Display panel and display device

Abstract

The utility model relates to a display panel and a display device. The display panel comprises a display area and a non-display area. The non-display area comprises an open hole and a partition area, the partition area is located between the open hole and the display area, and the partition area surrounds at least part of the open hole. The display panel comprises a substrate layer, a planarization layer is arranged on the substrate layer in the display area, the planarization layer is provided with a first partition structure on the substrate layer in the partition area, and the first partition structure comprises a main top surface, a main bottom surface and a main side surface connected between the main top surface and the main bottom surface, the main top surface and the main bottom surface are opposite in the direction perpendicular to the plane where the display panel is located. The partition area further comprises a reinforcing structure, and the reinforcing structure makes contact with at least part of the side face of the first partition structure and makes contact with the substrate layer. According to the display panel, the reinforcing structures are arranged in the partition areas, and the first partition structures in the partition areas are optimized, so that the binding force of the film layers in the partition areas of the display panel is improved, the stripping problem between the film layers is reduced, and then the stability and reliability of the display surface are effectively improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of display devices, in particular to a display panel and a display device. BACKGROUND

[0002] With the continuous development of flexible OLED (Organic Light-Emitting Diode) devices, mobile electronic devices have increasingly high demands for full screens, so the display screen hole technology has become increasingly urgent.

[0003] In the existing display panel, there is usually a barrier wall setting area between the screen hole (AA hole, AAH) and the display area, and a barrier wall is arranged in the barrier wall setting area to prevent water-absorbing and failure-prone evaporation organic materials from entering the AAH.

[0004] However, using a barrier wall structure will cause multiple stress concentration points in the barrier wall setting area. In the laser lift-off process (Laser Lift Off, LLO), that is, the process of using laser lift-off technology to separate the display components and devices made on the flexible substrate from the rigid substrate, the laser is easy to cause the organic light-emitting layer in the barrier wall setting area to vaporize, causing the film layers to separate, affecting the stability and reliability of the display panel. SUMMARY

[0005] The present application provides a display panel that can effectively solve the problem of film layer separation. It includes a display area and a non-display area, the non-display area includes an opening and a partition area, the partition area is located between the opening and the display area, and the partition area surrounds at least part of the opening;

[0006] The display panel includes a planarization layer in the display area, the planarization layer has a first partition structure in the partition area, the first partition structure includes a main top surface and a main bottom surface opposite in a direction perpendicular to the plane of the display panel, and a main side surface connecting the main top surface and the main bottom surface;

[0007] The display panel includes a substrate layer in the partition, the first partition structure is formed on the substrate layer, and a reinforcing structure is also arranged on the substrate layer, the reinforcing structure at least partially contacts at least part of the side surface of the first partition structure and contacts the substrate layer.

[0008] In one embodiment, the first partition structure includes a first partition part and a second partition part, the first partition part and the second partition part are sequentially arranged in a direction perpendicular to the plane of the display panel.

[0009] The first partition portion includes a first bottom surface and a first top surface opposite to each other in a direction perpendicular to a plane where the display panel is located, and a first side surface connecting the first top surface and the first bottom surface, and the second partition portion includes a second bottom surface and a second top surface opposite to each other in the direction perpendicular to the plane where the display panel is located, and a second side surface connecting the second top surface and the second bottom surface, wherein

[0010] The first top surface and the second bottom surface at least partially contact each other.

[0011] In one of the embodiments, the second partition portion is located on the first top surface, and an area of the second bottom surface of the second partition portion is smaller than an area of the first top surface.

[0012] In one of the embodiments, an area of the second bottom surface of the second partition portion is larger than an area of the first bottom surface of the first partition portion, and the second bottom surface of the second partition portion completely covers the first side surface of the first partition portion.

[0013] In one of the embodiments, the reinforcing structure includes an auxiliary fixing layer, the auxiliary fixing layer covers the substrate layer of the outer peripheral portion of the main bottom surface of the first partition structure to at least part of the main side surface of the first partition structure.

[0014] In one of the embodiments, the display panel further includes an anode layer, the anode layer and the planarization layer are sequentially stacked in a direction perpendicular to the plane where the display panel is located.

[0015] When the second partition portion is located on the first top surface, and an area of the second bottom surface of the second partition portion is smaller than an area of the first top surface, the anode layer forms the auxiliary fixing layer in the partition region, and the auxiliary fixing layer covers the first side surface of the first partition portion and a blank portion of the first top surface of the first partition portion which is not covered by the second bottom surface.

[0016] In one of the embodiments, the auxiliary fixing layer covers the substrate layer of the outer peripheral portion of the main bottom surface of the first partition structure, the main side surface and the main top surface.

[0017] In one of the embodiments, a plurality of exhaust holes are formed in the auxiliary fixing layer located on the main top surface, and the exhaust holes are arranged at intervals on the auxiliary fixing layer.

[0018] In one of the embodiments, the reinforcing structure further includes a plurality of auxiliary fixing portions, and a cross-sectional dimension of the auxiliary fixing portion gradually increases in a direction away from the substrate layer; or

[0019] The cross-sectional dimension of the auxiliary fixing portion gradually decreases and then increases in the direction away from the substrate layer.

[0020] In one of the embodiments, the width of the auxiliary fixing part is less than one fourth of the width of the first partition structure.

[0021] In one of the embodiments, when the second partition part is located on the first top surface and the area of the second bottom surface of the second partition part is less than the first top surface, the auxiliary fixing part is located between the first partition part and the substrate layer, and / or

[0022] The auxiliary fixing part is located between the first partition part and the second partition part.

[0023] In one of the embodiments, when the auxiliary fixing part is located between the first partition part and the substrate layer, the first bottom surface of the first partition part at least partially covers at least part of the top surface of the auxiliary fixing part.

[0024] When the auxiliary fixing part is located between the first partition part and the second partition part, the second bottom surface of the second partition part at least partially covers at least part of the top surface of the auxiliary fixing part.

[0025] In one of the embodiments, when the area of the second bottom surface of the second partition part is greater than the area of the first bottom surface of the first partition part, and the second bottom surface of the second partition part completely covers the first side surface of the first partition part, the auxiliary fixing part is located on both sides of the first partition part, and the second bottom surface of the second partition part at least partially covers at least part of the top surface of the auxiliary fixing part.

[0026] In one of the embodiments, the first bottom surface of the first partition part at least partially covers at least part of the top surface of the auxiliary fixing part.

[0027] In one of the embodiments, the partition region further comprises a second partition structure, the second partition structure comprising a third partition part and a fourth partition part; wherein,

[0028] The third partition part is located between the display region and the first partition structure, and the fourth partition part is located between the first partition structure and the opening.

[0029] In one of the embodiments, the display panel in the display region further comprises a circuit layer, an anode layer and a light emitting layer, and the substrate layer, the circuit layer, the anode layer, the planarization layer and the light emitting layer in the display region of the display panel are sequentially stacked; wherein,

[0030] The light-emitting layer is naturally truncated by the first partition structure and the second partition structure into a first part and a second part in the partition area, the first part is located on the surface of the first partition structure and the second partition structure, and the second part is located on the surface of the substrate layer outside the first partition structure and the second partition structure.

[0031] In one of the embodiments, the circuit layer comprises a semiconductor layer, a first gate insulating layer, a first gate metal layer, a second gate insulating layer, a second gate metal layer, a first interlayer dielectric layer, and a source-drain metal layer which are sequentially stacked; wherein

[0032] The first gate metal layer and / or the second gate metal layer have a raised structure in the partition area, and the raised structure is located below the second partition structure.

[0033] In one of the embodiments, the source-drain metal layer forms the auxiliary fixing part, the third partition part, and the fourth partition part in the partition area, and the auxiliary fixing part, the third partition part, and the fourth partition part are sequentially arranged.

[0034] In one of the embodiments, the display panel further comprises a cathode layer located on the side of the light-emitting layer away from the anode layer, and an encapsulation layer located on the side of the cathode layer away from the light-emitting layer in the display area.

[0035] The encapsulation layer comprises a first encapsulation inorganic layer, an encapsulation organic layer, and a second encapsulation inorganic layer which are sequentially stacked; wherein

[0036] The first encapsulation inorganic layer, the encapsulation organic layer, and the second encapsulation inorganic layer cover the third partition part, the first encapsulation inorganic layer and the second encapsulation inorganic layer cover the fourth partition part, and the encapsulation organic layer does not overlap with the fourth partition part.

[0037] The present application also provides a display device comprising the display panel as mentioned in any one of the above embodiments.

[0038] The technical solutions provided by the embodiments of the present application can have the following beneficial effects:

[0039] It can be known from the above embodiment that the display panel provided in the application comprises a display area and a non-display area. The non-display area comprises an opening and a partition area, the partition area is located between the opening and the display area, and the partition area surrounds at least part of the opening. The display panel comprises a substrate layer, a planarization layer is arranged on the substrate layer in the display area, the planarization layer has a first partition structure on the substrate layer in the partition area, the first partition structure comprises a main top surface and a main bottom surface opposite in a direction perpendicular to a plane where the display panel is located, and a main side surface connecting between the main top surface and the main bottom surface. The partition area further comprises a reinforcing structure, the reinforcing structure is in contact with at least part of the side surface of the first partition structure and in contact with the substrate layer. The application optimizes the first partition structure in the partition area by arranging the reinforcing structure in the partition area, so as to improve the bonding force between the first partition structure and the substrate layer, reduce the peeling problem of the first partition structure, and effectively improve the stability and reliability of the display panel.

[0040] It should be understood that the foregoing general description and the following detailed description are only exemplary and explanatory, and cannot limit the application. BRIEF DESCRIPTION OF DRAWINGS

[0041] In order to more clearly illustrate the technical solutions in the embodiments of the application, the drawings needed in the embodiment description will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the application, and other drawings can be obtained by those skilled in the art without creative labor.

[0042] Figure 1 A schematic diagram of a peeling problem caused by the LLO provided in an embodiment of the application to the partition area of the retaining wall.

[0043] Figure 2 A schematic diagram of an accelerated degradation strain simulation of a display panel provided in an embodiment of the application under 85℃ / 85% environment.

[0044] Figure 3 A schematic diagram of the structure of a display panel provided in an embodiment of the application.

[0045] Figure 4 A schematic diagram of the cross-sectional structure of a partial area of a display panel provided in an embodiment of the application.

[0046] Figure 5 A schematic diagram of the cross-sectional structure of a partial area of another display panel provided in an embodiment of the application.

[0047] Figure 6 A schematic diagram of the structure of a partial area of a display panel provided in an embodiment of the application. Figure 5 An enlarged structure schematic diagram of part A.

[0048] Figures 7 to 11A cross-sectional structure diagram of a partial region of a display panel provided in an embodiment of the present application.

[0049] Figure 12 A cross-sectional structure diagram of a partial region of a display panel provided in an embodiment of the present application. Figure 11 An enlarged structure diagram of part B in FIG. 6.

[0050] Figures 13 to 16 A cross-sectional structure diagram of a partial region of a display panel provided in an embodiment of the present application.

[0051] Figure 17 A top view diagram of an opening and a partition region of a display panel provided in an embodiment of the present application.

[0052] Reference signs:

[0053] 001, display region.

[0054] 1, flexible substrate layer; 2, buffer layer; 3, circuit layer; 31, semiconductor layer; 32, first gate insulating layer; 33, first gate metal layer; 34, second gate insulating layer; 35, second gate metal layer; 36, first interlayer dielectric layer; 37, source-drain metal layer; 4, planarization layer; 5, anode layer; 6, second interlayer dielectric layer; 7, light-emitting layer; 9, encapsulation layer; 91, first encapsulation inorganic layer; 92, encapsulation organic layer; 93, second encapsulation inorganic layer.

[0055] 002, opening.

[0056] 003, partition region.

[0057] 30, first partition structure; 301, first partition part; 3011, first bottom surface; 3012, first top surface; 3013, first side surface; 302, second partition part; 3021, second bottom surface; 3022, second top surface; 3023, second side surface. 40, second partition structure; 401, third partition part; 402, fourth partition part; 50, reinforcing structure; 60, heightening structure. DETAILED DESCRIPTION

[0058] The exemplary embodiments will be described in detail herein with reference to the attached drawings. In the following description, the same numbers are used to indicate the same or similar components. The following exemplary embodiments are described with reference to the drawings, by way of example only, and various changes in form and details can be made therein by persons skilled in the art without departing from the spirit and scope of the present application. In other words, it is intended to cover all such changes and modifications of the application, and for the exemplary embodiments to be accorded with the scope of the claims and their equivalents.

[0059] As described in the background, when the substrate of the display panel is a flexible substrate, the substrate is generally formed on a rigid substrate, and after other functional layers are formed on the substrate, the rigid substrate is generally removed by laser lift off (LLO) technology.

[0060] In the LLO process, Figure 1 For the schematic diagram of the peeling problem caused by the setting of the barrier wall in LLO, refer to Figure 1 It can be seen that, due to the high light transmittance of the barrier wall setting area, the laser penetrates the substrate, causing the organic material film in the barrier wall setting area to vaporize. Due to the large stress concentration in the film layer of the barrier wall ramp area, the vaporized organic material film has poor adhesion, thereby causing the peeling of the organic material film layer and affecting the structural stability and reliability of the display panel. The reliability can be understood as the integrity, electrical conductivity, and long-term stability under environmental changes (such as temperature and humidity changes) of the hole wall of the punching area. If there is a defect in the punching area, it may affect the reliability of the electronic device, leading to performance degradation or failure.

[0061] At the same time, the conventional barrier wall structure is generally a multi-layer structure, and the setting of the multi-layer structure causes the barrier wall structure to form multiple steps. Figure 2 For the schematic diagram of the accelerated degradation strain simulation of the display panel under 85°C / 85% environment, refer to Figure 3 It can be seen that each step is a stress concentration point, causing the strain of the encapsulated inorganic material layer in the barrier wall setting area to be large, thereby causing the detachment of the encapsulated inorganic material layer and affecting the structural stability and reliability of the display panel.

[0062] Based on this, the present application provides a display panel, which includes a display area 001 and a non-display area. The non-display area includes an opening 002 and a partition area 003, the partition area 003 is located between the opening 002 and the display area 001, and the partition area 003 surrounds at least part of the opening 002. The present application adds a reinforcing structure on the first partition structure for partitioning the organic material in the display area 001 in the partition area 003, effectively improves the adhesion between the film layers in the partition area 003, reduces the risk of peeling between the film layers, and further improves the structural stability and reliability of the display panel.

[0063] Specifically, the partition area 003 surrounding at least part of the opening 002 can include full surrounding and half surrounding settings. For example Figure 2 In the display area 001 in part a surrounds the opening 002, and correspondingly, the partition area 003 is arranged around the opening 002. Figure 2 In the display area 001 in part b surrounds the opening 002, and correspondingly, the partition area 003 is arranged around the opening 002.

[0064] The display panel comprises, in the display area 001, a circuit layer 3, a planarization layer 4, an anode layer 5 and a light-emitting layer 7 which are sequentially stacked. The planarization layer 4 has a first partition structure 30 in the partition area 003. It can also be understood that the first partition structure 30 is formed by the planarization layer 4.

[0065] Specifically, part of the planarization layer 4 in the display area 001 needs to be patterned to form a via hole. The anode layer 5 and the circuit layer 3 are electrically connected through the via hole on the planarization layer 4. Therefore, the convex structure (the convex structure is used to form the first partition structure 30 in the subsequent process) can be formed in the partition area 003 synchronously in the process of patterning the planarization layer 4, that is, the planarization layer 4 in the display area 001 is formed to provide a planarization surface for the anode layer 5, so as to facilitate light extraction. The first partition structure 30 for partitioning the light-emitting layer 7 is formed in the partition area 003. The planarization layer 4 can be made of an organic material.

[0066] The display panel comprises a substrate layer in the partition area 003. The substrate layer can be formed by part of the film layer in the circuit layer 3 in the display area 001, or by part of the film layer below the circuit layer 3, or by part of the film layer below the circuit layer 3 and part of the film layer in the circuit layer 3. The composition of the substrate layer is not limited in the present application.

[0067] It should be particularly noted that the circuit layer 3 mentioned in the present embodiment can also be understood as a thin film transistor (TFT). The type of thin film transistor is not limited in the present application. It can be any one of LTPS TFT (Low-Temperature Polycrystalline Silicon Thin-Film Transistor), Oxide TFT (Oxide Thin-Film Transistor) and LTPO TFT (Low Temperature Polycrystalline Oxide Thin Film Transistor).

[0068] In one embodiment, with reference to Figure 4The circuit layer 3 in the display area 001 includes, in sequence from top to bottom, a semiconductor layer 31, a first gate insulating layer 32, a first gate metal layer 33, a second gate insulating layer 34, a second gate metal layer 35, a first interlayer dielectric layer 36, and a source-drain metal layer 37. The flexible substrate layer 1 and the buffer layer 2 are further arranged below the circuit layer 3.

[0069] The semiconductor layer 31 is used to form a channel pattern of a transistor and a wiring pattern in a circuit. The first gate insulating layer 32 can be made of silicon oxide to insulate the transistor gate from the semiconductor layer 31. The first gate metal layer 33 can be made of molybdenum (Mo) to form a gate pattern of the transistor and a lower electrode pattern of a capacitor. The second gate insulating layer 34 can be made of silicon nitride to serve as a capacitor dielectric. The second gate metal layer 35 can also be made of molybdenum (Mo) to form an upper electrode pattern of the capacitor. The first interlayer dielectric layer 36 can be configured as a composite film layer to insulate the gate of the transistor from the source-drain metal layer 37 and to provide H atoms to fill defects in the polycrystalline silicon channel in the semiconductor layer 31. The source-drain metal layer 37 can be configured as a composite film layer, such as a titanium-aluminum-titanium (Ti-Al-Ti) film layer made of titanium (Ti), aluminum (Al), and titanium (Ti). The height of the source-drain metal layer 37 ranges from 1000 to 3000 (Angstrom, A), where the thicknesses of the three layers can be set to 1000 A, 1000 A, and 2000 A, respectively. The thicknesses of the titanium layers on the top and bottom sides are 1000 A and 1000 A, respectively. The thickness of the aluminum layer in the middle is 2000 A. The source-drain metal layer 37 is used to form a metal wiring to provide current to the anode layer 5 and control the luminance of the light-emitting device.

[0070] Further, the flexible substrate layer 1 can be made of any one of polyimide, polyethylene naphthalate (PEN), and polyethylene terephthalate (PET). The flexible substrate layer 1 can be a single layer or multiple layers, which are not limited herein. The buffer layer 2 can be made of any one of a-Si (amorphous silicon), SiNx (silicon nitride), and SiOx (silicon oxide), and the buffer layer 2 can be a single layer or multiple layers.

[0071] In some embodiments, continuing to refer to Figure 4The first partition structure 30 on the substrate layer includes a main top surface and a main bottom surface opposite in a direction perpendicular to the plane of the display panel, and a main side surface connecting between the main top surface and the main bottom surface. It should be noted that the direction perpendicular to the plane of the display panel is the first direction X mentioned above. In order to improve the readability of the content, the first direction X is used to represent the following.

[0072] Specifically, the first partition structure 30 is a protruding structure relative to the substrate layer, that is, it can be a dam or a retaining wall structure extending along the edge of the opening 002, which is used to naturally cut off the light-emitting layer 7 in the partition area 003 by the first partition structure 30, so that it cannot form a continuous film layer from the opening 002 to the display area 001, thereby isolating the water and oxygen in the process of opening the display panel from invading and extending to the display area 001 through the light-emitting layer 7, causing various display problems of the display panel.

[0073] Further, the number of the first partition structure 30 is not limited in the present application. It can be set to one, or multiple arranged at intervals. For example, for a circular opening 002, a first partition structure 30 can be arranged around the opening 002, that is, in the partition area 003. If multiple first partition structures 30 are arranged, each partition structure can form a ring structure around the opening 002, and multiple ring-shaped first partition structures 30 around the opening 002 are arranged at intervals.

[0074] In some embodiments, referring to Figure 5 , Figure 6 , Figure 11 and Figure 12 , the first partition structure 30 includes a first partition part 301 and a second partition part 302, and the first partition part 301 and the second partition part 302 are sequentially arranged in a direction perpendicular to the plane of the display panel. The first partition part 301 includes a first bottom surface 3011 and a first top surface 3012 opposite in a direction perpendicular to the plane of the display panel, and a first side surface 3013 connecting between the first top surface 3012 and the first bottom surface 3011. The second partition part 302 includes a second bottom surface 3021 and a second top surface 3022 opposite in a direction perpendicular to the plane of the display panel, and a second side surface 3023 connecting between the second top surface 3022 and the second bottom surface 3021. The first top surface 3012 and the second bottom surface 3021 at least partially contact.

[0075] In some embodiments, according to the different mask plates used in the preparation process of the first partition part 301 and the second partition part 302, the first partition structure 30 as a whole can form several different structural forms.

[0076] In one embodiment, referring to Figure 5 and Figure 6The second partition part 302 is located on the first top surface 3012, and an area of the second bottom surface 3021 of the second partition part 302 is smaller than an area of the first top surface 3012.

[0077] Further, the first partition part 301 and the second partition part 302 gradually decrease in cross-sectional size along a direction away from the substrate layer, and the first partition part 301 and the second partition part 302 are arranged in a stacked manner, and the cross-sectional shape of the first partition part 301 and the second partition part 302 as a whole is in a stepped shape.

[0078] In one embodiment, referring to Figure 11 and Figure 12 The area of the second bottom surface 3021 of the second partition part 302 is greater than the area of the first bottom surface 3011 of the first partition part 301, and the second bottom surface 3021 of the second partition part 302 completely covers the first side surface 3013 of the first partition part 301.

[0079] Further, the first partition part 301 and the second partition part 302 gradually decrease in cross-sectional size along a direction away from the substrate layer, and the second partition part 302 covers the first partition part 301, forming a large package small structure. Preferably, the cross-sectional shape of the first partition structure 30 is in a trapezoidal shape.

[0080] It should be particularly pointed out that the first partition structure 30 can also include several other forms, not limited to the above two stepped or large package small forms, and not limited to only two sub-partition parts. According to actual needs, a plurality of stacked or mutually wrapped partition parts can also be provided.

[0081] In some embodiments, continuing to refer to Figure 4 The display panel further includes a second interlayer dielectric layer 6 in the display area 001, and the planarization layer 4 forms the first partition part 301 in the partition area 003, and the second interlayer dielectric layer 6 forms the second partition part 302 in the partition area 003.

[0082] Specifically, in the process of patterning the planarization layer 4, the first protruding structure (which is used to form the first partition part 301 in the subsequent process) can be formed in the partition area 003 at the same time, and then the anode layer 5 and the second interlayer dielectric layer 6 are sequentially prepared in the display area 001. In the process of patterning the second interlayer dielectric layer 6, the second protruding structure (which is used to form the second partition part 302 in the subsequent process) can be formed in the partition area 003 at the same time. Further, the second interlayer dielectric layer 6 can be a collection of PDL (pixel definition layer) layer and PS (post spacer) layer.

[0083] In some embodiments, the partition region 003 further comprises a reinforcing structure 50. The reinforcing structure 50 is in contact with at least part of the side surface of the first partition structure 30 and in contact with the substrate layer. The reinforcing structure 50 can be a single layer or a laminated structure. The reinforcing structure 50 is made of a metal material or a composite film layer of a metal and other materials. Specifically, the reinforcing structure 50 can be made of a metal material such as IZO (Indium Zinc Oxide), AZO (Aluminum-doped Zinc Oxide), Ti / Al / Ti (Titanium / Aluminum / Titanium), Mo (Molybdenum), etc.

[0084] Firstly, the present application can effectively alleviate or release the stress of the display panel during the preparation process by setting the reinforcing structure 50, so as to improve the bonding force between the first partition structure 30 and each film layer, i.e. by improving the stress resistance of the light-emitting layer 7 or the encapsulation layer 9, etc. to increase the bonding force between the first partition structure 30 and the subsequently prepared light-emitting layer 7 and encapsulation layer 9, etc., thereby reducing the film layer peeling problem in the partition region 003 of the display panel.

[0085] Secondly, the setting of the reinforcing structure 50 can also effectively increase the bonding force between the first partition structure 30 and the substrate layer, between the film layers inside the first partition structure 30, and further improve the partitioning effect of the first partition structure 30 on the light-emitting layer 7, thereby improving the stability and reliability of the display panel.

[0086] Finally, the reinforcing structure 50 made of metal material can also effectively dissipate heat in the partition region 003, further reducing the risk of peeling of the film layers in the partition region 003.

[0087] It should be particularly noted that the reinforcing structure 50 can be prepared after the preparation of the first partition structure 30 is completed, or it can be prepared before the preparation of the first partition structure 30 is completed, or it can be prepared according to the first partition structure 30 and alternately prepared with the first partition structure 30. The present application does not limit the preparation sequence of the reinforcing structure 50 and the first partition structure 30, and the preparation node automatically adapts to the changes of its own structure and the changes of the first partition structure 30 to meet the actual needs.

[0088] Secondly, the reinforcing structure 50 can be prepared separately, or it can be formed by the metal layer in the display region 001, i.e. the reinforcing structure 50 can be formed in the partition region 003 simultaneously in the process of patterning the metal layer. The metal material used in the reinforcing structure 50 can be the same as or different from the material used in the metal layer in the display region 001. The present application does not limit this.

[0089] In some embodiments, the reinforcing structure 50 comprises an auxiliary fixing layer 501 and an auxiliary fixing part 502. It should be noted that the reinforcing structure is divided into the auxiliary fixing layer 501 and the auxiliary fixing part 502 for the convenience of understanding, wherein the auxiliary fixing layer 501 can be understood as one or more deposited film layers, and the auxiliary fixing part 502 can be understood as a composite film layer with a certain structure, but the functions of the two are the same. Different reinforcing structures 50 are adopted according to the actual needs in the process of preparing the display panel. For example, only the auxiliary fixing layer 501 can be provided in the partition area 003, or only the auxiliary fixing part 502 can be provided, or both the auxiliary fixing layer 501 and the auxiliary fixing part 502 can be provided. The present application does not make any limitation.

[0090] In one embodiment, the reinforcing structure 50 is provided as the auxiliary fixing layer 501. The auxiliary fixing layer 501 can also be understood as a metal layer formed on the first partition structure 30. The auxiliary fixing layer 501 has the following forms on the first partition structure 30.

[0091] Referring to Figure 8 and Figure 14 , the first form is that the auxiliary fixing layer 501 covers the outer peripheral edge portion of the first partition structure 30 in contact with the substrate layer and the main side surface of at least part of the first partition structure 30. This arrangement can ensure that the gas released from the inside of the display panel during the LLO process escapes from the main side surface and the main top surface which are not covered by the auxiliary fixing layer 501, thereby preventing structural damage or performance degradation of the display panel due to the increase in internal pressure.

[0092] Referring to Figure 5 and Figure 11 , the second form is that the auxiliary fixing layer 501 covers the substrate layer of the part of the outer peripheral edge of the main bottom surface of the first partition structure 30, the main side surface, and the main top surface. It can be understood that the auxiliary fixing layer 501 completely covers the first partition structure 30. This arrangement can greatly increase the adhesion between the first partition structure 30 and the light-emitting layer 7 and the encapsulation layer 9, avoiding the peeling problem between the film layers, thereby effectively improving the yield of the display panel. At the same time, the full wrapping of the auxiliary fixing layer 501 on the first partition structure 30 can increase the bonding force between the first partition structure 30 and the substrate layer, greatly improving the stability and reliability of the display panel.

[0093] Referring to Figure 7 , Figure 13 and Figure 17The third mode is to form a plurality of exhaust holes on the auxiliary fixing layer 501 on the main top surface based on the second mode. When the opening 002 is a ring-shaped opening 002 and the first partition structure 30 arranged in a circle is ring-shaped, the exhaust holes on the main top surface are arranged at intervals on the ring-shaped auxiliary fixing layer 501 to form a ring-shaped arrangement. This arrangement not only provides an effective channel for the release of gas inside the display panel, but also ensures the uniformity and efficiency of gas release by arranging the exhaust holes at intervals, and improves the bonding force between the film layers by using the remaining auxiliary fixing layer 501 on the main top surface.

[0094] In one embodiment, the reinforcing structure 50 is arranged as an auxiliary fixing portion 502. The auxiliary fixing portion 502 can also be understood as a metal column formed of metal on the substrate layer. The auxiliary fixing portion 502 can be arranged in different shapes.

[0095] In one embodiment, the auxiliary fixing portion 502 gradually increases in cross-sectional size in a direction away from the substrate layer. It can also be understood that the cross section of the auxiliary fixing portion 502 is in the shape of a buckle mortise and tenon structure or an inverted trapezoidal structure. In another embodiment, the auxiliary fixing portion 502 gradually decreases in cross-sectional size in a direction away from the substrate layer and then gradually increases. It can also be understood that the cross-sectional shape of the auxiliary fixing portion 502 is in the shape of an I-beam or a mushroom head.

[0096] In some embodiments, the source-drain metal layer 37 is a titanium / aluminum / titanium composite film layer, and the source-drain metal layer 37 has an auxiliary fixing portion 502 in the partition area 003. It can also be understood that the source-drain metal layer 37 and the auxiliary fixing portion 502 in the partition area 003 are prepared in the same layer.

[0097] Specifically, referring to Figure 4 , Figure 9 , Figure 10 and Figure 16 , based on the preparation sequence of the titanium / aluminum / titanium composite film layer, the first layer of titanium metal in the source-drain metal layer 37 forms a first sub-fixing portion in the partition area 003, the aluminum metal layer in the source-drain metal layer 37 forms a second sub-fixing portion in the partition area 003, the second layer of titanium metal in the source-drain metal layer 37 forms a third sub-fixing portion in the partition area 003, and the first sub-fixing portion, the second sub-fixing portion, and the third sub-fixing portion together form the auxiliary fixing portion 502, and the cross-sectional shape of the auxiliary fixing portion 502 is in the shape of an I-beam.

[0098] It should be particularly noted that when the source-drain metal layer 37 and the auxiliary fixing portion 502 are prepared in the same layer, the heights of the two are the same. Preferably, the height of the auxiliary fixing portion 502 is in the range of (Angstrom, A), wherein the thicknesses of the first sub-fixing portion, the second sub-fixing portion, and the third sub-fixing portion can be respectively set to The thickness of the first and third sub-fixing portions is The thickness of the second sub-fixing portion is

[0099] In some embodiments, the width of the auxiliary fixing portion 502 is less than one fourth of the width of the first partition structure 30. The auxiliary fixing portion 502 is mainly used to improve the adhesion between the first partition structure 30 and the substrate layer. In one embodiment, the width of the first partition structure 30 ranges from 30 μm to 50 μm, and the width of the auxiliary fixing portion 502 ranges from 5 μm to 15 μm.

[0100] In some embodiments, with reference to Figure 4 The partition area 003 further comprises a second partition structure 40. The second partition structure 40 comprises a third partition portion 401 and a fourth partition portion 402. The third partition portion 401 is located between the display area 001 and the first partition structure 30, and the fourth partition portion 402 is located between the first partition structure 30 and the opening 002. The light-emitting layer 7 is naturally cut into a first part and a second part by the first partition structure 30 and the second partition structure 40 in the partition area 003. The first part is located on the surface of the first partition structure 30 and the second partition structure 40, and the second part is located on the surface of the substrate layer outside the first partition structure 30 and the second partition structure 40.

[0101] The application adds the second partition structure 40, i.e., the third partition portion 401 and the fourth partition portion 402, in the partition area 003 of the display panel, which can further improve the partition effect of the light-emitting layer 7 on the basis of the first partition structure 30, and improve the problem of low yield of the display panel caused by the invasion of water and oxygen into the display area 001.

[0102] Specifically, the structure of the third partition portion 401 and the fourth partition portion 402 can be the same as that of the auxiliary fixing portion 502. That is, the cross section of the third partition portion 401 and the fourth partition portion 402 can be a buckle mortise structure with the upper part larger and the lower part smaller, or an inverted trapezoidal structure. Alternatively, the cross section of the third partition portion 401 and the fourth partition portion 402 can be an I-shaped or a mushroom-shaped.

[0103] In one embodiment, when the source-drain metal layer 37 is a titanium / aluminum / titanium composite film layer, the source-drain metal layer 37 has the third partition portion 401 and the fourth partition portion 402 in the partition area 003. It can also be understood that the source-drain metal layer 37 is prepared in the same layer as the third partition portion 401 and the fourth partition portion 402 in the partition area 003. The structure of the third partition portion 401 and the fourth partition portion 402 and the formation relationship between the film layers in the source-drain metal layer 37 can be referred to the specific content of the auxiliary fixing portion 502 described above, and will not be described here.

[0104] In one embodiment, the source / drain metal layer 37, the auxiliary fixing portion 502, the third partition portion 401 and the fourth partition portion 402 can be formed in the same layer, and the auxiliary fixing portion 502, the third partition portion 401 and the fourth partition portion 402 have the same height. Preferably, the height of the auxiliary fixing portion 502, the third partition portion 401 and the fourth partition portion 402 ranges from 0.5 μιη to 1.5 μιη.

[0105] Further, the third partition portion 401 and the fourth partition portion 402 have the same width as the auxiliary fixing portion 502. Alternatively, the third partition portion 401 and the fourth partition portion 402 have a width greater than that of the auxiliary fixing portion 502.

[0106] In some embodiments, continuing to refer to Figure 4 , the first gate metal layer 33 and / or the second gate metal layer 35 has a raised structure 60 in the partition region 003, and the raised structure 60 is located below the second partition structure 40.

[0107] Specifically, the raised structure 60 can be formed by the first gate metal layer 33, or by the second gate metal layer 35. Alternatively, the raised structure 60 can be formed by the first gate metal layer 33 and the second gate metal layer 35 together. For example Figure 4 , the raised structure 60 is formed by the first gate metal layer 33 and the second gate metal layer 35.

[0108] Further, an inorganic layer can be arranged between the raised structure 60 and the first partition structure 30 (the planarization layer 4). The inorganic layer can be one or more of the first gate insulating layer 32, the second gate insulating layer 34 and the first interlayer dielectric layer 36. Continuing to refer to Figure 4 , when the raised structure 60 is needed in the partition region 003, the substrate layer in the partition region 003 includes the flexible substrate layer 1, the buffer layer 2, the first gate insulating layer 32, the first gate metal layer 33, the second gate insulating layer 34, the second gate metal layer 35 and the first interlayer dielectric layer 36 arranged in sequence.

[0109] The present application can make the step difference between the light-emitting layer 7 at the top of the second partition structure 40 and the light-emitting layer 7 outside the second partition structure 40 greater by adding the raised structure 60 below the second partition structure 40 without adding the raised structure 60 outside the second partition structure 40, so as to improve the partition effect on the light-emitting layer 7.

[0110] In some embodiments, continuing to refer to Figure 4The display panel in the display area 001 further comprises a cathode layer (not shown in the figure) located on the side of the light-emitting layer 7 away from the anode layer 5, and an encapsulation layer 9 located on the side of the cathode layer away from the light-emitting layer 7. The encapsulation layer 9 comprises a first encapsulation inorganic layer 91, an encapsulation organic layer 92, and a second encapsulation inorganic layer 93 which are sequentially stacked. The first encapsulation inorganic layer 91, the encapsulation organic layer 92, and the second encapsulation inorganic layer 93 cover the third partition part 401, the first encapsulation inorganic layer 91 and the second encapsulation inorganic layer 93 cover the fourth partition part 402, and the encapsulation organic layer 92 does not overlap with the fourth partition part 402.

[0111] Specifically, the material of the first encapsulation inorganic layer 91 can be selected from silicon oxynitride, and the material of the second encapsulation inorganic layer 93 can be selected from silicon nitride. The first encapsulation inorganic layer 91 and the second encapsulation inorganic layer 93 cover the display area 001 to ensure that the display panel and the cathode layer 8 are not invaded by water and oxygen, and cover the partition area 003 to form a better encapsulation barrier effect. The encapsulation organic layer 92 covers the display area 001 to realize planarization and encapsulation of foreign matter, and further improve the encapsulation performance.

[0112] The different forms of the first partition structure (the first partition part and the second partition part are stacked or wrapped) mentioned in the above content are combined with the different forms of the reinforcing structure (the auxiliary fixing layer 501 and the auxiliary fixing part 502) respectively, and the following several embodiments can be obtained. The preparation process of the display panel in each specific embodiment is described in detail below in combination with the drawings.

[0113] It should be particularly noted that the structure of the display panel in the present embodiment is illustrated by way of example of the preparation process of the display panel. The "patterning" mentioned herein includes deposition of a film layer, coating photoresist, mask exposure, development, etching, and stripping photoresist, etc. The deposition can adopt any one or more selected from sputtering, evaporation, and chemical vapor deposition, the coating can adopt any one or more selected from spraying and spin coating, and the etching can adopt any one or more selected from dry etching and wet etching.

[0114] Embodiment 1; the structure in the partition area can refer to Figure 5 In the present embodiment, the first partition part and the second partition part are arranged in a stepped manner to jointly form the first partition structure. The auxiliary fixing layer is formed on the first partition structure. Specifically, the following steps S10-S17 are included.

[0115] Step S10, preparing a flexible substrate layer. The glass substrate (i.e. rigid substrate) is cleaned, and a PI material is coated on the surface of the glass substrate to form a flexible substrate layer.

[0116] Step S11, preparing a buffer layer. A composite film layer of SiNx and SiO2 is deposited on the flexible bottom layer. In the subsequent process of peeling off the glass substrate, it can absorb laser lift off (LLO) energy and prevent damage to the transistor (circuit layer).

[0117] Step S12, preparing a circuit layer (i.e., a thin film transistor). Refer to steps S120 to S129.

[0118] Step S120: preparing a semiconductor layer. An amorphous silicon layer is deposited on the buffer layer, and a dehydrogenation process is performed, followed by a laser annealing operation to realize the conversion of amorphous silicon to polycrystalline silicon to form a semiconductor layer. The polycrystalline silicon is exposed to light and developed and etched to realize the patterning of the thin film transistor channel and the patterning of the wiring.

[0119] Step S121: preparing a first gate insulating layer. SiO2 material is deposited to form a first gate insulating layer.

[0120] Step S122: preparing a first gate metal layer. Molybdenum metal material is deposited to form a first gate metal layer.

[0121] Step S123: preparing a second gate insulating layer. SiNx material is deposited to form a second gate insulating layer.

[0122] Step S124: preparing a second gate metal layer. Molybdenum is deposited to form a second gate metal layer.

[0123] Step S125: preparing a first interlayer dielectric layer. First, SiO2 film layer and SiNx film layer are deposited in sequence to form a composite first interlayer dielectric layer. Then the first interlayer dielectric layer is subjected to hydrogenation treatment. The first interlayer dielectric layer can be used to repair the dangling bonds on the surface of the polycrystalline silicon. Then the first interlayer dielectric layer is etched to form the first via required by the TFT (thin film transistor).

[0124] Step S126: preparing a first source-drain metal layer. Ti metal, Al metal and Ti metal are deposited in sequence in the first via to form a first source-drain metal layer with thicknesses of 50 nm, 650 nm and 50 nm, respectively. The first source-drain metal layer is patterned.

[0125] Step S127: preparing a first planarization layer. The first planarization layer is deposited on the display panel after the deposition of the first source-drain metal layer is completed, and the first planarization layer is patterned.

[0126] It is worth noting that in this step, the first planarization layer in the display area is etched to form the second via hole required by the TFT. The first planarization layer in the partition area forms an annular planarization layer boss (i.e., a first partition part is formed). The first partition part is formed on the first interlayer dielectric layer.

[0127] Step S128: preparing a second source-drain metal layer. Ti metal, Al metal and Ti metal are sequentially deposited in the second via hole and patterned to form the second source-drain metal layer with thicknesses of 50 nm, 650 nm and 50 nm, respectively. The second source-drain metal layer is patterned.

[0128] It should be particularly noted that in this step, when the composite film layer of the second source-drain metal layer fills the second via hole in the display area, a third partition part and a fourth partition part with a Ti / Al / Ti three-layer structure are simultaneously formed on both sides of the first partition part in the partition area. The cross section of the third partition part and the fourth partition part is in the shape of an I-beam.

[0129] Step S129: preparing a second planarization layer. After the deposition of the second source-drain metal layer is completed, a second planarization layer is deposited on the display panel, and the second planarization layer is patterned.

[0130] It is worth noting that in this step, the second planarization layer in the display area is etched to form the anode via hole. The second planarization layer in the partition area forms an annular planarization layer boss (i.e., a second partition part is formed).

[0131] It should be particularly noted that in this embodiment, the area of the second bottom surface of the second partition part is smaller than the area of the first top surface of the first partition part, so when the second partition part is prepared on the first partition part, the edge of the second bottom surface of the second partition part is a certain distance away from the edge of the first top surface of the first partition part, resulting in a certain blank area.

[0132] Therefore, the main side surface of the first partition structure in this embodiment can be understood as the first side surface of the first partition part, the blank area where the second bottom surface does not cover the first top surface, and the second side surface of the second partition part; the main top surface of the first partition structure is equivalent to the second top surface; and the main bottom surface of the first partition structure is equivalent to the first bottom surface.

[0133] Step S13: preparing an auxiliary fixing layer. An indium zinc oxide material is deposited in the first partition structure area of the partition area of the display panel and patterned to form an auxiliary fixing layer.

[0134] Specifically, when the indium zinc oxide material is deposited, the indium zinc oxide thin film completely covers the first interlayer dielectric layer of the outer peripheral portion of the main bottom surface (the first bottom surface) of the first partition structure, the main side surface of the first partition structure, and the main top surface (the second top surface) of the first partition structure.

[0135] Step S14, preparing an anode layer. ITO / AG / ITO composite material is sequentially deposited on the second planarization layer and is patterned to form the anode layer.

[0136] Step S15, preparing a light-emitting layer. The light-emitting layer can include a hole injection layer, a hole transport layer, a light-emitting layer, an electron transport layer, and an electron injection layer, etc. The preparation sequence and materials thereof are conventional techniques, and thus will not be described again.

[0137] Step S16, preparing a cathode layer. The cathode layer can be Mg / Ag alloy.

[0138] Step S17, preparing an encapsulation layer. SiON thin film, organic material thin film, and SiNx thin film are sequentially deposited to form a first encapsulation inorganic layer, an organic encapsulation layer, and a second encapsulation inorganic layer. The first encapsulation inorganic layer and the second encapsulation inorganic layer are stacked and cover the partition area of the display panel.

[0139] At this point, the process of the entire display panel is completed, and the glass substrate can be peeled from the display panel by LLO to form a flexible display panel.

[0140] In some embodiments, a second interlayer medium can be further added between step S129 and step S13. Specifically, the second interlayer medium layer includes a PDL (pixel definition layer) layer and a PS (post spacer) layer which are sequentially prepared.

[0141] Further, the PDL layer and / or the PS layer form a ring-shaped planarization layer boss in the partition area. The boss here can refer to the second partition part, or can refer to other partition parts which are superimposed on the second partition part and form the first partition structure together with the first partition part and the second partition part.

[0142] Embodiment 2; the preparation steps of the display panel in Embodiment 2 are substantially the same as those in Embodiment 1, and thus will not be described again. The difference between the two embodiments is that step S130 is added after step S13 in the case that the deposited indium zinc oxide thin film completely covers the first partition structure. The specific operation is to etch the ring-shaped indium zinc oxide thin film on the main top surface to form a plurality of exhaust holes. The partial structure in the partition area can refer to Figure 7 .

[0143] Embodiment 3; the preparation steps of the display panel in Embodiment 3 are substantially the same as those in Embodiment 1, and will not be repeated here. The difference between the two embodiments is that in step S13, different mask plates are used when depositing the indium-zinc oxide thin film. In this embodiment, by using different mask plates, the indium-zinc oxide thin film does not completely cover the first partition structure, but only covers part of the first partition structure. The structure in the partition area can refer to Figure 8 .

[0144] Specifically, the indium-zinc oxide thin film covers the first interlayer dielectric layer of the outer peripheral portion of the main bottom surface (first bottom surface) of the first partition structure, and part of the main side surface of the first partition structure. Among them, part of the side surface refers to the first side surface and the blank part of the second bottom surface that does not cover the first top surface. It can also be understood that not only the first side surface of the first partition part is covered, but also the part of the step corner between the first partition part and the second partition part is covered.

[0145] In one embodiment, when the indium-zinc oxide thin film covers the first interlayer dielectric layer of the outer peripheral portion of the main bottom surface (first bottom surface) of the first partition structure, and part of the main side surface of the first partition structure, the auxiliary fixing layer can be directly made with the second source-drain metal layer in step S128 without separate preparation, and then step S13 can be cancelled.

[0146] Specifically, in step S128, when the composite film layer of the second source-drain metal layer fills the second via hole in the display area, the composite film layer of the second source-drain metal is also deposited on the first partition part in the partition area, thereby forming the auxiliary fixing layer. Subsequently, the second partition part is prepared in the place on the first partition part that is not covered by the second source-drain metal composite film layer.

[0147] Embodiment 4; the first partition part and the second partition part are arranged in a stepped manner to jointly form the first partition structure. The auxiliary fixing part is formed on the first partition structure.

[0148] The display panel in this embodiment has substantially the same preparation process steps as the display panel in Embodiment 1, and the difference is that the auxiliary fixing part in this embodiment does not need to be prepared separately, and can be directly made with the first source-drain metal layer in step S126 and / or the second source-drain metal layer in step S128.

[0149] In one embodiment, when the TFT first via hole of the display area is sequentially deposited with Ti metal, Al metal and Ti metal to form the first source-drain metal layer in step S126, the Ti / Al / Ti composite thin film layer is also deposited in the partition area to form a plurality of annular first auxiliary fixing parts with a cross-section in the shape of an I-beam. It is worth noting that, in order to distinguish the auxiliary fixing part on the first interlayer dielectric layer from the auxiliary fixing part in other embodiments, the auxiliary fixing part on the first interlayer dielectric layer is named as the first auxiliary fixing part. Then the first partition part and the second partition part are continuously prepared on the first auxiliary fixing part, which is consistent with the steps in Embodiment 1, and thus will not be described here. The partial structure in the partition area can refer to Figure 9 .

[0150] Further, the partial structure in the partition area can refer to Figure 9 , and the first bottom surface of the first partition part at least partially covers the top surface of the first auxiliary fixing part. Specifically, the plurality of first auxiliary fixing parts are arranged at intervals, and the distance between two adjacent first auxiliary fixing parts is a first width, and the width of the first bottom surface in the first partition part is a second width. Preferably, the first width is greater than the second width, so that when the first partition part is prepared on the first auxiliary fixing part, the edge part of the first partition part can be located on the upper surface (i.e. the titanium metal layer) of the first auxiliary fixing part, thereby effectively improving the adhesion between the film layers.

[0151] In one embodiment, when the TFT second via hole of the display area is sequentially deposited with Ti metal, Al metal and Ti metal to form the second source-drain metal layer in step S128, the Ti / Al / Ti composite thin film layer is also deposited in the partition area to form a plurality of annular second auxiliary fixing parts with a cross-section in the shape of an I-beam. The second auxiliary fixing part here refers to the auxiliary fixing part between the first partition part and the second partition part. Then the second partition part and the like are prepared on the second auxiliary fixing part, which is consistent with the steps in Embodiment 1, and thus will not be described here.

[0152] Further, the partial structure in the partition area can refer to Figure 10 , that is, the second bottom surface of the second partition part at least partially covers the top surface of the second auxiliary fixing layer. Specifically, the plurality of second auxiliary fixing parts are arranged at intervals, and the distance between two adjacent second auxiliary fixing parts is a third width, and the width of the second bottom surface in the second partition part is a fourth width. Preferably, the third width is greater than the fourth width, so that when the second partition part is prepared on the second auxiliary fixing part, the edge part of the second partition part can be located on the upper surface (i.e. the titanium metal layer) of the second auxiliary fixing part, thereby effectively improving the adhesion between the film layers.

[0153] In one embodiment, the first auxiliary fixing part, the first partition part, the second auxiliary fixing part and the second partition part are sequentially prepared. The detailed preparation process can refer to the above-mentioned embodiments, which will not be described here.

[0154] In the embodiment 5, the first partition and the second partition are arranged in a wrapped manner to form a first partition structure together. An auxiliary fixing layer is formed on the first partition structure.

[0155] The display panel in the embodiment has substantially the same preparation process steps as the display panel in the embodiment 1, except that the size relationship between the first partition and the second partition is different.

[0156] Similarly, the first partition is formed by the first planarization layer in step S127 and the second partition is formed by the second planarization layer in step S129. The difference is that the area of the second bottom surface of the second partition is greater than the area of the first bottom surface of the first partition, and the second bottom surface of the second partition completely covers the first side surface of the first partition to form a first partition structure with a large first partition and a small second partition.

[0157] It is worth noting that in the embodiment, the main side surface of the first partition structure is the second side surface of the second partition; the main top surface of the first partition structure is the second top surface of the second partition; and the main bottom surface of the first partition structure can be understood as the first bottom surface of the first partition and the part of the second top surface of the second partition that is not covered by the first partition.

[0158] In one embodiment, the part of the structure in the partition area can refer to Figure 11 The auxiliary fixing layer completely covers the first partition structure. That is, the indium zinc oxide film adopted by the auxiliary fixing layer covers the first interlayer dielectric layer of the outer peripheral part of the main bottom surface (the first bottom surface) of the first partition structure, the main side surface (i.e. the second side surface of the second partition) of the first partition structure, and the main top surface (i.e. the second top surface on the second partition) of the first partition structure.

[0159] In one embodiment, in the case where the auxiliary fixing layer completely covers the first partition structure, a new step is added to etch the annular indium zinc oxide film on the main top surface to form a plurality of exhaust holes.

[0160] In one embodiment, the auxiliary fixing layer only covers part of the first partition structure. That is, the indium zinc oxide film adopted by the auxiliary fixing layer covers the first interlayer dielectric layer of the outer peripheral part of the main bottom surface (the first bottom surface and part of the second bottom surface) of the first partition structure, and part of the main side surface (i.e. the second side surface of the second partition) of the first partition structure.

[0161] Embodiment 6; the first partition and the second partition are arranged in a wrapped manner to jointly form the first partition structure. The auxiliary fixing part is formed on the first partition structure. The preparation process steps of the display panel in this embodiment are substantially the same as those of the display panel in Embodiment 1, the difference lies in the size relationship between the first partition and the second partition in this embodiment and the auxiliary fixing part in this embodiment does not need to be prepared separately, but can be directly made in the same layer as the first source-drain metal layer in step S126 or the second source-drain metal layer in step S128.

[0162] In one embodiment, in step S126, when the TFT first via hole of the display area is sequentially deposited with Ti metal, Al metal and Ti metal to form the first source-drain metal layer, the Ti / Al / Ti composite thin film layer is also deposited in the partition area to form a plurality of annular and cross-section I-shaped auxiliary fixing parts.

[0163] Specifically, the partial structure in the partition area can refer to Figure 16 The first bottom surface of the first partition at least partially covers the at least partial top surface of the auxiliary fixing part.

[0164] In one embodiment, in step S128, when the TFT second via hole of the display area is sequentially deposited with Ti metal, Al metal and Ti metal to form the second source-drain metal layer, the Ti / Al / Ti composite thin film layer is also deposited in the partition area to form a plurality of annular and cross-section I-shaped auxiliary fixing parts.

[0165] Specifically, the partial structure in the partition area can refer to Figure 15 The auxiliary fixing part is arranged on both sides of the first partition and is arranged in a spaced manner with the first partition. The second bottom surface of the second partition at least partially covers the at least partial top surface of the auxiliary fixing part.

[0166] It should be particularly pointed out that the display panel involved in the above-mentioned embodiments 1 to 6 and the drawings provided by the present application are slightly different. The main difference lies in the difference in the circuit layer, and the double-layer source-drain metal layer structure in Embodiments 1 to 5. However, the form of the first partition structure and the reinforcing structure involved in different embodiments are consistent, so the first bottom surface, the second bottom surface, the first top surface, the second top surface, the first side surface and the second side surface mentioned in Embodiments 1 to 5 can be understood in combination with part of the drawings provided by the present application.

[0167] The present application also provides a display device comprising the display panel as mentioned in any of the above embodiments. The specific structure and principle of the display panel are the same as those of the above-mentioned embodiments, and will not be repeated here. The display device can be, for example, a display, a mobile phone, a television, a tablet computer or any product with display function, etc., which will not be listed one by one here.

[0168] The terms "first", "second", and similar terms used herein do not necessarily have any sequence or order, but are used to distinguish one component from another. Also, the terms "one" or "the" do not necessarily have a limitation on the number and can mean at least one, unless specifically stated otherwise. The term "plurality" or "a plurality" means two or more. The term "and / or" includes any or all possible combinations of one or more of the associated listed items.

[0169] The technical features of the above embodiments can be combined in any manner. For the sake of brevity, not all possible combinations of the technical features described above are described, however, it is understood that any combination of the technical features is within the scope of the present specification.

Claims

1. A display panel, comprising: a display area and a non-display area, the non-display area comprising an opening and a partition area, the partition area being located between the opening and the display area and surrounding at least part of the opening; the display panel comprising a planarization layer in the display area, the planarization layer having a first partition structure in the partition area, the first partition structure comprising a main top surface and a main bottom surface opposite to each other in a direction perpendicular to a plane on which the display panel is located, and a main side surface connecting the main top surface and the main bottom surface; the display panel comprising a substrate layer in the partition area, the first partition structure being formed on the substrate layer, and a reinforcing structure being further provided on the substrate layer, the reinforcing structure being in contact with at least part of the side surface of the first partition structure and the substrate layer. The first partition structure comprises a first partition part and a second partition part, the first partition part and the second partition part being sequentially arranged in a direction perpendicular to a plane on which the display panel is located. The first partition part comprises a first bottom surface and a first top surface opposite to each other in a direction perpendicular to a plane on which the display panel is located, and a first side surface connecting the first top surface and the first bottom surface, and the second partition part comprises a second bottom surface and a second top surface opposite to each other in a direction perpendicular to a plane on which the display panel is located, and a second side surface connecting the second top surface and the second bottom surface, wherein the first top surface and the second bottom surface are at least partially in contact. The second partition part is located on the first top surface, and an area of the second bottom surface of the second partition part is smaller than an area of the first top surface.

2. The display panel of claim 1, wherein, An area of the second bottom surface of the second partition part is larger than an area of the first bottom surface of the first partition part, and the second bottom surface of the second partition part completely covers the first side surface of the first partition part. The reinforcing structure comprises an auxiliary fixing layer, the auxiliary fixing layer covering a part of the substrate layer surrounding an outer periphery of the main bottom surface of the first partition structure to at least part of the main side surface of the first partition structure. The display panel further comprises an anode layer, the anode layer and the planarization layer being sequentially arranged in a direction perpendicular to a plane on which the display panel is located.

3. The display panel of claim 2, wherein, When the second partition part is located on the first top surface, and an area of the second bottom surface of the second partition part is smaller than an area of the first top surface, the anode layer forms the auxiliary fixing layer in the partition area, and the auxiliary fixing layer covers the first side surface of the first partition part and a blank part of the first top surface of the first partition part which is not covered by the second bottom surface.

4. The display panel of claim 2, wherein, The auxiliary fixing layer covers the substrate layer, the main side surface and the main top surface of the part of the first partition structure surrounding the outer periphery of the main bottom surface.

5. The display panel according to any one of claims 2-4, characterized in that, A plurality of exhaust holes are formed on the auxiliary fixing layer located on the main top surface, the exhaust holes being arranged at intervals on the auxiliary fixing layer.

6. The display panel of claim 5, wherein, The reinforcing structure further comprises a plurality of auxiliary fixing parts, the auxiliary fixing parts gradually increasing in cross-sectional size in a direction away from the substrate layer; or the auxiliary fixing parts gradually decreasing in cross-sectional size first and then increasing in a direction away from the substrate layer. A width of the auxiliary fixing part is smaller than one fourth of a width of the first partition structure.

7. The display panel of claim 5, wherein, ​ 8. The display panel of claim 7, wherein, ​ 9. The display panel of any of claims 2-4, wherein, ​ ​ 10. The display panel of claim 9, wherein, ​ 11. The display panel of claim 9, wherein, when the second partition part is located on the first top surface and the area of the second bottom surface of the second partition part is smaller than the first top surface, the auxiliary fixing part is located between the first partition part and the substrate layer, and / or the auxiliary fixing part is located between the first partition part and the second partition part.

12. The display panel of claim 11, wherein, when the auxiliary fixing part is located between the first partition part and the substrate layer, the first bottom surface of the first partition part at least partially covers at least part of the top surface of the auxiliary fixing part; when the auxiliary fixing part is located between the first partition part and the second partition part, the second bottom surface of the second partition part at least partially covers at least part of the top surface of the auxiliary fixing part.

13. The display panel of claim 9, wherein, when the area of the second bottom surface of the second partition part is greater than the area of the first bottom surface of the first partition part, and the second bottom surface of the second partition part completely covers the first side surface of the first partition part, the auxiliary fixing part is located on both sides of the first partition part, and the second bottom surface of the second partition part at least partially covers at least part of the top surface of the auxiliary fixing part.

14. The display panel of claim 13, wherein, the first bottom surface of the first partition part at least partially covers at least part of the top surface of the auxiliary fixing part.

15. The display panel of claim 9, wherein, The partition region further comprises a second partition structure, the second partition structure comprising a third partition part and a fourth partition part; wherein the third partition part is located between the display region and the first partition structure, and the fourth partition part is located between the first partition structure and the opening.

16. The display panel of claim 15, wherein, The display panel in the display region further comprises a circuit layer, an anode layer and a light-emitting layer, and the substrate layer, the circuit layer, the anode layer, the planarization layer and the light-emitting layer in the display region of the display panel are sequentially stacked; wherein The light-emitting layer is naturally truncated into a first part and a second part by the first partition structure and the second partition structure in the partition region, the first part is located on the surface of the first partition structure and the second partition structure, and the second part is located on the surface of the substrate layer outside the first partition structure and the second partition structure.

17. The display panel of claim 16, wherein, The circuit layer comprises a semiconductor layer, a first gate insulating layer, a first gate metal layer, a second gate insulating layer, a second gate metal layer, a first interlayer dielectric layer and a source-drain metal layer which are sequentially stacked; wherein The first gate metal layer and / or the second gate metal layer have a raised structure in the partition region, and the raised structure is located below the second partition structure.

18. The display panel of claim 17, wherein, The source-drain metal layer forms the auxiliary fixing part, the third partition part and the fourth partition part in the partition region, and the auxiliary fixing part, the third partition part and the fourth partition part.

19. The display panel of claim 17, wherein, The display panel in the display region further comprises a cathode layer located on the side of the light-emitting layer away from the anode layer, and an encapsulation layer located on the side of the cathode layer away from the light-emitting layer; The encapsulation layer comprises a first encapsulation inorganic layer, an encapsulation organic layer and a second encapsulation inorganic layer which are sequentially stacked; wherein The first encapsulation inorganic layer, the encapsulation organic layer and the second encapsulation inorganic layer cover the third partition part, the first encapsulation inorganic layer and the second encapsulation inorganic layer cover the fourth partition part, and the encapsulation organic layer does not overlap with the fourth partition part.

20. A display device comprising: A display panel comprising any of claims 1-19.

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