Novel power diode chip for photovoltaic junction box

Abstract

The utility model discloses a novel power diode chip for a photovoltaic junction box, which comprises a chip and conductors arranged on two sides of the chip, each conductor comprises a pin close to one side of the chip and a copper lead arranged on the outer side of the pin, the pin is round, a plastic package body coated on the periphery of the conductor is arranged on the outer side of the chip, and the copper lead is arranged on the outer side of the plastic package body. The two groups of pins are in contact with the chip and are packaged on the inner side of the plastic package body, and the plane appearance of the chip is polygonal. According to the utility model, the bottleneck problem of the maximum chip size which can be packaged by the same packaging specification when the photovoltaic diode is packaged in the axial direction is solved, that is, a chip with a larger size can be packaged by the same axial packaging specification, so that the cost of the industry packaging link is reduced in a turning way.

Description

TECHNICAL FIELD

[0001] The utility model relates to electronic device technical field, in particular to a novel power diode chip for photovoltaic junction box. BACKGROUND

[0002] The core component of the diode is a chip. Since the chip material is similar to glass, it is relatively fragile, and a protective layer with good mechanical strength, insulation, and heat conduction performance needs to be added outside the chip to protect the chip. The entire process of adding leads and the protective layer is called packaging in the industry. Different packaging shapes and sizes are also called packaging forms. Common packaging forms in the photovoltaic industry include axial packaging, surface mount packaging, and non-standard module packaging. The current mature, high-reliability, and low-cost photovoltaic power diode packaging form is axial packaging (i.e., cylindrical packaging).

[0003] The axial diode disclosed in Chinese Utility Model Patent No. CN219958972U uses a square chip inside all diodes with different packaging forms in the current photovoltaic industry. Only a few are rectangular. Since all chips used in photovoltaic diodes currently have a square shape, four circular arcs will be generated on the edges of the square chip. This area does not produce any effect and wastes packaging materials and space. The current standard packaging size cannot package larger chips, resulting in many limitations in terms of compatible chip size during diode packaging, which cannot effectively reduce packaging costs. UTILITY MODEL CONTENT

[0004] To solve the above technical problems, a novel power diode chip for photovoltaic junction box is provided to solve the bottleneck problem of the maximum chip size that can be packaged in the same packaging specification during axial packaging of photovoltaic diodes, i.e., larger size chips can be packaged in the same axial packaging specification, thereby reducing the cost of the industry packaging link.

[0005] To achieve the above purpose, the utility model discloses a novel power diode chip for photovoltaic junction box, which comprises a chip and conductive bodies arranged on both sides of the chip. The conductive bodies include pins on one side close to the chip and copper wires outside the pins. The shape of the pins is circular. The chip is provided with a plastic encapsulating body wrapped around the conductive bodies. Two groups of pins contact the chip and are packaged inside the plastic encapsulating body. The planar shape of the chip is polygonal.

[0006] Further, the planar shape of the chip is a regular hexagon.

[0007] Further, the diameter of the circumscribed circle of the chip is less than or equal to the diameter of the pin profile.

[0008] Further, the geometric center of the chip is coaxially arranged with the geometric center of the pin.

[0009] Compared with the prior art, the utility model discloses a novel power diode chip for photovoltaic junction box, solve axial encapsulation photovoltaic diode encapsulation, same encapsulation specification can encapsulate the maximum chip size bottleneck problem of size, same axial encapsulation specification can encapsulate larger size chip, thereby reducing the cost of the industry encapsulation link. BRIEF DESCRIPTION OF DRAWINGS

[0010] The utility model will be further explained in detail in connection with the drawings and specific embodiment.

[0011] Figure 1 It is the encapsulation effect schematic view in prior art.

[0012] Figure 2 It is the encapsulation effect schematic view of the utility model.

[0013] Figure 3 It is the overall structure schematic view of the utility model.

[0014] In the drawing: 1 is chip;2 is pin;3 is copper wire;4 is plastic package body. DETAILED DESCRIPTION

[0015] The technical scheme in the utility model embodiment will be described clearly and completely in connection with the drawings in the utility model embodiment, and obviously, the described embodiment is only a part of the embodiment of the utility model, not all the embodiment. Based on the embodiment in the utility model, all other embodiments obtained by the ordinary skill in the art without creative labor are within the protection scope of the utility model.

[0016] One embodiment of the utility model, as shown in Figure 2 And Figure 3 The utility model discloses a chip 1 and the conductive body arranged on both sides of the chip 1, and the conductive body includes the pin 2 close to one side of the chip 1 and the copper wire 3 outside the pin 2, the shape of the pin 2 is circular, the chip 1 outside is provided with the plastic package body 4 covered around the conductive body, two groups of pins 2 contact the chip 1 and are encapsulated in the inside of the plastic package body 4, the plane shape of the chip 1 is polygon, solve axial encapsulation photovoltaic diode encapsulation, same encapsulation specification can encapsulate the maximum chip size bottleneck problem of size, same axial encapsulation specification can encapsulate larger size chip, and the encapsulation area outside the chip is reduced as far as possible, thereby saving cost and space.

[0017] The plane shape of the chip 1 is a regular hexagon, and the regular hexagon structure has a larger effective chip area than a quadrilateral structure in the same package size, is suitable for an axial packaging form of high maturity, high reliability and low cost, and can package a larger area chip.

[0018] The diameter of the circumscribed circle of the chip 1 is less than or equal to the profile diameter of the pin 2, so that the chip size does not exceed the packaging range.

[0019] The geometric center of the chip 1 is coaxially arranged with the geometric center of the pin 2, so that the chip is located at the center of the pin.

[0020] The points to be explained are as follows: first, in the description of the present application, it is necessary to explain that, unless otherwise specified and limited, the terms "mounting", "connecting", "connecting" should be understood broadly, which can be mechanical connection or electrical connection, or the communication between two elements, or direct connection, "up", "down", "left", "right" and the like are only used to represent the relative positional relationship, when the absolute position of the described object changes, the relative positional relationship may change; secondly, in this paper, relationship terms such as first and second are only used to distinguish one entity from another, and do not necessarily require or imply any such actual relationship or order between the entities.

[0021] The above examples are only illustrative of the present application and do not constitute a limitation on the protection scope of the present application, and any design identical or similar to the present application belongs to the protection scope of the present application.

Claims

1. A novel power diode chip for photovoltaic junction boxes, comprising a chip (1) and conductive bodies arranged on both sides of the chip (1), characterized in that, The conductive body includes pins (2) near one side of the chip (1) and copper wires (3) outside the pins (2), the pins (2) are circular in shape, the chip (1) is provided with a plastic package body (4) wrapped around the conductive body, two groups of the pins (2) are in contact with the chip (1) and are packaged inside the plastic package body (4), and a plane shape of the chip (1) is a polygon.

2. A novel power diode chip for photovoltaic junction boxes according to claim 1, characterized in that, The plane shape of the chip (1) is a regular hexagon.

3. A novel power diode chip for photovoltaic junction boxes according to claim 2, characterized in that, A circumscribed circle diameter of the chip (1) is less than or equal to a contour diameter of the pins (2).

4. A novel power diode chip for photovoltaic junction boxes according to claim 3, characterized in that, Geometric centers of the chip (1) and the pins (2) are coaxially arranged.

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