Lamp panel and display device

Abstract

The utility model provides a lamp panel and a display device. The overline cost of the lamp panel can be reduced. The lamp panel comprises a substrate; the light-emitting layer comprises a plurality of light-emitting elements; the plurality of power supply leads comprise a first power supply lead, and the first power supply lead comprises at least two spaced power supply lead sections; the bridging structure comprises a first conductive structure and a second conductive structure, the first conductive structure is located on the side, away from the substrate, of the first power lead and electrically connected with the power lead section, the second conductive structure is located in the gap, and any two conductive structures are arranged at intervals; the plurality of conductive leads are positioned in the gaps; the conductive connection layer is located on one side, away from the substrate, of the conductive structure and electrically connected with the conductive structure; the insulating material layer is located between the conductive connecting layer and the first power lead; the second conductive structure is electrically connected with the first power lead through the first conductive structure and the conductive connecting layer, one end of the conductive lead is electrically connected with the second conductive structure, and the other end is electrically connected with the light-emitting element.

Description

TECHNICAL FIELD

[0001] Embodiments of the present application relate to the technical field of display, and in particular, to a lamp panel and a display device. BACKGROUND

[0002] With the progress and development of display technology, the application scenarios of lamp panels are more and more extensive, and the requirements for the preparation cost and efficiency of lamp panels are gradually increasing. In a traditional lamp panel, a light-emitting layer includes a plurality of light-emitting units, and light-emitting elements of different colors in the same light-emitting unit are electrically connected to one power supply lead wire to supply power to the light-emitting elements through the power supply lead wire to light up the light-emitting layer.

[0003] However, in the lamp panel of the related art, a plurality of power supply lead wires connected to the same light-emitting unit are usually arranged at intervals on one side of the light-emitting unit, so that when part of the light-emitting elements in the light-emitting unit are electrically connected to the power supply lead wire, part of the power supply lead wire needs to be bridged, thereby increasing the cross-wiring cost of the lamp panel, increasing the cross-wiring difficulty of the lamp panel, and reducing the preparation efficiency of the lamp panel. Inventive Content

[0004] Therefore, the lamp panel and the display device provided by the embodiments of the present application can reduce the cross-wiring cost of the lamp panel, reduce the cross-wiring difficulty of the lamp panel, and improve the preparation efficiency of the lamp panel.

[0005] In a first aspect, the present application provides a lamp panel, comprising:

[0006] a substrate;

[0007] a light-emitting layer located on the light-emitting side of the substrate, the light-emitting layer including a plurality of light-emitting elements, at least two of which are connected to different voltages;

[0008] a plurality of power supply lead wires arranged in the same layer as the light-emitting layer, and the power supply lead wires are arranged at intervals, the power supply lead wires are used to connect power supply signals, different power supply lead wires are connected to different voltages of the power supply signals, and the power supply lead wires include a first power supply lead wire, wherein, in the extension direction of the first power supply lead wire, the first power supply lead wire includes at least two power supply lead wire segments arranged at intervals, and a gap is provided between adjacent power supply lead wire segments;

[0009] a bridging structure, comprising:

[0010] a plurality of conductive structures including a first conductive structure and a second conductive structure, wherein the first conductive structure is located on the side of the first power supply lead wire away from the substrate, the first conductive structure is electrically connected to the power supply lead wire segment, the second conductive structure is arranged in the same layer as the first power supply lead wire, and the second conductive structure is located in the gap, and any two conductive structures are arranged at intervals;

[0011] a plurality of conductive leads, disposed in the same layer as the power leads, the conductive leads being located in the gap, the conductive leads being spaced apart from the power lead segments, and the conductive leads being spaced apart from the conductive structure;

[0012] a conductive connection layer, located on a side of the conductive structure away from the substrate, the first conductive structure and the second conductive structure both being electrically connected to the conductive connection layer;

[0013] an insulating material layer, located between the conductive connection layer and the first power lead, and the insulating material layer being located in the gap, wherein the second conductive structure has the insulating material layer between the second conductive structure and the power lead segments, the second conductive structure has the insulating material layer between the second conductive structure and the conductive leads, and the conductive leads have the insulating material layer between the conductive leads and the power lead segments;

[0014] wherein the second conductive structure is electrically connected to the first power lead through the first conductive structure and the conductive connection layer, one end of the conductive leads is electrically connected to the second conductive structure, and the other end of the conductive leads is electrically connected to the corresponding light-emitting elements, and at least part of the light-emitting elements are electrically connected to the first power lead.

[0015] The above technical solution has the following advantages or technical effects: by dividing the first power lead into at least two power lead segments, the conductive leads can be arranged in the gap between the power lead segments, so that the conductive leads are arranged in the same layer as the power leads. By arranging the conductive connection layer on the side of the conductive structure away from the substrate, the second conductive structure located in the gap can be electrically connected to the first conductive structure electrically connected to the first power lead, and the integration of multiple light-emitting elements can be achieved by arranging multiple second conductive structures. Thus, the electrical connection between the light-emitting elements and the second conductive structure can be achieved, and the electrical connection between the light-emitting elements and the first power lead can be achieved. At the same time, by arranging the insulating material layer, the conductive leads connected to different power leads can be insulated from the conductive connection layer, and short circuits between different power leads can be further avoided. Therefore, by arranging the cross-connection structure, the power signal transmission quality in the lamp panel can be improved, the safety of the lamp panel can be improved, the cross-connection cost of the lamp panel can be saved, the cross-connection difficulty of the lamp panel can be reduced, and the preparation efficiency of the lamp panel can be improved.

[0016] In some embodiments, the lamp panel further comprises:

[0017] an optical structure layer, located on a side of the conductive structure away from the substrate;

[0018] wherein the conductive connection layer is located between the optical structure layer and the conductive structure; or,

[0019] The conductive connection layer is located on a side of the optical structure layer away from the conductive structure, the optical structure layer comprises a through hole, and the conductive structure and the conductive connection layer are electrically connected through the through hole.

[0020] The technical scheme has the following advantages or technical effects: the optical structure layer is arranged to adjust the light emitted by the light-emitting layer, thereby improving the light-emitting effect and light-emitting quality of the lamp panel; and the relative positions of the optical structure layer and the conductive connection layer can be adjusted according to the light emission requirement.

[0021] In some embodiments, the power supply lead further comprises a second power supply lead.

[0022] Part of the light-emitting elements are electrically connected to the first power supply lead through the conductive structure, and the other part of the light-emitting elements are electrically connected to the second power supply lead.

[0023] The technical scheme has the following advantages or technical effects: the power supply lead comprises the second power supply lead, different light-emitting elements can be powered by the first power supply lead and the second power supply lead respectively, thereby improving the brightness uniformity of the light-emitting layer and the display effect of the lamp panel.

[0024] In some embodiments, the second power supply lead is located on a side of the light-emitting element away from the first power supply lead.

[0025] The technical scheme has the following advantages or technical effects: the first power supply lead and the second power supply lead are arranged on two sides of the light-emitting element respectively, the length of the connecting line between the second power supply lead and the light-emitting element is shortened, the complexity of the surface wiring of the insulating material layer is reduced, the risk of short circuit between different power supply leads is reduced, the surface area of the insulating material layer is reduced, the cross-connection cost of the lamp panel is reduced, the preparation difficulty of the lamp panel is reduced, and the preparation efficiency of the lamp panel is improved.

[0026] In some embodiments, the second power supply lead is located on a side of the first power supply lead away from the light-emitting element.

[0027] The technical scheme has the following advantages or technical effects: all the power supply leads electrically connected to the light-emitting element are arranged on one side of the light-emitting element, the distance between different power supply leads is reduced, the arrangement space of the light-emitting element is increased, the number of light-emitting elements in the light-emitting layer is increased, the resolution of the lamp panel is improved, and the display effect of the lamp panel is improved.

[0028] In some embodiments, the cross-connection structure further comprises:

[0029] A plurality of metal wires are arranged in the same layer as the power lead and are located in the gap, the metal wires are insulated from the conductive structure, and the metal wires and the conductive lead have the insulating material layer therebetween.

[0030] The light-emitting element includes a first light-emitting element and a second light-emitting element, the first light-emitting element is electrically connected to the first power lead through the conductive structure, and the second light-emitting element is electrically connected to the second power lead through the metal wire.

[0031] The above technical solution has the following advantages or technical effects: by arranging the metal wire in the jumper structure, one end of the metal wire is electrically connected to the second power lead located on the side of the first power lead away from the light-emitting element, and the other end of the metal wire is electrically connected to the second light-emitting element, so that the metal wire is located in the gap. Thus, the first power lead and the second power lead can be prevented from being short-circuited, and the second power lead and the second light-emitting element can be directly connected. The integration quality of the jumper structure can be improved, the power signal transmission quality in the lamp panel can be improved, the safety of the lamp panel can be improved, the jumper cost of the lamp panel can be further saved, the jumper difficulty of the lamp panel can be reduced, and the preparation efficiency of the lamp panel can be improved.

[0032] In some embodiments, the insulating material layer has no overlap with the second power lead towards the base.

[0033] The above technical solution has the following advantages or technical effects: the surface of the second power lead can be exposed relative to the surface of the first power lead, so that the metal wire in the jumper structure can be directly electrically connected to the second power lead, the jumper cost of the lamp panel can be further saved, the jumper difficulty of the lamp panel can be reduced, and the preparation efficiency of the lamp panel can be improved.

[0034] In some embodiments, the light-emitting layer includes a first light-emitting unit and a second light-emitting unit, the first light-emitting unit is located on a first side of the second power lead, and the second light-emitting unit is located on a second side of the second power lead.

[0035] The jumper structure includes two, and the two jumper structures are located on the first side and the second side of the second power lead, respectively.

[0036] The above technical solution has the following advantages or technical effects: by arranging the second power lead between the two jumper structures, the first light-emitting unit and the second light-emitting unit are symmetrically arranged on both sides of the power lead, the occupied space of the power lead in the lamp panel can be reduced, the number of light-emitting elements in the light-emitting layer can be further increased, the resolution of the lamp panel can be improved, and the display effect of the lamp panel can be improved.

[0037] In some embodiments, the second power supply lead includes two, and the second light emitting element in the first light emitting unit and the second light emitting element in the second light emitting unit are respectively electrically connected with different second power supply leads.

[0038] The above technical solution has the following advantages or technical effects: by arranging the second power supply lead between the two cross-connection structures, the first light emitting unit and the second light emitting unit are symmetrically arranged on both sides of the power supply lead, which can reduce the occupied space of the power supply lead in the lamp panel, further increase the number of light emitting elements in the light emitting layer, thereby improving the resolution of the lamp panel and the display effect of the lamp panel.

[0039] In some embodiments, the second power supply lead includes one, and the second light emitting element in the first light emitting unit and the second light emitting element in the second light emitting unit are electrically connected with the same second power supply lead.

[0040] The above technical solution has the following advantages or technical effects: by making the first light emitting unit and the second light emitting unit on different sides of the second power supply lead share one second power supply lead, one second power supply lead can be saved, the preparation cost of the lamp panel is reduced, and the distance between the first light emitting unit and the second light emitting unit can be further shortened, which facilitates increasing the number of light emitting elements in the light emitting layer, thereby improving the resolution of the lamp panel and the display effect of the lamp panel.

[0041] In some embodiments, the two cross-connection structures on both sides of the second power supply lead are arranged in alignment.

[0042] The above technical solution has the following advantages or technical effects: by arranging the two cross-connection structures on both sides of the second power supply lead in alignment, the cross-connection distance between different cross-connection structures can be shortened when the conductive structures in the opposite two cross-connection structures need to be electrically connected, which further improves the integration degree of the cross-connection structure.

[0043] In some embodiments, the two cross-connection structures on both sides of the second power supply lead are arranged in alternation.

[0044] The above technical solution has the following advantages or technical effects: by arranging the two cross-connection structures on both sides of the second power supply lead in alternation, the space occupied by the second power supply lead can be further reduced, the distance between the first light emitting unit and the second light emitting unit can be further shortened, which facilitates increasing the number of light emitting elements in the light emitting layer, thereby improving the resolution of the lamp panel and the display effect of the lamp panel.

[0045] In some embodiments, the light-emitting layer comprises a plurality of light-emitting units, each of the light-emitting units comprising a plurality of light-emitting elements of different colors, and at least one of the second conductive structures is electrically connected to the light-emitting elements of the same color in the plurality of light-emitting units.

[0046] The above technical solution has the following advantages or technical effects: by sharing the same conductive structure by a plurality of light-emitting elements, the number of conductive structures can be reduced, thereby saving the space occupied by the cross-connection structure, and the preparation cost of the cross-connection structure can be saved, and further the cross-connection cost of the lamp panel can be saved.

[0047] In some embodiments, the plurality of light-emitting units connected to the same second conductive structure are located on the same side of the first power supply lead.

[0048] The above technical solution has the following advantages or technical effects: by connecting the light-emitting elements of the same color in the plurality of light-emitting units to the same conductive structure, the sharing of the conductive structure can be achieved, and the number of conductive structures can be further reduced, thereby saving the space occupied by the cross-connection structure, and the preparation cost of the cross-connection structure can be saved, and further the cross-connection cost of the lamp panel can be saved.

[0049] In some embodiments, part of the light-emitting units connected to the same second conductive structure are located on the first side of the first power supply lead, and another part of the light-emitting units are located on the second side of the first power supply lead.

[0050] The above technical solution has the following advantages or technical effects: by connecting the light-emitting elements of the same color in the light-emitting units located on different sides of the first power supply lead to the same conductive structure, the light-emitting units located on different sides of the first power supply lead can share a set of first power supply leads and the conductive structures electrically connected thereto, thereby further reducing the spacing between the light-emitting units distributed on both sides of the first power supply lead, facilitating the increase of the density of the arrangement of light-emitting elements in the light-emitting layer, and further improving the resolution of the lamp panel. Further, the preparation cost of the first power supply lead and the conductive structure can be further reduced, the preparation cost of the lamp panel can be reduced, the preparation speed of the lamp panel can be accelerated, and the preparation efficiency of the lamp panel can be improved.

[0051] In some embodiments, when the light-emitting elements of the same color in the light-emitting units located on different sides of the first power supply lead are all connected to the same second conductive structure, the number of the first power supply leads in the power supply lead is equal to the number of the light-emitting elements in the light-emitting unit.

[0052] The technical scheme has the following advantages or technical effects: by setting the number of the first power supply lead wires equal to the number of the light emitting elements in the light emitting units, the light emitting elements with the same light emitting color in different light emitting units can fully share one first power supply lead wire and one set of conductive structures, the integration capability of the bridging structure is further improved, the utilization rate of the first power supply lead wire and the conductive structure is improved, the density of the arrangement of the light emitting elements in the light emitting layer is facilitated to be improved, the resolution of the lamp panel is further improved, the preparation cost of the first power supply lead wire and the conductive structure is further reduced, the preparation cost of the lamp panel is reduced, the preparation speed of the lamp panel is accelerated, and the preparation efficiency of the lamp panel is improved.

[0053] In some embodiments, the bridging structure comprises at least two sets of conductive structures, and the conductive structures in different sets of conductive structures are respectively electrically connected with different first power supply lead wires.

[0054] The sets of conductive structures are arranged at intervals, and the conductive structures in the same set of conductive structures are arranged at intervals along the extension direction of the first power supply lead wire.

[0055] The technical scheme has the following advantages or technical effects: by setting multiple sets of conductive structures, the electrical connection between the conductive structures and the first power supply lead wire is facilitated, the accuracy of the connection between the conductive structures and the first power supply lead wire is improved, the preparation difficulty of the lamp panel is reduced, and the preparation efficiency of the lamp panel is improved.

[0056] In some embodiments, in the extension direction of the first power supply lead wire, the spacing between adjacent second conductive structures is greater than the width dimension of the second conductive structure.

[0057] The technical scheme has the following advantages or technical effects: by increasing the spacing of the conductive structures in the extension direction of the first power supply lead wire, the wiring space between the conductive structures is increased, the risk of short circuit between different power supply lead wires is reduced, the reliability, stability and safety of the light emitting layer are improved, and the service life of the lamp panel is prolonged.

[0058] In some embodiments, the lamp panel further comprises:

[0059] A driving chip is provided in the same layer as the light emitting layer, the driving chip is electrically connected with the light emitting elements, and the driving chip is used to drive the light emitting elements to emit light.

[0060] The technical scheme has the following advantages or technical effects: by setting the driving chip to drive the light emitting elements to emit light, the accuracy of the light emitting elements to emit light is improved, and the display quality is improved.

[0061] The second aspect of the embodiments of the present application provides a lamp panel, comprising:

[0062] A substrate;

[0063] a light emitting layer located at the light emitting side of the substrate, the light emitting layer comprising a plurality of light emitting elements, the light emitting elements comprising first light emitting elements and second light emitting elements, at least two of the light emitting elements being connected to different voltages;

[0064] a plurality of power supply leads arranged in the same layer as the light emitting layer, the power supply leads being arranged at intervals, the power supply leads being used to connect to power supply signals, different power supply leads being connected to power supply signals of different voltages, the power supply leads comprising first power supply leads and second power supply leads, the second power supply leads being located on the side of the first power supply leads away from the substrate, wherein, in the extension direction of the first power supply leads, the first power supply leads comprise at least two power supply lead segments arranged at intervals, the adjacent power supply lead segments having gaps therebetween;

[0065] a bridging structure comprising:

[0066] a plurality of conductive structures comprising first conductive structures and second conductive structures, wherein the first conductive structures are located on the side of the first power supply leads away from the substrate, the first conductive structures being electrically connected to the power supply lead segments, the second conductive structures being arranged in the same layer as the first power supply leads, and the second conductive structures being located in the gaps, any two of the conductive structures being arranged at intervals;

[0067] a plurality of conductive leads arranged in the same layer as the power supply leads, the conductive leads being located in the gaps, the conductive leads being arranged at intervals from the power supply lead segments, and the conductive leads being arranged at intervals from the conductive structures;

[0068] a conductive connection layer located on the side of the conductive structures away from the substrate, the first conductive structures and the second conductive structures being electrically connected to the conductive connection layer;

[0069] an insulating material layer located between the conductive connection layer and the first power supply leads, and the insulating material layer being located in the gaps, wherein the second conductive structures and the power supply lead segments have the insulating material layer therebetween, the second conductive structures and the conductive leads have the insulating material layer therebetween, and the conductive leads and the power supply lead segments have the insulating material layer therebetween;

[0070] a plurality of metal traces arranged in the same layer as the power supply leads, and the metal traces being located in the gaps, the metal traces being insulated from the conductive structures, and the metal traces and the conductive leads having the insulating material layer therebetween;

[0071] The second conductive structure is electrically connected with the first power lead through the first conductive structure and the conductive connection layer, one end of the conductive lead is electrically connected with the second conductive structure, and the other end is electrically connected with the corresponding first light emitting element, and the second light emitting element is electrically connected with the second power lead through the metal trace.

[0072] The technical scheme has the following advantages or technical effects: by dividing the first power lead into at least two power lead segments, the conductive lead can be arranged in the gap between the power lead segments, so that the conductive lead is arranged in the same layer as the power lead. By arranging the conductive connection layer on the side of the conductive structure away from the substrate, the second conductive structure in the gap can be electrically connected with the first conductive structure electrically connected to the first power lead, and multiple second conductive structures can be arranged to realize the integration of multiple light emitting elements. Thus, the light emitting unit can be electrically connected with the first power lead by electrically connecting the light emitting element with the second conductive structure. Meanwhile, by arranging the insulating material layer, the conductive lead connected to different power leads can be insulated from the conductive connection layer, further avoiding short circuit between different power leads. In addition, by arranging the metal trace in the cross-connection structure, one end of the metal trace is electrically connected with the second power lead on the side of the first power lead away from the light emitting element, and the other end of the metal trace is electrically connected with the second light emitting element, so that the metal trace is located in the gap. Thus, the first power lead and the second power lead can be prevented from being short-circuited, and the second power lead can be directly connected with the second light emitting element. The cross-connection cost of the lamp panel can be further saved, the cross-connection difficulty of the lamp panel can be reduced, and the preparation efficiency of the lamp panel can be improved. Therefore, by arranging the cross-connection structure, the power signal transmission quality in the lamp panel can be improved, the safety of the lamp panel can be improved, the cross-connection cost of the lamp panel can be saved, the cross-connection difficulty of the lamp panel can be reduced, and the preparation efficiency of the lamp panel can be improved.

[0073] In a third aspect, the embodiment of the present application provides a display device, comprising:

[0074] The lamp panel as described in any one of the above first aspects.

[0075] The technical scheme has the following advantages or technical effects: by dividing the first power supply lead into at least two power supply lead segments, the gap between the power supply lead segments can be used to arrange the conductive lead, so that the conductive lead is arranged in the same layer as the power supply lead. By arranging the conductive connection layer on the side of the conductive structure away from the base, the second conductive structure in the gap can be electrically connected to the first conductive structure electrically connected to the first power supply lead, and the integration of multiple light emitting elements can be achieved by arranging multiple second conductive structures. Thus, the light emitting elements and the second conductive structure can be electrically connected to realize the electrical connection between the light emitting unit and the first power supply lead. At the same time, by arranging the insulating material layer, the conductive lead connected to different power supply leads and the conductive connection layer can be insulated, further avoiding short circuit between different power supply leads. Therefore, by arranging the cross-connection structure, the power signal transmission quality in the lamp panel can be improved, the safety of the lamp panel can be improved, the cross-connection cost of the lamp panel can be saved, the cross-connection difficulty of the lamp panel can be reduced, and the preparation efficiency of the lamp panel can be improved. BRIEF DESCRIPTION OF DRAWINGS

[0076] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the related art, the drawings needed to be used in the description of the embodiments of the present application or the related art will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other related drawings can be obtained without creative labor.

[0077] Figure 1 A schematic structural diagram of a lamp panel is provided for the embodiments of the present application.

[0078] Figure 2 A schematic cross-sectional view of a lamp panel is provided for the embodiments of the present application.

[0079] Figure 3 Another schematic cross-sectional view of a lamp panel is provided for the embodiments of the present application.

[0080] Figure 4 Another schematic structural diagram of a lamp panel is provided for the embodiments of the present application.

[0081] Figure 5 Another schematic structural diagram of a lamp panel is provided for the embodiments of the present application.

[0082] Figure 6 Another schematic structural diagram of a lamp panel is provided for the embodiments of the present application.

[0083] Figure 7 A schematic structural diagram of a lamp panel is provided for the embodiments of the present application.

[0084] Figure 8Another schematic structural diagram of a lamp plate provided by an embodiment of the present application is shown in FIG. 6;

[0085] Figure 9 Another schematic structural diagram of a lamp plate provided by an embodiment of the present application is shown in FIG. 6;

[0086] Figure 10 Another schematic structural diagram of a lamp plate provided by an embodiment of the present application is shown in FIG. 6;

[0087] Figure 11 Another schematic structural diagram of a lamp plate provided by an embodiment of the present application is shown in FIG. 6;

[0088] Figure 12 Another schematic structural diagram of a lamp plate provided by an embodiment of the present application is shown in FIG. 6;

[0089] Figure 13 Another schematic structural diagram of a lamp plate provided by an embodiment of the present application is shown in FIG. 6;

[0090] Figure 14 Another schematic structural diagram of a lamp plate provided by an embodiment of the present application is shown in FIG. 6;

[0091] Figure 15 Another schematic structural diagram of a lamp plate provided by an embodiment of the present application is shown in FIG. 6;

[0092] Figure 16 Another schematic structural diagram of a lamp plate provided by an embodiment of the present application is shown in FIG. 6.

[0093] Legend of reference signs:

[0094] 100, substrate; 200, light-emitting layer; 201, light-emitting element; 2011, first light-emitting element; 2012, second light-emitting element; 210, light-emitting unit; 211, first light-emitting unit; 212, second light-emitting unit; 300, power supply lead; 310, first power supply lead; 320, second power supply lead; 400, bridging structure; 410, conductive structure; 411, first conductive structure; 412, second conductive structure; 420, conductive lead; 430, conductive connection layer; 440, insulating material layer; 450, metal trace; 500, optical structure layer; 600, driving chip; 700, hub structure; 1000, lamp plate. DETAILED DESCRIPTION

[0095] In order to facilitate the understanding of the present application, the present application will be described more fully below with reference to the accompanying drawings. The embodiments of the present application are shown in the accompanying drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present application more thorough and comprehensive.

[0096] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description herein is for describing particular embodiments only and is not intended to be limiting of the application.

[0097] It will be understood that when an element or layer is referred to as being "on" or "connected to" another element or layer, it can be directly on or connected to the other element or layer or intervening elements or layers can be present. In contrast, when an element is referred to as being "directly on" or "directly connected to" another element or layer, there are no intervening elements or layers present. It will also be understood that, although the terms first, second, third, etc. can be used herein to describe various elements, components, regions, layers and / or sections, these elements, components, regions, layers and / or sections should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section; for example, a first doped type could be termed a second doped type; and, similarly, a second doped type could be termed a first doped type; a first doped type and a second doped type are different doped types, e.g., a first doped type can be P-type and a second doped type can be N-type, or a first doped type can be N-type and a second doped type can be P-type.

[0098] Spatially relative terms, such as "beneath", "below", "lower", "under", "above", "upper" and the like, can be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use and / or operation in addition to the orientations depicted in the figures. For example, if a device in the figures is turned over, elements described as "below" or "beneath" other elements or features would then be oriented "above" or "over" the other elements or features. Thus, the exemplary term "below" can encompass both an orientation of above and below. The device can also be oriented in the other direction, and the spatially relative terms used herein are intended to encompass such additional orientations. It is to be understood that the spatially relative terms used herein, including up, down, top, bottom, front, back, leading, trailing, left, right, over, under, above, below, under, lower, upper, and the like, are intended for the device's use in the particular orientation as shown in the figures. It will be appreciated that the spatially relative terms are intended to encompass different orientations of the device in use and / or operation in addition to the orientations depicted in the figures. For example, if a device in the figures is turned over, elements described as "below" or "beneath" other elements or features would then be oriented "above" or "over" the other elements or features. Therefore, the exemplary term "below" can encompass both an orientation of above and below. The device can also be oriented in the other direction, and the spatially relative terms used herein are intended to encompass such additional orientations.

[0099] As used herein, the singular forms "a", "an" and "the" include plural referents unless the context clearly dictates otherwise. It will be further understood that the terms "comprises", "comprising", "includes" and / or "including", or the like, when used in this specification, specify the presence of stated features, integers, steps, operations, components, parts, or the like, but do not preclude the presence or addition of one or more other features, integers, steps, operations, components, parts, or the like.

[0100] It should be noted that the light-emitting layer generally includes a plurality of light-emitting units, and each light-emitting unit includes at least two light-emitting elements with different light-emitting colors, and the light-emitting elements with different light-emitting colors are connected to different power supply leads. Since the power supply leads are arranged on one side of the light-emitting elements in sequence, when connected to different power supply leads, the connection lines need to be jumpered. In the related art lamp panel, a jumper patch is generally provided at each jumper point to insulate the connection lines from other power supply leads.

[0101] However, the number of jumper patches required in the related art lamp panel is large, and needs to be prepared separately, which increases the jumper cost, and at the same time, causes the preparation time of the lamp panel to be long, the preparation difficulty to be large, and the preparation efficiency of the lamp panel to be affected.

[0102] Therefore, it is a technical problem to be solved at present to provide a lamp panel which can reduce the jumper cost of the lamp panel, reduce the jumper difficulty of the lamp panel, and improve the preparation efficiency of the lamp panel.

[0103] As shown in Figure 1 and Figure 2 The first aspect of the embodiment of the present application provides a lamp panel, comprising a substrate 100.

[0104] In some possible implementation manners, the lamp panel comprises a light-emitting layer 200; the light-emitting layer 200 is located on the light-emitting side of the substrate 100, and the light-emitting layer 200 includes a plurality of light-emitting elements 201, and at least two light-emitting elements 201 are connected to different voltages.

[0105] Exemplarily, the light-emitting colors of the plurality of light-emitting elements 201 can be different, and the light-emitting colors of the light-emitting elements 201 can include red, green and blue.

[0106] In some possible implementation manners, the lamp panel comprises a plurality of power supply leads 300, the plurality of power supply leads 300 are disposed in the same layer as the light-emitting layer 200, and the power supply leads 300 are disposed at intervals, the power supply leads 300 are used to connect to power supply signals, different power supply leads 300 are connected to power supply signals with different voltages, and the power supply leads 300 include a first power supply lead 310.

[0107] Exemplarily, the power supply lead 300 can include a plurality of first power supply leads 310, the light emitting elements 201 electrically connected to the same first power supply lead 310 have the same light emitting color, and the light emitting elements 201 electrically connected to different first power supply leads 310 can have the same or different light emitting colors.

[0108] In some possible implementations, in the extension direction of the first power supply lead 310, the first power supply lead 310 includes at least two spaced-apart power supply lead segments, and there is a gap between adjacent power supply lead segments.

[0109] Exemplarily, in the extension direction of the first power supply lead 310, the size of the gap between adjacent power supply lead segments is positively correlated with the number of the second conductive structures 412, and in the extension direction of the first power supply lead 310, the size of the gap between adjacent power supply lead segments is positively correlated with the number of the first power supply leads 310.

[0110] In some possible implementations, the lamp panel includes a bridging structure 400, and the bridging structure 400 includes a plurality of conductive structures 410 including first conductive structures 411 and second conductive structures 412, wherein the first conductive structures 411 are located on the side of the first power supply lead 310 away from the substrate 100, the first conductive structures 411 are electrically connected to the power supply lead segments, the second conductive structures 412 are arranged in the same layer as the first power supply lead 310, and the second conductive structures 412 are located in the gap, and any two conductive structures 410 are spaced apart.

[0111] Exemplarily, there is at least one second conductive structure 412 between two adjacent first conductive structures 411.

[0112] In some possible implementations, the bridging structure 400 further includes a plurality of conductive leads 420 arranged in the same layer as the power supply lead 310, the conductive leads 420 are located in the gap, the conductive leads 420 are spaced apart from the power supply lead segments, and the conductive leads 420 are spaced apart from the conductive structures 410.

[0113] In some possible implementations, the bridging structure 400 further includes a conductive connection layer 430 located on the side of the conductive structures 410 away from the substrate 100, and the first conductive structures 411 and the second conductive structures 412 are electrically connected to the conductive connection layer 430.

[0114] Exemplarily, the orthogonal projection of the conductive connection layer 430 toward the substrate 100 can partially overlap with the orthogonal projection of the first power supply lead 310 toward the substrate 100, or the orthogonal projection of the conductive connection layer 430 toward the substrate 100 can not overlap with the orthogonal projection of the first power supply lead 310 toward the substrate 100.

[0115] In some feasible embodiments, the jumper structure 400 also includes an insulating material layer 440, located between the conductive connection layer 430 and the first power lead 310, and the insulating material layer 440 is located in the gap, wherein there is an insulating material layer 440 between the second conductive structure 412 and the power lead segment, there is an insulating material layer 440 between the second conductive structure 412 and the conductive lead 420, and there is an insulating material layer 440 between the conductive lead 420 and the power lead segment.

[0116] In some feasible embodiments, the second conductive structure 412 is electrically connected to the first power lead 310 through the first conductive structure 411 and the conductive connection layer 430, one end of the conductive lead 420 is electrically connected to the second conductive structure 412, and the other end is electrically connected to the corresponding light-emitting element 200, and at least some of the light-emitting elements 200 are electrically connected to the first power lead 310.

[0117] For example, Figure 1 As shown, a conductive structure 410 is electrically connected to a light-emitting element 201. Multiple conductive structures 410 electrically connected to different first power leads 310 are arranged in a straight line. Arranging multiple conductive structures 410 in a straight line can reduce the spacing between adjacent conductive structures 410 in the direction of extension of the first power lead 310, thereby achieving a dense arrangement of the conductive structures 410. This can reduce the area of ​​the insulating material layer 440 and improve the integration capability of the jumper structure.

[0118] For example, Figure 4 As shown, a conductive structure 410 is electrically connected to a light-emitting element 201. The multiple conductive structures 410 electrically connected to different first power leads 310 are arranged in a staircase pattern. This staircase arrangement of the conductive structures 410 increases the spacing between adjacent conductive structures 410 electrically connected to the same first power lead 310, facilitating the passage of electrical wiring between the conductive structures 410 and the light-emitting element 201. This reduces the wiring complexity of the wiring and further reduces the risk of short circuits on the light panel.

[0119] For example, the insulating material layer 440 may be made of a composite material of epoxy resin and glass fiber, wherein the composite material has a flame retardant grade of FR-4. The conductive structure 410 may be made of tin.

[0120] The lamp panel provided by the embodiment of the present application can set the conductive lead 420 in the gap between the power lead segments by dividing the first power lead 310 into at least two power lead segments, so that the conductive lead 420 is arranged in the same layer as the power lead 300. The second conductive structure 412 in the gap can be electrically connected to the first conductive structure 411 electrically connected to the first power lead 310 by arranging the conductive connection layer 430 on the side of the conductive structure 410 away from the substrate 100, so that the integration of multiple light emitting elements can be achieved by arranging multiple second conductive structures 412. Thus, the light emitting element 201 can be electrically connected to the first power lead 310 by electrically connecting the light emitting element 201 to the second conductive structure. Meanwhile, the conductive lead 420 connected to different power leads 300 can be insulated from the conductive connection layer 430 by arranging the insulating material layer 440, further avoiding short circuit between different power leads. Therefore, by arranging the cross-connection structure 400, the power signal transmission quality in the lamp panel can be improved, the safety of the lamp panel can be improved, the cross-connection cost of the lamp panel can be saved, the cross-connection difficulty of the lamp panel can be reduced, and the preparation efficiency of the lamp panel can be improved.

[0121] As shown in Figure 2 some possible embodiments, the lamp panel further comprises an optical structure layer 500 located on the side of the conductive structure 410 away from the substrate.

[0122] Exemplarily, the optical structure layer 500 can include a glass substrate, and can also include a light guide plate and a light diffusion layer, etc.

[0123] In some possible embodiments, the conductive connection layer 430 is located between the optical structure layer 500 and the conductive structure 410.

[0124] Exemplarily, the conductive structure 410 can be a pad, and can be directly electrically connected to the conductive connection layer 430 by welding.

[0125] As shown in Figure 3 some possible embodiments, the conductive connection layer 430 is located on the side of the optical structure layer 500 away from the conductive structure 410, the optical structure layer 500 includes a through hole, and the conductive structure 410 is electrically connected to the conductive connection layer 430 through the through hole.

[0126] Exemplarily, the electrical connection between the conductive structure 410 and the conductive connection layer 430 can be formed by a metal interconnection process.

[0127] The lamp panel provided by the embodiment of the present application can adjust the light emitted by the light emitting layer 200 by arranging the optical structure layer 500, further improving the light emitting effect and light emitting quality of the lamp panel. The relative position of the optical structure layer 500 and the conductive connection layer 430 can be set according to the light emission requirement.

[0128] As Figure 5 shown in the figure, in some possible implementation manners, the power supply lead 300 further includes a second power supply lead 320.

[0129] In some possible implementation manners, part of the light emitting elements 201 are electrically connected to the first power supply lead 310 through the conductive structure 410, and the other part of the light emitting elements 201 are electrically connected to the second power supply lead 320.

[0130] Exemplarily, the light emitting elements 201 electrically connected to the first power supply lead 310 are of different colors from the light emitting elements 201 electrically connected to the second power supply lead 320. The power supply signal on the first power supply lead 310 can be different from the power supply signal on the second power supply lead 320.

[0131] The lamp panel provided by the embodiment of the present application can improve the brightness uniformity of the light emitting layer 200 by respectively supplying power to different light emitting elements through the first power supply lead 310 and the second power supply lead 320, and further improve the display effect of the lamp panel.

[0132] As Figure 6 shown in the figure, in some possible implementation manners, the second power supply lead 320 is located on the side of the light emitting element 201 away from the first power supply lead 310.

[0133] The lamp panel provided by the embodiment of the present application can shorten the length of the connecting line between the second power supply lead 320 and the light emitting element 201 by respectively arranging the first power supply lead 310 and the second power supply lead 320 on the two sides of the light emitting element 201, reduce the complexity of the surface wiring of the insulating material layer 440, further reduce the risk of short circuit between different power supply leads, thereby reducing the surface area of the insulating material layer 440, reducing the cross-connection cost of the lamp panel, reducing the preparation difficulty of the lamp panel, and improving the preparation efficiency of the lamp panel.

[0134] As Figure 5 shown in the figure, in some possible implementation manners, the second power supply lead 320 is located on the side of the first power supply lead 310 away from the light emitting element 201.

[0135] The lamp panel provided by the embodiment of the present application can facilitate reducing the spacing between different power supply leads 300 by arranging all the power supply leads 300 electrically connected to the light emitting element 201 on one side of the light emitting element 201, further increase the arrangement space of the light emitting element 201, thereby increasing the number of light emitting elements in the light emitting layer 200, improving the resolution of the lamp panel, and further improving the display effect of the lamp panel.

[0136] As Figure 5 and Figure 6As shown, in some possible implementation manners, the bridging structure 400 further includes a plurality of metal wires 450, which are arranged on the same layer as the power supply lead 300, and the metal wires 450 are located in the gap, the metal wires 450 are insulated from the conductive structure 410, and the metal wires 450 and the conductive lead 420 are provided with the insulating material layer 440.

[0137] For example, the first power supply lead 310 can include a plurality of power supply leads, and the second power supply lead 320 has and only one power supply lead.

[0138] In some possible implementation manners, the light-emitting element 201 includes a first light-emitting element 2011 and a second light-emitting element 2012, the first light-emitting element 2011 is electrically connected to the first power supply lead 310 through the conductive structure 410, and the second light-emitting element 2012 is electrically connected to the second power supply lead 320 through the metal wire 450.

[0139] The lamp panel provided by the embodiment of the present application can make the metal wire 450 in the gap by arranging the metal wire 450 in the bridging structure 400, electrically connecting one end of the metal wire 450 to the second power supply lead 320 located on the side of the first power supply lead 310 away from the light-emitting element 201, and electrically connecting the other end of the metal wire 450 to the second light-emitting element 2012, so as to prevent the first power supply lead 310 from being short-circuited with the second power supply lead 320, and realize the direct connection of the second power supply lead 320 and the second light-emitting element 2012. The integration quality of the bridging structure 400 can be improved, the power signal transmission quality in the lamp panel can be improved, the safety of the lamp panel can be improved, the bridging cost of the lamp panel can be further saved, the bridging difficulty of the lamp panel can be reduced, and the preparation efficiency of the lamp panel can be improved.

[0140] In some possible implementation manners, the orthographic projection of the insulating material layer 440 towards the substrate 100 does not overlap with the orthographic projection of the second power supply lead 320 towards the substrate 100.

[0141] The lamp panel provided by the embodiment of the present application can make the surface of the second power supply lead 320 exposed relative to the surface of the first power supply lead 310, so as to facilitate the direct electrical connection between the metal wire 450 in the bridging structure 400 and the second power supply lead 320, further save the bridging cost of the lamp panel, reduce the bridging difficulty of the lamp panel, and thus improve the preparation efficiency of the lamp panel.

[0142] As shown in the figures, Figure 7 As shown, in some possible implementation manners, the light-emitting layer 200 includes a first light-emitting unit 211 and a second light-emitting unit 212. The first light-emitting unit 211 is located on the first side of the second power supply lead 320, and the second light-emitting unit 212 is located on the second side of the second power supply lead 320.

[0143] In some feasible implementations, the bridge structure 400 includes two bridge structures 400 , which are located on the first side and the second side of the second power lead 320 , respectively.

[0144] The lamp board provided in the embodiment of the present application can reduce the space occupied by the power lead 300 in the lamp board by arranging the second power lead 320 between the two jumper structures 400, so that the first light-emitting unit 211 and the second light-emitting unit 212 are symmetrically arranged on both sides of the power lead 300. The number of light-emitting elements 201 in the light-emitting layer 200 can be further increased, thereby improving the resolution of the lamp board and improving the display effect of the lamp board.

[0145] like Figure 7 As shown, in some feasible embodiments, the second power leads 320 include two, and the second light-emitting element 2012 in the first light-emitting unit 211 and the second light-emitting element 2012 in the second light-emitting unit 212 are electrically connected to different second power leads 320 respectively.

[0146] The lamp board provided in the embodiment of the present application can reduce the space occupied by the power leads in the lamp board and further increase the number of light-emitting elements in the light-emitting layer, thereby improving the resolution of the lamp board and the display effect of the lamp board.

[0147] like Figure 8 As shown, in some feasible embodiments, the second power lead 320 includes one, and the second light-emitting element 2012 in the first light-emitting unit 211 and the second light-emitting element 2012 in the second light-emitting unit 212 are both electrically connected to the same second power lead 320 .

[0148] For example, multiple first power leads 310 may be provided on both sides of the second power lead 320, wherein the number of first power leads 310 on different sides is equal to the number of first light-emitting elements 2011 in the light-emitting unit 210 on that side. The second light-emitting elements 2012 electrically connected to the same second power lead 320 emit the same color.

[0149] The lamp board provided in the embodiment of the present application can save one second power lead 320 and reduce the preparation cost of the lamp board by making the first light-emitting unit 211 and the second light-emitting unit 212 located on different sides of the second power lead 320 share a second power lead 320. It can also further shorten the distance between the first light-emitting unit 211 and the second light-emitting unit 212, which is convenient for increasing the number of light-emitting elements 201 in the light-emitting layer 200, thereby improving the resolution of the lamp board and improving the display effect of the lamp board.

[0150] As shown in Figure 7 and Figure 8 In some possible implementation manners, the two jumper structures 400 located on the two sides of the second power supply lead 320 are arranged in alignment.

[0151] The lamp panel provided by the embodiment of the present application can shorten the jumper distance between different jumper structures 400 when the conductive structures 410 in the two opposite jumper structures 400 need to be electrically connected, and further improve the integration degree of the jumper structures 400.

[0152] As shown in Figure 9 In some possible implementation manners, the two jumper structures 400 located on the two sides of the second power supply lead 320 are arranged in alternation.

[0153] The lamp panel provided by the embodiment of the present application can further reduce the space occupied by the second power supply lead 320, further shorten the distance between the first light emitting unit 211 and the second light emitting unit 212, facilitate increasing the number of light emitting elements 201 in the light emitting layer 200, thereby improving the resolution of the lamp panel and improving the display effect of the lamp panel.

[0154] As shown in Figure 11 In some possible implementation manners, the light emitting layer 200 includes a plurality of light emitting units 210.

[0155] In some possible implementation manners, the light emitting unit 210 includes a plurality of light emitting elements 201 of different colors.

[0156] Exemplarily, one light emitting unit 210 includes at least two light emitting elements 201 of different colors.

[0157] In some possible implementation manners, the at least one second conductive structure 412 is electrically connected with the light emitting elements 201 of the same color in the plurality of light emitting units 210 respectively.

[0158] It should be noted that the light emitting elements 201 of different colors include different semiconductor materials, thereby resulting in different voltages required for lighting of the light emitting elements 201 of different colors. Therefore, the light emitting elements 201 of different colors need to be electrically connected with different power supply leads to obtain different voltages, so as to ensure the brightness uniformity of the light emitting layer 200.

[0159] The lamp panel provided by the embodiments of the present application can reduce the number of the second conductive structures 412, thereby saving the space occupied by the cross-connection structure 400, saving the preparation cost of the cross-connection structure, and further saving the cross-connection cost of the lamp panel.

[0160] As shown in Figure 11 In some possible embodiments, the plurality of light emitting units 210 connected to the same second conductive structure 412 are located on the same side of the first power supply lead 310.

[0161] The lamp panel provided by the embodiments of the present application can reduce the number of the second conductive structures 412, thereby saving the space occupied by the cross-connection structure 400, saving the preparation cost of the cross-connection structure, and further saving the cross-connection cost of the lamp panel.

[0162] As shown in Figure 12 In some possible embodiments, part of the light emitting units 210 connected to the same second conductive structure 412 are located on the first side of the first power supply lead 310, and another part of the light emitting units 210 are located on the second side of the first power supply lead 310.

[0163] The lamp panel provided by the embodiments of the present application can reduce the number of the second conductive structures 412, thereby saving the space occupied by the cross-connection structure 400, saving the preparation cost of the cross-connection structure, and further saving the cross-connection cost of the lamp panel.

[0164] As shown in Figure 12 In some possible embodiments, in the case that the light emitting elements 201 of the same color in the light emitting units 210 located on different sides of the first power supply lead 310 are connected to the same second conductive structure 412, the number of the first power supply leads 310 in the power supply lead 300 is equal to the number of the light emitting elements 201 in the light emitting units 210.

[0165] Exemplarily, in the case that the number of the light emitting elements 201 in the light emitting units 210 distributed on different sides of the first power supply lead 310 is not equal, the number of the first power supply lead 310 between the light emitting units 210 on different sides is equal to the maximum number of the light emitting elements 201 in the light emitting units 210.

[0166] The lamp panel provided by the embodiment of the present application can make the light emitting elements 201 of the same color in different light emitting units 210 fully share one first power supply lead 310 and one group of second conductive structures 412, further improve the integration capability of the cross-connection structure 400, improve the utilization rate of the first power supply lead 310 and the second conductive structure 412, facilitate to improve the density of the arrangement of the light emitting elements 201 in the light emitting layer 200, further improve the resolution of the lamp panel, further reduce the preparation cost of the first power supply lead 310 and the second conductive structure 412, reduce the preparation cost of the lamp panel, speed up the preparation speed of the lamp panel, and improve the preparation efficiency of the lamp panel.

[0167] As shown in Figure 13 In some possible embodiments, the cross-connection structure 400 includes at least two groups of conductive structures.

[0168] Exemplarily, the conductive structures 410 in different groups of conductive structures can be aligned with each other or staggered. The number of the conductive structures 410 in different groups of conductive structures can be different. The number of the groups of conductive structures can be equal to the number of the colors of the light emitting elements 201.

[0169] In some possible embodiments, the conductive structures 410 in different groups of conductive structures are respectively electrically connected with different first power supply leads 310.

[0170] Exemplarily, different groups of conductive structures can share one insulating material layer 440, or different groups of conductive structures can correspond to different insulating material layers 440.

[0171] In some possible embodiments, the groups of conductive structures are arranged at intervals, and the conductive structures 410 in the same group of conductive structures are arranged at intervals along the extension direction of the first power supply lead 310.

[0172] The lamp panel provided by the embodiment of the present application can facilitate the electrical connection between the conductive structures 410 and the first power supply lead 310, improve the accuracy of the connection between the conductive structures 410 and the first power supply lead 310, thereby reducing the preparation difficulty of the lamp panel and improving the preparation efficiency of the lamp panel.

[0173] As shown in Figure 2As shown in FIG. 1, in some possible implementation manners, the spacing L1 between the adjacent second conductive structures 412 in the extension direction of the first power lead 310 is greater than the width dimension L2 of the second conductive structure 412.

[0174] It should be noted that if the spacing of the second conductive structures 412 in the extension direction of the first power lead 310 is too small, the wire spacing between the second conductive structures 412 is insufficient, and the second conductive structures 412 can be electrically connected to the metal wires around the second conductive structures 412, which further increases the risk of short circuit between different power leads, thereby affecting the reliability, stability and safety of the light-emitting layer 200.

[0175] The lamp panel provided by the embodiment of the present application can increase the spacing of the second conductive structures 412 in the extension direction of the first power lead 310, increase the wire spacing between the second conductive structures 412, and reduce the risk of short circuit between different power leads, thereby improving the reliability, stability and safety of the light-emitting layer 200 and prolonging the service life of the lamp panel.

[0176] As shown in FIG. 1, in some possible implementation manners, the lamp panel further includes a driving chip 600. The driving chip 600 is disposed in the same layer as the light-emitting layer 200, the driving chip 600 is electrically connected to the light-emitting element 201, and the driving chip 600 is configured to drive the light-emitting element 201 to emit light. Figure 1 Figures 3 to 6 As shown in FIG. 1, in some possible implementation manners, the lamp panel further includes a driving chip 600. The driving chip 600 is disposed in the same layer as the light-emitting layer 200, the driving chip 600 is electrically connected to the light-emitting element 201, and the driving chip 600 is configured to drive the light-emitting element 201 to emit light.

[0177] For example, one driving chip 600 can be used to control one light-emitting element 201 to emit light, can be used to control all light-emitting elements 201 in one light-emitting unit 210 to emit light, or can be used to control all light-emitting elements 201 in a plurality of light-emitting units 210 to emit light.

[0178] The lamp panel provided by the embodiment of the present application can drive the light-emitting element 201 to emit light through the driving chip 600, thereby improving the accuracy of light emission of the light-emitting element 201 and improving the display quality.

[0179] As shown in FIG. 1, in some possible implementation manners, the lamp panel further includes a driving chip 600. The driving chip 600 is disposed in the same layer as the light-emitting layer 200, the driving chip 600 is electrically connected to the light-emitting element 201, and the driving chip 600 is configured to drive the light-emitting element 201 to emit light. Figure 14 As shown in FIG. 1, in some possible implementation manners, the lamp panel further includes a driving chip 600. The driving chip 600 is disposed in the same layer as the light-emitting layer 200, the driving chip 600 is electrically connected to the light-emitting element 201, and the driving chip 600 is configured to drive the light-emitting element 201 to emit light.

[0180] ​The lamp panel provided by the embodiment of the present application can reduce the number of conductive structures 410 and metal traces 450, thereby reducing the size of the insulating material layer 440, further reducing the cross-connection cost of the lamp panel, reducing the cross-connection difficulty, and improving the preparation efficiency of the lamp panel.

[0181] As shown in Figure 15 The second aspect of the embodiment of the present application provides a lamp panel, comprising: a substrate 100.

[0182] In some possible implementation manners, the lamp panel comprises a light-emitting layer 200; the light-emitting layer 200 is located on the light-emitting side of the substrate 100, the light-emitting layer 200 comprises first light-emitting elements 2011 and second light-emitting elements 2012, and the voltage of the at least two light-emitting elements 201 is different.

[0183] In some possible implementation manners, the lamp panel comprises a plurality of power supply leads 300; the plurality of power supply leads 300 are arranged in the same layer as the light-emitting layer 200, and the power supply leads 300 are arranged at intervals, the power supply leads 300 are used for accessing power supply signals, the voltage of the power supply signals accessed by different power supply leads 300 is different, the power supply leads 300 comprise first power supply leads 310 and second power supply leads 320, and the second power supply leads 320 are located on the side of the first power supply leads 310 away from the light-emitting elements 201.

[0184] In some possible implementation manners, in the extension direction of the first power supply leads 310, the first power supply leads 310 comprise at least two power supply lead segments arranged at intervals, and the adjacent power supply lead segments have gaps therebetween.

[0185] In some possible implementation manners, the lamp panel comprises a cross-connection structure 400; the cross-connection structure 400 comprises: a plurality of conductive structures 410, comprising first conductive structures 411 and second conductive structures 412, wherein the first conductive structures 411 are located on the side of the first power supply leads 310 away from the substrate 100, the first conductive structures 411 are electrically connected with the power supply lead segments, the second conductive structures 412 are arranged in the same layer as the first power supply leads 310, and the second conductive structures 412 are located in the gaps, and any two conductive structures 410 are arranged at intervals.

[0186] In some possible implementation manners, the cross-connection structure 400 further comprises a plurality of conductive leads 420 arranged in the same layer as the power supply leads 310, the conductive leads 420 are located in the gaps, the conductive leads 420 are arranged at intervals with the power supply lead segments, and the conductive leads 420 are arranged at intervals with the conductive structures 410.

[0187] In some possible embodiments, the bridging structure 400 further comprises a conductive connection layer 430 located on the side of the conductive structure 410 away from the substrate 100, and the first conductive structure 411 and the second conductive structure 412 are both electrically connected to the conductive connection layer 430.

[0188] In some possible embodiments, the bridging structure 400 further comprises an insulating material layer 440 located between the conductive connection layer 430 and the first power lead 310, and the insulating material layer 440 is located in the gap, wherein the second conductive structure 412 and the power lead segment are separated by the insulating material layer 440, the second conductive structure 412 and the conductive lead 420 are separated by the insulating material layer 440, and the conductive lead 420 and the power lead segment are separated by the insulating material layer 440.

[0189] In some possible embodiments, the bridging structure 400 further comprises a plurality of metal traces 450 arranged in the same layer as the power lead 300, and the metal traces 450 are located in the gap, the metal traces 450 are insulated from the conductive structure 410, and the metal traces 450 and the conductive lead 420 are separated by the insulating material layer 440.

[0190] In some possible embodiments, the second conductive structure 412 is electrically connected to the first power lead 310 through the first conductive structure 411 and the conductive connection layer 430, one end of the conductive lead 420 is electrically connected to the second conductive structure 412, the other end is electrically connected to the corresponding first light emitting element 2011, and the second light emitting element 2012 is electrically connected to the second power lead 230 through the metal traces 450.

[0191] The lamp panel provided by the embodiments of the present application can set the conductive lead 420 in the gap between the power lead segments by dividing the first power lead 310 into at least two power lead segments, so that the conductive lead 420 is arranged in the same layer as the power lead 300. The first conductive structure 411 electrically connected to the first power lead 310 and the second conductive structure 412 in the gap can be electrically connected by arranging the conductive connection layer 430 on the side of the conductive structure 410 away from the substrate 100, so that the integration of multiple light emitting elements can be achieved by arranging multiple second conductive structures 412. The light emitting element 201 and the second conductive structure can be electrically connected, so that the light emitting element 201 and the first power lead 310 are electrically connected. The conductive lead 420 connected to different power leads 300 and the conductive connection layer 430 can be insulated by arranging the insulating material layer 440, so as to further avoid short circuit between different power leads. In addition, the metal trace 450 is arranged in the cross-connection structure 400, one end of the metal trace 450 is electrically connected to the second power lead 320 on the side of the first power lead 310 away from the light emitting element 201, and the other end of the metal trace 450 is electrically connected to the second light emitting element 2012, so that the metal trace 450 is in the gap. Thus, the first power lead 310 and the second power lead 320 can be prevented from being short-circuited, and the second power lead 320 and the second light emitting element 2012 can be directly connected. The integration quality of the cross-connection structure 400 can be improved, the power signal transmission quality in the lamp panel can be improved, the safety of the lamp panel can be improved, the cross-connection cost of the lamp panel can be further saved, the cross-connection difficulty of the lamp panel can be reduced, and the preparation efficiency of the lamp panel can be improved. Therefore, by arranging the cross-connection structure 400, the power signal transmission quality in the lamp panel can be improved, the safety of the lamp panel can be improved, the cross-connection cost of the lamp panel can be saved, the cross-connection difficulty of the lamp panel can be reduced, and the preparation efficiency of the lamp panel can be improved.

[0192] As shown in Figure 16 The third aspect of the embodiments of the present application provides a display device, which comprises the lamp panel 1000 according to any one of the first aspect.

[0193] The display device provided by the embodiment of the present application can set the conductive lead 420 in the gap between the power lead segments by dividing the first power lead 310 into at least two power lead segments, so that the conductive lead 420 is arranged in the same layer as the power lead 300. The first conductive structure 411 electrically connected to the first power lead 310 and the second conductive structure 412 in the gap can be electrically connected by arranging the conductive connection layer 430 on the side of the conductive structure 410 away from the substrate 100, so that the integration of multiple light emitting elements can be achieved by arranging multiple second conductive structures 412. Thus, the light emitting element 201 and the first power lead 310 can be electrically connected by electrically connecting the light emitting element 201 and the second conductive structure. Meanwhile, the conductive lead 420 connected to different power leads 300 and the conductive connection layer 430 can be insulated by arranging the insulating material layer 440, further avoiding short circuit between different power leads. Therefore, by arranging the cross-connection structure 400, the power signal transmission quality in the lamp panel 1000 can be improved, the safety of the lamp panel 1000 can be improved, the cross-connection cost of the lamp panel 1000 can be saved, the cross-connection difficulty of the lamp panel 1000 can be reduced, and the preparation efficiency of the lamp panel 1000 can be improved.

[0194] In the description of the present specification, the description of the terms "some embodiments", "other embodiments", "ideal embodiments", and the like means that the specific features, structures, materials, or characteristics described in combination with the embodiments or examples are included in at least one embodiment or example of the present application. In the present specification, the illustrative description of the above terms does not necessarily refer to the same embodiment or example.

[0195] The technical features of the above-described embodiments can be combined in any manner. To make the description concise, all possible combinations of the technical features of the above-described embodiments are not described, but as long as the combinations of the technical features do not contradict, they should be considered within the scope of the present application.

[0196] The above-described embodiments only express several implementation manners of the present application, and the description is more specific and detailed, but it should not be understood as a limitation on the patent application scope. It should be noted that for ordinary skilled persons in the art, without departing from the concept of the present application, a number of modifications and improvements can be made, which are within the protection scope of the present application. Therefore, the patent protection scope of the present application should be subject to the appended claims.

Claims

1. A light panel, characterized in that The lamp panel comprises: a substrate; a light-emitting layer located on the light-emitting side of the substrate, the light-emitting layer comprising a plurality of light-emitting elements, at least two of the light-emitting elements being connected to different voltages; a plurality of power supply leads arranged in the same layer as the light-emitting layer, the power supply leads being spaced apart, the power supply leads being used to connect to power supply signals, different power supply leads being connected to power supply signals of different voltages, the power supply leads comprising a first power supply lead, wherein, in the extension direction of the first power supply lead, the first power supply lead comprises at least two power supply lead segments arranged at intervals, and there is a gap between adjacent power supply lead segments; a bridging structure comprising: a plurality of conductive structures comprising a first conductive structure and a second conductive structure, wherein the first conductive structure is located on the side of the first power supply lead away from the substrate, the first conductive structure is electrically connected to the power supply lead segment, the second conductive structure is arranged in the same layer as the first power supply lead, and the second conductive structure is located in the gap, and any two of the conductive structures are arranged at intervals; a plurality of conductive leads arranged in the same layer as the power supply leads, the conductive leads being located in the gap, the conductive leads being arranged at intervals with the power supply lead segments and being arranged at intervals with the conductive structures; a conductive connection layer located on the side of the conductive structure away from the substrate, the first conductive structure and the second conductive structure being electrically connected to the conductive connection layer; an insulating material layer located between the conductive connection layer and the first power supply lead, and the insulating material layer being located in the gap, wherein the second conductive structure and the power supply lead segment have the insulating material layer therebetween, the second conductive structure and the conductive lead have the insulating material layer therebetween, and the conductive lead and the power supply lead segment have the insulating material layer therebetween; wherein the second conductive structure is electrically connected to the first power supply lead through the first conductive structure and the conductive connection layer, one end of the conductive lead is electrically connected to the second conductive structure, and the other end is electrically connected to the corresponding light-emitting element, and at least part of the light-emitting elements are electrically connected to the first power supply lead.

2. The lamp panel of claim 1, wherein, Further comprising: an optical structure layer located on the side of the conductive structure away from the substrate; wherein the conductive connection layer is located between the optical structure layer and the conductive structure; or, the conductive connection layer is located on the side of the optical structure layer away from the conductive structure, the optical structure layer comprises a through hole, and the conductive structure and the conductive connection layer are electrically connected through the through hole.

3. The lamp panel according to claim 1, wherein: the power supply leads further comprise a second power supply lead; part of the light-emitting elements are electrically connected to the first power supply lead through the conductive structure, and another part of the light-emitting elements are electrically connected to the second power supply lead.

4. The lamp panel of claim 3, wherein, The second power supply lead is located on the side of the light-emitting element away from the first power supply lead.

5. The lamp panel of claim 4, wherein, The second power supply lead is located on the side of the first power supply lead away from the light-emitting element.

6. The lamp panel of claim 5, wherein, The bridging structure further comprises: a plurality of metal traces are disposed in the same layer as the power leads and are located in the gap, the metal traces are insulated from the conductive structures, and the metal traces and the conductive leads are separated by the layer of insulating material; the light emitting elements include first light emitting elements and second light emitting elements, the first light emitting elements are electrically connected to the first power leads through the conductive structures, and the second light emitting elements are electrically connected to the second power leads through the metal traces.

7. The lamp panel of claim 6, wherein a projection of the layer of insulating material onto the substrate does not overlap a projection of the second power leads onto the substrate.

8. The lamp panel of claim 6, wherein the light emitting layer includes first light emitting units and second light emitting units, the first light emitting units are located on a first side of the second power leads, and the second light emitting units are located on a second side of the second power leads; the bridging structures include two, and the two bridging structures are located on the first side and the second side of the second power leads, respectively.

9. The lamp panel of claim 8, wherein the second power leads include two, and the second light emitting elements in the first light emitting units and the second light emitting elements in the second light emitting units are electrically connected to different second power leads, respectively; or the second power leads include one, and the second light emitting elements in the first light emitting units and the second light emitting elements in the second light emitting units are electrically connected to the same second power lead.

10. The lamp panel of claim 8, wherein the two bridging structures located on both sides of the second power leads are aligned; or the two bridging structures located on both sides of the second power leads are staggered.

11. The lamp panel of claim 1, wherein the light emitting layer includes a plurality of light emitting units, the light emitting units include a plurality of light emitting elements of different colors, and at least one second conductive structure is electrically connected to the light emitting elements of the same color in a plurality of light emitting units.

12. The lamp panel of claim 11, wherein the plurality of light emitting units connected to the same second conductive structure are located on the same side of the first power leads.

13. The lamp panel of claim 11, wherein part of the light emitting units connected to the same second conductive structure are located on a first side of the first power leads, and another part of the light emitting units are located on a second side of the first power leads.

14. The lamp panel of claim 13, wherein in the case that the light emitting elements of the same color in the light emitting units located on different sides of the first power leads are connected to the same second conductive structure, the number of the first power leads is equal to the number of the light emitting elements in the light emitting units.

15. The lamp panel of claim 1, wherein The cross-connection structure comprises at least two groups of conductive structures, and the conductive structures in different groups of conductive structures are respectively electrically connected with different first power supply leads; The conductive structures in each group of conductive structures are arranged at intervals, and the conductive structures in the same group of conductive structures are arranged at intervals along the extension direction of the first power supply lead.

16. The lamp panel of claim 1, wherein, In the extension direction of the first power supply lead, the interval between adjacent second conductive structures is greater than the width dimension of the second conductive structure.

17. The lamp panel of claim 1, wherein, Further comprising: A driving chip, which is arranged in the same layer as the light-emitting layer, is electrically connected with the light-emitting element, and is used to drive the light-emitting element to emit light.

18. A light panel characterized by Comprise: A substrate; A light-emitting layer located on the light-emitting side of the substrate, the light-emitting layer comprising a plurality of light-emitting elements, the light-emitting elements comprising first light-emitting elements and second light-emitting elements, at least two light-emitting elements being connected to different voltages; A plurality of power supply leads arranged in the same layer as the light-emitting layer and arranged at intervals, the power supply leads being used to connect to power supply signals, different power supply leads connecting to power supply signals of different voltages, the power supply leads comprising first power supply leads and second power supply leads, the second power supply leads being located on the side of the first power supply leads away from the light-emitting elements, wherein, in the extension direction of the first power supply leads, the first power supply leads comprise at least two power supply lead segments arranged at intervals, and adjacent power supply lead segments have gaps therebetween; A cross-connection structure comprising: A plurality of conductive structures comprising first conductive structures and second conductive structures, wherein the first conductive structures are located on the side of the first power supply leads away from the substrate, the first conductive structures are electrically connected with the power supply lead segments, the second conductive structures are arranged in the same layer as the first power supply leads and are located in the gaps, and any two conductive structures are arranged at intervals; A plurality of conductive leads arranged in the same layer as the power supply leads, the conductive leads being located in the gaps, the conductive leads being arranged at intervals with the power supply lead segments and being arranged at intervals with the conductive structures; A conductive connection layer located on the side of the conductive structures away from the substrate, the first conductive structures and the second conductive structures being electrically connected with the conductive connection layer; An insulating material layer located between the conductive connection layer and the first power supply leads, and the insulating material layer being located in the gaps, wherein the second conductive structures have the insulating material layer between the power supply lead segments, the second conductive structures have the insulating material layer between the conductive leads, and the conductive leads have the insulating material layer between the power supply lead segments; A plurality of metal tracks arranged in the same layer as the power supply leads and located in the gaps, the metal tracks being insulated from the conductive structures and having the insulating material layer between the metal tracks and the conductive leads; The second conductive structure is electrically connected with the first power supply lead through the first conductive structure and the conductive connection layer, one end of the conductive lead is electrically connected with the second conductive structure, the other end is electrically connected with the corresponding first light emitting element, and the second light emitting element is electrically connected with the second power supply lead through the metal trace.

19. A display device comprising: Comprising: The light panel of any one of claims 1 to 17.

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