TWS earphone simultaneously supporting LDAC and LHDC decoding

Abstract

The utility model discloses a TWS earphone simultaneously supporting LDAC and LHDC decoding, the earphone comprises a Bluetooth master control module, a microphone module, a loudspeaker module, a power amplifier module, a switching module, an antenna module and a power supply module, the antenna module is connected to an antenna end of the Bluetooth master control module, the microphone module is connected to an audio signal input end of the Bluetooth master control module, and the loudspeaker module is connected to an audio signal output end of the Bluetooth master control module. The power amplifier module is connected with the data end of the Bluetooth master control module, the input end of the switching module is connected with the audio signal output end of the Bluetooth master control module and the audio signal output end of the power amplifier module, the loudspeaker module is connected to the output end of the switching module, and the power supply module is used for supplying power. According to the utility model, through the memory adding and switching module, two decoding formats of LDAC and LHDC can be supported at the same time, and better tone quality use experience can be provided for users.

Description

TECHNICAL FIELD

[0001] The utility model discloses a earphone, especially a TWS earphone of supporting LDAC and LHDC decoding simultaneously belongs to consumer electronics product technical field. BACKGROUND

[0002] TWS (True Wireless Stereo) earphone is a kind of completely wireless earphone type, usually by two earbuds are formed, left and right earbuds are connected through bluetooth technology, without any physical cable, TWS earphone provides high degree of freedom wearing experience, and supports stereo playback.

[0003] The current TWS earphone usually adopts LDAC or LHDC technology to carry out audio decoding, wherein,

[0004] LDAC (Low Latency Audio Codec) is a kind of high-resolution audio transmission encoding technology developed by Sony, mainly used in bluetooth audio equipment, such as earphone, sound and smart phone, provides higher quality wireless audio transmission, Sony opens authorization to Android 8.0 later system, installs the agreement to can support, and the highest code rate reaches 990 kbp / s.The main features of LDAC include: (1) LDAC supports up to 32bit / 96kHz audio resolution, can transmit high-quality audio; (2) LDAC provides three different bit rate modes, can automatically adjust transmission quality according to use scene and bluetooth connection condition between devices; (3) one of the design goals of LDAC is low delay, can provide better experience in the scene (such as playing games, watching movies) that audio and video synchronization demand is higher.

[0005] LHDC (Low Latency High Definition Audio Codec) is an audio codec technology designed to provide high-quality, low-latency wireless audio transmission. It is commonly used in wireless audio devices such as TWS headphones and Bluetooth speakers. LHDC is a high-quality Bluetooth codec developed based on the A2DP Bluetooth protocol. Compared to the Bluetooth SBC audio format, this technology allows for over three times the data transmission, significantly reducing the difference in audio quality between wireless and wired audio devices. Following Sony's LDAC protocol, LHDC has become the second Bluetooth high-quality audio standard certified by the Japan Audio Society to meet the Hi-Res Audio Wireless standard. The main features of LHDC include: (1) LHDC supports audio resolutions up to 24 bits / 96kHz, enabling the transmission of higher-quality audio; (2) One of the design focuses of LHDC is low latency, which makes the synchronization between audio and video more accurate; (3) While providing high sound quality, LHDC uses a more efficient compression algorithm, which can transmit more audio details at a lower bandwidth, reduce data loss, and thus ensure high sound quality restoration; (4) In order to fully utilize the advantages of LHDC, both the Bluetooth device and the receiving end (such as headphones or speakers) must support the LHDC protocol. If the device does not support LHDC, it will fall back to conventional audio encoding formats such as SBC or AAC.

[0006] Due to memory and algorithm reasons, some current TWS headphones do not support both types of decoding, or only support one of them, which makes them inconvenient to use. Summary of the Invention

[0007] In response to the above-mentioned shortcomings of TWS headphones in the prior art that cannot simultaneously support LDAC and LHDC technologies for audio decoding, the utility model provides a TWS headset that simultaneously supports LDAC and LHDC decoding. A switching module is connected to the Bluetooth main control module, which can directly switch the decoding format, and can provide users with a better sound quality experience.

[0008] The technical solution adopted by the utility model to solve its technical problems is: a TWS headset that supports both LDAC and LHDC decoding, the headset including a Bluetooth main control module, a microphone module, a speaker module, a power amplifier module, a switching module, an antenna module and a power module, the antenna module is connected to the antenna end of the Bluetooth main control module, the microphone module is connected to the audio signal input end of the Bluetooth main control module, the power amplifier module is connected to the data end of the Bluetooth main control module, the input end of the switching module is respectively connected to the audio signal output end of the Bluetooth main control module and the audio signal output end of the power amplifier module, the speaker module is connected to the output end of the switching module, and the power module is used for power supply.

[0009] The utility model solves its technical problem adopts technical scheme further still includes:

[0010] The XTAL_IN interface and XTAL_OUT interface of bluetooth main control module are connected with quartz crystal Y1.

[0011] The RF_LNA interface of bluetooth main control module is connected with antenna module, and the antenna module includes inductance L20, capacitor C30 and capacitor C31, the inductance L20 is connected in series between the RF_LNA interface of bluetooth main control module and antenna, capacitor C30 and capacitor C31 are connected between the front and rear ends of inductance L20 and ground respectively, and the antenna connecting end of antenna module is connected with transient suppression diode D4 between ground. The power amplifier module adopts power amplifier interface J1, the power amplifier interface J1 is connected on the general data end of bluetooth main control module through IIS interface, the inductance L26 and inductance L27 are connected in series on the port for connecting the audio output end of connected audio power amplifier on the power amplifier interface J1, and the port for connecting the audio output end of connected audio power amplifier on the power amplifier interface J1 is connected on the first input end of switching module. The switching module adopts electronic switching switch, the audio output end of power amplifier interface J1 is connected on the first input end of switching module, the SPK_RP interface and SPK_RN interface of bluetooth main control module are connected on the second input end of switching module, the control end of switching module is connected with the data end of bluetooth main control module, and the output end of switching module is connected with speaker module.

[0012] The microphone module includes a talk microphone, a noise reduction microphone and an audio feedback microphone, the talk microphone includes a microphone interface MIC1, an inductor L12, an inductor L13, an inductor L14, an inductor L15, a capacitor C24, a capacitor C25 and a capacitor C26, the inductor L12 is connected in series between a VDD interface of the microphone interface MIC1 and a MIC_BIAS1 interface of the Bluetooth master control module, the inductor L13 and the capacitor C24 are connected in series between an OUT interface of the microphone interface MIC1 and a TALK_MICP interface of the Bluetooth master control module, the inductor L14 and the capacitor C25 are connected in series between a GND interface of the microphone interface MIC1 and a TALK_MICN interface of the Bluetooth master control module, the capacitor C26 is connected between the MIC_BIAS1 interface of the Bluetooth master control module and the ground, the inductor L15 is connected between the GND interface of the microphone interface MIC1 and the ground, a transient suppression diode D1 is connected between the VDD interface of the microphone interface MIC1 and the ground, and a transient suppression diode D8 is connected between the OUT interface of the microphone interface MIC1 and the ground; the noise reduction microphone includes a microphone interface MIC2, an inductor L16, an inductor L17, an inductor L18, an inductor L19, a capacitor C27, a capacitor C28 and a capacitor C29, the inductor L16 is connected in series between a VDD interface of the microphone interface MIC2 and a MIC_BIAS0 interface of the Bluetooth master control module, the inductor L17 and the capacitor C27 are connected in series between an OUT interface of the microphone interface MIC2 and an FF_MICP interface of the Bluetooth master control module, the inductor L18 and the capacitor C28 are connected in series between a GND interface of the microphone interface MIC2 and an FF_MICN interface of the Bluetooth master control module, the capacitor C29 is connected between the MIC_BIAS0 interface of the Bluetooth master control module and the ground, the inductor L19 is connected between the GND interface of the microphone interface MIC2 and the ground, a transient suppression diode D3 is connected between the VDD interface of the microphone interface MIC2 and the ground, and a transient suppression diode D2 is connected between the OUT interface of the microphone interface MIC2 and the ground.The audio feedback microphone is connected to the speaker interface for audio feedback, and the audio feedback microphone comprises the speaker interface, an inductor L22, an inductor L23, an inductor L24, an inductor L25, a capacitor C33, a capacitor C34 and a capacitor C35, the inductor L22 is connected in series between the FB-VDD interface of the speaker interface and the MIC_BIAS0 interface of the Bluetooth master module, the inductor L23 and the capacitor C33 are connected in series between the FB-OUT interface of the speaker interface and the FB_MICP interface of the Bluetooth master module, the inductor L24 and the capacitor C34 are connected in series between the FB-GND interface of the speaker interface and the FB_MICN interface of the Bluetooth master module, the capacitor C35 is connected between the MIC_BIAS0 interface of the Bluetooth master module and the ground, the inductor L25 is connected between the FB-GND interface of the speaker interface and the ground, a transient suppression diode D7 is connected between the FB-VDD interface of the speaker interface and the ground, and a transient suppression diode D6 is connected between the FB-OUT interface of the speaker interface and the ground.

[0013] The data end of the Bluetooth master module is connected with a touch module, the I interface of the touch module is connected with a touch sheet through a series-connected resistor R23, the touch sheet is connected with the ground through a transient suppression diode D9, the touch sheet is connected with the ground through a filter capacitor C36, and the Q interface of the touch module is connected with the TOUCH interface of the Bluetooth master module.

[0014] The data end of the Bluetooth master module is connected with a temperature detection module, the temperature detection module comprises an NTC resistor R16, a resistor R15, a resistor R14 and a capacitor C23, the resistor R14 and the resistor R15 are connected in series between the positive power supply VDD18 and the ground, the common end of the resistor R14 and the resistor R15 is connected with the 7034_NTC interface of the Bluetooth master module, and the NTC resistor R16 and the capacitor C23 are connected in parallel with the resistor R15 respectively.

[0015] The data end of the Bluetooth master module is connected with a download module.

[0016] The power module comprises a power input interface, a lithium battery and a battery protection module, the lithium battery is connected to the power input interface, the battery protection module is connected with the lithium battery, the power input interface comprises an inductor L21 and a capacitor C32, the inductor L21 is connected in series between the +5V power input interface and the positive electrode of the lithium battery, the capacitor C32 is connected between the positive electrode of the lithium battery and the ground, and a transient suppression diode D5 is connected between the +5V power input interface and the ground; the battery protection module adopts a lithium battery protection chip IC2, and the lithium battery protection chip IC2 is connected with the lithium battery.

[0017] The utility model discloses an advantageous effect is: the utility model discloses through the memory increase and switching module, can support LDAC and LHDC two decoding formats simultaneously, can provide better sound quality use experience for the user.

[0018] The utility model will be further explained in connection with the drawings and specific embodiment. BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1 It is circuit block diagram for the utility model.

[0020] Figure 2 It is circuit principle diagram for bluetooth main control module part in the utility model.

[0021] Figure 3 It is circuit principle diagram for the utility model in the talk microphone part.

[0022] Figure 4 It is circuit principle diagram for the utility model in the noise reduction microphone part.

[0023] Figure 5 It is circuit principle diagram for the utility model in the audio feedback microphone part.

[0024] Figure 6 It is circuit principle diagram for the utility model in the loudspeaker interface part.

[0025] Figure 7 It is circuit principle diagram for the utility model in the power amplifier interface part.

[0026] Figure 8 It is circuit principle diagram for the utility model in the switching module part.

[0027] Figure 9 It is circuit principle diagram for the utility model in the touch module part.

[0028] Figure 10 It is circuit principle diagram for the utility model in the temperature detection module part.

[0029] Figure 11 It is circuit principle diagram for the utility model in the power input module part.

[0030] Figure 12 It is circuit principle diagram for the utility model in the lithium battery protection module part.

[0031] Figure 13 It is circuit principle diagram for the utility model in the download module part.

[0032] Figure 14 It is circuit principle diagram for the utility model in the antenna module part. DETAILED DESCRIPTION

[0033] The embodiment is the preferred embodiment of the utility model, other principles and basic structures which are same or similar to the embodiment are also within the protection scope of the utility model.

[0034] Please combine the attached Figure 1 to the attached Figure 14 The utility model discloses a kind of TWS earphone that supports LDAC and LHDC decoding simultaneously, it mainly includes bluetooth master control module, microphone module, speaker module, power amplifier module, switching module, antenna module and power module, antenna module is connected on the antenna end of bluetooth master control module, microphone module is connected on the audio signal input end of bluetooth master control module, power amplifier module is connected with the data end of bluetooth master control module, the input end of switching module is connected with the audio signal output end of bluetooth master control module and the audio signal output end of power amplifier module respectively, speaker module is connected on the output end of switching module, power module is used for power supply.

[0035] In the embodiment, bluetooth master control module adopts the bluetooth audio chip IC1 of model WQ7034, it is internally with MCU function, when specifically implementing, other model or other series of bluetooth chip can also be used instead.The XTAL_IN interface and XTAL_OUT interface of bluetooth audio chip IC1 are connected with quartz crystal Y1, quartz crystal Y1 adopts 16MHz quartz crystal, and provides clock signal for bluetooth audio chip IC1.

[0036] In the embodiment, the RF_LNA interface of bluetooth audio chip IC1 is connected with antenna module, and the antenna module includes inductance L20, capacitor C30 and capacitor C31, the inductance L20 is connected in series between the RF_LNA interface of bluetooth audio chip IC1 and antenna, and the capacitor C30 and capacitor C31 are connected between the front and rear ends of inductance L20 and ground.In the embodiment, transient suppression diode D4 is connected between the antenna connection end of antenna module and ground.

[0037] In the embodiment, power amplifier module adopts power amplifier interface J1, for connecting audio power amplifier, power amplifier interface J1 is connected on the general data end (analogue IIS interface through general data end) of bluetooth audio chip IC1 through IIS interface, for inputting the audio signal output by bluetooth audio chip IC1 to the connected audio power amplifier, inductance L26 and inductance L27 are respectively connected in series on the port of power amplifier interface J1 for connecting the audio output end of the connected audio power amplifier, and the port of power amplifier interface J1 for connecting the audio output end of the connected audio power amplifier is connected on the first input end of switching module.

[0038] In this embodiment, the switching module adopts an electronic switch, the audio output end of the power amplifier interface J1 is connected to the first input end of the switching module, the SPK_RP interface and the SPK_RN interface of the Bluetooth audio chip IC1 are connected to the second input end of the switching module, the control end of the switching module is connected to the data end of the Bluetooth audio chip IC1, and the output end of the switching module is connected to the speaker module.

[0039] In this embodiment, the speaker module adopts a speaker interface, which is used for connection with a speaker.

[0040] In the embodiment, the microphone module includes a talk microphone (TALK-MIC), a noise reduction microphone (FF-MIC), and an audio feedback microphone (FB-MIC). The talk microphone includes a microphone interface MIC1, an inductor L12, an inductor L13, an inductor L14, an inductor L15, a capacitor C24, a capacitor C25, and a capacitor C26. The inductor L12 is connected in series between a VDD interface of the microphone interface MIC1 and a MIC_BIAS1 interface of the Bluetooth audio chip IC1. The inductor L13 and the capacitor C24 are connected in series between an OUT interface of the microphone interface MIC1 and a TALK_MICP interface of the Bluetooth audio chip IC1. The inductor L14 and the capacitor C25 are connected in series between a GND interface of the microphone interface MIC1 and a TALK_MICN interface of the Bluetooth audio chip IC1. The capacitor C26 is connected between the MIC_BIAS1 interface of the Bluetooth audio chip IC1 and the ground. The inductor L15 is connected between the GND interface of the microphone interface MIC1 and the ground. A transient suppression diode D1 is connected between the VDD interface of the microphone interface MIC1 and the ground. A transient suppression diode D8 is connected between the OUT interface of the microphone interface MIC1 and the ground. The noise reduction microphone includes a microphone interface MIC2, an inductor L16, an inductor L17, an inductor L18, an inductor L19, a capacitor C27, a capacitor C28, and a capacitor C29. The inductor L16 is connected in series between a VDD interface of the microphone interface MIC2 and a MIC_BIAS0 interface of the Bluetooth audio chip IC1. The inductor L17 and the capacitor C27 are connected in series between an OUT interface of the microphone interface MIC2 and a FF_MICP interface of the Bluetooth audio chip IC1. The inductor L18 and the capacitor C28 are connected in series between a GND interface of the microphone interface MIC2 and a FF_MICN interface of the Bluetooth audio chip IC1. The capacitor C29 is connected between the MIC_BIAS0 interface of the Bluetooth audio chip IC1 and the ground. The inductor L19 is connected between the GND interface of the microphone interface MIC2 and the ground. A transient suppression diode D3 is connected between the VDD interface of the microphone interface MIC2 and the ground. A transient suppression diode D2 is connected between the OUT interface of the microphone interface MIC2 and the ground.The audio feedback microphone is connected to the speaker interface for audio feedback, and the audio feedback microphone comprises the speaker interface, the inductor L22, the inductor L23, the inductor L24, the inductor L25, the capacitor C33, the capacitor C34 and the capacitor C35, the inductor L22 is connected in series between the FB-VDD interface of the speaker interface and the MIC_BIAS0 interface of the Bluetooth audio chip IC1, the inductor L23 and the capacitor C33 are connected in series between the FB-OUT interface of the speaker interface and the FB_MICP interface of the Bluetooth audio chip IC1, the inductor L24 and the capacitor C34 are connected in series between the FB-GND interface of the speaker interface and the FB_MICN interface of the Bluetooth audio chip IC1, the capacitor C35 is connected between the MIC_BIAS0 interface of the Bluetooth audio chip IC1 and the ground, the inductor L25 is connected between the FB-GND interface of the speaker interface and the ground, the transient suppression diode D7 is connected between the FB-VDD interface of the speaker interface and the ground, and the transient suppression diode D6 is connected between the FB-OUT interface of the speaker interface and the ground.

[0041] In the embodiment, the data end of the Bluetooth master control module is connected with the touch module for inputting touch information, the touch module adopts a touch chip U3 with a model of BH7812E, the I interface of the touch chip U3 is connected with a touch sheet through a series-connected resistor R23, the touch sheet is connected with the ground through the transient suppression diode D9, the touch sheet is connected with the ground through the filter capacitor C36, and the Q interface of the touch chip U3 is connected with the TOUCH interface of the Bluetooth audio chip IC1.

[0042] In the embodiment, the data end of the Bluetooth master control module is connected with the temperature detection module, the temperature detection module comprises an NTC resistor R16, a resistor R15, a resistor R14 and a capacitor C23, the resistor R14 and the resistor R15 are connected in series between the positive power supply VDD18 and the ground, the common end of the resistor R14 and the resistor R15 is connected with the 7034_NTC interface of the Bluetooth audio chip IC1, and the NTC resistor R16 and the capacitor C23 are connected in parallel with the resistor R15.

[0043] In the embodiment, the data end of the Bluetooth master control module is connected with the download module, and the Bluetooth master control module can be upgraded in software through the serial interfaces TXD and RXD.

[0044] In the embodiment, the lithium battery is used for power supply, the power module includes a power input interface, a lithium battery and a battery protection module, the lithium battery is connected to the power input interface, the battery protection module is connected with the lithium battery, the power input interface includes an inductor L21 and a capacitor C32, the inductor L21 is connected in series between the +5V power input interface and the positive electrode of the lithium battery, the capacitor C32 is connected between the positive electrode of the lithium battery and the ground, and the transient suppression diode D5 is connected between the +5V power input interface and the ground; the battery protection module adopts a lithium battery protection chip IC2, the lithium battery protection chip IC2 is connected with the lithium battery, and is used for protecting the charging and discharging of the lithium battery.

[0045] The utility model discloses through the memory increase and switching module, can support LDAC and LHDC two decoding formats simultaneously, can provide better sound quality use experience for the user.

Claims

1. A TWS headset that supports both LDAC and LHDC decoding, characterized by: The headset includes a Bluetooth main control module, a microphone module, a speaker module, a power amplifier module, a switching module, an antenna module and a power module. The antenna module is connected to the antenna end of the Bluetooth main control module, the microphone module is connected to the audio signal input end of the Bluetooth main control module, the power amplifier module is connected to the data end of the Bluetooth main control module, the input end of the switching module is respectively connected to the audio signal output end of the Bluetooth main control module and the audio signal output end of the power amplifier module, the speaker module is connected to the output end of the switching module, and the power module is used for power supply.

2. The TWS headset supporting both LDAC and LHDC decoding according to claim 1, characterized in that: The XTAL_IN interface and the XTAL_OUT interface of the Bluetooth main control module are connected to a quartz crystal oscillator Y1.

3. The TWS headset supporting both LDAC and LHDC decoding according to claim 1, characterized in that: The RF_LNA interface of the Bluetooth main control module is connected to an antenna module, which includes an inductor L20, a capacitor C30, and a capacitor C31. The inductor L20 is connected in series between the RF_LNA interface of the Bluetooth main control module and the antenna, and the capacitors C30 and C31 are respectively connected between the front and rear ends of the inductor L20 and the ground. A transient suppression diode D4 is connected between the antenna connection end of the antenna module and the ground.

4. The TWS headset supporting both LDAC and LHDC decoding according to claim 1, characterized in that: The power amplifier module adopts a power amplifier interface J1, which is connected to the universal data terminal of the Bluetooth main control module through the IIS interface. The ports on the power amplifier interface J1 for connecting to the audio output terminal of the connected audio power amplifier are respectively connected in series with inductors L26 and L27. The port on the power amplifier interface J1 for connecting to the audio output terminal of the connected audio power amplifier is connected to the first input terminal of the switching module.

5. The TWS headset supporting both LDAC and LHDC decoding according to claim 1, characterized in that: The switching module adopts an electronic switching switch, the audio output end of the power amplifier interface J1 is connected to the first input end of the switching module, the SPK_RP interface and SPK_RN interface of the Bluetooth main control module are connected to the second input end of the switching module, the control end of the switching module is connected to the data end of the Bluetooth main control module, and the output end of the switching module is connected to the speaker module.

6. The TWS headset supporting both LDAC and LHDC decoding according to claim 1, characterized in that: The microphone module includes a call microphone, a noise reduction microphone and an audio feedback microphone. The call microphone includes a microphone interface MIC1, an inductor L12, an inductor L13, an inductor L14, an inductor L15, a capacitor C24, a capacitor C25 and a capacitor C26. The inductor L12 is connected in series between the VDD interface of the microphone interface MIC1 and the MIC_BIAS1 interface of the Bluetooth main control module. The inductor L13 and the capacitor C24 are connected in series between the OUT interface of the microphone interface MIC1 and the TALK_MICP interface of the Bluetooth main control module. The inductor L14 and the capacitor C25 are connected in series between the GND interface of the microphone interface MIC1 and the TALK_MICN interface of the Bluetooth main control module. The capacitor C26 is connected between the MIC_BIAS1 interface of the Bluetooth main control module and the ground. The inductor L15 is connected between the GND interface of the microphone interface MIC1 and the ground. A transient suppression diode D1 is connected between the VDD interface of the microphone interface MIC1 and the ground. The OUT interface of the microphone interface MIC1 A transient suppression diode D8 is connected between the MIC2 and ground; the noise reduction microphone includes a microphone interface MIC2, an inductor L16, an inductor L17, an inductor L18, an inductor L19, a capacitor C27, a capacitor C28 and a capacitor C29, the inductor L16 is connected in series between the VDD interface of the microphone interface MIC2 and the MIC_BIAS0 interface of the Bluetooth main control module, the inductor L17 and the capacitor C27 are connected in series between the OUT interface of the microphone interface MIC2 and the FF_MICP interface of the Bluetooth main control module, the inductor L18 and the capacitor C28 are connected in series between the GND interface of the microphone interface MIC2 and the FF_MICN interface of the Bluetooth main control module, the capacitor C29 is connected between the MIC_BIAS0 interface of the Bluetooth main control module and ground, the inductor L19 is connected between the GND interface of the microphone interface MIC2 and ground, a transient suppression diode D3 is connected between the VDD interface of the microphone interface MIC2 and ground, and a transient suppression diode D2 is connected between the OUT interface of the microphone interface MIC2 and ground; An audio feedback microphone is connected to the speaker interface for audio feedback. The audio feedback microphone includes the speaker interface, inductor L22, inductor L23, inductor L24, inductor L25, capacitor C33, capacitor C34, and capacitor C35. Inductor L22 is connected in series between the FB-VDD interface of the speaker interface and the MIC_BIAS0 interface of the Bluetooth main control module. Inductor L23 and capacitor C33 are connected in series between the FB-OUT interface of the speaker interface and the FB_MICP interface of the Bluetooth main control module. Inductor L24 and capacitor C34 are connected in series between the FB-GND interface of the speaker interface and the FB_MICN interface of the Bluetooth main control module. Capacitor C35 is connected between the MIC_BIAS0 interface of the Bluetooth main control module and ground. Inductor L25 is connected between the FB-GND interface of the speaker interface and ground. A transient suppression diode D7 is connected between the FB-VDD interface of the speaker interface and ground, and a transient suppression diode D6 is connected between the FB-OUT interface of the speaker interface and ground.

7. The TWS headset supporting both LDAC and LHDC decoding according to claim 1, characterized in that: The data end of the Bluetooth main control module is connected to a touch module, the I interface of the touch module is connected to a touch piece through a series-connected resistor R23, a transient suppression diode D9 is connected between the touch piece and the ground, a filter capacitor C36 is connected between the touch piece and the ground, and the Q interface of the touch core module is connected to the TOUCH interface of the Bluetooth main control module.

8. The TWS headset supporting both LDAC and LHDC decoding according to claim 1, characterized in that: The data end of the Bluetooth main control module is connected to a temperature detection module, which includes an NTC resistor R16, a resistor R15, a resistor R14 and a capacitor C23. The resistor R14 and the resistor R15 are connected in series between the positive power supply VDD18 and the ground. The common end of the resistor R14 and the resistor R15 is connected to the 7034_NTC interface of the Bluetooth main control module, and the NTC resistor R16 and the capacitor C23 are respectively connected in parallel with the resistor R15.

9. The TWS headset supporting both LDAC and LHDC decoding according to claim 1, characterized in that: The data end of the Bluetooth main control module is connected with a download module.

10. The TWS headset supporting both LDAC and LHDC decoding according to claim 1, characterized in that: The power module includes a power input interface, a lithium battery and a battery protection module. The lithium battery is connected to the power input interface, and the battery protection module is connected to the lithium battery. The power input interface includes an inductor L21 and a capacitor C32. The inductor L21 is connected in series between the +5V power input interface and the positive pole of the lithium battery. The capacitor C32 is connected between the positive pole of the lithium battery and the ground. A transient suppression diode D5 is connected between the +5V power input interface and the ground; the battery protection module uses a lithium battery protection chip IC2, and the lithium battery protection chip IC2 is connected to the lithium battery.

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