Laser processing equipment

Abstract

The utility model relates to the technical field of laser processing, and discloses laser processing equipment which comprises a shell, a laser light source, a laser light source, a laser light source, a laser light source, a laser light source, a laser light source, a laser light source and a laser light source. The circuit assembly is arranged in the shell; the laser assembly is arranged in the shell, located above the placement table, electrically connected with the circuit assembly and used for conducting laser machining on the machined part fixed to the placement table under the control of the circuit assembly; and the fingerprint assembly is embedded in the shell, is electrically connected with the circuit assembly in the shell, and is used for collecting fingerprint data and sending the fingerprint data to the circuit assembly, so that the circuit assembly controls the laser assembly to operate when receiving preset fingerprint data. By means of the mode, the mistaken touch problem of the laser processing equipment can be solved, and the operation safety is improved.

Description

Technical Field

[0001] This application relates to the field of laser processing technology, specifically to a laser processing device. Background Technology

[0002] With the development of technology, laser processing has been widely used in many industries. Taking laser engraving machines as an example, their working principle is to use a laser beam to create permanent marks on the surface of the workpiece, hence they are also called laser marking machines.

[0003] Existing laser engraving machines and other laser processing equipment typically control the start and stop of laser processing via a switch button after power is applied. However, since the switch button is prone to accidental activation, it is extremely dangerous if the laser beam comes into contact with the human body. Therefore, how to prevent laser processing equipment from being turned on due to accidental activation has become an urgent problem to be solved. Utility Model Content

[0004] In view of the above problems, this application provides a laser processing device that can solve the problem of accidental touch in laser processing devices and improve operational safety.

[0005] According to one aspect of the embodiments of this application, a laser processing device is provided, comprising: a housing, having an internal placement platform for placing a workpiece, and an openable door panel for placing the workpiece at a position corresponding to the placement platform; a circuit assembly disposed within the housing; a laser assembly disposed within the housing and located above the placement platform, electrically connected to the circuit assembly, for performing laser processing on the workpiece fixed on the placement platform under the control of the circuit assembly; and a fingerprint assembly embedded in the housing and electrically connected to the circuit assembly inside the housing, for collecting fingerprint data and sending it to the circuit assembly, so that the circuit assembly controls the operation of the laser assembly when it receives preset fingerprint data.

[0006] In one alternative embodiment, the fingerprint assembly includes a bracket and a fingerprint collector. The bracket is embedded and fixed to the housing, and the fingerprint collector is fixed to the inside of the bracket. The fingerprint collector is electrically connected to a circuit assembly and is used to collect fingerprint data and send it to the circuit assembly.

[0007] In one alternative embodiment, the circuit assembly includes a power module and a control module that are electrically connected to each other. The power module is disposed inside the housing and located at the bottom center, while the control module is disposed above the power module. The control module is used to control the power module to connect with the laser assembly when preset fingerprint data is received, so that the laser assembly can operate.

[0008] In one alternative embodiment, the housing includes a frame and multiple sealing plates, with the placement stage, circuit components, and laser components all housed within the frame, and the multiple sealing plates covering the outer perimeter of the frame.

[0009] In one alternative embodiment, a partition is provided within the frame, which divides the internal space of the frame into a mounting cavity and a processing cavity. The circuit components are disposed in the mounting cavity, the placement stage is disposed in the processing cavity, and the laser components are at least partially disposed in the processing cavity.

[0010] In one alternative embodiment, the partition extends vertically, and the sealing plate includes a rear sealing plate that covers the rear side of the frame. The rear sealing plate is arranged parallel to the partition, and a mounting cavity is formed between the rear sealing plate and the partition. Ventilation holes are provided on both the rear sealing plate and the partition, and an airflow driving component is provided on the rear sealing plate. The airflow driving component is used to drive airflow through the ventilation holes and through the mounting cavity to dissipate heat from the circuit components.

[0011] In one alternative approach, both the circuit assembly and the laser assembly are fixedly connected to the frame, and multiple sealing plates are fixedly connected to the frame on the inside.

[0012] In one alternative approach, the sealing plate is fixedly connected to the frame by fasteners extending from the inside of the frame outwards; and / or, the inner side of the sealing plate is snapped into and fixed to the frame by snap-fit ​​fasteners.

[0013] In one alternative configuration, the placement platform can be raised and lowered within the housing.

[0014] In one alternative approach, a fixture is provided on the placement table for placing and securing the workpiece.

[0015] In the laser processing equipment provided in this application embodiment, considering the safety of laser processing operations, the traditional switch button is abandoned, and a fingerprint component is embedded in the housing. The fingerprint component is electrically connected to the circuit component inside the housing, so as to use fingerprint recognition technology to control the operation of the laser processing equipment. This not only prevents the laser component from being erroneously turned on due to accidental touch or misoperation, thus avoiding safety hazards, but also avoids non-professionals from operating the laser processing equipment, further ensuring the operational safety of the laser processing equipment.

[0016] The above description is only an overview of the technical solution of this application. In order to better understand the technical means of this application and to implement it in accordance with the contents of the specification, and to make the above and other objects, features and advantages of this application more obvious and understandable, the following are specific embodiments of this application. Attached Figure Description

[0017] Various other advantages and benefits will become apparent to those skilled in the art upon reading the detailed description of the preferred embodiment below. The accompanying drawings are for illustration purposes only and are not to be considered as limiting the present application. The same reference symbols are used throughout the accompanying drawings to represent the same components. In the accompanying drawings:

[0018] Figure 1 A three-dimensional structural schematic diagram of the laser processing equipment provided in the embodiments of this utility model;

[0019] Figure 2 This is a schematic diagram of the structure of the laser processing equipment provided in the embodiment of the present invention in the open state of the door panel;

[0020] Figure 3 This is a structural schematic diagram of the laser processing equipment in an exploded state, provided in an embodiment of the present invention.

[0021] Figure 4 This is a schematic diagram of the internal structure of the laser processing equipment provided in an embodiment of the present invention;

[0022] Figure 5 Modular structure block diagram of circuit components in laser processing equipment provided for embodiments of this utility model;

[0023] Figure 6 This is a schematic diagram of the structure of a laser processing device in an exploded state, as provided in an embodiment of the present invention.

[0024] The reference numerals in the detailed embodiments are as follows:

[0025] 100. Laser processing equipment;

[0026] 110. Housing; 111. Door panel; 112. Frame; 1121. Partition; 1122. Mounting cavity; 1123. Machining cavity; 113. Sealing plate; 1131. Rear sealing plate; 1132. Bottom plate; 1133. Top plate; 1134. Front sealing plate; 1135. First side sealing plate; 1136. Second side sealing plate; 114. Ventilation hole; 115. Fastener; 116. Snap-fit ​​component;

[0027] 120. Circuit components; 121. Power supply module; 122. Control module; 1221. Processing module; 1222. Switching module;

[0028] 130. Laser components;

[0029] 140. Fingerprint assembly; 141. Stand; 142. Fingerprint scanner;

[0030] 150. Placement table; 151. Fixed fixture;

[0031] 160. Airflow drive components;

[0032] 200. Machined parts. Detailed Implementation

[0033] The following embodiments of the technical solution of the present application will be described in detail with reference to the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the present application and are therefore only examples and are not intended to limit the scope of protection of the present application.

[0034] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this application belongs; the terms used herein are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" and any variations thereof in the specification and claims of this application and the above-mentioned figure descriptions are intended to cover non-exclusive inclusions.

[0035] In the description of the embodiments of this application, technical terms such as "first" and "second" are used only to distinguish different objects and should not be construed as indicating or implying relative importance or implicitly specifying the number, specific order, or primary and secondary relationship of the indicated technical features. In the description of the embodiments of this application, "multiple" means two or more, unless otherwise explicitly defined.

[0036] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0037] In the description of the embodiments in this application, the term "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent three cases: A exists, A and B exist simultaneously, and B exists. In addition, the character " / " in this document generally indicates that the related objects before and after it have an "or" relationship.

[0038] In the description of the embodiments of the present application, the term "multiple" refers to more than two (including two). Similarly, "multiple groups" refers to more than two groups (including two groups), and "multiple pieces" refers to more than two pieces (including two pieces).

[0039] In the description of the embodiments of this application, the technical terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this application and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.

[0040] In the description of the embodiments of this application, unless otherwise expressly specified and limited, technical terms such as "installation," "connection," "joining," and "fixing" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in the embodiments of this application can be understood according to the specific circumstances.

[0041] Current laser processing equipment typically controls the laser head using push-button switches or toggle switches. If a mistake occurs and the laser head turns on and emits a laser beam, and the user's hand is not removed from the laser processing area in time, the high-energy laser beam can easily damage the skin of the user's hand.

[0042] Based on this, this application eliminates the conventional button switch or toggle switch and uses a fingerprint component embedded in the housing to trigger the operation of the laser component. This not only avoids accidental touches or misoperations, but also utilizes the characteristic of fingerprint recognition technology that it can only be triggered by pre-recorded fingerprints to ensure that the laser processing equipment will only be turned on by professional personnel. Other personnel cannot operate the laser processing equipment, thereby fully guaranteeing the safety of the operation.

[0043] This application provides a laser processing device; please refer to the following for details. Figures 1 to 3 , Figure 1 A three-dimensional view of the structure of the laser processing equipment is shown. Figure 2 This illustrates the structure of the door panel in the laser processing equipment in the open state. Figure 3The structure of a laser processing device in an exploded state is shown. As shown in the figure, the laser processing device 100 includes: a housing 110, a circuit assembly 120, a laser assembly 130, and a fingerprint assembly 140. The housing 110 has a placement platform 150 for placing a workpiece 200, and the housing 110 has an openable door panel 111 corresponding to the placement platform 150 for placing the workpiece 200. Specifically, the door panel 111 can be opened and closed by a hinge as shown in the figure, or it can be a sliding or push-pull mechanism; the specific method is not limited here.

[0044] A circuit assembly 120 is disposed within a housing 110, and a laser assembly 130 is disposed within the housing 110 above a placement stage 150. The laser assembly 130 is electrically connected to the circuit assembly 120 and is used to perform laser processing on a workpiece fixed on the placement stage 150 under the control of the circuit assembly 120. A fingerprint assembly 140 is embedded in the housing 110 and electrically connected to the circuit assembly 120 inside the housing 110. The fingerprint assembly 140 is used to collect fingerprint data and send it to the circuit assembly, so that the circuit assembly controls the laser assembly to operate when it receives preset fingerprint data. Specifically, the circuit assembly 120 can match the collected fingerprint data with pre-recorded fingerprint data, and control the laser assembly 130 to operate after a successful match.

[0045] Specifically, the circuit assembly 120 is the circuit structure required to realize fingerprint recognition and laser processing control, and generally includes a circuit board, various electronic components integrated on the circuit board or set independently, such as processors and memory. The fingerprint assembly 140 can be any one of the following: an optical lens using optical acquisition technology, a silicon sensor using silicon acquisition technology, or an ultrasonic penetrating material using ultrasonic acquisition technology; no specific limitation is made here.

[0046] It should also be noted that in the laser processing equipment provided in this application embodiment, the circuit component 120 matches the collected fingerprint data with the pre-recorded fingerprint data and performs corresponding control according to the matching result. This part is the processing method in the existing fingerprint recognition technology and does not involve the improvement of the computer program.

[0047] In summary, considering the safety of laser processing operations, the laser processing equipment 100 provided in this application eliminates the traditional switch button and embeds a fingerprint component 140 on the housing 110. The fingerprint component 140 is electrically connected to the circuit component 120 inside the housing to control the operation of the laser processing equipment 100 using fingerprint recognition technology. This not only prevents the laser component 130 from being mistakenly turned on due to accidental touch or misoperation, thus avoiding safety hazards, but also prevents non-professionals from operating the laser processing equipment 100, further ensuring the operational safety of the laser processing equipment 100.

[0048] Regarding the installation of the fingerprint component 140 on the housing 110, this application further proposes an embodiment, please refer to the following for details. Figure 3 As shown in the figure, the fingerprint component 140 includes a bracket 141 and a fingerprint collector 142. The bracket 141 is embedded and fixed in the housing 110, and the fingerprint collector 142 is fixed inside the bracket 141. The fingerprint collector 142 is electrically connected to the circuit component 120 and is used to collect fingerprint data and send it to the circuit component 120.

[0049] In the specific embodiment shown in the figure, the bracket 141 is fixed in the opening of the housing 110 by compression embedding, the fingerprint collector 142 is glued to the inner side of the bracket 141, and the bracket 141 is provided with a window for the collection part of the fingerprint collector 142 to be exposed to ensure that fingerprints can be collected normally.

[0050] In this embodiment, the fingerprint collector 142 is fixed to the inside of the housing 141 by embedding the bracket 141 in the housing 110, so as to cover and protect the fingerprint collector 142 by the bracket 141, thereby improving the service life of the fingerprint collector 142.

[0051] To ensure the overall stability of the equipment, this application further proposes an implementation method, which can be found in the following details. Figure 4 The figure shows the internal structure of the laser processing equipment 100. As shown, the circuit assembly 120 includes a power module 121 and a control module 122 that are electrically connected to each other. The power module 121 is disposed inside the housing 110 and located at the bottom center, while the control module 122 is disposed above the power module 121. The control module 122 is used to control the power module 121 to communicate with the laser assembly 130 when preset fingerprint data is received, so that the laser assembly 130 can operate.

[0052] The specific circuit structure is as follows: Figure 5 As shown, the control module 122 may include a processing module 1221 and a switch module 1222. The processing module 1221 matches the fingerprint data collected by the fingerprint component 140 with the pre-recorded fingerprint data. If the match is successful, it indicates that the current operator is a professional technician whose fingerprint has been pre-recorded. Then, the processing module 1221 controls the switch module 1222 to turn on, and the power module 121 supplies power to the laser component 130 to turn on the laser component 130.

[0053] It is understandable that the laser processing equipment 100 has a high power consumption when it is working. Therefore, the power module 121 that drives the laser component 130 is large in size and heavy in weight. In this embodiment, by placing the power module 121 in the middle of the bottom inside the housing 110, the center of gravity of the entire equipment can be kept in the middle and lower position, so that it is not easy to tip over when it is accidentally bumped from the side. By placing the control module 122 above the power module 121, the internal layout of the equipment can be made more compact, and the entire equipment occupies less space in the horizontal direction, which meets the miniaturization requirements of the equipment.

[0054] To facilitate the assembly and operation of the laser processing equipment 100, this application proposes an implementation method, which can be found in the following description. Figure 3 As shown in the figure, the housing 110 includes a frame 112 and multiple sealing plates 113. The placement platform 150, circuit assembly 120 and laser assembly 130 are all disposed inside the frame 112, and the multiple sealing plates 113 cover the outer periphery of the frame 112.

[0055] During assembly, each component can be assembled and fixed inside the frame 112 first, and then multiple sealing plates 113 can be assembled and fixed on the outer periphery of the frame 112 respectively, thus realizing the assembly of the laser processing equipment 100.

[0056] In this embodiment, the housing 110 adopts a structure in which the frame 112 and the sealing plate 113 are assembled together. The frame 112 provides assembly space for the internal components to facilitate the assembly operation of the components inside. The sealing plate 113 covers the outer periphery of the frame 112 to protect the components inside the frame 112.

[0057] To ensure the reliability of the operating environment of circuit component 120, this application further proposes an implementation method, which can be found in the following description. Figure 3 As shown in the figure, a partition 1121 is provided inside the frame 112, which divides the internal space of the frame 112 into an installation cavity 1122 and a processing cavity 1123. The circuit assembly 120 is disposed in the installation cavity 1122, the placement stage 150 is disposed in the processing cavity 1123, and the laser assembly 130 is at least partially disposed in the processing cavity 1123.

[0058] By using a partition 1121, the interior of the frame 112 is divided into a mounting cavity 1122 and a processing cavity 1123. The mounting cavity 1122 is responsible for accommodating the circuit assembly 120, and the processing cavity 1123 is responsible for accommodating the placement stage 150 and at least part of the laser assembly 130, forming a space for laser processing. Inside the housing 110, the mounting cavity 1122 and the processing cavity 1123 are independent of each other, so that the circuit assembly 120 is isolated from the laser processing environment, ensuring the reliability of the working environment of the circuit assembly 120.

[0059] Considering that the circuit component 120 generates a significant amount of heat during operation, this application further proposes an implementation method to ensure its stability during long-term operation. Please refer to the following for details. Figure 3 As shown in the figure, the partition 1121 extends vertically, and the sealing plate 113 includes a rear sealing plate 1131 that covers the rear side of the frame 112. The rear sealing plate 1131 is arranged parallel to the partition 1121, and a mounting cavity 1122 is formed between the rear sealing plate 1131 and the partition 1121. Ventilation holes 114 are provided on both the rear sealing plate 1131 and the partition 1121, and an airflow driving component 160 is provided on the rear sealing plate 1131. The airflow driving component 160 is used to drive airflow through the ventilation holes 114 and through the mounting cavity 1122 to dissipate heat from the circuit assembly 120.

[0060] exist Figure 3 In the specific embodiment shown, the airflow drive 160 includes a plurality of fans arranged vertically on the rear cover plate 1131. Of course, in some other embodiments, only one airflow drive 160 may be provided, or multiple airflow drive 160 may be arranged horizontally and / or vertically. In addition, in another embodiment, another airflow drive may be provided opposite to the partition plate 1121. The airflow drive 160 on the rear cover plate 1131 cooperates with the other airflow drive on the partition plate 1121 to increase the airflow rate through the mounting cavity 1122, thereby accelerating the heat dissipation efficiency of the circuit assembly 120.

[0061] To ensure the neatness and aesthetics of the laser processing equipment 100, this application also proposes an embodiment regarding the assembly method of the frame 112 and the sealing plate 113. Specifically, the circuit assembly 120 and the laser assembly 130 are both fixedly connected to the frame 112, and multiple sealing plates 113 are fixedly connected to the frame 112 on the inner side. Specifically, as shown... Figure 6 As shown, the sealing plate 113 can be fixedly connected to the frame 112 by fasteners 115 (e.g., screws, rivets, etc.) extending outward from the inside of the frame 112, and / or, as shown in the figure, the sealing plate 113 can be connected to the frame 112 by fasteners 115 (e.g., screws, rivets, etc.) extending outward from the inside of the frame 112, and / Figure 3 As shown, the inner side of the sealing plate 113 is snapped and fixed to the frame 112 by the snap-fit ​​component 116 (e.g., a metal elastic buckle).

[0062] In this embodiment, the sealing plate 113 is fixedly connected to the frame 112 on the inner side, which ensures that there are no assembly holes on the outer side of the sealing plate 113, and the surface is smooth and clean, which helps to improve the overall aesthetics of the equipment.

[0063] In this application Figure 3 and Figure 6In the specific embodiment shown, the sealing plate 113 includes a rear sealing plate 1131, a bottom plate 1132, a top plate 1133, a front sealing plate 1134, a first side sealing plate 1135, and a second side sealing plate 1136, wherein the door panel 111 is disposed on the front sealing plate 1134.

[0064] During assembly, the frame 112 and base plate 1132 are first assembled and fixed together. Then, the circuit assembly 120 and laser assembly 130 are assembled and fixed onto the frame 112. Next, the bottom of the placement platform 150 is assembled and fixed onto the base plate 1132, thus securing the placement platform 150 within the frame 112. The rear sealing plate 1131 is then installed. Before installing the rear sealing plate 1131, the airflow drive component 160 is assembled and fixed onto the rear sealing plate 1131. Then, fasteners 115 extending rearward from the inside of the frame 112 are connected to the rear sealing plate 1131, thus fixing the rear sealing plate 1131 to the frame 112. After the rear sealing plate 1131 is installed, the top plate 1133 is placed over the frame 112, and fasteners 115 extending upward from the inside of the frame 112 are connected to the top plate 1133, thus assembling and fixing the top plate 1133 onto the frame 112.

[0065] Next, the fingerprint component 140 is electrically connected to the circuit component 120. After the fingerprint component 140 is assembled onto the first side cover plate 1135, one side of the first side cover plate 1135 and the second side cover plate 1136 is first snapped into the frame 112 by the snap fastener 116. Then, the fastener 115 extending outward from the frame 112 is connected to the other side of the first side cover plate 1135 and the second side cover plate 1136, so that the first side cover plate 1135 and the second side cover plate 1136 are assembled and fixed onto the frame 112.

[0066] Finally, after the front cover plate 1134 is placed over the front side of the frame 112, the door panel 111 is opened, and the front cover plate 1134 is assembled and fixed to the frame 112 by connecting the fasteners 115 (preferably hand screws for easy assembly in space-constrained situations) that extend forward from inside the frame 112 to the portion of the front cover plate 1134 located at the edge of the door panel 111.

[0067] The above assembly steps are not only easy to operate, but also result in a neat and aesthetically pleasing appearance for the laser processing equipment 100 after assembly.

[0068] In order to meet the processing requirements of different workpieces 200, this application proposes an implementation method. Specifically, the placement table 150 can be lifted and lowered inside the housing 110. The placement table 150 can be lifted and lowered by existing translation mechanisms such as lead screw modules, hydraulic cylinders, pneumatic cylinders, and electric telescopic push rods. No specific limitation is made here.

[0069] To ensure the positional accuracy and structural stability of the workpiece 200 on the placement table 150, this application proposes an implementation method, which can be found in the following description. Figure 3 As shown in the figure, a fixing fixture 151 is provided on the placement table 150. The fixing fixture 151 is used to place and fix the workpiece 200. The fixing fixture 151 can be... Figure 3 The fixture shown is produced according to the shape of the workpiece 200. Of course, it can also be a standard fixture. The specific form of the fixing fixture 151 is not limited here.

[0070] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and not to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application. In particular, as long as there is no structural conflict, the various technical features mentioned in the various embodiments can be combined in any way.

Claims

1. A laser processing device, characterized in that, include: The housing has an internal platform for placing workpieces, and an openable door panel for placing workpieces is provided at a position corresponding to the platform. The circuit components are disposed within the housing; A laser component is disposed inside the housing and located above the placement stage, and is electrically connected to the circuit component for performing laser processing on the workpiece fixed on the placement stage under the control of the circuit component. A fingerprint component is embedded in the housing and electrically connected to the circuit component inside the housing. It is used to collect fingerprint data and send it to the circuit component so that the circuit component controls the operation of the laser component when it receives preset fingerprint data.

2. The laser processing equipment according to claim 1, characterized in that, The fingerprint assembly includes a bracket and a fingerprint collector. The bracket is embedded and fixed in the housing, and the fingerprint collector is fixed inside the bracket. The fingerprint collector is electrically connected to the circuit assembly and is used to collect fingerprint data and send it to the circuit assembly.

3. The laser processing equipment according to claim 1, characterized in that, The circuit assembly includes a power module and a control module that are electrically connected to each other. The power module is disposed inside the housing and located at the bottom center, and the control module is disposed above the power module. The control module is used to control the power module to connect with the laser component when it receives preset fingerprint data, so that the laser component can work.

4. The laser processing equipment according to claim 1, characterized in that, The housing includes a frame and multiple sealing plates. The placement stage, the circuit assembly, and the laser assembly are all disposed within the frame, and the multiple sealing plates cover the outer periphery of the frame.

5. The laser processing equipment according to claim 4, characterized in that, A partition is provided inside the frame, which divides the internal space of the frame into an installation cavity and a processing cavity. The circuit assembly is disposed in the installation cavity, the placement stage is disposed in the processing cavity, and the laser assembly is at least partially disposed in the processing cavity.

6. The laser processing equipment according to claim 5, characterized in that, The partition extends vertically, and the sealing plate includes a rear sealing plate that covers the rear side of the frame. The rear sealing plate is arranged parallel to the partition, and the mounting cavity is formed between the rear sealing plate and the partition. Ventilation holes are provided on both the rear cover plate and the partition plate, and an airflow driving component is provided on the rear cover plate. The airflow driving component is used to drive airflow through the ventilation holes and through the mounting cavity to dissipate heat from the circuit components.

7. The laser processing equipment according to claim 4, characterized in that, Both the circuit assembly and the laser assembly are fixedly connected to the frame, and the plurality of sealing plates are fixedly connected to the frame on the inner side.

8. The laser processing equipment according to claim 7, characterized in that, The sealing plate is fixedly connected to the frame by fasteners extending outward from the inside of the frame; and / or... The inner side of the sealing plate is snapped and fixed to the frame by snap-fit ​​connectors.

9. The laser processing equipment according to any one of claims 1-8, characterized in that, The placement platform can be raised and lowered within the housing.

10. The laser processing equipment according to any one of claims 1-8, characterized in that, A fixing fixture is provided on the placement platform, which is used to place and fix the workpiece.

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