Power distribution assembly for semiconductor detection equipment and semiconductor detection equipment

Abstract

The utility model discloses a power distribution assembly for semiconductor detection equipment and the semiconductor detection equipment, the power distribution assembly comprises a power supply unit, a heat dissipation assembly and a server unit, the power supply unit comprises an alternating current module, a direct current module and a function module which are detachably arranged, and the direct current module is arranged between the alternating current module and the function module; the heat dissipation assembly is detachably arranged, and the heat dissipation assembly is at least used for conducting heat dissipation on the power supply unit; the server unit is detachably arranged. The power distribution assembly provides a heat dissipation assembly for the power supply unit, and ripple interference caused by the power supply unit and noise interference caused by the heat dissipation assembly can be reduced while the power utilization requirement can be met. In the power supply unit, the direct-current module is arranged between the alternating-current module and the functional module, so that the wiring distance of the direct-current module for taking electricity from the alternating-current module and the wiring distance between the direct-current module and the control module can be shortened, meanwhile, the disorder degree of wiring in the power supply unit is reduced, and internal maintenance of the power distribution assembly is facilitated.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of semiconductor, and particularly relates to a power distribution assembly for a semiconductor detection device and the semiconductor detection device. BACKGROUND

[0002] Semiconductor processing equipment usually needs to run in a high-precision and high-sensitivity environment to ensure the performance and consistency of products. Among them, the semiconductor detection device is used to obtain the parameters of the device and provide a reference for subsequent manufacturing or inspection processes.

[0003] In the current production, the semiconductor detection device integrates the electrical components on the backplane of the main machine, and the wiring is stacked in disorder, which is easy to cause heat accumulation at the backplane, affecting the electrical safety, and the operation of the heat dissipation assembly will bring noise interference and other disturbances to the main machine, which is not conducive to the high-precision operation of the semiconductor detection device. CONTENT OF THE UTILITY MODEL

[0004] The embodiment of the present application provides a power distribution assembly for a semiconductor detection device and a semiconductor detection device, which integrates a power supply unit, a server unit and a heat dissipation assembly, and can independently power the semiconductor detection device, reducing disturbances and heat accumulation during operation.

[0005] In the first aspect, the embodiment of the present application provides a power distribution assembly for a semiconductor detection device, which comprises a power supply unit, a heat dissipation assembly and a server unit. The power supply unit comprises an AC module, a DC module and a function module which are detachably arranged. The DC module is arranged between the AC module and the function module. The heat dissipation assembly is detachably arranged and used for dissipating heat of the power supply unit. The server unit is detachably arranged.

[0006] In some embodiments, the power distribution assembly further comprises a metal shielding structure, and the metal shielding structure comprises a first shielding member arranged between the power supply unit and the server unit.

[0007] In some embodiments, the metal shielding structure further comprises two second shielding members, and the two second shielding members are arranged on a first side of the first shielding member to separate the AC module, the DC module and the function module. The second shielding member comprises a molybdenum layer or is arranged as a molybdenum plate.

[0008] In some embodiments, the power distribution assembly further comprises a gas control unit, and the metal shielding structure further comprises a third shielding member arranged on a second side of the first shielding member and used for separating the server unit and the gas control unit.

[0009] In some embodiments, the power distribution assembly further comprises a cabinet body, the heat dissipation assembly is mounted on the cabinet body, and the cabinet body is provided with a plurality of mounting cavities to accommodate the AC module, the DC module, the function module and the server unit.

[0010] In some embodiments, the function module, the DC module and the AC module are distributed from top to bottom along the height direction of the cabinet body, and the function module and the server unit are distributed on both sides of the first shielding member along the width direction of the cabinet body.

[0011] In some embodiments, the cabinet body comprises a top wall, a bottom wall and an enclosing portion, the top wall and the bottom wall are connected through the enclosing portion, the heat dissipation assembly comprises a heat dissipation fan mounted on the top wall, and at least one of the bottom wall and the enclosing portion is provided with an air outlet.

[0012] In some embodiments, at least one end of the first shielding member is spaced apart from the enclosing portion along the longitudinal direction of the cabinet body, at least one end of the second shielding member is spaced apart from the enclosing portion, and the power supply unit and the server unit are in heat dissipation communication.

[0013] In some embodiments, the heat dissipation assembly further comprises a dustproof structure, the dustproof structure is movably connected with the heat dissipation fan or the top wall to switch between opening and covering, and in the covering state of the dustproof structure, the dustproof structure covers at least the air inlet of the heat dissipation fan.

[0014] In a second aspect, the embodiments of the present application provide a semiconductor detection device, which comprises a host and the power distribution assembly provided by any one of the preceding embodiments, and the host is provided with a detection assembly; the power distribution assembly is separately arranged from the host, wherein the detection assembly is electrically connected with the DC module, the DC module is electrically connected with the AC module, the DC module is electrically connected with the function module, and the function module is electrically connected with the server unit.

[0015] The power distribution assembly of the embodiments of the present application is provided with a power supply unit and a server unit, and further provided with a heat dissipation assembly for the power supply unit, which can meet the power demand of the semiconductor detection device while reducing the ripple interference caused by the power supply unit and the noise interference caused by the heat dissipation assembly. In the power supply unit, arranging the DC module between the AC module and the function module can shorten the wiring distance from the AC module to the DC module and the wiring distance between the DC module and the control module, and at the same time, reduce the confusion degree of the wiring in the power supply unit, which is helpful for internal maintenance of the power distribution assembly. BRIEF DESCRIPTION OF DRAWINGS

[0016] Various other advantages and benefits will become apparent to those of ordinary skill in the art, upon reading the following detailed description of the preferred embodiment. The accompanying drawings are included to provide a description of preferred embodiments, and are not meant to limit the present application. Furthermore, the same reference numerals in different drawings denote the same elements. In the drawings:

[0017] Figure 1 Structure diagram of power distribution assembly of some embodiments of the present application;

[0018] Figure 2 Structure diagram of cabinet of power distribution assembly of some embodiments of the present application;

[0019] Figure 3 Connection diagram of cabinet and metal shielding structure shown in Figure 2

[0020] Connection diagram of dustproof structure and heat dissipation fan in power distribution assembly shown in Figure 4 Figure 2 Structure diagram of power distribution assembly including cabinet shown in

[0021] Figure 5 Figure 4 Connection diagram of dustproof structure and heat dissipation fan in power distribution assembly shown in

[0022] Reference numerals in the detailed description are as follows:

[0023] 110, power supply unit; 111, functional module; 112, DC module; 113, AC module; 120, server unit; 130, pneumatic control unit;

[0024] 200, cabinet; 201, installation cavity; 210, top wall; 220, bottom wall; 230, enclosing part; 231, air outlet;

[0025] 300, heat dissipation assembly; 310, heat dissipation fan; 320, dustproof structure;

[0026] 410, first shielding member; 420, second shielding member; 430, third shielding member;

[0027] Width direction X; depth direction Y; height direction Z. DETAILED DESCRIPTION

[0028] The embodiments of the technical solutions of the present application will be described in detail below in conjunction with the drawings. The following embodiments are only used to more clearly illustrate the technical solutions of the present application, and therefore only serve as examples, and cannot limit the protection scope of the present application.

[0029] ​​Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs; the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of this application; the use of the terms "including," "comprising," or "having" and variations thereof herein is intended to be broad and encompass the terms "consisting of" and "consisting essentially of" and variations thereof. Unless otherwise noted, the terms "including" and "comprising" are open-ended and do not exclude the presence of unrecited elements or limitations.

[0030] In the description of the embodiments of the present application, the technical terms "first", "second", etc. are only used to distinguish different objects, and cannot be understood as indicating or implying relative importance or implicitly indicating the number, specific order or primary and secondary relationship of the indicated technical features. In the description of the embodiments of the present application, the meaning of "a plurality of" is two or more, unless otherwise explicitly and specifically limited.

[0031] Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearance of the phrase in various places in the specification is not necessarily all referring to the same embodiment, nor is it necessarily a separate or alternative embodiment to other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with each other.

[0032] In the description of the embodiments of the present application, the term "and / or" is only a description of the association relationship of the associated objects, which means that there can be three relationships, for example, A and / or B, which can represent the three cases of A existing alone, A and B existing together, and B existing alone. In addition, the character " / " in this paper generally represents that the front and rear associated objects are a "or" relationship.

[0033] In the description of the embodiments of the present application, the term "a plurality of" refers to two or more (including two), and similarly, "a plurality of groups" refers to two or more groups (including two groups), and "a plurality of pieces" refers to two or more pieces (including two pieces).

[0034] In the description of the embodiments of the present application, the technical terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the embodiments of the present application and simplifying the description, and are not intended to indicate or imply that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the embodiments of the present application.

[0035] In the description of the embodiments of the present application, unless otherwise explicitly specified and limited, the technical terms "mounting", "connecting", "connecting", "fixing" and the like should be understood in a broad sense, for example, can be fixedly connected, or can be detachably connected, or can be integrated; can be mechanically connected, or can be electrically connected; can be directly connected, or can be indirectly connected through an intermediate medium, or can be the internal communication of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to the specific circumstances.

[0036] Generally, semiconductor processing equipment needs to operate in a high-precision and high-sensitivity environment to ensure the performance and consistency of the product. Among them, the semiconductor detection equipment is applied to measure the parameters of the semi-finished product or the finished product, so as to serve as a reference standard for subsequent processing procedures or inspection procedures.

[0037] Most of the currently used semiconductor detection equipment installs electric control components in the main machine, integrates alternating current, direct current, control and other electrical components through the backboard, resulting in a large volume of the main machine, increasing the difficulty of equipment transportation, and limiting the operation scene of the semiconductor detection equipment.

[0038] Specifically, direct current power supply is needed in the semiconductor detection equipment, and the direct current device can only select a switching power supply with large ripple fluctuation, which causes ripple interference to the imaging of the main machine, resulting in problems such as poor image signal-to-noise ratio and image jitter of the main machine.

[0039] In addition, a large number of electrical components need to be cooled in time during operation to ensure the normal operation of the power distribution system. In related products, cooling fans are used, and the cooling fans integrated with the main machine will bring jitter interference and noise interference during operation, affecting the stability of the imaging of the main machine.

[0040] In order to solve the problems in the prior art, the embodiments of the present application provide a power distribution assembly for a semiconductor detection equipment and a semiconductor detection equipment. It should be understood that the semiconductor detection equipment provided by the present application includes not only detection equipment for detecting the quality of semiconductor, such as defect detection equipment such as electron beam imaging equipment, but also measurement equipment for obtaining parameters of semiconductor, and other equipment with useful electricity demand, directly or indirectly detecting and measuring semiconductor products. First, the power distribution assembly for the semiconductor detection equipment provided by the embodiments of the present application is introduced.

[0041] Please refer to Figures 1 to 5The embodiment of the present application provides a power distribution assembly for a semiconductor detection device, the power distribution assembly comprising a power supply unit 110 and a server unit 120, the power supply unit 110 comprising an AC module 113, a DC module 112 and a function module 111 which are detachably assembled, the DC module 112 being arranged between the AC module 113 and the function module 111; and the server unit 120 being detachably arranged.

[0042] Optionally, the function module 111 comprises at least a control module, the control module being arranged on a side of the DC module 112 away from the AC module 113, and the control module being interconnected with the DC module 112 to realize control of the output power supply of the power distribution assembly.

[0043] Exemplarily, the function module 111 further comprises a safety module, the safety module being interconnected with the DC module 112, and the safety module being arranged between the control module and the DC module 112. The safety module is used for emergency power-off to improve the safety of power consumption.

[0044] In some embodiments, the function module 111 further comprises different sub-modules to expand the use scenarios of the power distribution assembly, wherein the sub-modules can be flexibly arranged according to the power consumption demand, and exemplarily, the sub-module interconnected with the control module is arranged on a side of the DC module 112 away from the AC module 113, and the sub-module interconnected with the AC module 113 is arranged on a side of the DC module 112 away from the control module.

[0045] It should be understood that the detachable arrangement of the power supply unit 110 and the server unit 120 comprises that the power supply unit 110 and the server unit 120 are directly connected in a detachable form, and further comprises that the power supply unit 110 and the server unit 120 are both detachably mounted on another structure to realize relative separation or relative fixation of the power supply unit 110 and the server unit 120.

[0046] Therefore, the power distribution assembly can independently meet the power supply demand of the semiconductor detection device, and the power supply unit 110 is separated from the semiconductor detection device to reduce the ripple interference of the power supply unit 110 and the server unit 120 on the semiconductor detection device in the working process, which is helpful to improve the high-precision operation of the semiconductor detection device. In addition, the power distribution assembly arranges the DC module 112 between the AC module 113 and the function module 111, which can shorten the wiring distance between the DC module 112 and the AC module 113 and between the DC module 112 and the function module 111, and facilitate the semiconductor detection device to directly take power from the DC module 112 at the intermediate position; on the other hand, the AC module 113 and the function module 111 are spaced apart by the DC module 112 to increase the distance, so as to as far as possible reduce the electromagnetic interference of the AC module 113 operation on the function module 111.

[0047] The power distribution assembly further comprises a heat dissipation assembly 300 for dissipating heat of at least the power supply unit 110, so as to timely release the accumulated heat during operation of the power supply unit 110, avoid thermal damage of the electrical components inside the power supply unit 110 due to long-term operation in a high-temperature state, and further reduce the noise disturbance inside the semiconductor detection equipment when the heat dissipation assembly 300 is integrated in the power distribution assembly. The heat dissipation assembly 300 is detachably arranged, on one hand, it is helpful to flexibly select according to the heat dissipation requirement of the power supply unit 110, for example, adjusting the form or model of the heat dissipation assembly 300, and facilitating the disassembly of maintenance and replacement that may occur during later maintenance, so that the power distribution assembly can maintain excellent heat dissipation performance and prolong the service life of the power distribution assembly; on the other hand, the heat dissipation assembly 300 can be separated individually, which reduces the transportation difficulty and installation difficulty of the whole power distribution assembly.

[0048] Please refer to Figure 1 or Figure 3 According to some embodiments of the present application, the power distribution assembly further comprises a metal shielding structure, which comprises a first shielding member 410 arranged between the power supply unit 110 and the server unit 120.

[0049] Optionally, the first shielding member 410 extends in the height direction (for example, the Z direction in the figure), and the power supply unit 110 and the server unit 120 are spaced apart in the width direction.

[0050] Optionally, the first shielding member 410 is coated with a shielding metal coating or is arranged as a shielding metal plate to achieve electromagnetic shielding, and the shielding metal comprises at least one of aluminum, silver, molybdenum and nickel to achieve electromagnetic shielding. For example, the first shielding member 410 is a molybdenum plate, and the first shielding member 410 is subjected to nickel plating treatment.

[0051] In this way, the ripple interference between the power supply unit 110 and the server unit 120 is reduced.

[0052] Please continue to refer to Figure 1 or Figure 3 According to some embodiments of the present application, the metal shielding structure further comprises two second shielding members 420 arranged at the first side of the first shielding member 410.

[0053] Optionally, the functional module 111 comprises two or more sub-modules, and the second shielding member 420 is arranged between adjacent two sub-modules.

[0054] Optionally, the second shielding member 420 is coated with a shielding metal coating or is arranged as a shielding metal plate to achieve electromagnetic shielding, and the shielding metal comprises at least one of aluminum, silver, molybdenum and nickel.

[0055] Exemplarily, the second shielding member 420 comprises a molybdenum layer, or the second shielding member 420 is provided as a molybdenum plate.

[0056] In this way, the AC module 113, the DC module 112 and the function module 111 are spaced apart by the second shielding member 420, realizing internal electromagnetic shielding of the power supply unit 110 and further reducing internal interference of the power distribution assembly.

[0057] Further optionally, the AC module 113 comprises at least one of a single-phase filter and a three-phase filter to reduce ripple interference from other machines when factory power enters the AC module 113, and output clean power to subsequent circuits.

[0058] Please refer to Figure 1 According to certain embodiments of the present application, the power distribution assembly further comprises an air control unit 130.

[0059] Optionally, the air control unit 130 and the power distribution unit are arranged on two sides of the first shielding member 410 to separate circuit wiring and air path wiring.

[0060] Optionally, the metal shielding structure further comprises a third shielding member 430, the third shielding member 430 is arranged on the second side of the first shielding member 410, and the server unit 120 and the air control unit 130 are arranged spaced apart by the third shielding member 430.

[0061] Further optionally, the air control unit 130 is arranged at the bottom of the power distribution assembly to facilitate the air control unit 130 to be connected to the factory.

[0062] In this way, the air control unit 130 is integrated inside the power distribution assembly to further reduce internal interference of the semiconductor detection equipment.

[0063] Please refer to Figure 3 According to certain embodiments of the present application, the power distribution assembly further comprises a cabinet 200, the heat dissipation assembly 300 is mounted on the cabinet 200, the power supply unit 110 is detachably mounted on the cabinet 200, and the server unit 120 is detachably mounted on the cabinet 200.

[0064] Optionally, the cabinet 200 is provided with a moving assembly to facilitate the movement and transportation of the entire power distribution assembly. Exemplarily, the moving assembly comprises at least one of a directional wheel and a universal wheel.

[0065] Please refer to Figure 2 Optionally, the cabinet 200 is provided with a plurality of mounting cavities 201 to accommodate the AC module 113, the DC module 112, the function module 111 and the server unit 120.

[0066] Optionally, the mounting cavities 201 are provided with the same specifications, which can reduce the assembly difficulty of the power distribution assembly.

[0067] Optionally, the structure forming the mounting cavity 201 comprises at least one of a guide rail, a clamping groove, a plug-in block, a threaded connection, to realize detachable connection of the power supply unit 110 and the cabinet 200 or the server unit 120 and the cabinet 200.

[0068] Thus, the power supply unit 110 and the server unit 120 are integrated in the cabinet 200 to facilitate overall transfer of the power distribution assembly, and the power supply unit 110 and the server unit 120 are both detachably connected with the cabinet 200 to realize connection or separation of the power supply unit 110 and the server unit 120.

[0069] According to some embodiments of the present application, the power supply unit 110 has a first box body, and the server unit 120 has a second box body, and the first box body and the second box body are assembled as a whole through clamping or threaded connection or other detachable form to realize detachable connection of the power supply unit 110 and the server unit 120.

[0070] Please refer to Figure 1 According to some embodiments of the present application, along the height direction of the cabinet 200, the functional module 111, the direct current module 112 and the alternating current module 113 are distributed from top to bottom, and the alternating current module 113 with larger self weight is arranged at the bottom of the power distribution assembly, so as to lower the center of gravity of the power distribution assembly, which helps to improve the stability during transfer of the power distribution assembly.

[0071] Please refer to Figure 1 Along the width direction of the cabinet 200, the air control unit 130 and the alternating current module 113 are arranged on the two sides of the first shielding member 410. On the one hand, the air control unit 130 is arranged at the bottom of the power distribution assembly, which can make it more convenient to be connected with the plant air circuit, and on the other hand, the air control unit 130 and the alternating current module 113 are spaced apart by the first shielding member 410, which helps to realize the separation of the circuit and the air circuit inside the power distribution assembly, clarify the wire harness and facilitate the later maintenance and repair work.

[0072] Please refer to Figure 1 Along the height direction of the cabinet 200, the server unit 120 is arranged above the air control unit 130, and along the width direction of the cabinet 200, the server unit 120 and the functional module 111 are arranged on the two sides of the first shielding member 410. Thus, the server unit 120 is separated from the power supply unit 110, which reduces the ripple interference of the switching power supply in the server unit 120 on the power supply unit 110, and reduces the probability of problems such as image signal-to-noise ratio difference and image jitter; at the same time, there is no crosstalk between the server unit 120 and the air control unit 130, so the two are stacked in the height direction to reduce the floor area of the power distribution assembly.

[0073] Please refer to Figure 3According to some embodiments of the present application, the cabinet 200 comprises a top wall 210, a bottom wall 220 and a surrounding part 230, the top wall 210 and the bottom wall 220 are connected through the surrounding part 230, and the surrounding part 230 is provided with first line grooves and second line grooves which are spaced apart along the width direction of the cabinet 200.

[0074] Optionally, the first line grooves close to the server unit 120 are used to accommodate power lines, and the second line grooves away from the server unit 120 are used to accommodate signal lines, so as to reduce the crosstalk between the signal lines and the server unit 120.

[0075] Optionally, the first line grooves and the second line grooves are spaced apart along the height direction of the cabinet 200, the first line grooves are used to accommodate power lines between the AC module 113 and the DC module 112, and the second line grooves are used to accommodate signal lines between the DC module 112 and the function module 111.

[0076] Thus, by arranging the first line grooves and the second line grooves to accommodate the signal lines and the power lines in the power supply unit 110 respectively, the degree of wiring disorder in the cabinet 200 is reduced.

[0077] Please refer to Figure 4 According to some embodiments of the present application, the heat dissipation assembly 300 comprises a heat dissipation fan 310 which is detachably mounted on the top wall 210, and the bottom wall 220 and the surrounding part 230 are provided with an air outlet 231.

[0078] It can be understood that the air outlet 231 is provided with one, and the air outlet 231 is located on the bottom wall 220 or the surrounding part 230 to form a unique air duct to guide the circulation of cold air inside the cabinet 200; or the air outlet 231 is provided with multiple, and the multiple air outlets 231 are respectively arranged on the bottom wall 220 and the surrounding part 230 to accelerate the air flow to discharge the heat exchange inside the cabinet 200 and reduce the heat accumulation inside the cabinet 200.

[0079] Exemplarily, the air outlet 231 is provided on the bottom wall 220 to prolong the circulation path of the cold air inside the cabinet 200.

[0080] Exemplarily, the air outlet 231 is provided on the side of the surrounding part 230 away from the top wall 210.

[0081] Optionally, the heat dissipation fan 310 is detachably connected with the top wall 210 through a buckle or a threaded connection.

[0082] Thus, the cabinet 200 defines a heat dissipation air duct, and cold air flows to the air outlet 231 from the heat dissipation fan 310 to exchange heat with the power supply unit 110 to achieve heat dissipation of the functional module 111, the direct current module 112 and the alternating current module 113. The cold air enters from the top of the cabinet 200, and the density of the cold air is greater than that of the hot air inside the cabinet 200, so that the cold air has a sinking tendency and exchanges heat with the rising hot air in the sinking process.

[0083] According to some embodiments of the present application, at least one end of the first shielding member 410 is spaced apart from the enclosing portion 230 along the longitudinal direction of the cabinet 200 (for example, the Y direction in the figure), and the power supply unit 110 is in communication with the server unit 120 to enable the heat dissipation assembly 300 to simultaneously dissipate heat from the power supply unit 110 and the server unit 120.

[0084] According to some embodiments of the present application, at least one end of the second shielding member 420 is spaced apart from the enclosing portion 230 along the longitudinal direction of the cabinet 200, and the functional module 111, the direct current module 112 and the alternating current module 113 are in communication to enable the heat dissipation assembly 300 to exchange heat with the power supply unit 110.

[0085] According to some embodiments of the present application, at least one end of the third shielding member 430 is spaced apart from the enclosing portion 230 along the longitudinal direction of the cabinet 200 to enable the installation chamber 201 in which the server unit 120 is located to be in communication with the installation chamber 201 in which the air control unit 130 is located, thereby enabling the heat dissipation assembly 300 to dissipate heat from the entire power distribution assembly.

[0086] Optionally, the first shielding member 410, the second shielding member 420 and the third shielding member 430 are arranged on the same side along the longitudinal direction of the cabinet 200 to accelerate the circulation and heat exchange of the cold air inside the cabinet 200.

[0087] According to some embodiments of the present application, the heat dissipation assembly 300 further comprises a dustproof structure 320, which is movably connected with the heat dissipation fan 310 or the top wall 210 to switch between an open state and a closed state. In the closed state, the dustproof structure 320 covers at least the air inlet of the heat dissipation fan 310.

[0088] Optionally, the dustproof structure 320 comprises two door plates, which are slidably connected with the top wall 210 and are moved away from or close to each other to switch the dustproof structure 320 between the open state and the closed state.

[0089] Please refer to Figure 5 Optionally, the dustproof structure 320 comprises a plurality of blades which are parallel to each other and are rotatably connected with the top wall 210 to open or close the dustproof structure 320.

[0090] Further optionally, the angle between the blade and the top wall 210 is less than or equal to 45° in the opened state of the dustproof structure 320, so as to reduce the dust brought into the cabinet 200 by the cold air when the heat dissipation assembly 300 is working. For example, the maximum angle between the blade and the top wall 210 is 30°.

[0091] Further optionally, the plurality of parallel blades are connected by a synchronous mechanism to realize the rapid opening or covering of the dustproof structure 320.

[0092] Thus, the dustproof structure 320 has two states of opening and covering, and when the heat dissipation assembly 300 is not working, the dustproof structure 320 is covered to reduce the external dust impurities entering the inside of the cabinet 200 through the heat dissipation fan 310.

[0093] According to some embodiments of the present application, the heat dissipation assembly 300 further comprises a plurality of parallel metal fins connected with the heat dissipation fan 310 and extending away from the top wall 210.

[0094] Thus, the heat exchange area of the cold air brought in by the heat dissipation fan 310 and the inside of the cabinet 200 is increased, and the cold air flow path is further limited, and the heat dissipation efficiency is improved.

[0095] In the second aspect, the embodiments of the present application provide a semiconductor detection device for detecting surface defects of a wafer or for detecting a critical dimension of a wafer, and the semiconductor detection device comprises a host and the power distribution assembly provided by any one of the preceding embodiments, and thus has all the beneficial effects of the power distribution assembly. The host is provided with a detection assembly, and the power distribution assembly is separately arranged from the host.

[0096] Compared with the conventional semiconductor detection device, the semiconductor detection device provided by the present application separately arranges the power supply unit 110 and the server unit 120 from the host, reduces the ripple interference of the electrical components in the power supply unit 110 and the server unit 120 to the host, and helps to improve the imaging accuracy of the semiconductor detection device. At the same time, the separation of the power supply unit 110 and the host reduces the heat dissipation requirement of the host to further reduce the disturbance, and the integration of the heat dissipation assembly 300 in the power distribution assembly is also conducive to the rapid heat dissipation of the power supply unit 110.

[0097] Specifically, in the semiconductor detection device, the detection assembly is electrically connected with the direct current module 112, the direct current module 112 is electrically connected with the alternating current module 113, the direct current module 112 is electrically connected with the function module 111, and the function module 111 is electrically connected with the server unit 120.

[0098] For example, the detection assembly can be an electron beam imaging mechanism, or the detection assembly can also be a laser imaging mechanism.

[0099] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than limit them. Although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that the technical solutions recorded in the foregoing embodiments can be modified, or some or all of the technical features can be replaced equivalently. Such modifications or replacements do not change the essence of the corresponding technical solutions, which should be covered in the scope of the present application. In particular, the technical features mentioned in each embodiment can be combined in any manner as long as there is no structural conflict. The present application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A power distribution assembly for semiconductor testing equipment, characterized in that: include: A power supply unit, comprising a detachably arranged AC module, a DC module, and a functional module, wherein the DC module is arranged between the AC module and the functional module; a heat dissipation assembly, which is detachably provided and is at least used to dissipate heat from the power supply unit; as well as The server unit is detachably provided.

2. The power distribution assembly according to claim 1, characterized in that The power distribution assembly further includes a metal shielding structure, wherein the metal shielding structure includes a first shielding member, and the first shielding member is disposed between the power supply unit and the server unit.

3. The power distribution assembly according to claim 2, characterized in that The metal shielding structure also includes two second shielding members, which are spaced apart on the first side of the first shielding member to separate the AC module, the DC module and the functional module. The second shielding member includes a molybdenum layer or is configured as a molybdenum plate.

4. The power distribution assembly according to claim 2, characterized in that The power distribution assembly further includes an air control unit, and the metal shielding structure further includes a third shielding member. The third shielding member is disposed on the second side of the first shielding member and is used to separate the server unit and the air control unit.

5. The power distribution assembly according to claim 3, characterized in that The power distribution assembly further includes a cabinet, the heat dissipation assembly is installed in the cabinet, and the cabinet is provided with a plurality of installation chambers for accommodating the AC module, the DC module, the functional module and the server unit.

6. The power distribution assembly according to claim 5, characterized in that Along the height direction of the cabinet, the functional modules, the DC modules and the AC modules are distributed from top to bottom. Along the width direction of the cabinet, the functional modules and the server units are distributed on both sides of the first shielding component.

7. The power distribution assembly according to claim 6, characterized in that The cabinet body includes a top wall, a bottom wall and an enclosure portion, the top wall and the bottom wall are connected by the enclosure portion, the heat dissipation assembly includes a heat dissipation fan installed on the top wall, and at least one of the bottom wall and the enclosure portion is provided with an air outlet.

8. The power distribution assembly according to claim 7, characterized in that Along the depth direction of the cabinet, at least one end of the first shielding member is spaced apart from the enclosure portion, at least one end of the second shielding member is spaced apart from the enclosure portion, and the power supply unit is connected to the server unit for heat dissipation.

9. The power distribution assembly according to claim 7, characterized in that: The heat dissipation assembly also includes a dustproof structure, which is movably connected to the heat dissipation fan or the top wall to switch between opening and closing. When the dustproof structure is in the closed state, the dustproof structure at least covers the air inlet of the heat dissipation fan.

10. A semiconductor testing device, characterized in that: include: A host computer, wherein the host computer is provided with a detection component; The power distribution assembly according to any one of claims 1 to 9, which is provided separately from the host, wherein: The detection component is electrically connected to the DC module, the DC module is electrically connected to the AC module, the DC module is electrically connected to the functional module, and the functional module is electrically connected to the server unit.

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