TOP type full-color LED lamp bead, LED display module and LED display screen

Abstract

The utility model provides a TOP type full-color LED lamp bead, LED display module and LED display screen, the lamp bead comprises an LED support, a full-color LED chip and a sealing glue layer, the LED support comprises a bowl cup body and a lead frame embedded in the bowl cup body, the bowl cup body is provided with an accommodating cavity and an opening communicated with the accommodating cavity, the lead frame partially extends to the bottom of the accommodating cavity, the opening is communicated with the full-color LED chip, and the opening is communicated with the full-color LED chip. The lead frame is provided with a first protrusion and a second protrusion, the full-color LED chip comprises a red light LED crystal grain, a green light LED crystal grain and a blue light LED crystal grain, the red light LED crystal grain is fixed on the first protrusion, the blue light LED crystal grain is fixed on the second protrusion, the green light LED crystal grain is arranged on the portion, located between the first protrusion and the second protrusion, of the lead frame, and the containing cavity is filled with the sealing glue layer. According to the utility model, the projection is stamped on the lead frame, so that the crystalline grains which are fixed on the projection and have partial light-emitting colors are close to the cup opening of the bowl cup as much as possible, and the light-emitting brightness and angle of the LED chip are improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to a light emitting diode technical field, especially TOP type full color LED lamp pearl, LED display module and LED display screen. BACKGROUND

[0002] TOP type full color LED (light emitting diode) lamp pearl refers to the full color LED of top surface light emitting, and its packaging structure usually includes LED support, full color LED chip, bonding wire and other components.

[0003] The preparation process of the support in the packaging structure of the existing TOP type full color LED usually includes stamping, electroplating, injection molding, bending and other steps, finally forms the bowl cup with the flat bottom, carries out die bonding and wire bonding on the metal pad at the bottom of the bowl cup when packaging the full color LED chip, and finally carries out glue dispensing and solidifies the glue.

[0004] However, due to the limitation of the material toughness of the lead frame in the LED support, in order to avoid damaging the flatness and consistency of the lead frame due to the large stretching degree of the lead frame stamping, the depth of the bottom of the existing bowl cup is generally set as a larger fixed value, and the larger depth of the bottom of the bowl cup will lead to smaller light emitting angle of the LED chip, and further lead to lower light emitting efficiency of the whole lamp pearl. UTILITY MODEL CONTENTS

[0005] Based on this, the utility model aims at appropriately improving the stretching degree of the lead frame stamping, and by stamping the protrusion on the lead frame, the light emitting color of the part of the die bonding on the protrusion is as close as possible to the cup mouth of the bowl cup, and the light emitting brightness and angle of the LED chip are improved.

[0006] To achieve the above-mentioned purpose, the utility model adopts the following technical scheme:

[0007] Firstly, the utility model provides a TOP type full color LED lamp pearl, which comprises an LED support, a full color LED chip and a sealing glue layer. The LED support comprises a bowl cup body and a lead frame embedded in the bowl cup body. The bowl cup body is provided with a containing cavity and an opening communicating with the containing cavity. The lead frame partially extends to the bottom of the containing cavity. The lead frame in the containing cavity is provided with a first protrusion and a second protrusion. The full color LED chip comprises red light LED grains, green light LED grains and blue light LED grains, which are electrically connected to the lead frame. The red light LED grains are die-bonded on the first protrusion, and the blue light LED grains are die-bonded on the second protrusion. The green light LED grains are arranged on the part of the lead frame between the first protrusion and the second protrusion. The sealing glue layer fills the containing cavity to cover the full color LED chip.

[0008] In addition, the TOP full-color LED lamp bead according to the utility model has the following additional technical features.

[0009] Further, the first protrusion and the second protrusion are isometric.

[0010] Further, the height of the accommodating cavity is 0.5mm-0.7mm, and the height of the first protrusion and the second protrusion is 0.1mm-0.3mm.

[0011] Further, the lead frame is partially exposed outside the bowl cup body.

[0012] Further, the red light LED crystal grain is prepared by using gallium arsenide.

[0013] Further, the encapsulation layer is a lens structure.

[0014] Further, the side wall of the accommodating cavity is obliquely arranged.

[0015] Further, the side wall of the accommodating cavity is provided with a reflection layer.

[0016] In the second aspect, based on the same inventive concept, the utility model also provides a LED display module, the LED display module includes a PCB board and at least one aforementioned TOP full-color LED lamp bead, the PCB board and the lead frame are electrically connected.

[0017] In the third aspect, based on the same inventive concept, the utility model also provides a LED display screen, which applies the aforementioned LED display module.

[0018] The utility model has at least the following beneficial effects: the lead frame is partially punched and stretched to form the first protrusion and the second protrusion, the height of the red light LED crystal grain and the blue light LED crystal grain is increased while the depth of the accommodating cavity is reduced based on the limitation of the punching toughness of the lead frame, the light emitting angle of the red light LED crystal grain and the blue light LED crystal grain is further increased, and finally the light emitting efficiency of the lamp bead is improved. BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1 It is a sectional view of the TOP full-color LED lamp bead before encapsulation of an embodiment of the utility model;

[0020] Figure 2 It is a sectional view of the TOP full-color LED lamp bead after encapsulation of an embodiment of the utility model;

[0021] Explanation of main element symbols:

[0022] The LED support 100, the bowl cup body 110, the accommodating cavity 111, the side wall 1111, the opening 112, the lead frame 120, the first protrusion 121, the second protrusion 122, the full-color LED chip 200, the red LED die 210, the green LED die 220, the blue LED die 230, the encapsulation layer 300;

[0023] The following detailed description will further describe the present application with reference to the above-mentioned drawings. DETAILED DESCRIPTION

[0024] In order to facilitate the understanding of the present application, the present application will be described more fully below with reference to the accompanying drawings. The drawings show several embodiments of the present application. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present application more thorough and comprehensive.

[0025] It should be noted that when an element is referred to as being "fixedly attached" to another element, it can be directly on the other element or there can be an intervening element. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements can be present. The terms "vertical", "horizontal", "left", "right", and the like as used herein are for purposes of illustration only.

[0026] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0027] In the TOP full-color LED lamp bead, the bowl cup depth of a normal LED support is 0.95 um, which is verified by 7 or 8 years of production evaluation, packaging factory and customer, that is, it has been recognized by the industry. However, the depth is still relatively deep, which makes it difficult to further improve the light efficiency of the LED lamp bead. Although the light emitting angle can be improved by reducing the cup depth, when the cup body is too shallow, the stamping and stretching depth of the lead frame in the LED support will increase. However, since the toughness of the lead frame is fixed, the flatness and consistency will be affected, so the bowl cup depth cannot be simply reduced. Therefore, the packaging structure of the TOP full-color LED lamp bead is improved, the stretching degree of the lead frame stamping is appropriately increased, and the convex is stamped on the lead frame, so that the light emitting color of the part of the crystal grain fixed on the convex is as close as possible to the cup mouth of the bowl cup, thereby improving the light emitting angle of the LED chip, and further improving the light efficiency of the LED lamp bead.

[0028] Specifically, referring to Figures 1 to 2 A TOP full-color LED lamp bead provided by the application includes an LED support 100, a full-color LED chip 200 and a sealing glue layer 300.

[0029] The LED support 100 includes a bowl cup body 110 and a lead frame 120 embedded in the bowl cup body 110. The bowl cup body 110 is provided with a containing cavity 111 and an opening 112 communicating with the containing cavity 111. The lead frame 120 partially extends to the bottom of the containing cavity 111. The lead frame 120 located in the containing cavity 111 is provided with a first convex 121 and a second convex 122. The full-color LED chip 200 includes red light LED crystal grains 210, green light LED crystal grains 220 and blue light LED crystal grains 230 which are electrically connected to the lead frame 120. The red light LED crystal grains are fixed on the fixed crystal area provided on the first convex 121 by insulating glue. The blue light LED crystal grains 230 are fixed on the fixed crystal area provided on the second convex 122 by insulating glue. The green light LED crystal grains 220 are fixed on the fixed crystal area provided on the part of the lead frame 120 between the first convex 121 and the second convex 122 by insulating glue. The green light LED crystal grains 220 are arranged between the first convex 121 and the second convex 122, mainly to make the LED lamp bead meet a certain brightness ratio and realize the effect of full-color brightness uniformity.

[0030] After the die bonding is completed, the positive and negative electrodes on the red LED die 210, the green LED die 220, and the blue LED die 230 are electrically connected to the metal pads at the bottom of the accommodating cavity 111 through the bonding wires. Then, the accommodating cavity 111 is filled with the encapsulation layer 300 to cover the full-color LED chip 200. The encapsulation layer 300 can play the roles of mechanical protection, heat dissipation enhancement, optical control, moisture-proof, waterproof, dust-proof, electrical insulation, and the like. Optionally, the encapsulation layer 300 can be made of epoxy resin, silica gel, or the like.

[0031] In the present example, the first protrusion 121 and the second protrusion 122 are arranged on the part of the lead frame 120 extending into the accommodating cavity 111, so as to improve the light-emitting angles of the red LED die 210 and the blue LED die 230, and further improve the light-emitting efficiency of the lamp bead.

[0032] It should be noted that the first protrusion 121 and the second protrusion 122 are obtained by stamping the lead frame 120, and then the LED bracket 100 with the bowl cup structure is obtained by injection molding the lead frame 120. The injection molding material can be high-temperature nylon (PPA), poly-1,4-cyclohexane dimethylene terephthalate (PCT), epoxy molding compound (EMC), ceramic, or the like.

[0033] In some optional embodiments, as shown in Figure 1 , Figure 2 The first protrusion 121 and the second protrusion 122 are of the same height, which facilitates stamping.

[0034] In some optional embodiments, as shown in Figure 1 On the basis of the existing lead frame 120, the first protrusion 121 and the second protrusion 122 are obtained by stamping and stretching the part of the lead frame 120, and then the height of the accommodating cavity 111 is 0.5 mm to 0.7 mm after injection molding. The red LED die 210 and the blue LED die 230 are improved by 0.1 mm to 0.3 mm compared with the bottom of the accommodating cavity 111. At this time, the total height of the first protrusion 121 or the second protrusion 122 and the corresponding LED die will not exceed the height of the accommodating cavity 111, which facilitates the subsequent dispensing needle to be put into the accommodating cavity 111 from the opening 112 for dispensing, prevents the dispensing needle from touching the LED die and causing damage, and also provides bonding space for the bonding wire.

[0035] In some optional embodiments, as shown in Figure 1 , Figure 2As shown, the lead frame 120 is partially exposed outside the bowl cup body 110, so as to facilitate the positive and negative poles of the red LED die 210, the green LED die 220 and the blue LED die 230 to be led out. In use, the exposed part of the lead frame 120 can be welded on the metal pad on the PCB to realize the function of electrical connection.

[0036] In some optional embodiments, the red LED die 210 is made of gallium arsenide.

[0037] In some optional embodiments, as shown in Figure 2 As shown, the encapsulation layer 300 is in a lens structure, which can effectively control the refraction and scattering of light, thereby optimizing the light beam mode of the LED lamp bead, improving the light utilization efficiency and lighting effect, and at the same time, the part of the lens structure extending to the opening 112 also provides a bonding space for the bonding wire after the height of the accommodating cavity 111 is reduced.

[0038] In some optional embodiments, as shown in Figure 1 、 Figure 2 As shown, the side wall 1111 of the accommodating cavity 111 is inclined, which is beneficial to the reflection of the light emitted by the red LED die 210, the green LED die 220 and the blue LED die 230.

[0039] In some optional embodiments, in order to improve the reflection effect of the side wall 1111 of the accommodating cavity 111, a reflection layer is arranged on the side wall 1111 of the accommodating cavity 111, for example, silver is plated on the side wall 1111 of the accommodating cavity 111.

[0040] In the second aspect, the utility model also provides a LED display module, LED display module includes PCB board and at least one preceding TOP type full color LED lamp bead, PCB board and lead frame 120 electricity is connected.

[0041] In the third aspect, the utility model also provides a LED display screen, and the LED display screen applies the LED display module.

[0042] In the description of the present specification, the description of the terms "one embodiment", "some embodiments", "example", "specific example" or "some examples" means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the utility model. In the present specification, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0043] The above-described embodiments only express several implementation manners of the present application, the description is relatively specific and detailed, but cannot be understood as the limitation of the protection scope of the present application. It should be pointed out that, for ordinary skilled persons in the art, without departing from the concept of the present application, several modifications and improvements can be made, which all belong to the protection scope of the present application. Therefore, the protection scope of the present application patent should be subject to the appended claims.

Claims

1. A full-color LED lamp bead of TOP type, characterized in that, The TOP type full-color LED lamp bead comprises: An LED support comprising a bowl cup body and a lead frame embedded in the bowl cup body, the bowl cup body being provided with a containing cavity and an opening communicating with the containing cavity, the lead frame partially extending to the bottom of the containing cavity, the lead frame in the containing cavity being provided with a first protrusion and a second protrusion; A full-color LED chip comprising red LED dies, green LED dies and blue LED dies, all of which are electrically connected to the lead frame, the red LED dies being die-bonded on the first protrusion, the blue LED dies being die-bonded on the second protrusion, and the green LED dies being arranged on the part of the lead frame between the first protrusion and the second protrusion; An encapsulation layer filling the containing cavity to cover the full-color LED chip.

2. The TOP type full-color LED lamp bead according to claim 1, characterized in that, The first protrusion and the second protrusion are of the same height.

3. The TOP type full-color LED lamp bead according to claim 2, characterized in that, The height of the containing cavity is 0.5mm-0.7mm, and the height of the first protrusion and the second protrusion is 0.1mm-0.3mm.

4. The TOP type full-color LED lamp bead according to claim 1, characterized in that, The lead frame is partially exposed outside the bowl cup body.

5. The TOP type full-color LED lamp bead according to claim 3, characterized in that, The red LED dies are made of gallium arsenide.

6. The TOP type full-color LED lamp bead according to claim 3, characterized in that, The encapsulation layer is of a lens structure.

7. The TOP type full-color LED lamp bead according to claim 1, characterized in that, The side wall of the containing cavity is obliquely arranged.

8. The TOP type full-color LED lamp bead according to claim 1, characterized in that, The side wall of the containing cavity is provided with a reflective layer.

9. An LED display module, characterized in that, The LED display module comprises a PCB and at least one TOP type full-color LED lamp bead as claimed in any one of claims 1-8, the PCB and the lead frame being electrically connected.

10. An LED display screen, characterized by The LED display module as claimed in claim 9 is applied.

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