Display substrate and display screen
By setting isolation grooves and isolation pillars in the opening encapsulation area of the OLED display to form a mortise and tenon structure, the problems of film rupture and water-oxygen channels caused by film stress are solved, thereby improving the reliability and lifespan of the display.
Patent Information
- Application Number
- CN202422954275.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-29
- Publication Date
- 2025-10-17
- Estimated Expiration
- 2034-11-29
AI Technical Summary
The stress generated in the perforated area of an OLED punch-hole screen can cause film rupture and separation between film layers, forming water and oxygen channels, resulting in black spots in the perforation and affecting the display effect.
An isolation groove and isolation pillars are provided in the opening encapsulation area, including an inner isolation pillar and an outer isolation pillar. The isolation groove is located between the outer isolation pillars, and an organic layer is filled between the outer isolation pillars near the opening area to form a tenon and mortise structure to block membrane cracks and water and oxygen channels.
It effectively prevents membrane rupture and separation caused by membrane stress, avoids the formation of water-oxygen channels, improves the problem of black spots in holes, and enhances the reliability and lifespan of the display screen.
Smart Images

Figure CN223452369U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of display, in particular to a display substrate and a display screen. Background Art
[0002] OLED (Organic Light-Emitting Diode) display technology eliminates the need for a backlight. Instead, it utilizes a very thin coating of organic materials on a glass substrate (or a flexible organic substrate). These materials emit light when an electric current flows through them. OLED screens offer advantages such as high contrast, wide viewing angles, and low power consumption, and are currently widely used in mobile electronic products, such as mobile phones.
[0003] Screen-to-body ratio refers to the proportion of a device's screen area to its overall front panel area, usually expressed as a percentage. A higher screen-to-body ratio means the screen occupies a larger proportion of the device's front face, reducing the relative size of the bezel or other non-displayable area. For example, if a phone's screen takes up 85% of the entire front panel, its screen-to-body ratio is 85%. A high screen-to-body ratio generally provides a more immersive visual experience and gives the device a more modern and stylish appearance. In pursuit of the ultimate screen-to-body ratio, OLED hole-punch displays are becoming mainstream. OLED hole-punch displays feature a hole cut into the operable area of the screen to house the camera. Hole-punch specks are defects that occur in the hole area during the reliability test. This is caused by stress in the film layer during the cut, which extends from the hole into the surface, causing film cracks and separation between film layers. These cracks form water and oxygen channels. Once water and oxygen invade, they can cause the electrode / light-emitting layer to fail, resulting in hole-punch specks. Utility Model Content
[0004] The purpose of the present invention is to provide a display substrate and a display screen to improve the problem of black spots in holes. The specific technical solution is as follows:
[0005] In a first aspect, an embodiment of the present invention provides a display substrate, comprising:
[0006] An opening area, an opening encapsulation area and a display area; the opening encapsulation area is located between the opening area and the display area, and the opening encapsulation area is arranged around the opening area;
[0007] The hole packaging area includes: an isolation groove, an isolation column, and a dam structure; the isolation column includes an inner isolation column and an outer isolation column, the inner isolation column is located on the side of the dam structure away from the hole area, and the outer isolation column is located on the side of the dam structure close to the hole area;
[0008] The isolation trench is opened on the first inorganic layer of the opening packaging area, and the isolation trench is located between the outer isolation columns.
[0009] In one possible embodiment, the isolation trench includes a first isolation trench, the first isolation trench is located between a first isolation column and a second isolation column, the first isolation trench is filled with a first organic layer, and the first organic layer exceeds the first isolation column and the second isolation column in the thickness direction of the display substrate.
[0010] In a possible implementation, the first organic layer is a pixel definition layer, and the first inorganic layer is an interlayer dielectric layer.
[0011] In a possible implementation, the isolation trench includes a second isolation trench, the second isolation trench is filled with a second organic layer, and the second organic layer in the second isolation trench is lower than the second organic layers on both sides of the second isolation trench in a thickness direction of the display substrate.
[0012] In a possible implementation manner, there are multiple second isolation trenches, and there is at most one second isolation trench between two adjacent outer isolation columns.
[0013] In a possible implementation manner, there are multiple second isolation trenches, and at least one group of adjacent outer isolation columns has multiple second isolation trenches.
[0014] In a possible implementation manner, the second isolation trench is located between a third isolation column and a fourth isolation column, and the third isolation column and the fourth isolation column are two isolation columns closest to the opening area.
[0015] In a possible implementation, the second organic layer is an electroluminescent layer.
[0016] In a possible implementation, the slope angle of the isolation trench ranges from 30 degrees to 50 degrees, wherein the slope angle is an acute angle formed by a side surface and a bottom surface of the isolation trench, and the bottom surface is a surface parallel to the substrate plane.
[0017] In a second aspect, an embodiment of the present invention provides a display screen, which includes any one of the display substrates described above.
[0018] The display substrate provided by the present invention includes an aperture area, an aperture packaging area, and a display area; the aperture packaging area is located between the aperture area and the display area, and is disposed around the aperture area; the aperture packaging area includes: an isolation groove, an isolation column, and a dam structure; the isolation column includes an inner isolation column and an outer isolation column, the inner isolation column being located on the side of the dam structure away from the aperture area, and the outer isolation column being located on the side of the dam structure closer to the aperture area; the isolation groove is provided on the first inorganic layer of the aperture packaging area, and the isolation groove is located between the outer isolation columns. By providing isolation columns and providing isolation grooves between the outer isolation columns near the aperture area, it is possible to prevent film cracks from extending inward from the aperture area to form water and oxygen channels, thereby improving the problem of hole black spots.
[0019] Of course, any product implementing the present invention does not necessarily need to achieve all of the advantages described above at the same time. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can also be obtained based on these drawings.
[0021] Figure 1 A schematic diagram of the first structure of a display substrate provided by an embodiment of the present utility model;
[0022] Figure 2a A schematic diagram of a second structure of a display substrate provided by an embodiment of the present utility model;
[0023] Figure 2b A third structural schematic diagram of a display substrate provided by an embodiment of the present utility model;
[0024] Figure 3 This is a first design rendering of the isolation groove provided by the embodiment of the utility model;
[0025] Figure 4 A second design rendering of the isolation trench provided in an embodiment of the present utility model;
[0026] Figure 5 A third design rendering of the isolation trench provided in an embodiment of the present utility model;
[0027] Figure 6 A schematic structural diagram of an isolation column provided in an embodiment of the utility model. DETAILED DESCRIPTION
[0028] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field based on the present invention are within the scope of protection of the present invention.
[0029] OLED (Organic Light-Emitting Diode) display technology eliminates the need for a backlight. Instead, it utilizes a very thin coating of organic materials on a glass substrate (or a flexible organic substrate). These materials emit light when an electric current flows through them. OLED screens offer advantages such as high contrast, wide viewing angles, and low power consumption, and are currently widely used in mobile electronic products, such as mobile phones.
[0030] Screen-to-body ratio refers to the proportion of a device's screen area to its overall front panel area, usually expressed as a percentage. A higher screen-to-body ratio means the screen occupies a larger proportion of the device's front face, reducing the relative size of the bezel or other non-displayable area. For example, if a phone's screen takes up 85% of the entire front panel, its screen-to-body ratio is 85%. A high screen-to-body ratio generally provides a more immersive visual experience and gives the device a more modern and stylish appearance. In pursuit of the ultimate screen-to-body ratio, OLED hole-punch displays are becoming mainstream. OLED hole-punch displays feature a hole cut into the operable area of the screen to house the camera. Hole-punch specks are defects that occur in the hole area during the reliability test. This is caused by stress in the film layer during the cut, which extends from the hole into the surface, causing film cracks and separation between film layers. These cracks form water and oxygen channels. Once water and oxygen invade, they can cause the electrode / light-emitting layer to fail, resulting in hole-punch specks.
[0031] Among them, film rupture mainly refers to the rupture of the insulating layer (Chemical Vapor Deposition, CVD), and the separation between film layers mainly occurs between the insulating layer and the cathode layer, between the first insulating layer (Chemical Vapor Deposition 1, CVD1) and the second insulating layer (Chemical Vapor Deposition 2, CVD2), and between the insulating layer and the touch insulating layer (Thermal Laminated Dielectric, TLD).
[0032] With the advancement of science and technology and the improvement of living standards, consumers have higher and higher requirements for OLED mobile phone displays. In order to improve the problem of black spots, first of all, see Figure 1 , an embodiment of the present utility model provides a display substrate, comprising:
[0033] An opening area 101 , an opening encapsulation area 102 and a display area 103 ; the opening encapsulation area 102 is located between the opening area 101 and the display area 103 , and the opening encapsulation area 102 is arranged around the opening area 101 .
[0034] The opening area 101 is generally cut into a circular area for placing a camera. The display area 103 is the active area (AA).
[0035] The hole packaging area 102 includes: isolation grooves, isolation columns, and a dam structure 11; the isolation columns include inner isolation columns and outer isolation columns, the inner isolation columns are located on the side of the dam structure 11 away from the hole area 101, and the outer isolation columns are located on the side of the dam structure 11 close to the hole area 101.
[0036] Isolators block the negatively charged cathode material, preventing electrochemical corrosion caused by the combined effects of small amounts of water vapor and electricity at the hole edge. However, even with a power-off design that includes internal and external isolation columns, a certain percentage of hole black spots will occur under conditions of 85°C and 85°C humidity. This is due to film stress caused by cutting the hole area, which extends from the hole cut channel into the surface, causing film rupture or separation at the hole edge.
[0037] Figure 1 In the figure, the seven isolation columns on the right side of the dam structure 11 are outer isolation columns, and the three isolation columns on the left side of the dam structure 11 are inner isolation columns. The number of outer isolation columns is not limited to seven, and can be eight, for example. The number of inner isolation columns is not limited to three, and can be four, for example.
[0038] The isolation trench is opened on the first inorganic layer 12 of the opening encapsulation area 102 , and the isolation trench is located between the outer isolation pillars.
[0039] The isolation groove is opened on the first inorganic layer 12 of the hole packaging area 102. When the membrane crack extends from the hole area to the surface, due to the existence of the isolation groove, the membrane crack cannot continue to develop after passing through the isolation groove. The design of the isolation groove can cut off the water and oxygen channels formed by the membrane cracks. Moreover, the isolation groove is located between the outer isolation columns. The closer to the hole area, the earlier the formation of the water and oxygen channels can be blocked, thereby preventing the water and oxygen channels from further developing inward under the action of the stress of the membrane layer.
[0040] In an embodiment of the present invention, a display substrate includes an aperture region, an aperture encapsulation region, and a display region; the aperture encapsulation region is located between the aperture region and the display region, and is disposed around the aperture region; the aperture encapsulation region includes: an isolation groove, an isolation column, and a dam structure; the isolation column includes an inner isolation column and an outer isolation column, the inner isolation column being located on a side of the dam structure away from the aperture region, and the outer isolation column being located on a side of the dam structure closer to the aperture region; the isolation groove is formed on the first inorganic layer of the aperture encapsulation region, and the isolation groove is located between the outer isolation columns. By providing the isolation columns, the organic layer in the light-emitting device is isolated, preventing water vapor in the air in the aperture region from being transported along the organic layer to the display region, causing poor display; and providing the isolation groove between the outer isolation columns near the aperture region can prevent film cracks from extending from the aperture region into the surface to form water and oxygen channels, thereby improving the problem of hole black spots.
[0041] In some embodiments, see Figure 1 The isolation groove includes a first isolation groove 13, which is located between a first isolation column 14 and a second isolation column 15. The first isolation groove 13 is filled with a first organic layer 16, and the first organic layer 16 exceeds the first isolation column 14 and the second isolation column 15 in the thickness direction of the display substrate.
[0042] The outer spacers are sequentially arranged in a direction from the aperture encapsulation region toward the aperture region: a first spacer and a second spacer. Specifically, the first spacer and the second spacer are the two outer spacers closest to the dam structure. A first isolation trench is provided between the first spacer and the second spacer, and the first isolation trench is filled with a first organic layer.
[0043] In some embodiments, the first inorganic layer is an inter-layer dielectric layer (ILD); the first organic layer is a pixel defining layer (PDL), and the pixel organic layer often uses polyimide (PI) material, which is an organic polymer material; the first organic layer and the first isolation groove form a mortise and tenon structure, that is, a mortise and tenon structure is formed between the organic layer and the inorganic layer. This can utilize the interaction force between molecules to grasp the upper and lower film layers, avoid separation between the film layers, and prevent film cracks from extending from the opening area into the surface to form water and oxygen channels, thereby improving the problem of hole black spots.
[0044] In some embodiments, see Figure 1 The isolation groove includes a second isolation groove 17, which is filled with a second organic layer 18. The second organic layer 18 in the second isolation groove 17 is lower than the second organic layers on both sides of the second isolation groove in the thickness direction of the display substrate.
[0045] The second organic layer is positioned on the second isolation trench, and the first inorganic layer is positioned below the isolation pillar. The second organic layer on the second isolation trench and the second organic layer on the first inorganic layer form an integrated structure. Because the isolation trench is formed on the first inorganic layer and the second isolation trench is filled with the second organic layer, it is equivalent to positioning the second organic layer on the trench-shaped first inorganic layer. Furthermore, the second isolation trench is also filled with the first insulating layer CVD1, which is an inorganic layer. This extends the in-plane path of membrane rupture and separation between membrane layers.
[0046] The second isolation trench can be provided between the third isolation column 19 and the fourth isolation column 20. The third isolation column 19 and the fourth isolation column 20 are the two isolation columns closest to the aperture area. There can be multiple second isolation trenches, and at least one group of adjacent outer isolation columns has multiple second isolation trenches. When the second isolation trench is provided between the third isolation column and the fourth isolation column, multiple second isolation trenches can be provided between the third isolation column and the fourth isolation column. Because the third and fourth isolation columns are the two isolation columns closest to the aperture area, when the membrane stress in the aperture area extends inward from the aperture area, it will not extend far before encountering the second isolation trench. Due to the presence of the second isolation trench, the other end of the second isolation trench will not receive the membrane stress. By providing the second isolation trench between the third and fourth isolation columns, membrane rupture and separation between membrane layers caused by membrane stress can be quickly blocked from extending inward, preventing the formation of water-oxygen channels.
[0047] The second organic layer is disposed on the second isolation trench, but unlike the first organic layer disposed on the first isolation trench, the first organic layer extends through the first isolation trench and the first and second isolation pillars, and exceeds them in height, forming a mortise and tenon structure with the first isolation trench and the first and second isolation pillars. The second organic layer is only a thin layer disposed on the second isolation trench, and the thickness of the second organic layer disposed on the second isolation trench is comparable to the thickness of the second organic layer disposed on the first inorganic layer. However, because the second isolation trench is formed on the first inorganic layer and is lower in height than the first inorganic layer, the second organic layer in the second isolation trench is lower than the second organic layers on either side of the second isolation trench in the thickness direction of the display substrate.
[0048] The second organic layer mentioned above is an electroluminescent layer (EL).
[0049] In some embodiments, there are multiple second isolation trenches, and there is at most one second isolation trench between two adjacent outer isolation columns.
[0050] See also Figure 1In the direction from the aperture packaging area to the aperture area, the outer isolation pillars arranged in sequence are: a first isolation pillar, a second isolation pillar, a fifth isolation pillar, a sixth isolation pillar, a seventh isolation pillar, a third isolation pillar, and a fourth isolation pillar. The third isolation pillar and the fourth isolation pillar are the two isolation pillars closest to the aperture area 101. A first isolation trench is provided between the first isolation pillar and the second isolation pillar. A second isolation trench is no longer provided between the first isolation pillar and the second isolation pillar. The second isolation trench can be provided between the second isolation pillar and the fifth isolation pillar, between the fifth isolation pillar and the sixth isolation pillar, between the sixth isolation pillar and the seventh isolation pillar, between the seventh isolation pillar and the third isolation pillar, or between the third isolation pillar and the fourth isolation pillar. At most, only one second isolation trench can be provided between two adjacent outer isolation pillars.
[0051] In some embodiments, see Figure 2a A first isolation trench 13 is provided between the first isolation pillar 14 and the second isolation pillar 15; a second isolation trench 17 is provided between the seventh isolation pillar 21 and the third isolation pillar 19, and a second isolation trench 17 is provided between the third isolation pillar 19 and the fourth isolation pillar 20. In other words, the current display substrate has one first isolation trench and two second isolation trenches. The second isolation trench is located close to the hole region, allowing timely measures to prevent film rupture and interlayer separation caused by film stress from propagating inward from the hole region.
[0052] In some embodiments, there are multiple second isolation trenches, and at least one group of adjacent outer isolation columns has multiple second isolation trenches. Figure 2b A first isolation groove 13 is provided between the first isolation column 14 and the second isolation column 15; two second isolation grooves 17 are provided between the seventh isolation column 21 and the third isolation column 19, and a second isolation groove 17 is provided between the third isolation column 19 and the fourth isolation column 20; that is, the current display substrate has one first isolation groove and three second isolation grooves, and there are multiple second isolation grooves between adjacent third isolation columns 19 and fourth isolation columns 20.
[0053] The isolation groove is a structure arranged between the isolation columns. In some embodiments, the isolation groove can also be arranged between the inner isolation columns. When the isolation groove is arranged between the two inner isolation columns farther away from the opening area 101, the isolation groove is filled with the pixel definition layer PDL. The height range of the pixel definition layer PDL includes from the isolation groove to the top of the two inner isolation columns farther away from the opening area 101. That is, the pixel definition layer PDL passes through the isolation groove and the two inner isolation columns farther away from the opening area 101, and exceeds the two inner isolation columns farther away from the opening area 101 in height, so that a mortise and tenon structure is formed between the pixel definition layer PDL and the isolation groove. In this way, the interaction force between molecules can be utilized to grasp the upper and lower film layers, avoid separation between the film layers, and prevent the film cracks from extending from the opening area to the surface to form water and oxygen channels, thereby improving the problem of generating hole black spots.
[0054] When an isolation trench is provided between two inner isolation pillars closer to the aperture region 101, the isolation trench is filled with an electroluminescent layer EL. The electroluminescent layer EL on the isolation trench and the electroluminescent layer EL on the interlayer dielectric layer ILD form an integrated structure. Because the isolation trench is provided on the interlayer dielectric layer ILD and is filled with the electroluminescent layer EL, it is equivalent to the electroluminescent layer EL being provided on the trench-shaped interlayer dielectric layer ILD. Furthermore, the isolation trench is filled with a first insulating layer CVD1, which is an inorganic layer. This prolongs the path for film rupture and separation to extend inward. When film stress in the aperture region extends inward from the aperture region, upon encountering the isolation trench, the other end of the isolation trench is shielded from the stress due to the presence of the isolation trench. By providing an isolation trench between two inner isolation pillars closer to the aperture region 101, the inward extension of film rupture and separation caused by film stress can be quickly blocked, preventing the formation of water and oxygen channels.
[0055] Furthermore, when an isolation trench is provided between two inner isolation pillars closer to the opening area 101 , the number of the isolation trenches may be one or more.
[0056] If an isolation groove is set between the inner isolation pillars, the isolation groove can indeed form a mortise and tenon structure with the pixel definition layer (PDL), using the interaction force between molecules to grasp the upper and lower film layers, prevent separation between the film layers, and prevent film cracks from extending from the opening area into the surface to form a water-oxygen channel. Alternatively, together with the electroluminescent layer EL, it can block the path of film rupture and separation between film layers from extending into the surface, thereby preventing the formation of a water-oxygen channel. However, these effects only act on the portion starting from the inner isolation pillar to the left, and cannot provide good protection for the portion starting from the inner isolation pillar to the right. Therefore, under normal circumstances, it is still preferred to set an isolation groove between the outer isolation pillars. Since the outer isolation pillars are close to the opening area, they can quickly cut off the stress in the film layer when it begins to take effect, causing film rupture and separation between film layers, preventing the stress in the film layer from extending from the hole into the surface to form a water-oxygen channel.
[0057] In some embodiments, the slope angle of the isolation trench ranges from 30 degrees to 50 degrees, wherein the slope angle is an acute angle formed by the side surface and the bottom surface of the isolation trench, and the bottom surface is a surface parallel to the substrate plane.
[0058] In existing production processes, trenching can be achieved through etching. The etching process involves exposing and developing a photoresist (PR) to form a mask pattern. Based on the material, thickness, and density of the etched film, appropriate etching gases are introduced, and chemical reactions and plasma bombardment are used to remove the film not covered by the mask. Exposure and development are steps in the preparation process, primarily used to transfer the photolithographic pattern to the photoresist. Exposure involves irradiating a light source (such as ultraviolet light) through a mask onto the photoresist, changing its chemical properties. A developer then removes the unexposed or exposed portions, forming a pattern. Figure 3 , Figure 3 The left side is a design diagram of a method for forming an isolation groove in the prior art and its effect diagram: there are photoresists with a width of a1 and a width of c1 on both sides of the isolation groove with a width of b1. When the first inorganic layer is etched with a solution, because there is no photoresist where the isolation groove is to be etched, the solution can corrode the isolation groove but cannot corrode the sides of the isolation groove, so that an isolation groove can be etched.
[0059] However, it was found that if the inorganic layer between the isolation pillars is directly grooved in the existing technology, the groove is deeper and the slope angle is larger. Photoresist or impurities are likely to remain at the corners of the groove. Moreover, the larger the etching slope angle, the worse the flatness of the upper coating. Figure 3 The second picture on the left shows the photoresist or impurity residue. Figure 3 The third figure from the left shows the slope angle, which is α in the figure.
[0060] To reduce the slope angle, Figure 3The upper right corner of the figure shows a design diagram of a method for forming an isolation trench according to the present invention: An area of width d is selected from the photoresist-containing region on the left and right sides of the location where the trench is originally intended, and the photoresist is removed from this area. This area, like the isolation trench, is then etched by the solution. Between this area of width d and the isolation trench, there is an area of width e, which still contains photoresist. The areas of width a2 and c2 on either side of the isolation trench also contain photoresist. Thus, when the first inorganic layer is etched with the solution, both the area of width d and the isolation trench of width b2 are etched. For the isolation trench of width b2, the etch effect is similar to that of directly trepanning in the prior art. For the area of width d, the solution also seeps downward, and because width e is a very small value, as both the isolation trench of width b2 and the area of width d are etched, the etched spaces of the isolation trench of width b2 and the area of width d gradually connect. For the area with photoresist of width e, the space below it has been etched away, so the photoresist of width e will also be etched away. Moreover, as the solution penetrates downward, the etching time of the first inorganic layer above the solution is longer, resulting in more corrosion of the upper layer and less corrosion of the lower layer. Therefore, the upper part of the isolation trench will always be etched more than the lower part, such as Figure 3 As shown in the lower right corner of the figure, the slope angle is β in this case. By expanding the upper layer's etched area, the present invention allows the resulting trench to be considered a trapezoidal isolation trench. Compared to conventional right-angle isolation trenches, the trapezoidal isolation trench has a smaller slope angle and is less likely to retain photoresist or impurities. This improves the filling effect when the first or second organic layer is filled into the isolation trench. The resulting mortise and tenon structure creates stronger molecular interactions, preventing separation and rupture between film layers.
[0061] In some embodiments, the present invention can also coat the trench with photoresist in areas of width e, on both sides of the original trench location. Between this area of width e and the edge of the isolation trench, there is an area of width d, which is free of photoresist. When etching an isolation trench of width (b2 + 2d + 2e), the solution penetrates downward through both the area of width d and the area of width b2. Because width e is a very small value, as both the isolation trench of width b2 and the area of width d are etched, the etched spaces of the isolation trench of width b2 and the area of width d gradually connect. The space beneath the area of width e with photoresist has already been eroded away, so the photoresist of width e is also etched away. Furthermore, as the solution penetrates downward, the etching time of the first inorganic layer above it, which is exposed to the solution, is longer, resulting in more etching of the upper layer and less etching of the lower layer. Consequently, the upper portion of the isolation trench is always more etched than the lower portion. The trapezoidal isolation trench, which can be considered a trapezoidal isolation trench, has a smaller slope angle than the previous right-angle isolation trench, making it less likely to retain photoresist or impurities. This improves the filling effect when the first or second organic layer is filled into the isolation trench. The better filling effect creates a mortise and tenon structure with stronger molecular forces between the layers, better preventing separation and rupture between the film layers.
[0062] In some embodiments, the area to be grooved can also be designed as Figure 4 and Figure 5 The area with width a3, the area with width e, the area with width c3, the small square between the area with width a3 / c3 and the area with width b3, the area with width a4, the area with width c4, the small square between the area with width a4 / c4 and the area with width b4 also have photoresist. When etched with a solution, the slope of the isolation groove formed is smaller.
[0063] In some embodiments, see Figure 1The display substrate provided by the embodiment of the present invention further includes a bottom substrate, a first gate metal layer Gate1 (22) arranged on the substrate, a second gate metal layer Gate2 (23) arranged on the first gate metal layer Gate1, and an interlayer dielectric layer arranged on the second gate metal layer Gate2. Subsequently, the film layer settings will vary depending on the region. Specifically, for the display area, it includes a first planarization layer (Planarization1, PLN1) 24, a second planarization layer (Planarization2, PLN2) 25, a pixel definition layer PDL (16), an electroluminescent layer EL (26), a first insulating layer CVD1 (27), an organic layer (Ink Jet Printing, IJP) 28, a second insulating layer CVD2 (29), a touch insulating layer TLD and a buffer layer Buffer (30), and a touch overlay component (TOC) 31. Among them, the first planarization layer 24, the second planarization layer 25, and the touch protection layer 31 are often made of polyimide material.
[0064] The first flat layer PLN1 is arranged on the side of the interlayer dielectric layer ILD away from the substrate; the second flat layer PLN2 is arranged on the side of the first flat layer PLN1 away from the interlayer dielectric layer ILD; the pixel definition layer PDL is arranged on the side of the second flat layer PLN2 away from the first flat layer PLN1; the electroluminescent layer is arranged on the pixel definition layer PDL away from the second flat layer PLN2; the first insulating layer CVD1 is arranged on the side of the electroluminescent layer EL away from the pixel definition layer PDL; the organic layer IJP is arranged on the side of the first insulating layer CVD1 away from the electroluminescent layer; the second insulating layer CVD2 is arranged on the side of the organic layer IJP away from the first insulating layer CVD1; the touch protection layer TLD and the buffer layer Buffer are arranged on the side of the second insulating layer CVD2 away from the organic layer IJP; the touch protection layer TOC is arranged on the touch protection layer TLD and the buffer layer Buffer away from the second insulating layer CVD2.
[0065] The perforated packaging area includes an isolation column, a pixel definition layer PDL (16), a dam structure 11, an isolation groove, an electroluminescent layer EL (26), a first insulating layer CVD1 (27), a second insulating layer CVD2 (29), a touch insulating layer TLD and a buffer layer Buffer (30), and a touch protection layer 31.
[0066] The isolation column is arranged on the side of the interlayer dielectric layer ILD away from the substrate. When the electroluminescent layer EL in the display area extends toward the opening packaging area, it will be isolated by the isolation column. Figure 6A specific structure of the isolation column can be a first structure + a second structure, wherein the first structure is provided on the same layer as the source and drain metal layer (Source & Drain, SD), and both are provided on the side of the interlayer dielectric layer ILD (12) away from the substrate; wherein the first structure of the isolation column includes a titanium metal layer 32, a first aluminum metal layer 33 and a titanium metal layer 32 stacked in sequence, and the first aluminum metal layer 33 is indented to form a notch with the upper and lower titanium metal layers 32, which can be used to isolate organic light-emitting materials such as the electroluminescent layer EL (26). The second structure of the isolation column is below the first structure of the isolation column, and the orthographic projections of the second structure and the first structure on the substrate at least partially overlap. The second structure includes at least one gate metal layer, which may include a first gate metal layer Gate1 (22) and a second gate metal layer Gate2 (23). The second structure may also include an inorganic insulating layer, such as an interlayer dielectric layer ILD (12), a gate insulating layer (Gate Insulator 1, GI), etc. The gate insulating layer may include a first gate insulating layer GI1 and a second gate insulating layer GI2. The first gate insulating layer GI1 is prepared on the first gate metal layer Gate1 (22), and the second gate insulating layer GI2 is prepared on the first gate metal layer Gate1 (22). The second structure can raise the first structure and can also be used to prevent cracks formed during cutting from propagating to the display area. Of course, the structure of the isolation column is not limited to this, and other designs are also possible.
[0067] The dam structure is arranged on the side of the interlayer dielectric layer ILD away from the substrate, and the dam structure is composed of three polyimide materials, namely PI1, PI2, and PI3; the pixel definition layer PDL is arranged on the two isolation columns closest to the display area and on the first isolation groove; the electroluminescent layer EL of the opening packaging area is arranged on the side of the interlayer dielectric layer ILD away from the substrate, the side of the dam structure away from the substrate, the side of the pixel definition layer PDL away from the substrate, and the side of the isolation column away from the substrate; the first insulating layer CVD1 is arranged on the side of the electroluminescent layer EL away from the interlayer dielectric layer ILD; the second insulating layer CVD2 is arranged on the side of the first insulating layer CVD1 away from the electroluminescent layer EL; the touch protection layer TLD and the buffer layer Buffer are arranged on the side of the second insulating layer CVD2 away from the first insulating layer CVD1; the touch protection layer TOC is arranged on the touch protection layer TLD and the buffer layer Buffer away from the second insulating layer CVD2.
[0068] The second aspect of the present invention further provides a display screen, comprising the display panel described above, wherein the display screen can be applied to any product with a display function, such as a mobile phone, a tablet computer, a television, a laptop computer, a digital photo frame, a navigator, or the like.
[0069] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply the existence of any such actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article, or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or device. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of other identical elements in the process, method, article, or device comprising the element.
[0070] Each embodiment in this specification is described in a related manner. The same or similar parts between the embodiments can be referred to each other. Each embodiment focuses on the differences from other embodiments.
[0071] The above description is only a preferred embodiment of the present invention and is not intended to limit the scope of protection of the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention are included in the scope of protection of the present invention.
Claims
1. A display substrate, characterized in that: include: Opening area, opening packaging area and display area; The opening encapsulation area is located between the opening area and the display area, and the opening encapsulation area is arranged around the opening area; The hole packaging area includes: an isolation groove, an isolation column, and a dam structure; the isolation column includes an inner isolation column and an outer isolation column, the inner isolation column is located on the side of the dam structure away from the hole area, and the outer isolation column is located on the side of the dam structure close to the hole area; The isolation trench is opened on the first inorganic layer of the opening packaging area, and the isolation trench is located between the outer isolation columns.
2. The display substrate according to claim 1, wherein: The isolation trench includes a first isolation trench located between a first isolation column and a second isolation column. The first isolation trench is filled with a first organic layer, and the first organic layer extends beyond the first isolation column and the second isolation column in a thickness direction of the display substrate.
3. The display substrate according to claim 2, wherein: The first organic layer is a pixel definition layer, and the first inorganic layer is an interlayer dielectric layer.
4. The display substrate according to claim 2, wherein: The isolation trench includes a second isolation trench filled with a second organic layer. The second organic layer in the second isolation trench is lower than the second organic layers on both sides of the second isolation trench in a thickness direction of the display substrate.
5. The display substrate according to claim 4, wherein: There are multiple second isolation trenches, and there is at most one second isolation trench between two adjacent outer isolation columns.
6. The display substrate according to claim 4, wherein: There are a plurality of the second isolation trenches, and at least one group of adjacent outer isolation columns has a plurality of the second isolation trenches.
7. The display substrate according to claim 4, wherein: The second isolation trench is located between the third isolation column and the fourth isolation column. The third isolation column and the fourth isolation column are two isolation columns closest to the opening area.
8. The display substrate according to any one of claims 4 to 7, characterized in that: The second organic layer is an electroluminescent layer.
9. The display substrate according to claim 1, wherein: The slope angle of the isolation trench ranges from 30 degrees to 50 degrees, wherein the slope angle is an acute angle formed by the side surface and the bottom surface of the isolation trench, and the bottom surface is a surface parallel to the substrate plane.
10. A display screen, characterized in that: The display screen comprises the display substrate according to any one of claims 1 to 9.