Solid-state transducer

Abstract

The utility model discloses a solid-state transducer, which relates to the technical field of ultrasonic transducers, and comprises a solid-state transducer shell, an acoustic window is arranged on the solid-state transducer shell, a rubber coating is sleeved outside the solid-state transducer shell on one side of the acoustic window, a ceramic wafer is arranged in the solid-state transducer shell, and the solid-state transducer shell is provided with an acoustic window. The ceramic wafer is a disc or circular ring planar wafer, two conducting rods are symmetrically installed on the ceramic wafer, when the solid-state transducer works, current output by a corresponding circuit is applied to the ceramic wafer through the conducting rods, the ceramic wafer sends out ultrasonic waves which enter the sound transmission window at a vertical angle, and the ultrasonic waves are transmitted to the sound transmission window through the conducting rods. The novel ceramic wafer structure is a disc-shaped or circular-ring-shaped planar wafer, and the die-casting process and the simple planar coating sintering process are adopted, so that the structure of the spherical self-focusing wafer is simplified, the complexity of the processing process is effectively reduced, and the qualification rate of the wafer is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to ultrasonic transducer technical field, concretely is a kind of solid-state transducer. BACKGROUND

[0002] The transducer assembled with ceramic wafer converts electric energy into ultrasonic wave through matching circuit, and ultrasonic wave acts on patient to realize treatment through mechanical effect, thermal effect and cavitation effect, and spherical self-focusing ultrasonic transducer is commonly used transducer form.

[0003] However, spherical self-focusing ultrasonic transducer needs to grind large ceramic wafer into concave spherical surface, and the processing technology of such wafer is complex and difficult to process, needs to grind plane into spherical surface or bond plane ceramic wafer into spherical structure by grinding machine, so that the rejection rate is higher, the manufacturing cost is higher, meanwhile, the front end medium of spherical self-focusing ceramic wafer of spherical self-focusing transducer and concave lens acoustic lens focusing transducer is concave spherical surface, and intermediate medium with similar acoustic impedance to human tissue is needed when ultrasonic transmission in human body, and such medium can only use liquid due to assembly and adhesion problems, and water is generally used as medium in current market, and water needs to be sealed, so that the assembly process of transducer is complex, the process is difficult, and the labor cost is high. UTILITARY MODEL

[0004] The utility model aims at providing a kind of solid-state transducer to solve the problems in prior art.

[0005] To achieve the above object, the utility model provides the following technical scheme: the solid-state transducer includes solid-state transducer shell, the solid-state transducer shell is provided with sound-transmitting window, the solid-state transducer shell is provided with rubber coating on the side of sound-transmitting window, the side of the solid-state transducer shell away from sound-transmitting window is ceramic wafer mounting surface, the ceramic wafer mounting surface is provided with ceramic wafer, the ceramic wafer is circular ring shaped plane wafer, two conductive rods are symmetrically installed on the ceramic wafer, when the solid-state transducer works, the current outputted through corresponding circuit is applied to ceramic wafer through conductive rod, the collimated ultrasonic wave emitted by ceramic wafer enters into sound-transmitting window at the angle perpendicular to ceramic wafer mounting surface of solid-state transducer, and the ultrasonic wave enters into the object for ultrasonic detection through rubber coating, the novel ceramic wafer structure is disc or circular ring shaped plane wafer, cancels two complex processes of grinding and arc coating sintering in process, only needs to use die casting process and simple plane coating sintering process in original process flow, simplify the structure of spherical self-focusing wafer, effectively reduce the complexity of processing technology, and improve the qualified rate of wafer.

[0006] As a preferred technical scheme, the far side of the ceramic wafer from the encapsulation is a first surface of the ceramic wafer, the near side of the ceramic wafer from the encapsulation is a second surface of the ceramic wafer, the first surface and the second surface of the ceramic wafer are provided with conductive plating layers, there is a plating layer interval between the two conductive plating layers, a larger part of the surface plating layer on the first surface of the ceramic wafer is connected with one conductive rod, a smaller part of the surface plating layer on the first surface of the ceramic wafer is connected with another conductive rod, the smaller part of the surface plating layer on the first surface of the ceramic wafer is connected with the conductive plating layer on the second surface of the ceramic wafer, and the two conductive rods are connected with the metal plating layers on the first surface and the second surface of the ceramic wafer respectively for inputting excitation current.

[0007] As a preferred technical scheme, the encapsulation material is silica gel, according to the propagation characteristics of ultrasonic waves: when sound waves propagate from one medium to another medium, if the acoustic impedance of the two is different, reflection and transmission phenomena will occur on the interface, part of the energy returns to the first medium, and another part of the energy continues to propagate into the second medium, the refraction angle is related to the acoustic impedance, and the silica gel material is selected for the encapsulation, so that the ultrasonic beam can be converged in the process of refraction twice.

[0008] As a preferred technical scheme, the solid-state transducer shell is provided with a glue overflow prevention process groove for glue adding and encapsulation fixation.

[0009] As a preferred technical scheme, the interface between the ceramic wafer and the solid-state transducer shell is a first interface, the interface between the solid-state transducer shell and the encapsulation is a second interface, and the interface between the encapsulation and the external object is a third interface; the collimated ultrasonic waves enter the solid-state transducer shell at an angle perpendicular to the installation plane, so that the ultrasonic waves do not refract at the first interface, the ultrasonic waves pass through the solid-state transducer shell to reach the second interface, the transducer shell and the encapsulation are made of different materials, the acoustic impedance is also different, and the incident angle of the ultrasonic waves relative to the second interface is also not perpendicular, so the ultrasonic waves refract at the second interface.

[0010] As a preferred technical scheme, the shape of the encapsulation at the second interface and the third interface is spherical, which can focus the ultrasonic waves as an acoustic lens, and the double-spherical encapsulation achieves the self-focusing effect of the spherical ceramic wafer.

[0011] Compared with the prior art, the present application has the following advantages:

[0012] 1. The novel wafer structure of the utility model is discoid or annular planar wafer, cancels two complex processes of grinding and arc coating sintering in process, only needs to adopt die casting process and simple planar coating sintering process in original process flow, simplifies the structure of spherical self-focusing wafer, effectively reduces the complexity of processing technology, and improves the qualified rate of wafer.

[0013] 2. The transducer of the utility model does not need to use liquid as intermediate medium, has the advantages of simple process and low processing cost, avoids the concave structure of lens acoustic lens focusing transducer and spherical self-focusing transducer, does not need to use liquid as intermediate medium, does not use liquid as intermediate medium to effectively slow down the oxidation speed of the surface of the ceramic wafer originally in contact with the liquid, prolongs the service life of the ceramic wafer, and does not use liquid as intermediate medium to avoid the risk of liquid leakage, prevents pollution of patients during treatment and increases the difficulty of transportation process.

[0014] 3. The planar wafer structure of the utility model can effectively improve the anti-shock ability of the ceramic wafer and reduce the damage rate caused by the transportation process. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 It is the first perspective structural diagram of the utility model;

[0016] Figure 2 It is the second perspective structural diagram of the utility model;

[0017] Figure 3 It is the first perspective structural diagram of the utility model explosion view;

[0018] Figure 4 It is the second perspective structural diagram of the utility model explosion view;

[0019] Figure 5 It is the sectional structural diagram of the utility model;

[0020] Figure 6 It is the ultrasonic wave beam propagation direction diagram of the utility model.

[0021] In the drawing: 1, solid-state transducer shell; 2, glue coating; 3, anti-glue overflow process tank; 4, ceramic wafer mounting surface; 5, ceramic wafer; 6, ceramic wafer first surface; 7, ceramic wafer second surface; 8, plating layer interval; 9, conductive rod; 10, first boundary surface; 11, second boundary surface; 12, third boundary surface; 13, sound transmission window. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0023] Example: Figures 1-5 As shown, the utility model provides a solid-state transducer technical solution, characterized in that: the solid-state transducer includes a solid-state transducer housing 1, a sound-transmitting window 13 is provided on the solid-state transducer housing 1, and a rubber coating 2 is provided on one side of the sound-transmitting window 13 of the solid-state transducer housing 1. The side of the solid-state transducer housing 1 away from the sound-transmitting window 13 is a ceramic chip mounting surface 4, and a ceramic chip 5 is mounted on the ceramic chip mounting surface 4. The ceramic chip 5 is a disc-shaped or annular flat chip. Two conductive rods 9 are symmetrically mounted on the ceramic chip 5. When the solid-state transducer is working, the electricity output by the corresponding circuit The current is applied to the ceramic chip 5 through the conductive rod 9. The collimated ultrasonic wave emitted by the ceramic chip 5 enters the sound-transmitting window 13 at an angle perpendicular to the ceramic chip mounting surface 4 on the solid-state transducer. The ultrasonic wave then enters the object to be ultrasonically detected through the rubber coating 2. The structure of the new ceramic chip 5 is a disc-shaped or ring-shaped flat chip. The two complex processes of grinding and arc coating sintering are eliminated in the process. Only the die-casting process and the simple flat coating sintering process in the original process flow are required. The structure of the spherical self-focusing chip is simplified, the complexity of the processing technology is effectively reduced, and the qualified rate of the chip is improved.

[0024] The side of the ceramic wafer 5 away from the rubber lagging 2 is the first surface 6 of the ceramic wafer, and the side of the ceramic wafer 5 close to the rubber lagging 2 is the second surface 7 of the ceramic wafer. Conductive coatings are provided on both the first surface 6 and the second surface 7 of the ceramic wafer. There is a coating gap 8 between the two conductive coatings. The coating gap 8 divides the first surface 6 of the ceramic wafer into two areas of different sizes. A part with a large surface coating area on the first surface 6 of the ceramic wafer is connected to a conductive rod 9, and a part with a small surface coating area on the first surface 6 of the ceramic wafer is connected to another conductive rod 9. A part with a small surface coating area on the first surface 6 of the ceramic wafer is connected to the conductive coating on the second surface 7 of the ceramic wafer. Two conductive rods 9 are respectively connected to the metal coatings on the first surface 6 and the second surface 7 of the ceramic wafer for inputting excitation current.

[0025] The material of the rubber coating 2 is silicone. According to the propagation characteristics of ultrasound: when sound waves propagate from one medium to another, if the acoustic impedances of the two are different, reflection and transmission phenomena will occur at their interface, causing part of the energy to return to the first medium, and the other part of the energy to enter the second medium and continue to propagate. When entering from a material with large acoustic impedance to a material with small acoustic impedance, the refraction angle will be smaller than the incident angle. When entering from a material with small acoustic impedance to a material with large acoustic impedance, the refraction angle will be larger than the incident angle. The size of the refraction angle is related to the acoustic impedance of the material. Choosing silicone material for the rubber coating 2 can ensure that the ultrasonic beam can be converged during the two refraction processes.

[0026] The solid-state transducer housing 1 is provided with an anti-overflow glue process groove 3 for adding glue and fixing it with the rubber bag 2.

[0027] like Figure 6 As shown, the interface between the ceramic chip 5 and the solid-state transducer housing 1 is a first interface 10, the interface between the solid-state transducer housing 1 and the rubber coating 2 is a second interface 11, and the interface between the rubber coating 2 and the external object is a third interface 12. The collimated ultrasonic wave enters the solid-state transducer housing 1 at an angle perpendicular to the installation plane. Therefore, the ultrasonic wave is not refracted at the first interface 10. The ultrasonic wave passes through the solid-state transducer housing 1 and reaches the second interface 11. Since the materials of the solid-state transducer housing 1 and the rubber coating 2 are different, the acoustic impedance is also different, and the incident angle of the ultrasonic wave relative to the second interface 11 is also non-perpendicular, the ultrasonic wave is refracted at the second interface 11.

[0028] The shape of the encapsulation 2 at the second boundary surface 11 and the third boundary surface 12 is spherical, and this shape can focus ultrasound as an acoustic lens. The use of the double-spherical encapsulation 2 here achieves the self-focusing effect of the spherical ceramic chip 5.

[0029] The working principle of this utility model:

[0030] When the solid-state transducer is working, the current output by the corresponding circuit is applied to the ceramic chip 5 through the conductive rod 9. The collimated ultrasonic wave emitted by the ceramic chip 5 enters the sound-transmitting window 13 at an angle perpendicular to the ceramic chip mounting surface 4 on the solid-state transducer. The ultrasonic wave then enters the object being ultrasonically detected through the rubber coating 2.

[0031] The new ceramic chip 5 is a disc-shaped or ring-shaped flat chip. The two complex processes of grinding and arc coating and sintering are eliminated. Only the die-casting process and the simple flat coating and sintering process in the original process flow are required. This simplifies the structure of the spherical self-focusing chip, effectively reduces the complexity of the processing technology, and improves the chip qualification rate.

[0032] According to the propagation characteristics of ultrasonic waves: when the sound waves propagate from one medium to another medium, if the acoustic impedance of the two is different, reflection and transmission phenomenon will occur on the interface, part of the energy returns to the first medium, another part of the energy continues to propagate into the second medium, when the sound wave enters from the material with large acoustic impedance into the material with small acoustic impedance, the refraction angle will be smaller than the incident angle, when the sound wave enters from the material with small acoustic impedance into the material with large acoustic impedance, the refraction angle will be larger than the incident angle, the size of the refraction angle is related to the acoustic impedance of the material, the encapsulating 2 selects silica gel material, which can ensure that the ultrasonic beam can be converged in the process of twice refraction.

[0033] The collimated ultrasonic waves enter the solid transducer shell 1 at an angle perpendicular to the installation plane, so that the ultrasonic waves do not refract at the first interface 10, the ultrasonic waves pass through the solid transducer shell 1 to reach the second interface 11, since the materials of the solid transducer shell 1 and the encapsulating 2 are different, the acoustic impedance is also different, and the incident angle of the ultrasonic waves relative to the second interface 11 is also not perpendicular, the ultrasonic waves refract at the second interface 11.

[0034] The shape of the encapsulating 2 at the second interface 11 and the third interface 12 is spherical, which can focus the ultrasonic waves as an acoustic lens, and the double-spherical encapsulating 2 used here achieves the self-focusing effect of the spherical ceramic wafer.

[0035] It is apparent for those skilled in the art that the present application is not limited to the details of the above exemplary embodiments but can be implemented in other embodiments without departing from the spirit or essential characteristics of the application. Consequently, the embodiments are to be considered in all respects as illustrative and not restrictive, the scope of the application being indicated by the appended claims rather than by the above description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. No limitation is intended to the scope of the claims based on any embodiment illustrated in the drawings.

Claims

1. A solid-state transducer, characterized by: The solid-state transducer comprises a solid-state transducer shell (1), the solid-state transducer shell (1) is provided with a sound transmission window (13), the solid-state transducer shell (1) is provided with a glue coating (2) on the side of the sound transmission window (13), the side of the solid-state transducer shell (1) away from the sound transmission window (13) is a ceramic wafer mounting surface (4), the ceramic wafer mounting surface (4) is provided with a ceramic wafer (5), the ceramic wafer (5) is a disc-shaped or ring-shaped planar wafer, and two conductive rods (9) are symmetrically arranged on the ceramic wafer (5).

2. A solid-state transducer according to claim 1, wherein: The side of the ceramic wafer (5) away from the glue coating (2) is a ceramic wafer first surface (6), the side of the ceramic wafer (5) close to the glue coating (2) is a ceramic wafer second surface (7), the ceramic wafer first surface (6) and the ceramic wafer second surface (7) are provided with conductive plating layers, and there is a plating layer interval (8) between the two conductive plating layers, one of the conductive rods (9) is connected to the part with a large surface plating layer area on the ceramic wafer first surface (6), the other conductive rod (9) is connected to the part with a small surface plating layer area on the ceramic wafer first surface (6), and the part with a small surface plating layer area on the ceramic wafer first surface (6) is connected to the conductive plating layer on the ceramic wafer second surface (7).

3. A solid-state transducer according to claim 2, wherein: The glue coating (2) is made of silica gel.

4. A solid-state transducer according to claim 2, wherein: The solid-state transducer shell (1) is provided with a glue overflow prevention process groove (3).

5. A solid-state transducer as claimed in claim 2, wherein: The interface between the ceramic wafer (5) and the solid-state transducer shell (1) is a first interface (10), the interface between the solid-state transducer shell (1) and the glue coating (2) is a second interface (11), and the interface between the glue coating (2) and external objects is a third interface (12).

6. A solid-state transducer according to claim 5, wherein: The shape of the glue coating (2) at the second interface (11) and the third interface (12) is spherical.

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