the device in the figures is turned over, elements described as "above" or "up" other elements or features would then be oriented "below" or "down" the other elements or features. Thus, the exemplary term "above" can encompass both an orientation of above and below. The device can be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly. Well, the spatial relative terms used herein are for ease of description only and do not limit the scope of the present application.

[0049] In addition, it should be noted that the use of "first", "second", and the like words of distinction do not limit the corresponding parts, and are only used to distinguish the corresponding parts for convenience, and the above words have no special meaning unless otherwise stated, and therefore cannot be understood as limiting the scope of protection of the present application.

[0050] The above only describes the preferred embodiments of the present application and is not intended to limit the present application. For those skilled in the art, the present application can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A current detection device for a welding type power module, wherein the power module (30) comprises a substrate, a conductive portion (31) and a plurality of chips (32), wherein the conductive portion (31) is arranged on the substrate, and the plurality of chips (32) are arranged on the conductive portion (31), characterized in that: The current detection device for a welding-type power module comprises a detection member (10) and a transmission member (20); the detection member (10) is arranged on a side of the conductive portion (31) away from the substrate and is insulated from the conductive portion (31); the detection member (10) is provided with a plurality of through holes (12); the plurality of through holes (12) are arranged one-to-one on the periphery of a plurality of chips (32); a detection coil (13) for detecting the corresponding chip (32) is provided on the periphery of each through hole (12); a bonding wire (321) of the chip (32) passes through the through hole (12); and the detection member (10) is signal-connected to the transmission member (20).

2. The current detection device for a welding type power module according to claim 1, characterized in that: The detection component (10) includes a PCB board (11), the PCB board (11) includes a plug-in board section (111) and a connecting board section (112) connected to each other, the plug-in board section (111) is inserted into the power module (30), the plug-in board section (111) is located on a side of the conductive portion (31) away from the substrate, a plurality of through holes (12) are provided on the plug-in board section (111), the connecting board section (112) is located outside the power module (30), and the connecting board section (112) is signal-connected to the transmission component (20).

3. The current detection device for a welding type power module according to claim 2, characterized in that: The connecting plate section (112) is provided with a plurality of pin pads (1121), the plurality of pin pads (1121) and the plurality of detection coils (13) are provided in a one-to-one correspondence, each of the pin pads (1121) is provided with a corresponding connector, and the connector is electrically connected to the transmission member (20).

4. The current detection device for a welding type power module according to claim 2, characterized in that: The transmission element (20) includes a signal transmission line (21), an integrator (22), and a controller (23). The first end of the signal transmission line (21) is connected to the connecting plate section (112), the second end of the signal transmission line (21) is connected to the integrator (22) so that the integrator (22) receives the detection signal of the detection coil (13), and the controller (23) is electrically connected to the integrator (22) so that the controller (23) controls the driving signal of the power module (30) according to the signal of the integrator (22).

5. The current detection device for a welding type power module according to claim 2, characterized in that: The power module (30) further includes a housing (33), the substrate is arranged in the housing (33), or a portion of the housing (33) forms the substrate, a connecting groove is provided on a side wall of the housing (33), and the plug-in board section (111) is inserted into the connecting groove.

6. The current detection device for a welding type power module according to claim 5, characterized in that: An adhesive layer is provided between the groove wall of the communicating groove and the plug-in board section (111) to fix the plug-in board section (111).

7. The current detection device for a welding type power module according to claim 1, characterized in that: The through hole (12) is a rectangular structure.

8. The current detection device for a welding type power module according to claim 2, characterized in that: An insulating plate is provided between the plug-in board section (111) and the chip (32), and an avoidance hole matching the through hole (12) is provided on the insulating plate to avoid the bonding wire (321).

9. The current detection device for a welding type power module according to claim 8, characterized in that: The insulating plate is made of ceramic.

10. The current detection device for a welding-type power module according to any one of claims 1 to 9, characterized in that: The detection coil (13) is a Rogowski coil.

11. The current detection device for a welding power module according to claim 5, characterized in that: A shell is provided on the connecting plate section (112) of the PCB board (11), and a clamping structure is provided between the shell and the housing (33) to limit and fix the shell on the housing (33).

12. The current detection device for a welding type power module according to claim 11, characterized in that: The clamping structure includes: A clamping block is arranged on a side wall of the housing facing the power module (30), and the clamping block has a clamping hole; A hook is provided with connecting columns on both sides of the hook, a mounting recess is provided on the outer side wall of the shell (33), mounting grooves are symmetrically provided on the two opposite inner side walls of the mounting recess, the two connecting columns are provided in a one-to-one correspondence with the two mounting grooves, and the hook is rotatably provided in the mounting recess.

13. The current detection device for a welding type power module according to claim 12, characterized in that: The clamping structure further comprises a torsion spring sleeved on the connecting column, wherein a first end of the torsion spring is connected to the housing (33), and a second end of the torsion spring is connected to the connecting column.

Images