Precise temperature control system for semiconductor welding equipment

Abstract

The utility model relates to a precise temperature control system for semiconductor welding equipment, and relates to the technical field of semiconductor device welding equipment. The precise temperature control system comprises a temperature controller, a mounting seat and a heating platform, wherein the mounting seat and the heating platform are oppositely arranged up and down; the heating platform can reciprocate towards the direction of the mounting seat; heating assemblies are mounted in the mounting seat and the heating platform; liquid flow circulation passages are further arranged in the mounting base and the heating platform, the heating assembly can heat liquid in the liquid flow circulation passages, and the liquid flow circulation passages further communicate with a liquid cooling pipeline assembly used for injecting cooling liquid; a plurality of temperature sensors are arranged in the mounting seat and the heating platform, and are electrically connected with the temperature controller. According to the application, the temperature change of different positions can be monitored in real time by arranging the plurality of temperature sensors, and the uniformity and stability of the temperature of the whole system are ensured.

Description

TECHNICAL FIELD

[0001] The application relates to the technical field of semiconductor welding equipment, in particular to a precision temperature control system for semiconductor welding equipment. BACKGROUND

[0002] Semiconductor welding equipment is commonly used to connect chips to AMB substrates and is one of the indispensable devices in the preparation process of semiconductor devices.

[0003] In the field of semiconductor manufacturing, the application of a precision temperature control system is crucial for ensuring product quality and production efficiency. During the semiconductor welding process, the temperature needs to be precisely controlled. If the temperature is too low, the stable and reliable connection between the chip and the substrate cannot be achieved. If the temperature is too high, the chip is likely to be damaged. In existing precision temperature control systems, in order to achieve high-precision temperature control, various methods and technical means are usually adopted. Common solutions include the use of high-precision temperature sensors and heating elements, combined with a PID control algorithm for temperature adjustment. In addition, some systems also adopt a multi-point temperature monitoring method, which uses temperature sensors distributed at different positions to real-time feedback the temperature changes at each point, so as to more accurately adjust the heating power.

[0004] With the development of technology, the size of semiconductor devices is continuously decreasing, and related welding equipment is also becoming smaller and more precise. At the same time, the requirements for temperature control are becoming higher and higher, requiring higher precision and stability to ensure the smooth progress of the semiconductor device production process. The existing precision temperature control system still has some deficiencies when applied to semiconductor welding equipment, which cannot meet the strict requirements for temperature uniformity and consistency during the semiconductor welding process. In addition, these systems are often complex in structure, large in size, and high in cost, making it difficult to be widely promoted and applied. CONTENT OF THE INVENTION

[0005] In order to improve the uniformity and consistency of the temperature during the semiconductor welding process and ensure the compactness of the overall structure, the application provides a precision temperature control system for semiconductor welding equipment.

[0006] The precision temperature control system for semiconductor welding equipment provided by the application adopts the following technical solution:

[0007] A precision temperature control system for semiconductor welding equipment, comprising a temperature controller, an upper and lower oppositely arranged mounting seat and a heating platform, the heating platform can reciprocate towards the mounting seat direction; the mounting seat and the heating platform are both internally provided with a heating assembly;

[0008] The mounting seat and the heating platform are both internally provided with a liquid flow circulation passage, the heating assembly can heat the liquid in the liquid flow circulation passage, and the liquid flow circulation passage is also connected with a liquid cooling pipe assembly for injecting cooling liquid;

[0009] The mounting seat and the heating platform are each provided with a plurality of temperature sensors, which are electrically connected to the temperature controller.

[0010] In use, the semiconductor device to be welded is placed on the heating platform, and after the heating platform moves towards the mounting seat, the semiconductor device to be welded is clamped between the mounting seat and the heating platform, and the heating components inside the mounting seat and the heating platform are heated synchronously to provide sufficient and uniform temperature for welding.

[0011] By adopting the above technical solutions, the combination of the heating component and the liquid flow circulation passage in the present application can preheat, and the system can quickly reach the set temperature in a short time, and at the same time, the liquid cooling pipe component is used to realize rapid cooling, so as to ensure accurate temperature control and improve work efficiency. The precise temperature control system in the present application can monitor the temperature changes at different positions in real time by arranging a plurality of temperature sensors inside the heating platform and the mounting seat, so as to ensure the uniformity and stability of the temperature of the whole system. In the present application, the heating component, the liquid flow circulation passage and the temperature sensor are arranged inside the mounting seat and the heating platform, which has high integration and compact structure, can ensure efficient heat conduction, and can greatly reduce the volume of the whole device, which can be used in semiconductor precise welding equipment and realize real-time temperature control with high precision and high stability.

[0012] Optionally, the heating platform is provided with a first brass substrate, the heating component in the heating platform includes at least three heating rods, the heating rods are laid on the first brass substrate near the upper side, and all the heating rods are distributed at intervals; and the liquid flow circulation passage in the heating platform is arranged near the lower side of the first brass substrate.

[0013] The thermal conductivity of the first brass substrate can reach 123 W / (m.K); by adopting the above technical solutions, the high thermal conductivity of the first brass substrate ensures uniform heat distribution, improves heating efficiency and temperature stability. The plurality of heating rods are laid and arranged at intervals, so that the heating area is more uniform, and local overheating phenomenon is avoided.

[0014] Optionally, the liquid flow circulation passage in the heating platform includes a plurality of straight holes opened in the first brass substrate and a connecting elbow connecting adjacent two straight holes, and the connecting elbow is located outside the first brass substrate and is used to connect the ports of adjacent two straight holes.

[0015] By adopting the above technical solutions, the liquid flow circulation passage in the heating platform is designed in the form of a plurality of straight holes and connecting elbows, which is convenient for processing and ensures that the cooling liquid can flow uniformly in the first brass substrate, thereby improving the cooling efficiency and the stability of temperature control.

[0016] Optionally, the temperature sensors in the heating platform are at least three, at least two of which are arranged at the same height level as the heating rods and in the area between two adjacent heating rods, and at least one is arranged above the heating rods.

[0017] By adopting the above technical solution, the temperature difference between the heating rods can be monitored in real time to ensure temperature uniformity. The above layout enables the temperature sensors to comprehensively cover the key areas of the heating platform, improving the reliability and stability of temperature monitoring, thereby ensuring the working performance of the semiconductor soldering equipment.

[0018] Optionally, the length direction of the heating rods is arranged along the length direction of the first brass substrate, the length direction of the straight hole is arranged along the width direction of the first brass substrate, and the temperature sensors in the heating platform are distributed on the two adjacent sides of the first brass substrate.

[0019] By adopting the above technical solution, the heating rods and the liquid circulation passage are reasonably arranged on the first brass substrate, making the heating more uniform and the cooling more efficient, improving the precision and stability of temperature control. At the same time, the temperature sensors are distributed on the two adjacent sides of the first brass substrate, which can comprehensively monitor the temperature changes at different positions of the heating platform, ensuring the accuracy and reliability of temperature control.

[0020] Optionally, a second brass substrate is arranged in the mounting seat, the heating assembly in the mounting seat includes at least three heating rods, the heating rods are laid in the second brass substrate and are distributed at intervals, and the liquid circulation passage in the mounting seat is arranged on the lower side of the second brass substrate.

[0021] By adopting the above technical solution, the high thermal conductivity of the second brass substrate ensures uniform heat distribution, improves heating efficiency and temperature stability, and improves the precision and response speed of temperature control, meeting the requirements of semiconductor soldering equipment for high-precision temperature control.

[0022] Optionally, the heating rods are electric heating rods, and peripheral plates are fixedly arranged on the outer sides of the mounting seat, one of the peripheral plates is fixedly provided with an aviation connector electrically connected with the heating rods.

[0023] By adopting the above technical solution, reliable power supply and safety protection of the heating rods are realized, ensuring the stability and safety of the heating rods during operation.

[0024] Optionally, the temperature sensors are PT100 sensors, and the temperature controller adopts a PID controller.

[0025] By adopting the above technical scheme, the PT100 sensor is matched with the PID controller to realize automatic adjustment and display of the temperature, operation is simple, human intervention is reduced, and the system automation degree is improved. The system in the application is provided with a temperature upper limit alarm function, when the temperature exceeds the set upper limit, the temperature controller will issue an alarm to timely remind the operator to take measures to prevent equipment damage or safety accidents.

[0026] In summary, the present application includes at least one of the following beneficial technical effects:

[0027] 1. The combination design of the heating assembly and the liquid flow circulation path in the present application can preheat and enable the system to quickly reach the set temperature in a short time, and at the same time, the liquid cooling pipe assembly realizes rapid cooling, ensures accurate temperature control, and improves work efficiency.

[0028] 2. The precision temperature control system in the present application can monitor the temperature changes at different positions in real time by arranging multiple temperature sensors inside the heating platform and the mounting seat, ensuring the uniformity and stability of the temperature of the entire system.

[0029] 3. The heating assembly, liquid flow circulation path and temperature sensor are arranged inside the mounting seat and heating platform in the present application, which has high integration and compact structure, can ensure efficient temperature conduction, and can greatly reduce the volume of the entire device, can be used in semiconductor precision welding equipment, and can realize real-time temperature control with high precision and stability.

[0030] 4. The combination of the temperature sensor and the PID controller in the present application realizes automatic adjustment and display of the temperature, operation is simple, human intervention is reduced, and the system automation degree is improved. BRIEF DESCRIPTION OF DRAWINGS

[0031] Figure 1 is a schematic view of the three-dimensional structure of the semiconductor welding equipment.

[0032] Figure 2 is a schematic view of the mounting structure of the precision temperature control system in the present application.

[0033] Figure 3 is a front view of the mounting structure of the precision temperature control system in the present application.

[0034] Figure 4 is a schematic view of the three-dimensional structure of the heating platform in the present application.

[0035] Figure 5 is a schematic view of the three-dimensional structure of the mounting seat in the present application.

[0036] Figure 6 is a schematic view of the sectional structure of the mounting seat in the present application.

[0037] In the figure:

[0038] 10, temperature controller; 20, mounting seat; 21, second brass base plate; 22, peripheral plate; 23, aviation joint; 30, heating platform; 31, first brass base plate; 40, heating assembly; 41, heating rod; 50, liquid flow circulation passage; 51, straight hole; 52, connecting elbow; 60, liquid cooling pipe assembly; 70, temperature sensor; 80, rack; 90, casing; 100, guide rod; 110, base; 120, driving member; 130, multi-modal pressure head assembly; 131, pressing block; 140, upper computer. DETAILED DESCRIPTION

[0039] The technical solutions in the embodiments of the present application will be described below with reference to the accompanying drawings. Figure 1 The accompanying drawings are used to further illustrate the present application. Figure 6 The technical solutions in the embodiments of the present application will be described below with reference to the accompanying drawings. The embodiments described are only possible technical implementations of the present application, and are not all possible implementations. Those skilled in the art can easily obtain other embodiments by combining the embodiments of the present application without creative labor, and these embodiments are also within the protection scope of the present application.

[0040] The present precision temperature control system can be applied to semiconductor welding equipment, and can also be applied to aerospace, medical equipment, telecommunications equipment, industrial equipment and other industries, and in this embodiment, it is applied to a nanosilver sintering device for semiconductor devices.

[0041] Referring to FIGS. 1-3, Figure 1 , Figure 2 and Figure 3 The precision temperature control system provided by the present embodiment is applied to semiconductor welding equipment, and in particular to a nanosilver sintering device for semiconductor device preparation, using nanosilver as a connecting substrate for connecting chips and AMB substrates in semiconductor devices. The nanosilver sintering device includes a rack 80 and a casing 90 covering the outside of the rack 80; the rack 80 is provided with a vertical guide rod 100, the guide rod 100 is slidably provided with a base 110, the bottom of the base 110 is provided with a driving member 120 such as an air cylinder or a hydraulic cylinder, for driving the base 110 to move up and down on the guide rod 100; a multi-modal pressure head assembly 130 is provided above the guide rod 100, the multi-modal pressure head assembly 130 includes a pressing block 131, which needs to be heated, and during the semiconductor device welding process, the pressing block 131 is pressed on the corresponding chip, maintaining a certain pressure, and during this process, a certain temperature is applied to the nanosilver between the chip and the AMB substrate, so that the nanosilver is sintered in solid phase, forming a densified connection structure, thereby stably connecting the chip and the AMB substrate.

[0042] Referring to FIGS. 1-3, Figure 3 , Figure 4 and Figure 5As shown, the precision temperature control system in the application includes a temperature controller 10, a mounting seat 20 and a heating platform 30. The heating platform 30 is arranged on the base 110 and can move up and down with the base 110. The mounting seat 20 is part of a multi-modal indenter assembly 130. The mounting seat 20 is arranged opposite to the heating platform 30. The mounting seat 20 is used to install the pressing block 131 of the multi-modal indenter assembly 130 and heat it.

[0043] Referring to Figure 4 , Figure 5 and Figure 6 As shown, the heating platform 30 and the mounting seat 20 in the application are both internally provided with a heating assembly 40. The heating platform 30 is internally provided with a first brass substrate 31, and the mounting seat 20 is internally provided with a second brass substrate 21. The thermal conductivity of the first brass substrate 31 and the second brass substrate 21 can reach 123 W / (m.K). The heating assembly 40 is an electric heating rod 41. The heating assembly 40 in the heating platform 30 and the mounting seat 20 at least includes three electric heating rods 41. For example, the heating assembly 40 in the heating platform 30 can include five electric heating rods 41, and the heating assembly 40 in the mounting seat 20 can include four electric heating rods 41. All the electric heating rods 41 in the heating platform 30 are laid on the first brass substrate 31 near the upper side and are uniformly and spacedly distributed. All the electric heating rods 41 in the mounting seat 20 are laid on the second brass substrate 21 and are also uniformly and spacedly distributed.

[0044] Referring to Figure 4 , Figure 5 and Figure 6 As shown, the mounting seat 20 and the heating platform 30 are both internally provided with a liquid flow circulation passage 50. The above-mentioned heating assembly 40 can heat the liquid in the liquid flow circulation passage 50. The liquid flow circulation passage 50 is also communicated with a liquid cooling pipe assembly 60 for injecting cooling liquid. The mounting seat 20 and the heating platform 30 are both internally provided with a plurality of temperature sensors 70. The temperature sensors 70 are electrically connected with the temperature controller 10.

[0045] Referring to Figure 4As shown in the figure, the liquid flow circulation passage 50 in the heating platform 30 is arranged at the lower side of the first brass substrate 31. Further, the liquid flow circulation passage 50 in the heating platform 30 comprises a plurality of straight channels 51 arranged in the first brass substrate 31 and connecting bends 52 connecting adjacent two straight channels 51, the connecting bends 52 are arranged outside the first brass substrate 31 and used to connect the ports of adjacent two straight channels 51; the liquid cooling pipe assembly 60 comprises a connecting joint, the connecting joint is connected with the port of the outermost straight channel 51. The temperature sensors 70 in the heating platform 30 are at least three, the length direction of the heating rods 41 is arranged along the length direction of the first brass substrate 31, the length direction of the straight channels 51 is arranged along the width direction of the first brass substrate 31; the temperature sensors 70 in the heating platform 30 are distributed on the two adjacent sides of the first brass substrate 31, at least two temperature sensors 70 are arranged at the same height level of the heating rods 41 and in the area between adjacent two heating rods 41; at least one temperature sensor 70 is arranged above the heating rods 41.

[0046] Referring to Figure 5 and Figure 6 As shown in the figure, the liquid flow circulation passage 50 in the mounting seat 20 is arranged at the lower side of the second brass substrate 21. The heating rods 41 are electric heating rods 41, the outer periphery of the mounting seat 20 is fixedly provided with the peripheral plate 22, one side of the peripheral plate is fixedly provided with the aviation connector 23 electrically connected with the electric heating rods 41 in the mounting seat 20.

[0047] The temperature sensor 70 in the application is a PT100 sensor, and the temperature controller 10 adopts a PID controller. For example, three PT100 sensors can be arranged in the first brass substrate 31, and three PT100 sensors can be arranged in the second brass substrate 21. The temperature controller 10 adopts a six-unit meter to monitor the temperature at six different positions in real time and communicates data with the upper computer 140. The PT100 sensor measures the real-time temperature of the environment, converts the measured temperature data into an electrical signal, and transmits the electrical signal to the PID controller. After receiving the data, the PID controller compares the data with the preset temperature value, and then sends a control instruction to the electric heating rod 41 according to the temperature difference value data, so as to adjust the power of the electric heating rod 41 to perform heating work. The six-unit meter displays the real-time temperature of the environment and the preset temperature and other data in real time. When the heating demand is stopped, the external water chiller transmits water or other cooling liquid to the liquid flow circulation passage 50 through the liquid cooling pipe assembly 60 to cool the device. The temperature sensor 70 continues to work to measure the real-time temperature, and finally the six-unit meter displays the real-time temperature of the cooled device. Through the cooperation of the PT100 sensor and the PID controller, automatic temperature adjustment and display are realized, the operation is simple, human intervention is reduced, and the degree of automation of the system is improved. The system in the application also has a temperature upper limit alarm function. When the temperature exceeds the set upper limit, the temperature controller 10 will issue an alarm to remind the operator to take measures in time to prevent equipment damage or safety accidents.

[0048] The implementation principle of the embodiment is as follows: during work, the semiconductor device to be welded is placed on the heating platform 30. After the heating platform 30 moves towards the mounting seat 20, the semiconductor device to be welded is clamped between the mounting seat 20 and the heating platform 30. The heating assembly 40 in the mounting seat 20 and the heating platform 30 is synchronously heated and warmed up. The pressure and temperature are maintained for a predetermined time. During the pressure and temperature maintaining process, the temperature of the heating platform 30 and the pressing block 131 of the mounting seat 20 is monitored in real time by the corresponding PT100 sensor, and is automatically controlled by the PID controller. When the preset temperature is reached, the heating assembly 40 in the mounting seat 20 and the heating platform 30 stops heating. The external water chiller transmits water or other cooling liquid to the liquid flow circulation passage 50 through the liquid cooling pipe assembly 60 to cool the device. When the temperature reaches the preset temperature, the external water chiller stops water transmission.

[0049] The combination of the heating assembly 40 and the liquid flow circulation passage 50 in the present application can be preheated, so that the system can quickly reach the set temperature in a short time, and the liquid cooling pipe assembly 60 can realize rapid cooling, ensure accurate temperature control, and improve work efficiency. The precise temperature control system in the present application can monitor the temperature changes at different positions in real time by arranging multiple temperature sensors 70 inside the heating platform 30 and the mounting seat 20, so as to ensure the uniformity and stability of the temperature of the whole system. The heating assembly 40, the liquid flow circulation passage 50 and the temperature sensor 70 in the present application are arranged inside the mounting seat 20 and the heating platform 30, which has high integration and compact structure, can ensure efficient heat conduction, and can greatly reduce the volume of the whole device, can be used in semiconductor precise welding equipment, and can realize real-time temperature control with high precision and high stability. The high thermal conductivity of the first brass substrate 31 and the second brass substrate 21 in the present application ensures uniform heat distribution, improves heating efficiency and temperature stability.

[0050] The embodiments of the present specific embodiment are the preferred embodiments of the present application, and are not limited to the protection scope of the present application, wherein the same parts are indicated by the same reference numerals. Therefore, any equivalent changes made according to the structure, shape, principle of the present application should be covered by the protection scope of the present application.

Claims

1. A precision temperature control system for semiconductor welding equipment, comprising a temperature controller (10), an upper and lower oppositely arranged mounting seat (20) and a heating platform (30), the heating platform (30) being capable of reciprocating towards the mounting seat (20); the mounting seat (20) and the heating platform (30) are internally provided with a heating assembly (40); characterized in that the mounting seat (20) and the heating platform (30) are internally provided with a liquid flow circulation passage (50), the heating assembly (40) can heat the liquid in the liquid flow circulation passage (50), and the liquid flow circulation passage (50) is also communicated with a liquid cooling pipe assembly (60) for injecting cooling liquid; the mounting seat (20) and the heating platform (30) are internally provided with a plurality of temperature sensors (70), and the temperature sensors (70) are electrically connected with the temperature controller (10).

2. The precision temperature control system for semiconductor soldering apparatus according to claim 1, wherein The heating platform (30) is provided with a first brass base plate (31), the heating assembly (40) in the heating platform (30) comprises at least three heating rods (41), the heating rods (41) are laid on the first brass base plate (31) near the upper side and all the heating rods (41) are distributed at intervals; the liquid flow circulation passage (50) in the heating platform (30) is arranged near the lower side of the first brass base plate (31).

3. The precision temperature control system for semiconductor soldering apparatus according to claim 2, wherein The liquid flow circulation passage (50) in the heating platform (30) comprises a plurality of straight holes (51) opened in the first brass base plate (31) and connecting elbow pipes (52) connecting adjacent two straight holes (51), the connecting elbow pipes (52) are located outside the first brass base plate (31) and are used to connect the ports of adjacent two straight holes (51).

4. The precision temperature control system for semiconductor soldering apparatus according to claim 2 or 3, characterized by, The temperature sensors (70) in the heating platform (30) are at least three, of which at least two temperature sensors (70) are arranged at the same height level as the heating rods (41) and in the area between adjacent two heating rods (41); at least one temperature sensor (70) is arranged above the heating rods (41).

5. The precision temperature control system for semiconductor soldering apparatus according to claim 3, wherein The length direction of the heating rods (41) is arranged along the length direction of the first brass base plate (31), the length direction of the straight holes (51) is arranged along the width direction of the first brass base plate (31); the temperature sensors (70) in the heating platform (30) are distributed on the two adjacent sides of the first brass base plate (31).

6. The precision temperature control system for semiconductor soldering apparatus according to claim 1, wherein The mounting seat (20) is provided with a second brass base plate (21), the heating assembly (40) in the mounting seat (20) comprises at least three heating rods (41), the heating rods (41) are laid in the second brass base plate (21) and all the heating rods (41) are distributed at intervals; the liquid flow circulation passage (50) in the mounting seat (20) is arranged at the lower side of the second brass base plate (21).

7. The precision temperature control system for semiconductor soldering apparatus according to claim 6, wherein The heating rods (41) are electric heating rods (41), the peripheral plates (22) are fixedly arranged on the outer side of the mounting seat (20), and the aviation connectors (23) electrically connected with the heating rods (41) are fixedly arranged on one side of the peripheral plates (22).

8. The precision temperature control system for semiconductor soldering apparatus according to claim 1, wherein The temperature sensor (70) is a PT100 sensor, and the temperature controller (10) adopts a PID controller.

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