Two-color LED packaging device with side light emitting function and module
By adopting side-emitting design and light-blocking layer isolation technology in LED packaging devices, the problem that traditional LED packaging devices cannot achieve dual-color light is solved, and efficient dual-color light purity and clarity are achieved, which is suitable for applications such as lighting, display and decoration.
Patent Information
- Application Number
- CN202422851666.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-21
- Publication Date
- 2025-10-21
- Estimated Expiration
- 2034-11-21
AI Technical Summary
Most traditional LED packaging devices are monochromatic light sources, which cannot meet the needs of dual-color light sources. In addition, the top-emitting design has low luminous efficiency and limited luminous angle.
It adopts a side-emitting design, by arranging the first and second LED chips on the substrate and covering them with an encapsulation layer, combining the first and second light-blocking layers to isolate the light, ensuring the purity and clarity of the two-color light.
It achieves the side-emitting effect of two-color light, improves the light efficiency, and ensures the purity and clarity of the two-color light. It is suitable for lighting, display, decoration and other fields.
Smart Images
Figure CN223463306U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to LED technical field, concretely is a kind of double-color LED packaging device and module of luminous. BACKGROUND
[0002] Traditional LED packaging device mostly adopts single-color light source, cannot satisfy the demand of double-color light source in certain specific occasion.Although there are some double-color LED packaging devices on the market, mostly adopt top-emitting design, and the light-emitting angle is limited, and the light efficiency is low.Therefore, it is of great significance to develop a double-color LED packaging device and its module which can side-emitting and have high light efficiency. SUMMARY
[0003] In order to overcome the problems in the prior art, the purpose of the utility model is to provide a double-color LED packaging device and module of luminous.
[0004] The technical scheme adopted by the utility model to solve its technical problems is: a double-color LED packaging device of side-emitting, comprising:
[0005] substrate, first LED chip, second LED chip, first encapsulation glue layer, second encapsulation glue layer, first light blocking layer and second light blocking layer;
[0006] The first light blocking layer is arranged on the surface of the substrate, and the first light blocking layer divides the substrate into a first half area and a second half area, the first LED chip is mounted on the surface of the first half area, and the first encapsulation glue layer covers the surface of the first LED chip, the second LED chip is mounted on the surface of the second half area, and the second encapsulation glue layer covers the surface of the second LED chip;
[0007] The second light blocking layer is arranged on the surface of the first encapsulation glue layer, the second encapsulation glue layer and the first light blocking layer.
[0008] Main working principle: when the first LED chip is energized and activated, it will emit light of the first color.These light rays will first be emitted in all directions, including upwards (towards the encapsulation glue layer) and downwards (towards the substrate).Similarly, when the second LED chip is energized and activated, it will emit light of the second color, which will also be emitted in all directions.
[0009] The first encapsulation glue layer covers the surface of the first LED chip, which plays a protective and light-transmitting role.The second encapsulation glue layer covers the surface of the second LED chip, which has the same effect as the first encapsulation glue layer.The thickness of the encapsulation glue layer is greater than the thickness of the LED chip, to ensure that the LED chip is completely covered, and to provide sufficient mechanical protection and optical performance.
[0010] The first light blocking layer is arranged on the surface of the substrate, which separates the substrate into a first half area and a second half area. The main function of this light blocking layer is to block and isolate the light emitted by the first LED chip and the second LED chip, preventing them from interfering or mixing with each other. When the light propagates in the encapsulation layer, it may undergo multiple refractions and reflections, but due to the presence of the first light blocking layer, it is confined within the first half area and the second half area, forming the first and second color side light emitting effects respectively.
[0011] The second light blocking layer is arranged on the surface of the first encapsulation layer, the second encapsulation layer, and the first light blocking layer. This additional light blocking layer has the effect of reducing the light transmittance, ensuring the purity and clarity of the dual-color light. Since the light emitted by the LED chips is guided and transmitted by the encapsulation layer, and effectively isolated and reflected by the light blocking layer, the dual-color light is mainly emitted from the side of the encapsulation device, but part of the light will be transmitted from the second blocking layer.
[0012] In summary, the side-emitting dual-color LED encapsulation device achieves the side-emitting effect of dual-color light through clever structural design, and ensures the purity and clarity of the dual-color light. This device has wide application prospects in the fields of lighting, display, and decoration.
[0013] As a preferred embodiment, the first light blocking layer is perpendicular to one side of the substrate, and the first LED chip and the second LED chip are respectively opposite to the two ends of the substrate.
[0014] As a preferred embodiment, the first light blocking layer is connected to the opposite corners of the substrate, and the first LED chip and the second LED chip are respectively opposite to the end corners on both sides of the substrate.
[0015] As a preferred embodiment, the first encapsulation layer and the second encapsulation layer are composed of one of the transparent or fluorescent powder-containing thermosetting resin materials; the thickness of the first encapsulation layer and the second encapsulation layer is greater than the thickness of the first LED chip and the second LED chip; the two ends of the first encapsulation layer and the two ends of the second encapsulation layer do not exceed the edge of the substrate, and the width of the first encapsulation layer and the width of the second encapsulation layer are the same.
[0016] As a preferred embodiment, the first light blocking layer contains a reflective material in the thermosetting resin material; the thickness of the first light blocking layer is equal to the thickness of the first encapsulation layer and the second encapsulation layer; the width of the first light blocking layer is equal to or greater than 0.4 mm; the first light blocking layer does not exceed the edge of the substrate.
[0017] As a preferred, the first light blocking layer contains a thermosetting resin material with reflective material; the thickness of the first light blocking layer is equal to the thickness of the first encapsulation layer and the second encapsulation layer; the width of the first light blocking layer is equal to or greater than 0.4mm; the first light blocking layer does not exceed the edge of the substrate.
[0018] As a preferred, the second light blocking layer contains a thermosetting resin material with reflective material; the second light blocking layer covers the first light blocking layer and the first encapsulation layer and the second encapsulation layer; the second light blocking layer does not exceed the edge of the first light blocking layer and the first encapsulation layer and the second encapsulation layer, and the thickness of the second light blocking layer is less than the thickness of the first light blocking layer.
[0019] A side-emitting dual-color LED packaging module, comprising the above-mentioned side-emitting dual-color LED packaging device, and a PCB circuit board;
[0020] The side-emitting dual-color LED packaging device is provided in multiple, and multiple side-emitting dual-color LED packaging devices are installed on the PCB circuit board, and the two ends of the first light blocking layer in adjacent two side-emitting dual-color LED packaging devices are oppositely arranged.
[0021] Main working principle: The working principle of the side-emitting dual-color LED packaging module is mainly based on the light-emitting characteristics of the side-emitting dual-color LED packaging devices it is composed of and their arrangement on the PCB circuit board.
[0022] Each side-emitting dual-color LED packaging device contains two independent LED chips, namely the first LED chip and the second LED chip, which emit different colors of light. These lights are guided and transmitted by the encapsulation layer, and are effectively isolated by the light blocking layer, ensuring the purity and clarity of the dual-color light.
[0023] Multiple side-emitting dual-color LED packaging devices are installed on the PCB circuit board. The arrangement of these devices can be designed according to specific application requirements, such as linear arrangement, matrix arrangement, etc.
[0024] The two ends of the first light blocking layer in the two adjacent packaged devices are oppositely arranged. This design helps to further isolate the different colors of light emitted by adjacent devices, preventing them from interfering or mixing with each other. When the LED chips of each packaged device are energized and activated, the first LED chip and the second LED chip will emit different colors of light. These light rays propagate in the encapsulation layer and are guided to the side and top of the device. Since the two ends of the first light blocking layer of adjacent devices are oppositely arranged, an effective light isolation area is formed between them. This area can block the penetration or mixing of light emitted by adjacent devices, ensuring that the dual-color light emitted by each device remains pure and clear.
[0025] Since the packaged devices in the module are independently controlled, complex lighting effects and patterns can be achieved to meet different application scenarios and needs.
[0026] In summary, the side-emitting dual-color LED packaging module achieves the side-emitting effect of dual-color light by precisely designing the arrangement of the packaged devices and the structure of the light blocking layer, and ensures the purity and clarity of the dual-color light. This module has important value in various applications.
[0027] As a preferred, the side-emitting dual-color LED packaging device is provided with a plurality of, and the plurality of side-emitting dual-color LED packaging devices are installed on the PCB circuit board, and the two ends of the first light blocking layer in the two adjacent side-emitting dual-color LED packaging devices are oppositely arranged.
[0028] As a preferred, the plurality of side-emitting dual-color LED packaging devices are divided into two groups, the two groups of side-emitting dual-color LED packaging devices are arranged side by side, and the first light blocking layers in the two groups of side-emitting dual-color LED packaging devices are arranged in parallel, and the two groups of parallelly arranged first light blocking layers enclose a light-emitting dark area.
[0029] As a preferred, the two groups of parallelly arranged first light blocking layers enclose a "V" shape.
[0030] Compared with the prior art, the utility model has the beneficial effects that:
[0031] 1.The utility model discloses a double-color LED packaging device, which integrates two independent LED chips in the same packaging device and covers them with packaging glue layers, achieving the effect of independent double-color light emission. This design enables a single packaging device to emit two different colors of light simultaneously, increasing the diversity and flexibility of the product. The first light barrier effectively isolates the light emitted by the two LED chips, preventing them from interfering or mixing with each other, thereby ensuring the purity and clarity of the double-color light. This is particularly important for applications that require precise color control. The packaging device is designed to primarily emit light from the side and secondarily from the top, allowing light to primarily emit from the side of the device, increasing the distribution range and visual effect of the light.
[0032] 2.The utility model discloses a double-color LED packaging module composed of multiple double-color LED packaging devices, achieving modular design. This design allows the module to be flexibly configured and expanded according to specific application requirements, improving the adaptability and flexibility of the product. The first light barrier in adjacent double-color LED packaging devices is oppositely arranged at both ends, further enhancing the light isolation effect. This design ensures that the double-color light emitted by each packaging device remains pure and clear, while improving the overall light consistency of the module. BRIEF DESCRIPTION OF DRAWINGS
[0033] To more clearly illustrate the technical solutions of the embodiments of the utility model, the following will briefly introduce the drawings needed in the embodiment description. Obviously, the drawings described below are some embodiments of the utility model, and those skilled in the art can obtain other drawings based on these drawings without creative labor.
[0034] Figure 1 It is a side view of the double-color LED packaging device.
[0035] Figure 2 It is a top view of the A-line section of the double-color LED packaging device. Figure 1
[0036] Figure 3 It is a top view of the A-line section of the double-color LED packaging device. Figure 2
[0037] Figure 4 It is a schematic diagram of the double-color LED packaging module.
[0038] Figure 5 It is a schematic diagram of the double-color LED packaging module in "V" shape.
[0039] Figure 6 It is a schematic diagram of the double-color LED packaging module in "V" shape.
[0040] 1, substrate; 2, first LED chip; 3, second LED chip; 4, first encapsulation glue layer; 5, second encapsulation glue layer; 6, first light blocking layer; 7, second light blocking layer; 8, PCB circuit board; 9, light-emitting dark area. DETAILED DESCRIPTION
[0041] In order to enable the above-mentioned purpose, features and advantages of the present application to be more clearly understood, the present application will be described in detail below with reference to the drawings and specific embodiments. It should be noted that the embodiments and features in the embodiments can be combined with each other without conflict. In the following description, a large number of specific details are set forth in order to provide a thorough understanding of the present application. The described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.
[0042] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the present application belongs. The terms used in the specification of the present application are only for the purpose of describing the specific embodiments and are not intended to limit the present application.
[0043] Example 1
[0044] The present embodiment discloses a side-emitting dual-color LED packaging device, as shown in Figures 1-3 The present embodiment discloses a side-emitting dual-color LED packaging device, as shown in
[0045] The substrate 1, the first LED chip 2, the second LED chip 3, the first encapsulation glue layer 4, the second encapsulation glue layer 5, the first light blocking layer 6 and the second light blocking layer 7;
[0046] The first light blocking layer 6 is arranged on the surface of the substrate 1, the first light blocking layer 6 divides the substrate 1 into a first half area and a second half area, the first LED chip 2 is mounted on the surface of the first half area, and the first encapsulation glue layer 4 covers the surface of the first LED chip 2, the second LED chip 3 is mounted on the surface of the second half area, and the second encapsulation glue layer 5 covers the surface of the second LED chip 3;
[0047] The second light blocking layer 7 is arranged on the surface of the first encapsulation glue layer 4, the second encapsulation glue layer 5 and the first light blocking layer 6.
[0048] When the first LED chip 2 is powered on and activated, it emits light of a first color. These light rays are first emitted in all directions, including upwards (towards the encapsulation layer) and downwards (towards the substrate 1). Similarly, when the second LED chip 3 is powered on and activated, it emits light of a second color, also in all directions.
[0049] The first encapsulation layer 4 covers the surface of the first LED chip 2, serving the purpose of protection and light transmission. The second encapsulation layer 5 covers the surface of the second LED chip 3, serving the same purpose as the first encapsulation layer 4. The thickness of the encapsulation layers is greater than that of the LED chips, ensuring that the LED chips are completely covered and providing sufficient mechanical protection and optical performance.
[0050] The first light barrier 6 is arranged on the surface of the substrate 1, dividing the substrate 1 into a first half and a second half. The main purpose of this light barrier is to block and isolate the light emitted by the first LED chip 2 and the second LED chip 3, preventing them from interfering or mixing with each other. When the light rays propagate in the encapsulation layers, they may undergo multiple refractions and reflections, but due to the presence of the first light barrier 6, they are confined within the first half and the second half, respectively forming the side-emitting effect of the first and second colors.
[0051] The second light barrier 7 is arranged on the surface of the first encapsulation layer 4, the second encapsulation layer 5, and the first light barrier 6. This additional light barrier serves the purpose of reducing the light transmission rate, ensuring the purity and clarity of the dual-color light. Since the light emitted by the LED chips is guided and transmitted by the encapsulation layers, while being effectively isolated and reflected by the light barriers, the dual-color light is mainly emitted from the side of the encapsulation device, but some light may be transmitted from the second barrier.
[0052] In summary, the side-emitting dual-color LED encapsulation device achieves the side-emitting effect of dual-color light through clever structural design, and ensures the purity and clarity of the dual-color light. This device has wide application prospects in the fields of lighting, display, and decoration.
[0053] In some optional embodiments, the first light barrier 6 is perpendicular to one side of the substrate 1, i.e., forming a straight line of separation, and the first LED chip 2 and the second LED chip 3 are respectively mounted at the two ends of the substrate 1, opposite the separation line. The light emitted by the first LED chip 2 and the second LED chip 3 is blocked by the first light barrier 6, as shown in Figure 2 , and is respectively transmitted outward from the two ends of the substrate 1. Thus, a layout method of LED chips and light barriers is provided, increasing the flexibility of the design, while still maintaining the effects of independent emission of dual colors and isolation of light rays.
[0054] In some alternative embodiments, the first light blocking layer 6 is connected to the opposite corners of the substrate 1, forming a diagonal separation line. The first LED chip 2 and the second LED chip 3 are respectively mounted at the end corners of the substrate 1 on both sides of the separation line. The light emitted by the first LED chip 2 and the second LED chip 3 will respectively transmit outward from the two end corners of the substrate 1 due to the blocking of the first light blocking layer 6, as shown in FIG. 3. Thus, a layout of LED chips and light blocking layers is provided, increasing the flexibility of design while still maintaining the effects of independent emission of double colors and light isolation. Figure 3
[0055] In some alternative embodiments, the first encapsulating glue layer 4 and the second encapsulating glue layer 5 are made of transparent or fluorescent powder-containing thermosetting resin materials, ensuring the light transmission and possible color conversion. The thickness of the first encapsulating glue layer 4 and the second encapsulating glue layer 5 is greater than the thickness of the first LED chip 2 and the second LED chip 3, to provide sufficient protection and mechanical strength. The width of the encapsulating glue layers is the same and does not exceed the edge of the substrate 1, ensuring uniform light distribution and preventing light leakage.
[0056] The first encapsulating glue layer 4 and the second encapsulating glue layer 5 not only protect the first LED chip 2 and the second LED chip 3, but also play a role in guiding light. The light propagates in the first encapsulating glue layer 4 and the second encapsulating glue layer 5 and is emitted through the side surface. Good light transmission and possible color conversion effects are provided. The thickness and width of the encapsulating glue layers are reasonably designed, ensuring uniform light distribution and preventing leakage.
[0057] In some alternative embodiments, the first light blocking layer 6 contains reflective material-containing thermosetting resin material, enhancing the reflection and isolation effects of light. The thickness of the light blocking layer is the same as that of the encapsulating glue layer, ensuring the uniformity and consistency of the structure. The width of the light blocking layer is equal to or greater than 0.4 mm, providing sufficient light isolation effect. The light blocking layer does not exceed the edge of the substrate 1, preventing light leakage and interference. The first light blocking layer 6 effectively isolates the light emitted by the two LED chips and enhances the isolation effect of light through the reflective material. Good light isolation effect is provided, ensuring the purity and clarity of double-color light. The thickness and width of the light blocking layer are reasonably designed, ensuring the stability of the structure and the light isolation effect.
[0058] In some alternative embodiments, the second light blocking layer 7 also contains a thermosetting resin material with reflective material, enhancing the reflection and isolation effect of light. The second light blocking layer 7 is covered on the first light blocking layer 6 and the encapsulation layer, playing the effect of isolating part of the light, allowing the light to be more soft from the second light blocking layer 7. The thickness of the second light blocking layer 7 is less than the thickness of the first light blocking layer 6, ensuring that light can be transmitted from the second light blocking layer 7. The second light blocking layer 7 does not exceed the edge of the first light blocking layer 6 and the encapsulation layer, preventing light leakage and interference. Ensuring the purity and clarity of the double-color light, and presenting different light effects.
[0059] Embodiment 2
[0060] A side-emitting double-color LED packaging module, as shown in Figure 4 includes the side-emitting double-color LED packaging device in Embodiment 1 above, and a PCB circuit board 8.
[0061] The side-emitting double-color LED packaging device is provided in multiple, and the multiple side-emitting double-color LED packaging devices are mounted on the PCB circuit board 8, and the two ends of the first light blocking layer 6 in the two adjacent side-emitting double-color LED packaging devices are oppositely arranged.
[0062] The working principle of the side-emitting double-color LED packaging module is mainly based on the light-emitting characteristics of the side-emitting double-color LED packaging devices it is composed of and their arrangement on the PCB circuit board 8.
[0063] Each side-emitting double-color LED packaging device contains two independent LED chips, namely the first LED chip 2 and the second LED chip 3, which emit different colors of light. These lights are guided and transmitted by the encapsulation layer, and are effectively isolated by the light blocking layer, ensuring the purity and clarity of the double-color light.
[0064] Multiple side-emitting double-color LED packaging devices are mounted on the PCB circuit board 8. The arrangement of these devices can be designed according to specific application requirements, such as linear arrangement, matrix arrangement, etc.
[0065] The two ends of the first light blocking layer 6 in the two adjacent packaged devices are oppositely arranged. This design helps to further isolate the different colors of light emitted by adjacent devices, preventing them from interfering or mixing with each other. When the LED chips of each packaged device are energized and activated, the first LED chip 2 and the second LED chip 3 emit different colors of light. These light rays propagate in the encapsulation layer and are guided to the side and top of the device to be emitted. Since the two ends of the first light blocking layer 6 in adjacent devices are oppositely arranged, an effective light isolation area is formed between them. This area can block the penetration or mixing of light emitted by adjacent devices, ensuring that the dual-color light emitted by each device remains pure and clear.
[0066] Since the packaged devices in the module are independently controlled, complex lighting effects and patterns can be achieved to meet different application scenarios and needs.
[0067] In summary, the side-emitting dual-color LED packaging module achieves the side-emitting effect of dual-color light by precisely designing the arrangement of the packaged devices and the structure of the light blocking layer, and ensures the purity and clarity of the dual-color light. This module has important value in various applications.
[0068] In some optional embodiments, as shown in Figures 5-6 two groups of dual-color LED packaging devices are formed. The two groups of devices are arranged side by side on the PCB circuit board 8, ensuring that the first light blocking layer 6 in the two groups of devices is arranged in parallel.
[0069] By adjusting the arrangement and spacing of the devices, the first light blocking layer 6 arranged in parallel in the two groups encloses a light-emitting dark area 9. Most of the light in this light-emitting dark area 9 is blocked by the second light blocking layer 7, and only a small part of the light is transmitted from the second light blocking layer 7, so the brightness of this part is lower than that of other areas, which can be used to emphasize the light effect of other areas, or as part of the design element, this dark area contrasts with the surrounding bright areas, enhancing the overall visual effect.
[0070] In some optional embodiments, the arrangement and spacing of the two groups of dual-color LED packaging devices are further adjusted, so that the first light blocking layer 6 arranged in parallel in the two groups encloses a "V"-shaped light-emitting dark area 9. This "V"-shaped dark area can point to a specific direction, guide the viewer's line of sight, or emphasize the light effect of a certain area.
[0071] The two groups of double-color LED packaging devices work independently and emit different colors of light. By precisely adjusting the arrangement and spacing of the devices, the two groups of first light blocking layers 6 arranged in parallel enclose a "V"-shaped light-emitting dark area 9. The dark area is in sharp contrast with the surrounding light area, enhances the overall visual effect and level, the "V"-shaped light-emitting dark area 9 can guide the viewer's line of sight, emphasize specific areas or design elements, and improve the attractiveness and application value of the product.
[0072] The above is only a preferred embodiment of the present application, and does not limit the present application in any form. Any modification, equivalent change and modification of the above embodiment according to the technical essence of the present application, without departing from the technical solution of the present application, still belongs to the scope of the technical solution of the present application.
Claims
1. A side-emitting dual-color LED package device, characterized in that, Comprising: a substrate, a first LED chip, a second LED chip, a first encapsulation layer, a second encapsulation layer, a first light blocking layer and a second light blocking layer; the first light blocking layer is disposed on the surface of the substrate, the first light blocking layer separates the substrate into a first half area and a second half area, the first LED chip is mounted on the surface of the first half area, and the first encapsulation layer covers the surface of the first LED chip, the second LED chip is mounted on the surface of the second half area, and the second encapsulation layer covers the surface of the second LED chip; the second light blocking layer is disposed on the surface of the first encapsulation layer, the second encapsulation layer and the first light blocking layer.
2. The side-emitting dual-color LED packaging device according to claim 1, wherein the first light blocking layer is perpendicular to one side of the substrate, and the first LED chip and the second LED chip are respectively opposite to the two ends of the substrate.
3. The side-emitting dual-color LED packaging device according to claim 1, wherein the first light blocking layer is connected to the opposite corners of the substrate, and the first LED chip and the second LED chip are respectively opposite to the end corners on the two sides of the substrate.
4. The side-emitting dual-color LED packaging device according to claim 1, wherein the first encapsulation layer and the second encapsulation layer are composed of one of transparent or thermosetting resin materials containing fluorescent powder; the thickness of the first encapsulation layer and the second encapsulation layer is greater than the thickness of the first LED chip and the second LED chip; the two ends of the first encapsulation layer and the two ends of the second encapsulation layer do not exceed the edge of the substrate, and the width of the first encapsulation layer and the width of the second encapsulation layer are the same.
5. The side-emitting dual-color LED packaging device according to claim 1, wherein the first light blocking layer contains thermosetting resin materials containing reflective materials; the thickness of the first light blocking layer is equal to the thickness of the first encapsulation layer and the second encapsulation layer; the width of the first light blocking layer is equal to or greater than 0.4 mm; and the first light blocking layer does not exceed the edge of the substrate.
6. The side-emitting dual-color LED packaging device according to claim 1, wherein the second light blocking layer contains thermosetting resin materials containing reflective materials; the second light blocking layer covers the first light blocking layer and the first encapsulation layer and the second encapsulation layer; the second light blocking layer does not exceed the edge of the first light blocking layer and the first encapsulation layer and the second encapsulation layer, and the thickness of the second light blocking layer is less than the thickness of the first light blocking layer. The side-emitting dual-color LED packaging device according to any one of claims 1-6, and a PCB circuit board; a plurality of the side-emitting dual-color LED packaging devices are provided, and the plurality of the side-emitting dual-color LED packaging devices are mounted on the PCB circuit board, and the two ends of the first light blocking layer in the two adjacent side-emitting dual-color LED packaging devices are oppositely disposed. 7. A side-emitting dual-color LED package module, characterized in that, 8.The side-emitting dual-color LED package module of claim 7, wherein, the plurality of side-emitting dual-color LED package devices are divided into two groups, the two groups of side-emitting dual-color LED package devices are arranged side by side, and the first light blocking layers in the two groups of side-emitting dual-color LED package devices are arranged in parallel, and the two groups of parallel first light blocking layers enclose a light-emitting dark area. 9.The side-emitting dual-color LED package module of claim 8, wherein, the two groups of parallel first light blocking layers enclose a "V" shape.