Ultrasonic coupling structure, ultrasonic probe and electronic equipment

Abstract

The embodiment of the utility model provides an ultrasonic coupling structure, an ultrasonic probe and electronic equipment, and belongs to the technical field of ultrasonic detection, a coupling piece is wrapped in a packaging piece, the water loss phenomenon of the coupling piece is avoided, and the ultrasonic coupling structure can be used for a long time. Bonding interfaces are arranged between the two opposite faces of the coupling piece and the inner surface of the packaging piece, fixing of the coupling piece and the packaging piece is achieved through the bonding interfaces, high bonding fastness is achieved, the stability of the interfaces is kept in various deformation scenes such as twisting, pressing and stretching, and the stability of long-term use is improved. And a bonding interface formed by combining the coupling piece and the packaging piece is flat, so that the problems of bubbles, wrinkles and the like are avoided, the attenuation of ultrasonic waves on a propagation interface is reduced, and the detection effect and the detection accuracy are improved. The thickness of the bonding interface between the coupling piece and the packaging piece is small, the thickness of the whole ultrasonic coupling structure can be obviously reduced, energy attenuation of ultrasonic waves propagating in the ultrasonic coupling structure is reduced, and the propagation efficiency of the ultrasonic waves is improved.

Description

Technical Field

[0001] This application relates to the field of ultrasonic testing technology, and in particular to an ultrasonic coupling structure, an ultrasonic probe, and electronic equipment. Background Technology

[0002] With the rapid development of electronic device technology, most wearable electronic devices such as smartwatches and smart bracelets now support wearable detection functions. These devices can detect health indicators while worn, allowing for real-time monitoring of the user's health. Among these, ultrasound imaging can perform non-invasive examinations and diagnoses of tissues and organs. When applied to wearable electronic devices, it can detect indicators such as blood pressure, blood oxygen, and lung capacity.

[0003] Electronic devices may include a probe body and an ultrasonic coupling structure. The probe body is used to transmit and receive ultrasonic waves, and the ultrasonic coupling structure is located on the end face of the probe body for contact with the user's skin. The ultrasonic coupling structure can reduce the reflection and attenuation of ultrasonic energy to improve the accuracy of detection. The ultrasonic coupling structure typically includes a coupling sheet formed of a coupling agent. The coupling agent is mostly a water-soluble colloid, which makes the coupling sheet prone to water loss. To solve the problem of water loss, the ultrasonic coupling structure may also include two silicone layers. Adhesive layers can be modified on the two silicone layers respectively, so that the silicone layers can be glued and fixed to the coupling sheet and encapsulate the coupling sheet. The silicone layers can encapsulate the coupling sheet to reduce or prevent water loss from the coupling sheet.

[0004] However, air bubbles and wrinkles are inevitable at the interface between the coupling sheet and the silicone layer, which can cause loss of ultrasonic signal propagation and affect the detection effect. Utility Model Content

[0005] This application provides an ultrasonic coupling structure, an ultrasonic probe, and an electronic device. The bonding interface between the coupling sheet and the package is flat and free of defects such as bubbles and wrinkles, ensuring strong interface bonding and improving detection results. This enables the ultrasonic coupling structure to achieve long-term stability and effectiveness.

[0006] A first aspect of this application provides an ultrasonic coupling structure, including a package and a coupling sheet. The coupling sheet is encapsulated within the package, which encapsulates the coupling sheet. This reduces or prevents water loss from the coupling sheet, improves the long-term water retention capacity of the ultrasonic coupling structure, extends the service life of the coupling sheet, and solves the problem of the coupling sheet easily losing water and thus being unable to be used for a long time.

[0007] The two opposing sides of the coupling piece have bonding interfaces with the inner surface of the package. Specifically, the coupling piece on the first surface directly bonds to the package, forming a bonding interface between the first surface of the coupling piece and the inner surface of the package. Similarly, the coupling piece on the second surface directly bonds to the package, forming a bonding interface between the second surface of the coupling piece and the inner surface of the package. This bonding interface secures the coupling piece to the package, thus achieving assembly between the coupling piece and the package.

[0008] The opposing sides of the coupling sheet form a bonding interface with the inner surface of the package through a bonding reaction. This effectively improves the bonding strength between the coupling sheet and the package, maintaining the stability of the bonding interface under various deformation scenarios such as torsion, compression, and stretching, thus enhancing the long-term stability of the ultrasonic coupling structure. Furthermore, the bonding interface between the coupling sheet and the package is smooth and free from problems such as bubbles and wrinkles. This reduces the attenuation of ultrasonic waves at the propagation interface, maximizing the coupling of ultrasonic signals and improving detection effect and accuracy. This solves the problem of bubble defects and other imperfections that affect detection results caused by bonding methods used in related technologies.

[0009] Compared to fixing the coupling plate and the package by adhesive bonding, the bonding interface between the coupling plate and the package is thinner, which can significantly reduce the thickness of the entire ultrasonic coupling structure. This reduces the energy attenuation of the ultrasonic signal propagating within the ultrasonic coupling structure and improves the propagation efficiency of the ultrasonic wave.

[0010] In one possible implementation, the inner surface of the package has multiple microstructures, the size of which is less than 1:10 of the ultrasonic length.

[0011] The microstructure design increases the roughness of the inner surface of the package, increasing the bonding area between the inner surface of the package and the opposite sides of the coupling sheet. This expands the surface area of ​​the bonding interface formed by the package and the coupling sheet, enhancing the bonding strength. This allows for a tighter bond between the coupling sheet and the package, ensuring high bonding strength and preventing the formation of bubbles. It also maintains interface stability under various deformation scenarios such as twisting, pressing, and stretching, further improving detection performance and long-term stability.

[0012] In one possible implementation, the thickness of the bonding interface is less than 1 μm. The thinness of the bonding interface makes the overall thickness of the ultrasonic coupling structure very thin, which can achieve lower energy attenuation and higher propagation efficiency, thereby improving the detection effect.

[0013] In one possible implementation, the bonding interface includes at least one of a chemical bonding interface and a molecular chain entanglement interface.

[0014] For example, a chemical bonding reaction can occur between the coupling sheet and the package to form a bonding interface, making the bonding interface between the first and second surfaces of the coupling sheet and the inner surface of the package a chemical bonding interface. This achieves a high-strength bond between the coupling sheet and the package, ensuring high bonding force between them, and maintaining a highly stable bonding interface under various deformation scenarios such as twisting, pressing, and stretching, thereby improving long-term stability.

[0015] For example, the coupling sheet and the package can form a bonding interface through molecular chain entanglement, so that the bonding interface between the first and second surfaces of the coupling sheet and the inner surface of the package can be a molecular chain entanglement interface. This ensures a high bonding strength between the coupling sheet and the package, and facilitates bonding and molding with lower molding difficulty.

[0016] In one possible implementation, the package includes a first encapsulation layer and a second encapsulation layer, with a coupling piece located between the first and second encapsulation layers. The circumferential edges of the first and second encapsulation layers are connected to encapsulate the coupling piece. Bonding interfaces are provided between the coupling piece and the first encapsulation layer, and between the coupling piece and the second encapsulation layer.

[0017] By dividing the package into two structural components, it is easier to form the ultrasonic coupling structure and improves the bonding strength and flatness of the bonding interface between the coupling sheet and the package, thereby ensuring that the ultrasonic coupling structure has high detection effect and long-term stability.

[0018] In one possible implementation, the coupling sheet is molded from a hydrogel material, which has excellent softness and skin-friendliness, ensuring the effectiveness of ultrasound detection while improving the user experience.

[0019] The molding material of the encapsulation component includes at least one of silicone, rubber, polyurethane, polystyrene, etc., which can play a good role in water retention, and has good softness and skin-friendliness, which helps to improve the user experience.

[0020] In one possible implementation, the molding material of the coupling sheet also includes a water-retaining material, that is, adding water-retaining components to the molding material of the coupling sheet to further improve the water retention effect of the ultrasonic coupling structure, which is more conducive to the long-term use of the ultrasonic coupling structure and ensures the stability and effectiveness of the ultrasonic coupling structure in long-term use.

[0021] For example, the water-retaining material includes at least one of glycerin, ethylene glycol, phytic acid, sorbitol, and inorganic salts, which has low cost and good water retention effect, and is convenient for production and use.

[0022] A second aspect of this application provides an ultrasonic probe, including a probe body and any of the above-described ultrasonic coupling structures, wherein the encapsulation component of the ultrasonic coupling structure is disposed on the end face of one end of the probe body.

[0023] By incorporating an ultrasonic coupling structure, the coupling plate and encapsulation component exhibit high bonding stability, and the bonding interface between the coupling plate and encapsulation component is smooth and free of bubbles, wrinkles, and other issues, which is beneficial for improving the detection effect and accuracy of ultrasonic probes and electronic devices. Furthermore, the overall thickness of the ultrasonic coupling structure is relatively thin, which can reduce the thickness of the film layer between the probe body and the measured object, thereby improving the ultrasonic wave propagation efficiency of ultrasonic probes and electronic devices while ensuring effective ultrasonic coupling.

[0024] A third aspect of this application provides an ultrasonic probe, including a probe body, a package, and a coupling plate. The coupling plate is disposed on the end face of one end of the probe body, and the package at least covers the coupling plate, i.e., the coupling plate and the package are directly disposed on the probe body. At least two opposing sides of the coupling plate and the package have a bonding interface, which improves the bonding strength between the coupling plate and the package and ensures a smooth bonding interface between the coupling plate and the package, preventing problems such as bubbles and wrinkles, thereby improving the detection effect and accuracy.

[0025] Furthermore, compared to assembling the ultrasonic coupling structure onto the probe body through adhesive bonding, the ultrasonic coupling structure has a thinner overall thickness. It can also eliminate the need for the adhesive layer and the encapsulation component located between the coupling plate and the probe body, further thinning the film layer on the end face of the probe body. This results in only two different material layers between the probe body and the object being measured: the coupling plate and the encapsulation component. This can further reduce energy attenuation during ultrasonic wave propagation and achieve higher ultrasonic wave propagation efficiency.

[0026] In one possible implementation, the probe body includes a main body and a matching layer. The matching layer is located at one end of the main body, and a coupling piece is disposed on the side of the matching layer facing away from the main body. A bonding interface exists between the two opposite sides of the coupling piece and the matching layer. This improves the bonding strength between the coupling piece and the probe body, further enhancing the assembly stability of the coupling piece, packaging components, etc., on the probe body. It also ensures that the bonding interface between the coupling piece and the probe body is smooth and free of bubbles, wrinkles, etc., achieving superior detection results and accuracy.

[0027] Moreover, the bonding interface is relatively thin, and the bonding with the coupling sheet is achieved by using the matching layer of the probe body itself. This can further reduce the thickness of the film layer between the probe body and the object being measured, better reduce the energy attenuation during ultrasonic wave propagation, and further improve the propagation efficiency of ultrasonic waves.

[0028] A fourth aspect of this application provides an electronic device, including a device body and the aforementioned ultrasonic probe, wherein one end of the probe body of the ultrasonic probe, away from the ultrasonic coupling structure, is disposed on the device body.

[0029] Alternatively, the end of the ultrasonic probe body facing away from the coupling plate is mounted on the main body of the device. Attached Figure Description

[0030] Figure 1a This is a cross-sectional schematic diagram of a coupling structure in a related technology;

[0031] Figure 1b for Figure 1a A partial cross-sectional schematic diagram of the ultrasonic probe assembled with the central coupling structure and the probe body;

[0032] Figure 2 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application;

[0033] Figure 3 This is a schematic diagram of an ultrasonic coupling structure provided in an embodiment of this application;

[0034] Figure 4 for Figure 3 A schematic diagram of the cross-sectional structure of the ultrasonic coupling structure on the AA plane;

[0035] Figure 5 This is a schematic diagram illustrating a covalently bonded interface between a coupling sheet and a package in a coupling structure provided in an embodiment of this application.

[0036] Figure 6 for Figure 4 A partially enlarged schematic diagram of the ultrasonic coupling structure;

[0037] Figure 7 A partial cross-sectional structural diagram of an electronic device provided in an embodiment of this application;

[0038] Figure 8 A partial cross-sectional structural schematic diagram of another electronic device provided in an embodiment of this application;

[0039] Figure 9 A partial cross-sectional structural schematic diagram of another electronic device provided in an embodiment of this application;

[0040] Figure 10 This is a schematic diagram of the manufacturing process of an ultrasonic coupling structure provided in an embodiment of this application;

[0041] Figure 11 An imaging image obtained by ultrasonic testing of an electronic device, as provided in an embodiment of this application;

[0042] Figure 12aAn imaging image obtained using ultrasonic testing for another electronic device provided in this application embodiment;

[0043] Figure 12b An imaging image obtained by ultrasonic testing for another electronic device provided in this application embodiment;

[0044] Figure 13 The water retention performance curves of the ultrasonic coupling structures prepared under different glycerol concentrations provided in the embodiments of this application are shown.

[0045] Figure 14 The graph shows the bonding force at the bonding interface in the ultrasonic coupling structure prepared under different photoinitiator contents provided in the embodiments of this application.

[0046] Explanation of reference numerals in the attached figures:

[0047] 100 - Electronic devices;

[0048] 101 - Equipment body; 101a - Frame;

[0049] 102-Fixing belt; 102a-First belt body; 102b-Second belt body;

[0050] 103-Ultrasonic coupling structure;

[0051] 10-Coupled sheet; 10a-First surface; 10b-Second surface;

[0052] 20 - Package component; 21 - First package layer; 22 - Second package layer;

[0053] 30-Keyed interface;

[0054] 104 - Probe body; 104a - Main body; 104b - Matching layer;

[0055] 105 - Ultrasonic probe. Detailed Implementation

[0056] The terminology used in the implementation section of this application is for the purpose of explaining specific embodiments of this application only, and is not intended to limit this application.

[0057] Ultrasound imaging enables non-invasive examination and diagnosis of tissues and organs, and is widely used in medical testing and routine health monitoring. Coupling agents are essential in ultrasound testing; these agents act as a medium that helps ultrasound waves pass through the object being tested to form an image. Coupling agents also help eliminate air between the ultrasound probe and the object, allowing the ultrasound waves emitted by the probe to effectively penetrate the object, reducing energy attenuation and achieving effective detection.

[0058] To improve user experience and testing results, the coupling agent can be designed as a sheet-like coupling plate, which can be placed on the end face of one end of the ultrasonic probe. Coupling agents are mostly water-soluble polymer colloids, and moisture evaporation is inevitable in open environments. Increased temperature and decreased humidity in the environment will further exacerbate the dehydration of the coupling plate, leading to the loss of its acoustic function and rendering it unusable for long periods.

[0059] Figure 1a This is a cross-sectional schematic diagram of a coupling structure in related technologies.

[0060] The problem of water loss from the coupling plate can be mitigated by encapsulating it with a silicone layer. For example, see... Figure 1a As shown, the coupling structure 200 may include a coupling sheet 201, a first silicone layer 202, and a second silicone layer 203. The coupling sheet 201 can be fixed to the first silicone layer 202 and the second silicone layer 203 by adhesive bonding. For example, a first adhesive layer 204 is provided on the first silicone layer 202, and a second adhesive layer 205 is provided on the second silicone layer 203. The first silicone layer 202 can be fixed to one side of the coupling sheet 201 by the first adhesive layer 204, and the second silicone layer 203 can be fixed to the other side of the coupling sheet 201 by the second adhesive layer 205. The first silicone layer 202 and the second silicone layer 203 can be connected together, so that the first silicone layer 202 and the second silicone layer 203 together wrap the coupling sheet 201, playing a sealing role and reducing or preventing water loss of the coupling sheet.

[0061] The first adhesive layer 204 and the second adhesive layer 205 respectively fix the first silicone layer 202 and the second silicone layer 203 to both sides of the coupling sheet 201. Bubbles and wrinkles are easily formed at the interface where the adhesive layer and the coupling sheet 201 are bonded, which affects the propagation of ultrasonic waves, affects the detection effect, and can also cause artifact interference in the detected ultrasonic image, thus affecting the detection accuracy.

[0062] In addition, the thickness of the first adhesive layer 204 and the second adhesive layer 205 is also relatively thick, such as about 50 μm, resulting in a relatively thick overall coupling structure, which affects the propagation efficiency of ultrasonic waves.

[0063] Figure 1b for Figure 1a A partial cross-sectional schematic diagram of the ultrasonic probe assembled with the intermediate coupling structure and the probe body.

[0064] When the coupling structure 200 is used in an ultrasonic probe, it can be attached to the probe body 300 by adhesive bonding, for example, see [reference needed]. Figure 1bAs shown, a third adhesive layer 301 can be provided on the end face of the probe body 300. The coupling structure 200 can be assembled onto the probe body 300 through the third adhesive layer 301. On the one hand, bubbles and wrinkles may also occur at the interface where the coupling structure 200 and the third adhesive layer 301 are bonded, affecting the propagation of ultrasonic waves. On the other hand, the probe body 300 has a large number of layers and a relatively thick thickness. During detection, the membrane layer and thickness between the probe body 300 end face and the object being measured are relatively large. The impedance mismatch between the interfaces of each membrane layer leads to increased acoustic reflection and increased ultrasonic energy attenuation, which affects the propagation efficiency of ultrasonic waves and the detection effect.

[0065] Based on this, this application provides an ultrasonic coupling structure in which a coupling sheet is encapsulated within a package. The package effectively encapsulates the coupling sheet, reducing or preventing water loss and extending its lifespan, thus enabling long-term use of the ultrasonic coupling structure. Furthermore, a bonding interface is formed between the opposing sides of the coupling sheet and the inner surface of the package. Specifically, the two sides of the coupling sheet directly bond with the package, forming bonding interfaces between the two sides of the coupling sheet and the inner surface of the package. This bonding interface fixes the coupling sheet to the package, achieving assembly between the coupling sheet and the package. This effectively improves the bonding strength between the coupling sheet and the package, maintaining the stability of the bonding interface under various deformation scenarios such as twisting, pressing, and stretching, thus enhancing the long-term stability of the ultrasonic coupling structure. Moreover, the bonding interface between the coupling sheet and the package is smooth, preventing issues such as bubbles and wrinkles. This reduces the attenuation of ultrasonic waves at the propagation interface, maximizing the coupling of ultrasonic signals, improving detection effect and accuracy, and solving the problem of bubble defects and other defects affecting detection results caused by adhesive bonding methods in related technologies. Furthermore, compared to fixing the coupling plate and the package by adhesive bonding, the bonding interface between the coupling plate and the package is thinner, which can significantly reduce the thickness of the entire ultrasonic coupling structure. This reduces the energy attenuation of the ultrasonic signal propagating within the ultrasonic coupling structure and improves the propagation efficiency of the ultrasonic wave.

[0066] In some examples, the ultrasonic coupling structure can be integrated into an electronic device capable of ultrasonic detection. Exemplarily, this electronic device can be a wearable device, such as a watch (mechanical or electronic), smartwatch, bracelet, or smart band. It can also be an augmented reality (AR) device, a virtual reality (VR) device, or a mixed reality (MR) device, such as VR glasses, AR glasses, AR helmets, VR helmets, or MR helmets.

[0067] The wearable device can also be a wearable decorative item such as a belt, waistband, bracelet, anklet, or ring. Alternatively, it can be a wearable electronic health monitoring device, such as a wearable blood pressure monitor or pulse oximeter.

[0068] Alternatively, in some examples, the electronic device can be other types of ultrasound detection devices.

[0069] For example, if the electronic device is a wearable watch, the watch can be a mechanical watch, or it can be an electronic watch, a smart watch, etc. The watch can be worn on the user's wrist and can be used to realize one or more functions such as time display, timing, time announcement, message notification, communication interaction, and sports detection. It can also be used to realize health indicator detection functions such as heart rate monitoring, blood oxygen level detection, and blood pressure detection.

[0070] Figure 2 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application.

[0071] The electronic device 100 may include a device body 101 and a fixing strap 102. The device body 101 is connected to the fixing strap 102, and the electronic device 100 can be worn through the fixing strap 102 to wear the device body 101 on the user's wrist. The fixing strap 102 serves to fix the device body 101 so that it can be worn stably. For ease of wearing, the fixing strap 102 can be a flexible strap-shaped structure.

[0072] The fixing strap 102 can be made of a flexible or rigid material. For example, the fixing strap 102 can be made of stainless steel or plastic, or it can be made of rubber. Alternatively, the fixing strap 102 can be a metal strap made of metal links connected in sequence, or it can be a cloth strap woven from cotton or nylon threads.

[0073] For example, the fixing strap 102 may include a first strap body 102a and a second strap body 102b. The first end of the first strap body 102a and the first end of the second strap body 102b may be connected to the two ends of the device body 101, respectively. The second ends of the first strap body 102a and the second strap body 102b may be connected, so that the device body 101, the first fixing strap 102 and the second fixing strap 102 can together form a closed loop to wrap around the user's wrist or other wearing parts, thereby fixing the entire electronic device 100 to the user's body.

[0074] The main body 101 may include a frame 101a, and the electronic device 100 may also include several structural components (not shown in the figure) for realizing the device functions, which may be disposed within the frame 101a. For example, the electronic device 100 may also include a mechanism (not shown in the figure), which is housed within the frame 101a of the main body 101.

[0075] For example, the movement can be a manual mechanical movement, an automatic mechanical movement, or an intelligent movement, etc. The type of movement is not limited in this embodiment. It is understood that the main body 101 of the device can be a structure in which the movement has been assembled within the frame 101a, or the main body 101 of the device can be without the movement assembled, and the main body 101 of the device can only include the frame 101a.

[0076] In the example where the movement is an automatic mechanical movement or an intelligent movement, the movement may include a control unit, which can control the entire electronic device 100, such as controlling the display of information such as time and health indicator detection.

[0077] The mechanism may also include a battery (not shown in the figure) and a wireless charging coil (not shown in the figure). The battery can be electrically connected to the control unit to power the control unit, and the wireless charging coil can be electrically connected to the battery to charge the battery.

[0078] The electronic device 100 may also include an ultrasonic probe (not shown in the figure), which is used to perform ultrasonic detection, thereby enabling functions such as detecting health indicators of the user (i.e., the object being tested). The ultrasonic probe may include a probe body and an ultrasonic coupling structure. The probe body may be an acoustic-to-electrical conversion device, and the probe body may be electrically connected to the device body 101. For example, the ultrasonic probe may be electrically connected to a control unit within the device body 101 to enable communication between the device body 101 and the ultrasonic probe. The device body 101 may also power the ultrasonic probe with a battery.

[0079] The main body of the device 101 can output electrical signals to the ultrasound probe, which can then convert these electrical signals into ultrasonic signals and radiate them outwards to deliver the ultrasound waves under the user's skin. The probe can also receive reflected ultrasound waves and convert them back into electrical signals, transmitting them to the main body of the device 101 to obtain and display the test results, thus achieving the purpose of detecting health indicators.

[0080] The ultrasonic probe can be mounted on the inner surface of the device body 101, such as on the inner surface of the frame 101a. Alternatively, the ultrasonic probe can be mounted on the inner surface of the fixing strap 102 to ensure detection accuracy. The probe body can be fixed to the inner surface of the device body 101, and the ultrasonic coupling structure can be mounted on the end face of the probe body facing away from the device body 101. This allows the ultrasonic signal emitted by the probe body to be absorbed under the skin after passing through the ultrasonic coupling structure, and the reflected ultrasonic wave to be received by the probe body after passing through the ultrasonic coupling structure. This maximizes the transmission of the ultrasonic signal, reduces or avoids ultrasonic signal attenuation and reflection, and improves detection effect and accuracy.

[0081] When the electronic device 100 is worn on a user's wearing part (such as the wrist), the inner surface of the frame 101a and the inner surface of the fixing strap 102 are the sides of the frame 101a and the fixing strap 102 that face the user's wearing part and are in contact with the user's wearing part.

[0082] For example, the probe body and the device body 101 can be electrically connected via wired or wireless means. For instance, the probe body and the device body 101 can be electrically connected via wired means such as connecting cables or flexible printed circuit boards (FPCs). Alternatively, the probe body and the device body 101 can be electrically connected via wireless means such as Bluetooth or wireless fidelity (WIFI).

[0083] In the embodiments of this application, the type of probe body is not limited. For example, the probe body can be a piezoelectric ceramic bulk probe, a polyvinylidene fluoride (PVDF) flexible piezoelectric film ultrasonic probe, a capacitive micromachined ultrasonic transducer (CMUT), etc.

[0084] It is understood that the structures illustrated in the embodiments of this application do not constitute a specific limitation on the electronic device 100. In other embodiments of this application, the electronic device 100 may include more or fewer components than illustrated, or combine some components, or split some components, or have different component arrangements. For example, the electronic device 100 may also include devices such as a dial, a drive mechanism, and a display panel.

[0085] Alternatively, in some examples, the ultrasonic coupling structure can also be used as a standalone accessory with electronic equipment capable of performing ultrasonic testing. This electronic equipment may include a probe body, and in practical use, the ultrasonic coupling structure can be placed on the end face of the probe body.

[0086] Alternatively, in some examples, the coupling plate and package can be directly combined with the probe body to form an ultrasonic probe and electronic device with ultrasonic coupling effect, without having to first form an ultrasonic coupling structure and then assemble it with the probe body, which can also meet the ultrasonic testing requirements of the ultrasonic probe and electronic device.

[0087] The ultrasonic coupling structure provided in the embodiments of this application will be described in the following description with reference to the accompanying drawings.

[0088] Figure 3 This is a schematic diagram of an ultrasonic coupling structure provided in an embodiment of this application. It should be noted that... Figure 3 The ultrasonic coupling structure 103 shown is a schematic diagram in a partially bent state. It is only used to illustrate that the ultrasonic coupling structure 103 is a relatively soft sheet structure, and does not limit the shape and outline of the ultrasonic coupling structure 103.

[0089] See Figure 3 As shown, the ultrasonic coupling structure 103 includes a coupling sheet 10, which can be in the form of a sheet-like structure. The molding material of the coupling sheet 10 includes a coupling agent, which is a gel-like preparation. For example, the coupling agent can be an aqueous polymer gel material. For instance, the coupling agent can be, but is not limited to, a hydrogel, which has good softness and skin-friendliness, ensuring the ultrasonic detection effect while improving the user experience.

[0090] The ultrasonic coupling structure 103 also includes a package 20, which can encapsulate the coupling sheet 10, allowing the coupling sheet 10 to be completely encapsulated within the package 20. This reduces or avoids water loss from the coupling sheet 10, minimizes or avoids the impact of changes in ambient temperature and humidity on the coupling sheet 10, improves the long-term water retention capacity of the ultrasonic coupling structure 103, extends the service life of the coupling sheet 10, and solves the problem of the coupling sheet 10 being prone to water loss and unable to be used for a long time.

[0091] The side of the package 20 facing the coupling plate 10 is the inner surface of the package 20, and the side of the package 20 facing away from the coupling plate 10 is the outer surface of the package 20. The outer surface of the package 20 is in contact with the external environment, such as the electronic device 100 and the object under test.

[0092] Figure 4 for Figure 3 A schematic diagram of the cross-sectional structure of the ultrasonic coupling structure on the AA plane.

[0093] See Figure 4 As shown, the coupling plate 10 may include two opposing sides, for example, with the thickness direction of the coupling plate 10 as... Figure 4Taking the z-direction as an example, the coupling sheet 10 may include two surfaces opposite to each other in the thickness direction, such as a first surface 10a and a second surface 10b, respectively. The package 20 encapsulates the coupling sheet 10, and at least the first surface 10a and the second surface 10b are respectively attached and fixed to the inner surface of the package 20.

[0094] Specifically, bonding interfaces 30 are formed between the first surface 10a and the second surface 10b of the coupling sheet 10 and the inner surface of the package 20, respectively. The bonding interface 30 refers to the interface formed by the direct bonding reaction between the first surface 10a and the second surface 10b of the coupling sheet 10 and the inner surface of the package 20. The bonding reaction involves the direct bonding of the two surfaces under certain conditions, through van der Waals forces, molecular forces, and atomic forces, forming an integrated structure. Interactions such as van der Waals forces, hydrogen bonds, and covalent bonds are formed between the two surfaces.

[0095] In other words, the coupling piece 10 on the first surface 10a side directly bonds with the package 20, forming a bonding interface 30 between the first surface 10a of the coupling piece 10 and the inner surface of the package 20. Figure 4 The bonding interface 31 is formed between the second surface 10b of the coupling piece 10 and the inner surface of the package 20. A bonding reaction occurs directly between the coupling piece 10 and the package 20, forming a bonding interface 30 between them. Figure 4 The bonding interface 32 in the middle allows the coupling piece 10 to be fixed to the package 20 through the bonding interface 30, thereby realizing the assembly between the coupling piece 10 and the package 20.

[0096] The two opposing sides of the coupling sheet 10 and the inner surface of the package 20 form a bonding interface 30 through a bonding reaction, which can effectively improve the bonding strength between the coupling sheet 10 and the package 20. It can maintain the stability of the bonding interface between the two in various deformation scenarios such as torsion, pressing, and stretching, which is conducive to improving the stability and reliability of the ultrasonic coupling structure 103 in long-term use.

[0097] Compared to fixing the coupling sheet and the package (such as the silicone layer in related technologies) by adhesive bonding, forming a bonding interface 30 between the coupling sheet 10 and the package 20 results in a smooth interface that avoids problems such as bubbles and wrinkles. This reduces the attenuation of ultrasonic waves at the propagation interface, thereby maximizing the coupling of ultrasonic signals, improving detection effect and accuracy, and solving the problem of affecting detection effect due to defects such as bubbles caused by adhesive bonding.

[0098] Furthermore, compared to the adhesive layer between the coupling sheet and the silicone layer, the bonding interface 30 formed between the coupling sheet 10 and the package 20 has a smaller thickness, which can significantly reduce the thickness of the entire ultrasonic coupling structure 103, thereby reducing the energy attenuation of ultrasonic waves propagating within the ultrasonic coupling structure 103 and improving the propagation efficiency of ultrasonic waves.

[0099] For example, the thickness of the bonding interface 30 can be less than 1 μm. The thinness of the bonding interface 30 makes the overall thickness of the ultrasonic coupling structure 103 also very thin, which can achieve lower energy attenuation and higher propagation efficiency, thereby improving the detection effect.

[0100] In some examples, a chemical bonding reaction can occur between the coupling sheet 10 and the package 20 to form a bonding interface 30, that is, the bonding interface 30 between the first surface 10a and the second surface 10b of the coupling sheet 10 and the inner surface of the package 20 can be a chemical bonding interface.

[0101] For example, the chemical bonding interface may include a covalent bonding interface, in which the coupling sheet 10 and the package 20 undergo a chemical reaction to share electron pairs (or electron pairing) and form a covalent bond, thereby achieving a strong bond between the coupling sheet 10 and the package 20, ensuring a high bonding force between the coupling sheet 10 and the package 20, and ensuring a highly stable bonding interface in various deformation scenarios such as twisting, pressing, and stretching, thus improving the stability of long-term use.

[0102] Figure 5 This is a schematic diagram of a covalently bonded interface formed between a coupling sheet and a package in an ultrasonic coupling structure provided in an embodiment of this application.

[0103] For example, taking the covalent bonding interface 32 between the second surface 10b of the coupling piece 10 and the inner surface of the package 20 as an example, see... Figure 5 As shown, the coupling sheet 10 and the package 20 can undergo a chemical reaction to share electron pairs, causing the second surface 10b of the coupling sheet 10 to form a covalent bond with the inner surface of the package 20, thus forming a bonding interface 32. The bonding interface 32 is a covalent bonding interface. The covalent bonding interface between the first surface 10a of the coupling sheet 10 and the inner surface of the package 20 can be referenced to the covalent bonding interface 32 between the second surface 10b and the package 20.

[0104] In some other examples, the chemical bonding interfaces between the two opposing sides of the coupling piece 10 and the inner surface of the package 20 can also be other types of covalent bonding interfaces, or they can be non-covalent bonding interfaces, etc. For example, the chemical bonding interfaces between the first surface 10a and the second surface 10b of the coupling piece 10 and the inner surface of the package 20 can also be hydrogen bonding interfaces, that is, the coupling piece 10 and the package 20 undergo a chemical reaction to form hydrogen bonds.

[0105] Alternatively, in some examples, the coupling sheet 10 and the package 20 can undergo molecular chain entanglement to form a bonding interface 30. That is, the bonding interface 30 between the first surface and the second surface of the coupling sheet 10 and the inner surface of the package 20 can be a molecular chain entanglement interface. This ensures a high bonding strength between the coupling sheet 10 and the package 20, and facilitates bonding and molding with lower molding difficulty.

[0106] For example, the molding material of the coupling sheet 10 may include a material with a large molecular chain length, and the molding material of the package 20 may also include a material with a large molecular chain length. The molecular chains become entangled together due to strong interactions, resulting in molecular chain entanglement, so that molecular entanglement interfaces can be formed between the first surface and the second surface of the coupling sheet 10 and the inner surface of the package 20, respectively.

[0107] To further enhance the bonding strength between the coupling piece 10 and the package 20, the inner surface of the package 20 may have multiple microstructures (not shown in the figure). The microstructures increase the roughness of the inner surface of the package 20, increasing the bonding area between the inner surface of the package 20 and the opposing sides of the coupling piece 10. This expands the surface area of ​​the bonding interface 30 formed by the package 20 and the coupling piece 10, thus improving the bonding force. This allows the coupling piece 10 and the package 20 to bond more tightly, ensuring high bonding strength and preventing the formation of bubbles. It also maintains interface stability well in various deformation scenarios such as twisting, pressing, and stretching, further improving detection performance and long-term stability.

[0108] In this design, the ratio of the size of each microstructure to the ultrasonic wave length can be less than 1:10, meaning the microstructures on the inner surface of the package 20 are subwavelength microstructures. This effectively increases the surface area of ​​the bonding interface 30 between the coupling sheet 10 and the package 20, and ensures excellent ultrasonic wave transmission performance at the bonding interface 30. It should be noted that the ultrasonic wave length refers to the wavelength of the ultrasonic wave used by the ultrasonic probe when this ultrasonic coupling structure is applied for ultrasonic testing.

[0109] For example, the size of the microstructure can be less than 10 μm, which has a wide range of applicability, ensures a high bonding strength between the coupling sheet 10 and the package 20, and has good transmission performance.

[0110] In some examples, multiple microstructures can be formed on the inner surface of the package 20 by etching, for example, by laser etching. Of course, in other examples, microstructures can also be formed on the inner surface of the package 20 by other methods.

[0111] In this embodiment, there are no restrictions on the outer contour shape of the microstructure or the arrangement of multiple microstructures; these can be selectively set according to actual needs and molding methods. The outer contour shape of the microstructure can be a regular shape such as a semicircle, ellipse, square, or trapezoid, or it can be an irregular shape. The size of the microstructure can be the maximum size of its outer contour.

[0112] Multiple microstructures can be arranged in a regular array on the inner surface of the package 20, or multiple microstructures can be distributed in an irregular manner on the inner surface of the package 20.

[0113] The molding material of the encapsulation component 20 may include, but is not limited to, silicone, rubber, polyurethane (PU), polystyrene, etc., which can play a good role in water retention, and have good softness and skin-friendliness, which helps to improve the user experience.

[0114] For example, the main molding material of the encapsulation component 20 can be silicone, which is low in cost, highly skin-friendly, and has high safety, making it easy to manufacture, process, and use. It should be noted that in this embodiment, the type of silicone is not limited. The silicone can be inorganic or organic silicone; for example, silicone can include, but is not limited to, platinum-catalyzed silicone (such as the ecoflex series silicone) and polydimethylsiloxane (PDMS).

[0115] It should be noted that the package 20 can be colorless and transparent, such as using transparent silicone as the main molding material. The coupling sheet 10 can also be colorless and transparent, as its main molding material is a gel-like formulation.

[0116] The encapsulation component 20 and the coupling plate 10 are formed using the aforementioned molding materials. Both the encapsulation component 20 and the coupling plate 10 can be structural components with a certain degree of softness and elasticity, making the entire ultrasonic coupling structure soft and elastic, capable of being twisted, pressed, and stretched. This allows the ultrasonic coupling structure to be adapted to probe bodies of various shapes and is suitable for a variety of application scenarios. Furthermore, it offers high skin-friendliness and comfort, ensuring a good user experience.

[0117] To further improve the water retention effect of the ultrasonic coupling structure, in some examples, the molding material of the coupling sheet 10 may also include a water-retaining material, that is, water-retaining components are added to the molding material of the coupling sheet 10 to further improve the water retention effect of the ultrasonic coupling structure, which is more conducive to the long-term use of the ultrasonic coupling structure and ensures the stability and effectiveness of the ultrasonic coupling structure in long-term use.

[0118] For example, the water-retaining material can include, but is not limited to, glycerol, ethylene glycol, phytic acid, sorbitol, inorganic salts, etc., which are low in cost and have good water retention effect, making them easy to produce and use.

[0119] In this embodiment, the outer contour shape of the package 20 and the coupling piece 10 is not limited. For example, the outer contour shape of the coupling piece 10 can be a regular shape such as a rectangle, circle, ellipse, or trapezoid. The outer contour shape of the coupling piece 10 can also be other regular or irregular shapes.

[0120] The package 20 is wrapped around the coupling sheet 10. The outer contour shape of the package 20 can correspond to and match the outer contour shape of the coupling sheet 10, such as the outer contour shape of the package 20 can be consistent with the outer contour shape of the coupling sheet 10.

[0121] Of course, in some other examples, the outer contour shape of the package 20 may not correspond to the outer contour shape of the coupling piece 10, as long as it can wrap around the package coupling piece 10. The outer contour shape of the package 20 may also be a regular or irregular shape such as a circle, rectangle, circle, or ellipse.

[0122] The encapsulation component 20 can be a single, integral structural component. For example, before encapsulating the coupling sheet 10 to form an ultrasonic coupling structure, the encapsulation component 20 can be a single, sheet-like structure, such as a rectangular sheet. The encapsulation component 20 can be bent and folded into two parts, with the coupling sheet 10 placed between the two parts. The two parts of the encapsulation component 20 are then fixed at their edges, thus encapsulating the coupling sheet 10 and forming the ultrasonic coupling structure.

[0123] Figure 6 for Figure 4 A partially enlarged schematic diagram of the ultrasonic coupling structure.

[0124] Alternatively, in some examples, package 20 may also be split into two structural components. See, for an example, [link to example]. Figure 6 As shown, the package 20 may include a first package layer 21 and a second package layer 22.

[0125] The first encapsulation layer 21 and the second encapsulation layer 22 can each be a sheet-like structure, such as a rectangular sheet-like structure. The coupling piece 10 can be located between the first encapsulation layer 21 and the second encapsulation layer 22, and the circumferential edges of the first encapsulation layer 21 and the second encapsulation layer 22 can be connected and fixed together (see reference). Figure 4As shown in the figure, the coupling sheet 10 inside is wrapped and encapsulated to form an ultrasonic coupling structure 103. This facilitates the molding of the ultrasonic coupling structure 103 and helps to improve the bonding strength and flatness of the bonding interface 30 between the coupling sheet 10 and the encapsulation component 20, further ensuring that the ultrasonic coupling structure 103 has high detection effect and long-term stability.

[0126] The first surface 10a of the coupling piece 10 may be disposed facing the first encapsulation layer 21, and the second surface 10b of the coupling piece 10 may be disposed facing the second encapsulation layer 22. The side of the first encapsulation layer 21 facing the coupling piece 10 and the side of the second encapsulation layer 22 facing the coupling piece 10 may serve as at least part of the inner surface of the package 20.

[0127] A bonding interface 31 may be provided between the first surface 10a of the coupling sheet 10 and the side of the first encapsulation layer 21 facing the coupling sheet 10, and a bonding interface 32 may be provided between the second surface 10b of the coupling sheet 10 and the side of the second encapsulation layer 22 facing the coupling sheet 10.

[0128] For example, the circumferential edges of the first encapsulation layer 21 and the second encapsulation layer 22 can be connected and sealed by heat fusion sealing. Of course, in some other examples, the circumferential edges of the first encapsulation layer 21 and the second encapsulation layer 22 can also be connected and sealed by bonding, heat pressing, or other methods.

[0129] Figure 7 This is a partial cross-sectional structural diagram of an electronic device provided in an embodiment of this application.

[0130] In one example of assembling the aforementioned ultrasonic coupling structure 103 into an electronic device, see [reference needed]. Figure 7 As shown, taking a watch as an example, the ultrasonic probe 105 is disposed on the inner surface of the fixing band 102. The ultrasonic probe 105 may include a probe body 104 and an ultrasonic coupling structure 103, which may be disposed on one end face of the probe body 104.

[0131] The coupling plate 10 of the ultrasonic coupling structure 103 is encapsulated and wrapped in the encapsulation component 20. When it is assembled with the end face of the probe body 104, the outer surface of the encapsulation component 20 can be assembled with the end face of the probe body 104. That is, the encapsulation component 20 is fixedly set on the end face of the probe body 104 away from the device body 101, so that the ultrasonic coupling structure 103 can be assembled with the probe body 104 through the encapsulation component 20 to form the ultrasonic probe 105.

[0132] For example, the package 20 can be assembled to the end face of the probe body 104 by adhesive bonding. For instance, an adhesive layer can be provided between one outer surface of the package 20 and the end face of the probe body 104, allowing the ultrasonic coupling structure 103 to be fixed to the probe body 104 via this adhesive layer. Of course, in some other examples, the package 20 can also be assembled to the probe body 104 by welding, hot pressing, or other methods, thereby assembling the entire ultrasonic coupling structure 103 onto the probe body 104 of the device body 101.

[0133] The ultrasonic probe 105 can be mounted on the inner surface of the fixing band 102. Specifically, the end of the probe body 104 facing away from the ultrasonic coupling structure 103 can be fixed on the inner surface of the fixing band 102. This ensures that the ultrasonic waves emitted by the probe body 104 propagate through the ultrasonic coupling structure 103, and the reflected ultrasonic waves enter the probe body 104 after passing through the ultrasonic coupling structure 103, thus guaranteeing the detection effect and accuracy.

[0134] In actual assembly, the ultrasonic coupling structure 103 described above can be formed first, and then the ultrasonic coupling structure 103 can be assembled onto the probe body 104 to form an ultrasonic probe 105. The ultrasonic probe 105 can then be assembled with the device body, such as by assembling and fixing it with the fixing strap 102 of the device body, to form an electronic device. Alternatively, the probe body 104 can be assembled with the fixing strap 102 of the device body first, and then the ultrasonic coupling structure 103 can be assembled onto the probe body 104 to form an electronic device.

[0135] The coupling plate 10 and the package 20 in the ultrasonic coupling structure 103 exhibit high bonding stability, and the bonding interface between the coupling plate 10 and the package 20 is smooth and free of bubbles, wrinkles, and other problems, which is beneficial to improving the detection effect and accuracy of the ultrasonic probe 105 and electronic equipment. Furthermore, the overall thickness of the ultrasonic coupling structure 103 is relatively thin, similar to... Figure 1b Compared to the ultrasonic probe shown, the thickness of the membrane layer between the probe body 104 and the object being measured can be reduced, which, while ensuring the ultrasonic coupling effect, is conducive to improving the ultrasonic wave propagation efficiency of the ultrasonic probe 105 and electronic equipment.

[0136] This application also provides an electronic device in which the coupling sheet 10 and the package 20 are directly combined with the probe body, and the coupling sheet 10 and the package 20 are formed on the end face of the probe body 104, without the need to first form the ultrasonic coupling structure 103 and then assemble the ultrasonic coupling structure 103 with the probe body 104.

[0137] Figure 8 This is a partial cross-sectional structural diagram of another electronic device provided in an embodiment of this application.

[0138] For example, see Figure 8As shown, the coupling sheet 10 can be disposed on the end face of one end of the probe body 104, and the encapsulation component 20 at least covers the coupling sheet 10. For example, the first surface 10a of the coupling sheet 10 can be fixedly connected to the end face of one end of the probe body 104, and part of the encapsulation component 20 can completely cover the second surface 10b of the coupling sheet 10, while part of the encapsulation component 20 can surround and cover the circumferential outer side of the coupling sheet 10 to completely encapsulate the coupling sheet 10. The end face of the probe body 104 and the encapsulation component 20 can achieve the effect of encapsulating the coupling sheet 10, solving the problem of easy water loss of the coupling sheet 10.

[0139] It should be noted that the package 20 may only cover the coupling sheet 10. Alternatively, in some examples, the package 20 may also cover a portion of the probe body 104. For instance, part of the package 20 may completely cover the second surface 10b of the coupling sheet 10, part of the package 20 may surround the outer circumference of the coupling sheet 10, and part of the package 20 may surround the outer circumference of the probe body 104, thus covering at least a portion of the probe body 104. This improves the bonding strength between the package 20, the coupling sheet 10, and the probe body 104, and provides a certain degree of encapsulation and protection for the probe body 104.

[0140] At least two opposing sides of the coupling piece 10 and the package 20 have a bonding interface 30. For example, if the side of the package 20 facing the second surface 10b of the coupling piece 10 is considered the inner surface of the package 20, a bonding interface 30 is formed between the second surface 10b of the coupling piece 10 and the inner surface of the package 20. This improves the bonding strength between the coupling piece 10 and the package 20, and ensures that the bonding interface between the coupling piece 10 and the package 20 is flat, preventing problems such as bubbles and wrinkles, thereby improving the detection effect and accuracy.

[0141] With Figure 1b Compared with the ultrasonic probes in the related technologies shown, the ultrasonic coupling structure 103 has a thinner overall thickness. It can also eliminate the need for adhesive layers (such as the third adhesive layer 301) and some encapsulation components (such as the first silicone layer 202) located between the coupling sheet and the probe body. This further thins the film layer on the end face of the probe body 104, so that there are only two different material layers between the probe body 104 and the object being measured: the coupling sheet 10 and the encapsulation component 20. This can further reduce the energy attenuation in ultrasonic wave propagation and achieve higher ultrasonic wave propagation efficiency.

[0142] Figure 9 This is a partial cross-sectional structural diagram of another electronic device provided in an embodiment of this application.

[0143] For example, a bonding interface 30 can also be formed between the coupling piece 10 and the end face of the probe body 104. See, for example, [link to documentation]. Figure 9As shown, the probe body 104 may include a main body portion 104a and a matching layer 104b, wherein the main body portion 104a is used to realize the ultrasonic wave transmission and reception functions of the probe body 104, and the matching layer 104b may be located on one end of the main body portion 104a.

[0144] A coupling piece 10 is disposed on the side of the mating layer 104b facing away from the main body 104a. The coupling piece 10 can undergo a bonding reaction with the mating layer 104b, forming a bonding interface 30 between the two opposing sides of the coupling piece 10 and the mating layer 104b. For example, the first surface 10a of the coupling piece 10 can be disposed on the mating layer 104b, and a bonding interface 31 is formed between the first surface 10a of the coupling piece 10 and the side of the mating layer 104b facing the coupling piece 10. A bonding interface 32 is formed between the second surface 10b of the coupling piece 10 and the inner surface of the package 20.

[0145] The coupling strength between the coupling plate 10 and the probe body 104 is improved, the assembly stability of the coupling plate 10, the package 20 and other components on the probe body 104 is further enhanced, and the bonding interface between the coupling plate 10 and the probe body 104 is smooth and free of bubbles, wrinkles, etc., so as to achieve better detection effect and detection accuracy.

[0146] Furthermore, the bonding interface 30 is relatively thin, and the bonding with the coupling sheet 10 is achieved by using the matching layer 104b of the probe body 104 itself, which can further reduce the thickness of the film layer between the probe body 104 and the object under test, better reduce the energy attenuation in ultrasonic wave propagation, and further improve the propagation efficiency of ultrasonic waves.

[0147] For example, the main molding material of the mating layer 104b can be the same as the molding material of the package 20. For example, the main molding material of the mating layer 104b can also be, but is not limited to, silicone, rubber, polyurethane, polystyrene, etc.

[0148] When assembling the ultrasonic probe 105 with the main body of the device, taking the ultrasonic probe 105 as being mounted on the inner surface of the fixing band 102 as an example, the end of the probe body 104 facing away from the coupling plate 10 can be fixed to the inner surface of the fixing band 102, that is, the end of the main body 104a of the probe body 104 facing away from the matching layer 104b can be fixed to the fixing band 102. This ensures that the ultrasonic waves emitted by the probe body 104 propagate through the coupling plate 10 and the encapsulation 20, and the reflected ultrasonic waves enter the probe body 104 after passing through the encapsulation 20 and the coupling plate 10, thus guaranteeing the detection effect and accuracy.

[0149] It should be noted that in the example where a portion of the encapsulation 20 surrounds the outer circumferential side of one end of the probe body 104 to enclose part of the probe body 104, this portion of the encapsulation 20 can also be fixedly assembled with the inner surface of the fixing strap 102, which helps to improve the overall bonding strength between the ultrasonic probe 105 and the device body.

[0150] In this embodiment, there is no limitation on the assembly method between the ultrasonic probe 105 and the device body. The ultrasonic probe 105 can be connected to the device body by means of bonding, ultrasonic welding, silicone hot melting, etc.

[0151] This application embodiment also provides a method for manufacturing an ultrasonic coupling structure, the method comprising:

[0152] S101: Provides packaging structure components.

[0153] The packaging structure can be a single, integral component. Alternatively, it can consist of two separate components, as detailed above, and will not be repeated here.

[0154] S102: Provides a coupling plate.

[0155] S103: Place the coupling sheet inside the package structure so that a bonding interface is formed between the two opposite sides of the coupling sheet and the inner surface of the package structure.

[0156] For example, the coupling piece can be placed between the two folded parts of the package structure. Alternatively, in an example where the package structure consists of two parts—a first package layer and a second package layer—the coupling piece can be placed between the first and second package layers. Then, using a first mold, the coupling piece can be fixed to the package structure, and a bonding reaction can occur between the coupling piece and the package structure, forming bonding interfaces between both sides of the coupling piece and the inner surface of the package structure.

[0157] S104: Form the package structure into a package, and the package wraps the coupling piece.

[0158] For example, the two folded encapsulation components are fixed at their edges, or the circumferential edges of the first and second encapsulation layers are fixed, so that the encapsulation components form an encapsulation and completely enclose the coupling sheet. The two opposing sides of the coupling sheet then have bonding interfaces with the inner surface of the encapsulation.

[0159] The ultrasonic coupling structure can be obtained through the above method. This structure can achieve excellent ultrasonic detection results, has high detection accuracy, low energy attenuation of ultrasonic signal propagation, and high propagation efficiency. Furthermore, the molding method is simple and easy to implement.

[0160] Figure 10This is a schematic diagram of the manufacturing process of an ultrasonic coupling structure provided in an embodiment of this application.

[0161] See Figure 10 As shown, step S102, which provides the coupling sheet, may include step S1021: providing a plurality of molded monomers.

[0162] S1022: A coupling sheet is formed by the one-time polymerization of several molding monomers.

[0163] For example, a prepolymer mixture can be obtained by mixing several molding monomers with deionized water, an initiator, etc. The prepolymer mixture can be placed in a second mold to polymerize the molding monomers into sheet-like coupling sheets.

[0164] Taking the bonding interface between the coupling sheet and the package as a covalent bonding interface as an example, for instance, after the coupling sheet is polymerized in step S1022 and before the coupling sheet is placed inside the package structure in step S103, the method may further include S1023: immersing the coupling sheet in a monomer solution, the monomer solution including at least one of the above-mentioned molding monomers.

[0165] Step S103 involves placing the coupling sheet inside the package structure, forming a bonding interface between the two opposing sides of the coupling sheet and the inner surface of the package structure. This may include placing the soaked coupling sheet inside the package structure, allowing for secondary bonding between the coupling sheet and the package structure. This forms a bonding interface between the two opposing sides of the coupling sheet and the inner surface of the package structure.

[0166] First, a coupling sheet is formed through a single polymerization process. Then, the coupling sheet is immersed to fully absorb and bind monomers on its surface. After that, the immersed coupling sheet is directly bonded to the package structure. The monomers are then polymerized with the package structure a second time to form a bonding interface between the two sides of the coupling sheet and the inner surface of the package structure.

[0167] This two-stage polymerization process achieves the bonding reaction between the coupling sheet and the package structure, forming a bonding interface. The coupling sheet after the first polymerization can play an auxiliary pressure-holding role, facilitating the second polymerization with the package structure. It also helps to improve the bonding strength between the coupling sheet and the package structure (i.e., the package), and further reduces the gaps and wrinkles between the coupling sheet and the package structure.

[0168] In some examples, the monomer solution may also include an initiator for initiating the polymerization reaction between the coupling sheet and the encapsulation structure (or encapsulation). For example, the initiator may be a photoinitiator.

[0169] It should be noted that when the initiator is a photoinitiator, the immersion process of the coupling sheet needs to be carried out in a dark environment. When the coupling sheet and the packaged structure undergo a polymerization reaction, light can be irradiated to initiate the polymerization.

[0170] In some examples, the monomer solution may also include a water-retaining material, so that the coupling sheet can have a water-retaining material, thereby improving the water retention performance of the coupling sheet.

[0171] In some examples, step S101 above, which provides a packaging structure, may include S1011: providing a molding solution.

[0172] The molding solution may include the main molding material of the package, such as a silicone solution.

[0173] S1012: Encapsulated structural components are formed by curing a molding solution.

[0174] For example, the first mold may include two glass sheets, and a molding solution may be applied to the glass sheets by means of spin coating or other methods. After curing, a first encapsulation layer and a second encapsulation layer are formed respectively. The first encapsulation layer and the second encapsulation layer can be combined to form an encapsulation structure. The side of the first encapsulation layer facing away from the glass sheet and the side of the second encapsulation layer facing away from the glass sheet can be the inner surface of the encapsulation structure.

[0175] For example, after the above step S1012 forms the package structure, the method may further include S1013: forming a plurality of microstructures on the inner surface of the package structure.

[0176] For example, multiple microstructures are formed on the side of the first encapsulation layer facing away from the glass sheet and on the side of the second encapsulation layer facing away from the glass sheet, respectively.

[0177] After the microstructure is formed in step S1013, the method may further include S1014: cleaning the packaged structure.

[0178] The cleaning of the encapsulated structural components can include ultrasonic cleaning, organic solvent cleaning, etc. For example, benzophenone ethanol solution can be used to cover the first and second encapsulation layers for a certain period of time to complete the organic solvent cleaning process.

[0179] After cleaning the encapsulation structure, it can be assembled with a glass sheet (i.e., the first mold) having a first encapsulation layer and a second encapsulation layer and an immersed coupling sheet to facilitate the polymerization reaction between the coupling sheet and the encapsulation structure to form a bonding interface.

[0180] For example, taking a package including a first encapsulation layer and a second encapsulation layer, the molding material of the package being silicone, such as ecoflex 00-30 type silicone, and the molding material of the coupling sheet being hydrogel, the molding steps of the above-mentioned ultrasonic coupling structure are specifically illustrated.

[0181] For example, taking the first mold as an example consisting of two glass plates, prepare two clean and dry glass plates, such as those with dimensions of 10×10×0.2cm. 3 An aerosol release agent is sprayed onto the glass slides to facilitate the subsequent release of the silicone sealant. Components A and B of ecoflex 00-30 silicone sealant are mixed in a 1:1 (w / w) ratio and stirred thoroughly to form an ecoflex mixture (i.e., molding solution). Air bubbles are removed by depressurization in a vacuum oven at room temperature (e.g., 25°C). The ecoflex mixture is then evenly spin-coated onto two glass slides using a spin coater, and subsequently cured at room temperature to form a first encapsulation layer and a second encapsulation layer, which together form the encapsulation structure. After curing, different patterns can be selectively fabricated on one side of the first and second encapsulation layers to form microstructures, depending on actual needs.

[0182] 1.5g of acrylamide (AAm) monomer, 2g of 3-[N,N-dimethyl-[2-(2-methylprop-2-enoyloxy)ethyl]ammonium]propane-1-sulfonic acid inner salt (SBMA) monomer, 6.5g of deionized water, 0.1mol% of ammonium persulfate solution, 0.1mol% of N,N'-methylenebisacrylamide solution, and 0.2mol% of tetramethylethylenediamine solution were mixed and stirred until homogeneous to form a prepolymer mixture.

[0183] The second mold may include two acrylic sheets and a silicone pad with a rectangular hollow structure inside. For example, the acrylic sheets may have dimensions of 10×10×0.3cm. 3 The outer dimensions of the silicone pad can be 8×8×0.15cm. 3 The dimensions of the hollow structure can be 6×6×0.15cm. 3 A silicone gasket is sandwiched between two acrylic plates, and then clamped tightly around the edges using clamps such as dovetail clips. The hollow structure of the silicone gasket, pressed by the acrylic plates, forms an oxygen-barrier sealing system. The prepolymer mixture described above is injected into the hollow structure of the silicone gasket using a syringe. Polymerization is completed after 2 hours at room temperature (e.g., 25°C), forming a sheet-like structure of P(AAm-SB) composite hydrogel. Demolding yields a coupling sheet, which can be 6×6×0.15cm in size. 3 .

[0184] Mix 12g of AAm monomer, 0.2mol% of photoinitiator (e.g., photoinitiator 2959), and 28g of glycerol aqueous solution and stir until homogeneous to obtain a monomer solution. Immerse the above coupling sheet in the monomer solution, such as under dark conditions for 12 hours, to allow the coupling sheet to fully absorb AAm monomer, photoinitiator 2959, and glycerol.

[0185] Glass slides with the first and second encapsulation layers were ultrasonically cleaned for 2 minutes each with methanol and deionized water, respectively, and then purged with a nitrogen gun to remove surface water droplets. The surfaces of the first and second encapsulation layers were then covered with a 10 wt% benzophenone-ethanol solution for 10 minutes, followed by cleaning twice with anhydrous methanol and purging with a nitrogen gun to remove surface methanol droplets. The soaked coupling sheet was sandwiched between the two glass slides with the first and second encapsulation layers, with the opposite sides of the coupling sheet contacting the first and second encapsulation layers, respectively. A 1.5 mm thick silicone pad was placed around the coupling sheet, and the two glass slides were clamped together using dovetail clips. The clamped and assembled glass slides were then irradiated under a 365 nm UV lamp for 4 hours to initiate the polymerization of AAM monomers on the coupling sheet with the first and second encapsulation layers, forming bonding interfaces between the opposite sides of the coupling sheet and the first and second encapsulation layers, respectively.

[0186] Then, the mold is removed, and the circumferential edges of the first and second encapsulation layers are connected to form an encapsulation component, which encapsulates the coupling sheet and assembles it to form an ultrasonic coupling structure.

[0187] Understandably, the molding material for the package can also be other types of silicone, such as ecoflex 00-10, ecoflex 00-20, ecoflex 00-30, PDMS, etc.

[0188] For example, taking PDMS as the molding material of the package as an example, the molding steps of the above-mentioned ultrasonic coupling structure are specifically illustrated.

[0189] For example, first prepare two clean, dry glass slides, such as 10×10×0.2cm. 3An aerosol release agent is sprayed onto the glass slides to facilitate the subsequent release of the silicone sealant. PDMS components A and B are mixed at a mass ratio of 30:1 to form a PDMS mixture (i.e., molding solution). It should be noted that the mixing ratio of components A and B in the PDMS mixture can be adjusted within the range of 30:1 to 10:1. After stirring for 10 minutes, the mixture is then vacuum degassed in a vacuum oven for 20 minutes. The PDMS mixture is evenly spin-coated onto two glass slides using a spin coater, and then cured at room temperature to form the first and second encapsulation layers, respectively. The first and second encapsulation layers form the encapsulation structure. After curing, different patterns can be selectively prepared on one side of the first and second encapsulation layers to form microstructures, depending on actual needs.

[0190] 1.5g of acrylamide monomer, 2g of 3-[N,N-dimethyl-[2-(2-methylprop-2-enoyloxy)ethyl]ammonium]propane-1-sulfonic acid inner salt monomer, 6.5g of deionized water, 0.1mol% of monomer amount of ammonium persulfate solution, 0.1mol% of monomer amount of N,N'-methylenebisacrylamide solution, and 0.2mol% of monomer amount of tetramethylethylenediamine solution were mixed and stirred evenly to form a prepolymer mixture.

[0191] Prepare two acrylic sheets and a silicone pad with a rectangular hollow structure inside. For example, the acrylic sheets can be 10×10×0.3cm in size. 3 The outer dimensions of the silicone pad can be 8×8×0.15cm. 3 The dimensions of the hollow structure can be 6×6×0.15cm. 3 The silicone gasket is sandwiched between two acrylic plates, and then the two acrylic plates can be clamped together around their perimeter using clamps such as dovetail clips. The prepolymer mixture described above is injected into the hollow structure of the silicone gasket using a syringe. Polymerization is completed after 2 hours at room temperature (e.g., 25°C), forming a sheet-like structure of P(AAm-SB) composite hydrogel. Demolding yields the coupling sheet, which can be 6×6×0.15cm in size. 3 .

[0192] Mix 12g of AAm monomer, 0.2mol% of photoinitiator (e.g., photoinitiator 2959), and 28g of glycerol aqueous solution and stir until homogeneous to obtain a monomer solution. Immerse the above coupling sheet in the monomer solution, such as under dark conditions for 12 hours, to allow the coupling sheet to fully absorb AAm monomer, photoinitiator 2959, and glycerol.

[0193] Glass slides with the first and second encapsulation layers were ultrasonically cleaned for 2 minutes each with methanol and deionized water, respectively, and then purged with a nitrogen gun to remove surface water droplets. The surfaces of the first and second encapsulation layers were then covered with a 10 wt% benzophenone-ethanol solution for 10 minutes, followed by cleaning twice with anhydrous methanol and purging with a nitrogen gun to remove surface methanol droplets. The soaked coupling sheet was sandwiched between the two glass slides with the first and second encapsulation layers, with the opposite sides of the coupling sheet contacting the first and second encapsulation layers, respectively. A 1.5 mm thick silicone pad was placed around the coupling sheet, and the two glass slides were clamped together using dovetail clips. The clamped and assembled glass slides were then irradiated under a 365 nm UV lamp for 4 hours to initiate the polymerization of AAM monomers on the coupling sheet with the first and second encapsulation layers, forming bonding interfaces between the opposite sides of the coupling sheet and the first and second encapsulation layers, respectively.

[0194] Then, the mold is removed, and the circumferential edges of the first and second encapsulation layers are connected to form an encapsulation component, which encapsulates the coupling sheet and assembles it to form an ultrasonic coupling structure.

[0195] Figure 11 An imaging image obtained by ultrasonic testing of an electronic device provided in an embodiment of this application.

[0196] See Figure 11 As shown, ultrasound coupling structures using PDMS-molded encapsulation materials can achieve clear imaging of blood vessels and tissues during ultrasound detection, as illustrated below. Figure 11 The veins (400), arteries (500), and fat layer (600) can be clearly observed.

[0197] For example, the thickness of the encapsulation can be adjusted by changing the spin coating speed, thereby adjusting the balance between water retention and imaging quality to achieve better water retention and clearer imaging quality.

[0198] For example, prepare two clean, dry glass slides, such as 10×10×0.2cm. 3 An aerosol release agent is sprayed onto the glass slides to facilitate subsequent release of the silicone. Components A and B of ecoflex 00-30 silicone are mixed in a 1:1 (w / w) ratio and stirred thoroughly to form an ecoflex mixture (i.e., molding solution). Air bubbles are removed by depressurization in a vacuum oven at room temperature (e.g., 25°C). The ecoflex mixture is then evenly spin-coated onto two glass slides using a spin coater, and subsequently cured at room temperature to form the first and second encapsulation layers, which together form the encapsulation structure. Different patterns can be selectively fabricated on one side of the first and second encapsulation layers to form microstructures, depending on the specific requirements.

[0199] In the above steps, the thickness of the first and second encapsulation layers can be selectively set by adjusting the spin coating speed. For example, a spin coating speed of 500 r / min for 10 seconds, followed by a spin coating speed of 1000 r / min for 20 seconds, can yield a first and second encapsulation layer with a thickness of approximately 100 μm. Adjusting the spin coating speed to 500–3000 r / min can yield a first and second encapsulation layer with a thickness range of 30–300 μm. By repeating the following steps using glass slides with first and second encapsulation layers of different thicknesses, ultrasonic coupling structures with different encapsulation thicknesses can be obtained.

[0200] 1.5g of acrylamide monomer, 2g of 3-[N,N-dimethyl-[2-(2-methylprop-2-enoyloxy)ethyl]ammonium]propane-1-sulfonic acid inner salt monomer, 6.5g of deionized water, 0.1mol% of monomer amount of ammonium persulfate solution, 0.1mol% of monomer amount of N,N'-methylenebisacrylamide solution, and 0.2mol% of monomer amount of tetramethylethylenediamine solution were mixed and stirred evenly to form a prepolymer mixture.

[0201] Prepare two acrylic sheets and a silicone pad with a rectangular hollow structure inside. For example, the acrylic sheets can be 10×10×0.3cm in size. 3 The outer dimensions of the silicone pad can be 8×8×0.15cm. 3 The dimensions of the hollow structure can be 6×6×0.15cm. 3 The silicone gasket is sandwiched between two acrylic plates, and then the two acrylic plates can be clamped together around their perimeter using clamps such as dovetail clips. The prepolymer mixture described above is injected into the hollow structure of the silicone gasket using a syringe. Polymerization is completed after 2 hours at room temperature (e.g., 25°C), forming a sheet-like structure of P(AAm-SB) composite hydrogel. Demolding yields the coupling sheet, which can be 6×6×0.15cm in size. 3 .

[0202] Mix 12g of AAm monomer, 0.2mol% of photoinitiator (e.g., photoinitiator 2959), and 28g of glycerol aqueous solution and stir until homogeneous to obtain a monomer solution. Immerse the above coupling sheet in the monomer solution, such as under dark conditions for 12 hours, to allow the coupling sheet to fully absorb AAm monomer, photoinitiator 2959, and glycerol.

[0203] Glass slides with the first and second encapsulation layers were ultrasonically cleaned for 2 minutes each with methanol and deionized water, respectively, and then purged with a nitrogen gun to remove surface water droplets. The surfaces of the first and second encapsulation layers were then covered with a 10 wt% benzophenone-ethanol solution for 10 minutes, followed by cleaning twice with anhydrous methanol and purging with a nitrogen gun to remove surface methanol droplets. The soaked coupling sheet was sandwiched between the two glass slides with the first and second encapsulation layers, with the opposite sides of the coupling sheet contacting the first and second encapsulation layers, respectively. A 1.5 mm thick silicone pad was placed around the coupling sheet, and the two glass slides were clamped together using dovetail clips. The clamped and assembled glass slides were then irradiated under a 365 nm UV lamp for 4 hours to initiate the polymerization of AAM monomers on the coupling sheet with the first and second encapsulation layers, forming bonding interfaces between the opposite sides of the coupling sheet and the first and second encapsulation layers, respectively.

[0204] Then, the mold is removed, and the circumferential edges of the first and second encapsulation layers are connected to form an encapsulation component, which encapsulates the coupling sheet and assembles it to form an ultrasonic coupling structure.

[0205] Figure 12a An imaging image obtained using ultrasonic testing for another electronic device provided in this application embodiment. Figure 12b An imaging image obtained using ultrasonic testing for another electronic device provided in this application embodiment.

[0206] Among them, obtained Figure 12a In the electronic device for detecting images, the thicknesses of the first and second encapsulation layers of the ultrasonic coupling structure are less than the thickness of the obtained image. Figure 12b The thickness of the first and second encapsulation layers of the ultrasonic coupling structure in the electronic device used to detect images.

[0207] Understandably, increasing the thickness of the first and second encapsulation layers leads to a corresponding increase in water retention. Combined with... Figure 12a and Figure 12b As shown, the imaging clarity for blood vessels, tissues, etc., is somewhat reduced. The thickness of the encapsulation layer can be adaptively selected based on the thickness of the ultrasound coupling structure and the corresponding imaging clarity. For example, the thickness of the first and second encapsulation layers can be in the range of 30μm to 300μm, ensuring good water retention while also achieving high imaging quality.

[0208] For example, the softness of the ultrasound coupling structure can be adjusted by regulating the content of the molding monomer in the coupling agent, thereby affecting the imaging quality and the degree of adhesion to the skin.

[0209] For example, prepare two clean, dry glass slides, such as 10×10×0.2cm. 3An aerosol release agent is sprayed onto the glass slides to facilitate subsequent release of the silicone. Components A and B of ecoflex 00-30 silicone are mixed in a 1:1 (w / w) ratio and stirred thoroughly to form an ecoflex mixture (i.e., molding solution). Air bubbles are removed by depressurization in a vacuum oven at room temperature (e.g., 25°C). The ecoflex mixture is then evenly spin-coated onto two glass slides using a spin coater, and subsequently cured at room temperature to form the first and second encapsulation layers, which together form the encapsulation structure. Different patterns can be selectively fabricated on one side of the first and second encapsulation layers to form microstructures, depending on the specific requirements.

[0210] 1g of acrylamide monomer, 1g of 3-[N,N-dimethyl-[2-(2-methylprop-2-enoyloxy)ethyl]ammonium]propane-1-sulfonic acid inner salt monomer, 8g of deionized water, 0.1mol% of ammonium persulfate solution, 0.1mol% of N,N'-methylenebisacrylamide solution, and 0.2mol% of tetramethylethylenediamine solution were mixed and stirred until homogeneous to form a prepolymer mixture.

[0211] Prepare two acrylic sheets and a silicone pad with a rectangular hollow structure inside. For example, the acrylic sheets can be 10×10×0.3cm in size. 3 The outer dimensions of the silicone pad can be 8×8×0.15cm. 3 The dimensions of the hollow structure can be 6×6×0.15cm. 3 The silicone gasket is sandwiched between two acrylic plates, and then the two acrylic plates can be clamped together around their perimeter using clamps such as dovetail clips. The prepolymer mixture described above is injected into the hollow structure of the silicone gasket using a syringe. Polymerization is completed after 2 hours at room temperature (e.g., 25°C), forming a sheet-like structure of P(AAm-SB) composite hydrogel. Demolding yields the coupling sheet, which can be 6×6×0.15cm in size. 3 .

[0212] Mix 8g of AAm monomer, 0.2mol% of photoinitiator (e.g., photoinitiator 2959), and 32g of glycerol aqueous solution and stir until homogeneous to obtain a monomer solution. Immerse the above coupling sheet in the monomer solution, such as under dark conditions for 12 hours, to allow the coupling sheet to fully absorb AAm monomer, photoinitiator 2959, and glycerol.

[0213] Glass slides with the first and second encapsulation layers were ultrasonically cleaned for 2 minutes each with methanol and deionized water, respectively, and then purged with a nitrogen gun to remove surface water droplets. The surfaces of the first and second encapsulation layers were then covered with a 10 wt% benzophenone-ethanol solution for 10 minutes, followed by cleaning twice with anhydrous methanol and purging with a nitrogen gun to remove surface methanol droplets. The soaked coupling sheet was sandwiched between the two glass slides with the first and second encapsulation layers, with the opposite sides of the coupling sheet contacting the first and second encapsulation layers, respectively. A 1.5 mm thick silicone pad was placed around the coupling sheet, and the two glass slides were clamped together using dovetail clips. The clamped and assembled glass slides were then irradiated under a 365 nm UV lamp for 4 hours to initiate the polymerization of AAM monomers on the coupling sheet with the first and second encapsulation layers, forming bonding interfaces between the opposite sides of the coupling sheet and the first and second encapsulation layers, respectively.

[0214] Then, the mold is removed, and the circumferential edges of the first and second encapsulation layers are connected to form an encapsulation component, which encapsulates the coupling sheet and assembles it to form an ultrasonic coupling structure.

[0215] Reducing the content of molding monomers in the coupling sheet within a certain range can improve the flexibility of the ultrasound coupling structure, enhance imaging clarity, and also improve the skin-friendliness and skin adhesion of the ultrasound coupling structure.

[0216] For example, by adjusting the concentration of the water-retaining material (such as glycerol solution), the water retention of the ultrasonic coupling structure can be affected, allowing it to adapt to different temperature and humidity environments and thus improve imaging quality.

[0217] For example, prepare two clean, dry glass slides, such as 10×10×0.2cm. 3 An aerosol release agent is sprayed onto the glass slides to facilitate subsequent release of the silicone. Components A and B of ecoflex 00-30 silicone are mixed in a 1:1 (w / w) ratio and stirred thoroughly to form an ecoflex mixture (i.e., molding solution). Air bubbles are removed by depressurization in a vacuum oven at room temperature (e.g., 25°C). The ecoflex mixture is then evenly spin-coated onto two glass slides using a spin coater, and subsequently cured at room temperature to form the first and second encapsulation layers, which together form the encapsulation structure. Different patterns can be selectively fabricated on one side of the first and second encapsulation layers to form microstructures, depending on the specific requirements.

[0218] 1.5g of acrylamide monomer, 2g of 3-[N,N-dimethyl-[2-(2-methylprop-2-enoyloxy)ethyl]ammonium]propane-1-sulfonic acid inner salt monomer, 6.5g of deionized water, 0.1mol% of monomer amount of ammonium persulfate solution, 0.1mol% of monomer amount of N,N'-methylenebisacrylamide solution, and 0.2mol% of monomer amount of tetramethylethylenediamine solution were mixed and stirred evenly to form a prepolymer mixture.

[0219] Prepare two acrylic sheets and a silicone pad with a rectangular hollow structure inside. For example, the acrylic sheets can be 10×10×0.3cm in size. 3 The outer dimensions of the silicone pad can be 8×8×0.15cm. 3 The dimensions of the hollow structure can be 6×6×0.15cm. 3 The silicone gasket is sandwiched between two acrylic plates, and then the two acrylic plates can be clamped together around their perimeter using clamps such as dovetail clips. The prepolymer mixture described above is injected into the hollow structure of the silicone gasket using a syringe. Polymerization is completed after 2 hours at room temperature (e.g., 25°C), forming a sheet-like structure of P(AAm-SB) composite hydrogel. Demolding yields the coupling sheet, which can be 6×6×0.15cm in size. 3 .

[0220] 12g of AAm monomer, 0.2mol% of photoinitiator (e.g., photoinitiator 2959), and 28g of glycerol aqueous solutions of different concentrations were mixed and stirred until homogeneous to obtain a monomer solution. The glycerol concentration can be adjusted within the range of 0–60 w / w%. Different monomer solutions were obtained by mixing glycerol aqueous solutions of different concentrations. Repeating the following steps yielded ultrasonic coupling structures with different glycerol concentrations.

[0221] The coupling sheet described above is immersed in a monomer solution, such as under dark conditions for 12 hours, to allow the coupling sheet to fully absorb the AAM monomer, photoinitiator 2959, and glycerol.

[0222] Glass slides with the first and second encapsulation layers were ultrasonically cleaned for 2 minutes each with methanol and deionized water, respectively, and then purged with a nitrogen gun to remove surface water droplets. The surfaces of the first and second encapsulation layers were then covered with a 10 wt% benzophenone-ethanol solution for 10 minutes, followed by cleaning twice with anhydrous methanol and purging with a nitrogen gun to remove surface methanol droplets. The soaked coupling sheet was sandwiched between the two glass slides with the first and second encapsulation layers, with the opposite sides of the coupling sheet contacting the first and second encapsulation layers, respectively. A 1.5 mm thick silicone pad was placed around the coupling sheet, and the two glass slides were clamped together using dovetail clips. The clamped and assembled glass slides were then irradiated under a 365 nm UV lamp for 4 hours to initiate the polymerization of AAM monomers on the coupling sheet with the first and second encapsulation layers, forming bonding interfaces between the opposite sides of the coupling sheet and the first and second encapsulation layers, respectively.

[0223] Then, the mold is removed, and the circumferential edges of the first and second encapsulation layers are connected to form an encapsulation component, which encapsulates the coupling sheet and assembles it to form an ultrasonic coupling structure.

[0224] Figure 13 The water retention performance curves of the ultrasonic coupling structures prepared under different glycerol concentrations provided in the embodiments of this application are shown.

[0225] See Figure 13 As shown in the figure, the water retention capacity of an ultrasonic coupling structure constructed using coupling sheets soaked in monomer solutions of two different glycerol concentrations is evaluated in an environment with a temperature of 37°C and a relative humidity of 30% RH. Figure S1 shows the water retention curve of the ultrasonic coupling structure constructed using coupling sheets soaked in a monomer solution containing 60% glycerol, and Figure S2 shows the water retention curve of the ultrasonic coupling structure constructed using coupling sheets soaked in a monomer solution containing 40% glycerol.

[0226] Depend on Figure 13 It is known that increasing the glycerol concentration within a certain range can improve the water retention effect of the ultrasonic coupling structure. For example, keeping the glycerol concentration in the range of 0–60 w / w% can adapt to different climatic differences, such as enabling long-term effective use in high-temperature and low-humidity environments, which is beneficial to improving the imaging quality of electronic devices.

[0227] For example, the bonding strength of the bonding interface between the package and the coupling sheet can be affected by adjusting the content of the photoinitiator (such as photoinitiator 2959 mentioned above), thereby affecting the imaging quality of the electronic device.

[0228] For example, prepare two clean, dry glass slides, such as 10×10×0.2cm. 3An aerosol release agent is sprayed onto the glass slides to facilitate subsequent release of the silicone. Components A and B of ecoflex 00-30 silicone are mixed in a 1:1 (w / w) ratio and stirred thoroughly to form an ecoflex mixture (i.e., molding solution). Air bubbles are removed by depressurization in a vacuum oven at room temperature (e.g., 25°C). The ecoflex mixture is then evenly spin-coated onto two glass slides using a spin coater, and subsequently cured at room temperature to form the first and second encapsulation layers, which together form the encapsulation structure. Different patterns can be selectively fabricated on one side of the first and second encapsulation layers to form microstructures, depending on the specific requirements.

[0229] 1.5g of acrylamide monomer, 2g of 3-[N,N-dimethyl-[2-(2-methylprop-2-enoyloxy)ethyl]ammonium]propane-1-sulfonic acid inner salt monomer, 6.5g of deionized water, 0.1mol% of monomer amount of ammonium persulfate solution, 0.1mol% of monomer amount of N,N'-methylenebisacrylamide solution, and 0.2mol% of monomer amount of tetramethylethylenediamine solution were mixed and stirred evenly to form a prepolymer mixture.

[0230] Prepare two acrylic sheets and a silicone pad with a rectangular hollow structure inside. For example, the acrylic sheets can be 10×10×0.3cm in size. 3 The outer dimensions of the silicone pad can be 8×8×0.15cm. 3 The dimensions of the hollow structure can be 6×6×0.15cm. 3 The silicone gasket is sandwiched between two acrylic plates, and then the two acrylic plates can be clamped together around their perimeter using clamps such as dovetail clips. The prepolymer mixture described above is injected into the hollow structure of the silicone gasket using a syringe. Polymerization is completed after 2 hours at room temperature (e.g., 25°C), forming a sheet-like structure of P(AAm-SB) composite hydrogel. Demolding yields the coupling sheet, which can be 6×6×0.15cm in size. 3 .

[0231] 12g of AAm monomer, 28g of glycerol aqueous solution, and a certain amount of photoinitiator 2959 were mixed and stirred evenly to obtain a monomer solution. The content of the photoinitiator can be adjusted within the range of 0-1 mol% of the monomer amount. Different monomer solutions were obtained by mixing with different contents of photoinitiator. Repeating the following steps allowed for the formation of ultrasonic coupling structures under different initiator contents.

[0232] The coupling sheet described above is immersed in a monomer solution, such as under dark conditions for 12 hours, to allow the coupling sheet to fully absorb the AAM monomer, photoinitiator 2959, and glycerol.

[0233] Glass slides with the first and second encapsulation layers were ultrasonically cleaned for 2 minutes each with methanol and deionized water, respectively, and then purged with a nitrogen gun to remove surface water droplets. The surfaces of the first and second encapsulation layers were then covered with a 10 wt% benzophenone-ethanol solution for 10 minutes, followed by cleaning twice with anhydrous methanol and purging with a nitrogen gun to remove surface methanol droplets. The soaked coupling sheet was sandwiched between the two glass slides with the first and second encapsulation layers, with the opposite sides of the coupling sheet contacting the first and second encapsulation layers, respectively. A 1.5 mm thick silicone pad was placed around the coupling sheet, and the two glass slides were clamped together using dovetail clips. The clamped and assembled glass slides were then irradiated under a 365 nm UV lamp for 4 hours to initiate the polymerization of AAM monomers on the coupling sheet with the first and second encapsulation layers, forming bonding interfaces between the opposite sides of the coupling sheet and the first and second encapsulation layers, respectively.

[0234] Then, the mold is removed, and the circumferential edges of the first and second encapsulation layers are connected to form an encapsulation component, which encapsulates the coupling sheet and assembles it to form an ultrasonic coupling structure.

[0235] Figure 14 The graph shows the bonding force at the bonding interface in the ultrasonic coupling structure prepared under different photoinitiator contents provided in the embodiments of this application.

[0236] See Figure 14 As shown in the figure, the bonding force at the bonding interface of the ultrasonic coupling structure formed after the coupling sheet is immersed in a monomer solution containing 0.2 mol% monomer as an initiator is illustrated. Figure 14 It is known that the interfacial bonding force between the encapsulation component and the coupling sheet of the ultrasonic coupling structure is higher than 200 N / m. Understandably, reducing the photoinitiator content helps form a more stable bonding interface. Keeping the photoinitiator content within the range of 0–1 mol% monomer content ensures a high bonding strength between the coupling sheet and the encapsulation component, which is beneficial for the long-term use of the ultrasonic coupling structure.

[0237] This application also provides a method for preparing an ultrasonic probe, the method comprising:

[0238] S201: Provides packaging components.

[0239] S202: Provides a coupling plate.

[0240] S204: Provides the probe body.

[0241] S205: Place the coupling plate on one end face of the probe body, so that the package at least covers the coupling plate.

[0242] S206: Forms a bonding interface between the two opposing sides of the package and the coupling piece.

[0243] The above method allows for direct integration of the coupling plate and encapsulation component with the probe body to form an ultrasonic probe. This achieves excellent ultrasonic detection results and high accuracy, with minimal energy attenuation and high propagation efficiency. Furthermore, the forming method is simple and easy to implement.

[0244] Step S201 provides a package, which may include forming multiple microstructures on one side of the package. It may also include cleaning the package; the specific microstructure forming method and cleaning method can be referred to the package structure above, and will not be repeated here.

[0245] The specific methods for providing the coupling sheet in step S202 and forming a bonding interface between the two opposing sides of the package and the coupling sheet in step S206 can also be found in the molding method of the bonding interface between the coupling sheet and the package structure described above. For example, the coupling sheet is first formed by a one-time polymerization of several molding monomers. The coupling sheet is then immersed in a monomer solution. The immersed coupling sheet is placed on one end face of the probe body, and the package covers the coupling sheet. The coupling sheet and the package are then polymerized a second time, forming a bonding interface between the two opposing sides of the coupling sheet and the package.

[0246] In some examples, the probe body may include a main body and a matching layer, with the matching layer located at one end of the main body. Step S205, placing the coupling piece and package on one end face of the probe body, includes placing the coupling piece on the side of the matching layer facing away from the main body.

[0247] Step S206 further includes: creating a bonding interface between the two opposing sides of the coupling sheet and the matching layer.

[0248] Specifically, placing the soaked coupling sheet on the matching layer allows for secondary polymerization between the coupling sheet and the matching layer, forming a bonding interface between the two opposite sides of the coupling sheet and the matching layer.

[0249] For example, taking the packaging material as ecoflex 00-30 type silicone and the coupling sheet as hydrogel, with the two sides of the coupling sheet forming bonding interfaces with the matching layers of the packaging and the probe body respectively, the molding steps of the above-mentioned ultrasonic probe are specifically illustrated.

[0250] For example, prepare a clean, dry glass slide, such as one measuring 10×10×0.2cm. 3An aerosol release agent is sprayed onto the glass slide to facilitate subsequent release of the silicone sealant. Components A and B of ecoflex 00-30 silicone sealant are mixed in a 1:1 (w / w) mass ratio and stirred until homogeneous to form an ecoflex mixture (i.e., molding solution). Air bubbles are removed by depressurization in a vacuum oven at room temperature (e.g., 25°C). The ecoflex mixture is then evenly spin-coated onto the glass slide using a spin coater and subsequently cured at room temperature to form an encapsulation. After curing, different patterns can be selectively fabricated on one side of the encapsulation to create microstructures, depending on actual requirements.

[0251] 1.5g of acrylamide monomer, 2g of 3-[N,N-dimethyl-[2-(2-methylprop-2-enoyloxy)ethyl]ammonium]propane-1-sulfonic acid inner salt monomer, 6.5g of deionized water, 0.1mol% of monomer amount of ammonium persulfate solution, 0.1mol% of monomer amount of N,N'-methylenebisacrylamide solution, and 0.2mol% of monomer amount of tetramethylethylenediamine solution were mixed and stirred evenly to form a prepolymer mixture.

[0252] Prepare two acrylic sheets and a silicone pad with a rectangular hollow structure inside. For example, the acrylic sheets can be 10×10×0.3cm in size. 3 The outer dimensions of the silicone pad can be 8×8×0.15cm. 3 The dimensions of the hollow structure can be 6×6×0.15cm. 3 The silicone gasket is sandwiched between two acrylic plates, and then the two acrylic plates can be clamped together around their perimeter using clamps such as dovetail clips. The prepolymer mixture described above is injected into the hollow structure of the silicone gasket using a syringe. Polymerization is completed after 2 hours at room temperature (e.g., 25°C), forming a sheet-like structure of P(AAm-SB) composite hydrogel. Demolding yields the coupling sheet, which can be 6×6×0.15cm in size. 3 .

[0253] Mix 12g of AAm monomer, 0.2mol% of photoinitiator (e.g., photoinitiator 2959), and 28g of glycerol aqueous solution and stir until homogeneous to obtain a monomer solution. Immerse the above coupling sheet in the monomer solution, such as under dark conditions for 12 hours, to allow the coupling sheet to fully absorb AAm monomer, photoinitiator 2959, and glycerol.

[0254] The glass slide with the encapsulation was ultrasonically cleaned for 2 minutes each with methanol and deionized water, and then purged with a nitrogen gun to remove surface water droplets. The encapsulation surface was then covered with a 10 wt% benzophenone-ethanol solution for 10 minutes, followed by cleaning twice with anhydrous methanol and purging with a nitrogen gun to remove methanol droplets. The soaked coupling sheet was sandwiched between the glass slide containing the first encapsulation and the matching layer of the probe body. A 1.5 mm thick silicone pad was placed around the coupling sheet, and the glass slide and probe body were clamped together using dovetail clips. The assembled glass slide and probe body were then irradiated under a 365 nm UV lamp for 4 hours to induce polymerization of the AAM monomers on the coupling sheet with the matching layers of the encapsulation and probe body, forming bonding interfaces between the opposite sides of the coupling sheet and the matching layers of the encapsulation and probe body. Demolding yielded the ultrasonic probe.

[0255] For example, an ultrasonic coupling structure can be obtained using the above method, and then assembled with the probe body to obtain an ultrasonic probe; alternatively, an ultrasonic probe can be directly obtained using the above method. A third mold can then be used to assemble the ultrasonic probe with the device body.

[0256] For example, taking the assembly of the fixing strap of the main body of the device with the ultrasonic probe as an example, the ultrasonic probe and the fixing strap can be placed in a third mold for fixation. There is a reserved space between the ultrasonic probe and the fixing strap, and liquid silicone can be injected into this reserved space. Under the corresponding temperature conditions, the silicone is cured, thus reliably connecting and assembling the ultrasonic probe and the fixing strap together.

[0257] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, an indirect connection through an intermediate medium, or the internal connection of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this application according to the specific circumstances. The terms "first," "second," "third," "fourth," etc. (if present) are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

[0258] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the embodiments of this application, and are not intended to limit them. Although the embodiments of this application have been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. An ultrasonic coupling structure, characterized in that, include: Package (20); A coupling piece (10) is enclosed within the package (20). The two opposite sides of the coupling piece (10) have a bonding interface (30) with the inner surface of the package (20). The coupling piece (10) is fixed to the package (20) through the bonding interface (30).

2. The ultrasonic coupling structure according to claim 1, characterized in that, The inner surface of the package (20) has a plurality of microstructures, the ratio of the size of the microstructure to the length of the ultrasonic wave being less than 1:

10.

3. The ultrasonic coupling structure according to claim 1 or 2, characterized in that, The thickness of the bonding interface (30) is less than 1 μm.

4. The ultrasonic coupling structure according to claim 1 or 2, characterized in that, The bonding interface (30) includes at least one of chemical bonding interface and molecular chain entanglement interface.

5. The ultrasonic coupling structure according to claim 1 or 2, characterized in that, The package (20) includes a first package layer (21) and a second package layer (22), and the coupling piece (10) is located between the first package layer (21) and the second package layer (22). The circumferential edge of the first package layer (21) and the circumferential edge of the second package layer (22) are connected to wrap the coupling piece (10). The coupling sheet (10) has a bonding interface (30) between itself and the first encapsulation layer (21), and between itself and the second encapsulation layer (22).

6. An ultrasonic probe, characterized in that, The device includes a probe body (104) and an ultrasonic coupling structure (103) as described in any one of claims 1-5, wherein the encapsulation (20) of the ultrasonic coupling structure (103) is disposed on the end face of one end of the probe body (104).

7. An ultrasonic probe, characterized in that, The device includes a probe body (104), a package (20), and a coupling plate (10). The coupling plate (10) is disposed on the end face of one end of the probe body (104), and the package (20) at least covers the coupling plate (10). At least the coupling sheet (10) has a bonding interface (30) between the two opposite sides of the package (20).

8. The ultrasonic probe according to claim 7, characterized in that, The probe body (104) includes a main body (104a) and a matching layer (104b), wherein the matching layer (104b) is located at one end of the main body (104a); The coupling piece (10) is disposed on the side of the matching layer (104b) opposite to the main body (104a), and there is a bonding interface (30) between the two sides of the coupling piece (10) and the matching layer (104b).

9. An electronic device, characterized in that, The device includes a main body (101) and the ultrasonic probe as described in claim 6 above, wherein the probe body (104) of the ultrasonic probe is disposed on the main body (101) at one end facing away from the ultrasonic coupling structure (103); Alternatively, it may include a device body (101) and an ultrasonic probe as described in claim 7 or 8 above, wherein the probe body (104) of the ultrasonic probe is disposed on the device body (101) at one end opposite to the coupling plate (10).

Images