Wafer polishing equipment
By designing automated wafer polishing equipment, robotic arms and unmanned transport vehicles are used to automate wafer loading, unloading, and cleaning, solving the problem of low efficiency of manual operation in existing technologies, improving production efficiency, and avoiding material mixing and fragmentation.
Patent Information
- Application Number
- CN202423076606.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-12
- Publication Date
- 2025-10-28
- Estimated Expiration
- 2034-12-12
AI Technical Summary
In existing wafer polishing equipment, wafer loading, unloading, and cleaning operations mainly rely on manual operation, resulting in low production efficiency and the possibility of mixed materials and fragmentation.
A wafer polishing equipment was designed, which included a loading buffer area, a polishing device, an unloading buffer area, a cleaning and drying area, and a final unloading area. Automatic loading and unloading and cleaning were achieved through a wafer transfer mechanism and a control unit, and wafers were transferred and transported using a robotic arm and an unmanned transport vehicle.
It improves production efficiency, avoids material mixing and fragmentation caused by manual operation, and realizes automation and stability of the wafer polishing process.
Smart Images
Figure CN223477301U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of semiconductor processing technology, and in particular to a wafer polishing device. Background Art
[0002] During the wafer polishing process, continuous loading, unloading, and rinsing are required. However, currently, the wafer polishing process mainly relies on manual labor to complete wafer loading, unloading, and cleaning operations, resulting in low production efficiency. Furthermore, operator work may lead to material mixing and unnecessary debris. Utility Model Content
[0003] In order to solve at least one of the technical problems in the prior art, the present disclosure provides a wafer polishing apparatus.
[0004] The technical solutions provided in this disclosure are as follows:
[0005] This disclosure provides a wafer polishing apparatus, including:
[0006] A loading buffer area used to temporarily store multiple wafers to be polished;
[0007] Polishing apparatus used for polishing wafers;
[0008] A buffer area for temporarily storing polished wafers;
[0009] A cleaning and drying area used for cleaning and drying polished wafers;
[0010] The final unloading area for receiving wafers from the cleaning and drying area;
[0011] A wafer transfer mechanism for transferring wafers between the loading buffer area, the polishing device, the unloading buffer area, the cleaning and drying area, and the final unloading area; and
[0012] A control unit for controlling the working status of the loading buffer area, the polishing device, the unloading buffer area, the cleaning and drying area, the final unloading area, and the wafer transfer mechanism, wherein the control unit is connected to the loading buffer area, the polishing device, the unloading buffer area, the cleaning and drying area, the final unloading area, and the wafer transfer mechanism, respectively.
[0013] For example, the wafer transfer mechanism includes:
[0014] A first loading robotic arm for transferring wafers to be polished to the loading buffer area, the first loading robotic arm being configured to swing between the loading and conveying mechanism and the loading buffer area;
[0015] A second loading robotic arm is used to transfer the wafer to be polished from the loading buffer area to the polishing device, the second loading robotic arm being configured to swing between the loading buffer area and the polishing device;
[0016] A loading robot arm for transferring polished wafers from the polishing apparatus to the loading buffer area, the loading robot arm being configured to swing between the polishing apparatus and the loading buffer area;
[0017] A third loading robot arm is used to transfer polished wafers from the unloading buffer area to the cleaning and drying area, the third loading robot arm being configured to swing between the unloading buffer area and the cleaning and drying area.
[0018] For example, at least one of the first loading robotic arm, the second loading robotic arm, the third loading robotic arm, and the unloading robotic arm is provided with a plurality of vacuum suction cups at its execution end, the plurality of vacuum suction cups being used to adsorb the wafer during the wafer transfer process.
[0019] For example, the loading buffer area, the unloading buffer area, the cleaning and drying area, and the final unloading area are all located on the same side of the polishing device, and the first loading robot arm is located between the loading buffer area and the polishing device, the unloading robot arm is located between the polishing device and the unloading buffer area, and the third loading robot arm is located between the unloading buffer area and the cleaning and drying area.
[0020] For example, the wafer polishing equipment further includes:
[0021] A loading and conveying mechanism for transporting wafers to be polished from the previous process; and
[0022] A material handling mechanism for transporting wafers from the final unloading area to the next process.
[0023] For example, both the loading and unloading mechanisms include unmanned transport vehicles.
[0024] For example, the control unit is also connected to the loading and unloading conveying mechanism to control the working status of the loading and unloading conveying mechanism.
[0025] For example, the polishing apparatus includes multiple wafer carriers; the wafer polishing equipment further includes a vision positioning device configured to determine the placement position of multiple wafers to be polished in each of the wafer carriers, and to determine the position of multiple polished wafers in the wafer carriers, based on the acquired images of the wafer carriers.
[0026] For example, the unloading buffer area includes: a cleaning tank for temporarily storing polished wafers; and a preliminary cleaning component for performing preliminary cleaning on the polished wafers stored in the cleaning tank, the preliminary cleaning component being disposed in the cleaning tank.
[0027] For example, the preliminary cleaning assembly includes a bubbling cleaning assembly; wherein the cleaning agent of the bubbling cleaning assembly includes deionized water, and the bubbling gas includes nitrogen.
[0028] The beneficial effects of the embodiments disclosed herein are as follows:
[0029] The wafer polishing equipment provided in this embodiment includes a loading buffer area, a polishing device, a unloading buffer area, a cleaning and drying area, a final unloading area, a wafer transfer mechanism, and a control unit. The control unit can control the working status of the loading buffer area, the polishing device, the unloading buffer area, the cleaning and drying area, the final unloading area, and the wafer transfer mechanism. The wafer transfer mechanism transfers wafers between the loading buffer area, the polishing device, the unloading buffer area, the cleaning and drying area, and the final unloading area, realizing automatic wafer loading and unloading operations in the entire polishing process. Compared with the prior art, which requires manual operation for wafer loading, unloading, and cleaning, this method can improve production efficiency and avoid mixing and fragmentation caused by manual operation. Attached Figure Description
[0030] Figure 1 This is a schematic diagram showing the structure of the polishing equipment provided in the embodiments of this disclosure. DETAILED DESCRIPTION
[0031] To make the objectives, technical solutions, and advantages of the embodiments of this disclosure clearer, the technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this disclosure. All other embodiments obtained by those skilled in the art based on the described embodiments of this disclosure without creative effort are within the scope of protection of this disclosure.
[0032] Unless otherwise defined, the technical or scientific terms used in this disclosure shall have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms “first,” “second,” and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, the terms “an,” “a,” or “the,” and similar terms do not indicate a quantity limitation, but rather indicate the presence of at least one. The terms “including,” “comprising,” or “containing,” and similar terms mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. The terms “connected,” “linked,” or similar terms are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. The terms “upper,” “lower,” “left,” and “right,” etc., are used only to indicate relative positional relationships, and these relative positional relationships may change accordingly when the absolute position of the described objects changes.
[0033] The features such as "parallel," "perpendicular," and "identical" used in the embodiments of this disclosure include features in the strict sense of "parallel," "perpendicular," and "identical," as well as cases where "approximately parallel," "approximately perpendicular," and "approximately identical" include certain tolerances. Taking into account the measurement and the tolerances associated with the measurement of a specific quantity (e.g., limitations of the measurement system), they represent the acceptable deviation range for a specific value as determined by a person skilled in the art. For example, "approximately" can mean within one or more standard deviations, or within 3% or 5% of said value.
[0034] Furthermore, throughout this document, unless otherwise defined, the terms “substantially,” “essentially,” “approximately,” and “about” are used to describe and explain small variations. When used with an event or situation, these terms can cover situations where the event or situation occurs precisely or approximately. For example, when used with a numerical value, these terms can include a range of variation of the numerical value less than or equal to 10%, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%. The term “substantially coplanar” can refer to two surfaces arranged along the same plane within a micrometer range, for example, within 40 μm, 30 μm, 20 μm, 10 μm, or 1 μm.
[0035] like Figure 1 As shown, this disclosure provides a wafer polishing apparatus, which includes:
[0036] 100 is a loading buffer area used to temporarily store multiple wafers to be polished;
[0037] Polishing apparatus 200 for polishing wafers;
[0038] 300 is a feeding buffer area used to temporarily store polished wafers;
[0039] Cleaning and drying zone 400 is used for cleaning and drying polished wafers;
[0040] The final unloading area 500 is used to receive wafers from the cleaning and drying area 400;
[0041] A wafer transfer mechanism 600 for transferring wafers between the loading buffer area 100, the polishing device 200, the unloading buffer area 300, the cleaning and drying area 400 and the final unloading area 500.
[0042] The control unit is connected to the loading buffer area 100, the polishing device 200, the unloading buffer area, the cleaning and drying area 400, the final unloading area 500, and the wafer transfer mechanism 600, respectively. The control unit is used to control the working status of the loading buffer area 100, the polishing device 200, the unloading buffer area, the cleaning and drying area 400, the final unloading area 500, and the wafer transfer mechanism 600.
[0043] In the above scheme, the wafer polishing equipment is equipped with a loading buffer area 100, a polishing device 200, a unloading buffer area 300, a cleaning and drying area 400, a final unloading area 500, a wafer transfer mechanism 600, and a control unit. The control unit can control the working status of the loading buffer area 100, the polishing device 200, the unloading buffer area, the cleaning and drying area 400, the final unloading area 500, and the wafer transfer mechanism 600. The wafer transfer mechanism 600 transfers wafers between the loading buffer area 100, the polishing device 200, the unloading buffer area 300, the cleaning and drying area 400, and the final unloading area 500, realizing automatic loading, unloading, and cleaning of wafers in the entire polishing process. Compared with the existing technology that requires manual operation for wafer loading and unloading, this method can improve production efficiency and avoid mixing and fragmentation caused by manual operation.
[0044] Before wafer grinding, multiple wafers to be polished are temporarily stored in the loading buffer area 100. After wafer grinding is completed, the polished wafers are temporarily stored in the unloading buffer area 300. This ensures the continuity and stability of the operation. For example, the loading buffer area 100 can temporarily store 20 wafers, and the unloading buffer area 300 can temporarily store 20 wafers. However, this is not a limitation.
[0045] Furthermore, in some embodiments, by pre-setting a control strategy in the control unit, multiple wafers temporarily stored in the loading buffer 100 can be automatically transferred to the polishing device 200 in a first-in, first-out (FIFO) manner. Similarly, by pre-setting a control strategy in the control unit, multiple wafers temporarily stored in the unloading buffer 300 can be automatically transferred to the cleaning and drying area 400 in a FIFO manner. Thus, by adhering to the FIFO principle throughout the entire automatic loading and unloading process, the risk of material mixing can be eliminated.
[0046] In some exemplary embodiments, such as Figure 1 As shown, the wafer transfer mechanism 600 may include:
[0047] A first loading robotic arm 610 for transferring a wafer to be polished to the loading buffer 100 is configured to swing between the loading end and the loading buffer 100.
[0048] A second loading robotic arm 620 for transferring the wafer to be polished from the loading buffer 100 to the polishing apparatus 200, the second loading robotic arm 620 being configured to swing between the loading buffer 100 and the polishing apparatus 200.
[0049] A loading robot arm 630 for transferring polished wafers from the polishing apparatus 200 to the loading buffer 300, the loading robot arm 630 being configured to swing between the polishing apparatus 200 and the loading buffer 300;
[0050] A third loading robotic arm 640 for transferring polished wafers from the unloading buffer 300 to the cleaning and drying zone 400, the third loading robotic arm 640 being configured to swing between the unloading buffer 300 and the cleaning and drying zone 400.
[0051] Using the above solution, wafer transfer can be achieved through a robotic arm, which is easy to control. It is understood that the wafer transfer mechanism 600 can also be implemented without being limited to a robotic arm.
[0052] Furthermore, in some exemplary embodiments, at least one of the first loading robotic arm 610, the second loading robotic arm 620, the third loading robotic arm 640, and the unloading robotic arm 630 is provided with a plurality of vacuum suction cups at its execution end, the plurality of vacuum suction cups being used to adsorb the wafer during the wafer transfer process.
[0053] Using the above scheme, when transferring wafers with a robotic arm, the wafers can be adsorbed and fixed by a vacuum chuck set at the end of the robotic arm. After the wafers are transferred to the target position, the vacuum is broken to release the wafers, thus completing the wafer transfer.
[0054] During the loading and unloading process, to ensure the effective adsorption of the wafers by each vacuum chuck at the end effector of the robotic arm, the adsorption force of the vacuum chucks can be increased in actual implementation. Specific methods are not detailed in this embodiment. Furthermore, after the robotic arm completes the wafer loading and unloading operation, it can return to its original state to prepare for the next round of loading and unloading operations.
[0055] Furthermore, the other essential components of the first loading robotic arm 610, the second loading robotic arm 620, the third loading robotic arm 640, and the unloading robotic arm 630 are all present in the art and should be understood by those skilled in the art. They will not be described in detail here, nor should they be construed as limiting the present disclosure.
[0056] Furthermore, in some exemplary embodiments, such as Figure 1 As shown, the loading buffer area 100, the unloading buffer area 300, the cleaning and drying area 400, and the final unloading area 500 are all located on the same side of the polishing device 200. The first loading robotic arm 610 is located between the loading buffer area 100 and the polishing device 200, the unloading robotic arm 630 is located between the polishing device 200 and the unloading buffer area 300, and the third loading robotic arm 640 is located between the unloading buffer area 300 and the cleaning and drying area 400.
[0057] Using the above scheme, the loading buffer area 100, the unloading buffer area 300, the cleaning and drying area 400, and the final unloading area 500 can be arranged sequentially along the production line direction on the same side of the polishing device 200. The first loading robotic arm 610 is located between the loading buffer area 100 and the polishing device 200, the unloading robotic arm 630 is located between the polishing device 200 and the unloading buffer area 300, and the third loading robotic arm 640 is located between the unloading buffer area 300 and the cleaning and drying area 400. This makes the automatic loading and unloading production line layout of the polishing equipment more compact and reasonable. Of course, it is understood that the automatic loading and unloading production line layout is not limited to this.
[0058] Furthermore, in some exemplary embodiments, the wafer polishing equipment further includes: a loading and transporting mechanism 710 for transporting wafers to be polished from the previous process; and a unloading and transporting mechanism 720 for transporting wafers from the final unloading area 500 to the next process. The control unit is also connected to the loading and transporting mechanism 710 and the unloading and transporting mechanism 720 to control their operating states. This further automates the loading and unloading process of the polishing process.
[0059] For example, both the loading and unloading handling mechanism 710 and the unloading handling mechanism 720 include automated guided vehicles (AGVs). AGVs are automated transportation equipment widely used in industrial and logistics fields. AGV systems typically move automatically in environments such as factories and warehouses via preset paths or navigation systems to complete tasks such as material handling and cargo transportation.
[0060] The above solution integrates the loading and unloading processes in the wafer polishing process with an AGV system to transport wafers from the previous process. The first loading robotic arm 610 loads the wafers to be polished, transported by the unmanned transport vehicle, into the loading buffer area 100. The unmanned transport vehicle then transports the polished, cleaned, and dried wafers from the final unloading area 500 to the next process, thereby further improving the automated loading and unloading process of the entire polishing segment. Wafer transfer between the final unloading area 500 and the unloading and transport mechanism 720 can be achieved via a robotic arm or conveyor belt.
[0061] Furthermore, in some exemplary embodiments of this disclosure, the polishing apparatus 200 may include a polishing disk, multiple wafer carriers, an inner pin ring, and an outer pin ring. Taking a double-sided polishing apparatus 200 as an example, it may include an upper polishing disk and a lower polishing disk, wherein an inner pin ring and an outer pin ring are disposed on the lower polishing disk, and multiple wafer carriers are located between the inner pin ring and the outer pin ring. The wafer carriers are driven to rotate by the inner pin ring and the outer pin ring, and the lower polishing disk drives the wafer carriers to revolve, thereby achieving wafer polishing. One wafer carrier may have multiple wafer carrying areas, that is, one wafer carrier may carry multiple wafers. In addition, other essential components of the polishing apparatus 200 are those that should be understood by those skilled in the art, and will not be described in detail here, nor should they be construed as limitations on this disclosure.
[0062] In some exemplary embodiments, the wafer polishing apparatus may further include a visual positioning device. The visual positioning device can be a system that utilizes image processing and computer vision techniques to determine the position and orientation of an object. The visual positioning device can use a camera or other imaging device to capture environmental images and obtain the positional information of the target object by analyzing these images.
[0063] The visual positioning device is configured to: determine the placement position of multiple wafers to be polished in each wafer carrier based on the acquired image of the wafer carrier, so that the multiple wafers to be polished adsorbed by the multiple vacuum suction cups of the second loading robot arm 620 can be accurately placed in the wafer carrier; and determine the position of multiple polished wafers in the wafer carrier based on the acquired image of the wafer carrier, so that the multiple vacuum suction cups of the unloading robot arm 630 can accurately adsorb the polished wafers in the wafer carrier.
[0064] The camera of the visual positioning device may be installed at the execution end of the second loading robotic arm 620 and the unloading robotic arm 630, or it may be installed on the polishing device 200.
[0065] In addition, in some exemplary embodiments, the unloading buffer area 300 includes: a cleaning tank for temporarily storing polished wafers; and a preliminary cleaning component for performing preliminary cleaning on the polished wafers stored in the cleaning tank, the preliminary cleaning component being disposed in the cleaning tank.
[0066] By adopting the above scheme, when the polished wafer is temporarily stored in the unloading buffer area 300, the wafer can be initially cleaned and then enter the cleaning and drying area 400 for secondary cleaning, so as to improve the cleaning effect of the wafer surface and thus improve the product quality.
[0067] In some exemplary embodiments, the preliminary cleaning assembly includes a bubbling cleaning assembly; wherein the cleaning agent of the bubbling cleaning assembly includes deionized water (DIW), and the bubbling gas includes nitrogen (N2). Due to its high purity, deionized water (DIW) can effectively dissolve and remove impurities and contaminants dissolved in water. Nitrogen (N2), as an inert gas, can be used for bubbling to help remove air bubbles and impurities from the water, while preventing oxidation reactions.
[0068] The bubbling cleaning assembly can introduce nitrogen gas into deionized water through a suitable device (e.g., a bubble generator) to form bubbles. The bubbling of nitrogen gas increases the fluidity of the water, helping it to flow to the surface of the object and enhancing the cleaning effect. Other essential components of the bubbling cleaning assembly are as would be understood by those skilled in the art and are not described in detail here, nor should they be construed as limiting this disclosure.
[0069] Furthermore, in some embodiments, the cleaning and drying zone 400 may include a cleaning machine, which may select a cleaning zone 410 and a drying zone 420. The polished wafers can be loaded into the cleaning zone 410 by the third loading robotic arm 640 for secondary cleaning. The cleaned wafers then enter the drying zone 420 for air drying, and the air-dried wafers automatically enter the final unloading zone 500. Other essential components of the cleaning machine are understood by those skilled in the art and are not described in detail here, nor should they be construed as limiting this disclosure.
[0070] In addition, it should be noted that the cleaned and dried wafers can be automatically transferred to the final unloading area 500, for example, by a robotic arm (such as the third loading robotic arm 640) or a conveyor belt, etc., and there is no limitation thereto.
[0071] The working process of the polishing equipment provided in some embodiments of this disclosure is as follows:
[0072] The unmanned transport vehicle (loading and transporting mechanism 710) transports wafers to be polished from the previous process;
[0073] The first loading robotic arm 610 transfers the wafer to be polished from the unmanned transport vehicle to the loading buffer area 100;
[0074] The loading buffer area 100 temporarily stores multiple wafers to be polished;
[0075] The visual positioning device positions the wafer carrier in the polishing device 200, and the second loading robotic arm 620 transfers the wafer in the loading buffer area 100 to the wafer carrier.
[0076] The polishing device 200 polishes and grinds the wafer;
[0077] The visual positioning device positions the wafer carrier in the polishing device 200, and the unloading robotic arm 630 transfers the polished wafer to the unloading buffer area 300.
[0078] The unloading buffer area 300 temporarily stores the polished wafers and performs bubble cleaning on the wafers;
[0079] The third loading robotic arm 640 transfers the wafers from the unloading buffer area 300 to the cleaning and drying area 400;
[0080] The cleaning and drying zone 400 cleans and dries the wafer and then transfers it to the final unloading zone 500.
[0081] The unmanned transport vehicle (unloading and transporting mechanism 720) transports the wafers from the final unloading area to the next process.
[0082] The following points need to be explained:
[0083] (1) The accompanying drawings of the embodiments of this disclosure only involve the structures involved in the embodiments of this disclosure. Other structures can be referred to the general design.
[0084] (2) For clarity, the thickness of layers or regions is enlarged or reduced in the drawings used to describe embodiments of the present disclosure, i.e., these drawings are not drawn to actual scale. It will be understood that when an element such as a layer, film, region or substrate is referred to as being “above” or “below” another element, the element may be “directly” located “above” or “below” the other element or there may be intermediate elements.
[0085] (3) Where there is no conflict, the embodiments of this disclosure and the features in the embodiments can be combined with each other to obtain new embodiments.
[0086] The above are merely specific embodiments of this disclosure, but the scope of protection of this disclosure is not limited thereto. The scope of protection of this disclosure shall be determined by the scope of the claims.
Claims
1. A wafer polishing device, characterized in that, include: A loading buffer area used to temporarily store multiple wafers to be polished; Polishing apparatus used for polishing wafers; A buffer area for temporarily storing polished wafers; A cleaning and drying area used for cleaning and drying polished wafers; The final unloading area for receiving wafers from the cleaning and drying area; A wafer transfer mechanism for transferring wafers between the loading buffer area, the polishing device, the unloading buffer area, the cleaning and drying area, and the final unloading area; and A control unit for controlling the working status of the loading buffer area, the polishing device, the unloading buffer area, the cleaning and drying area, the final unloading area, and the wafer transfer mechanism, wherein the control unit is connected to the loading buffer area, the polishing device, the unloading buffer area, the cleaning and drying area, the final unloading area, and the wafer transfer mechanism, respectively.
2. The wafer polishing equipment according to claim 1, characterized in that, The wafer transfer mechanism includes: A first loading robotic arm for transferring the wafer to be polished to the loading buffer area; A second loading robotic arm is used to transfer the wafer to be polished from the loading buffer area to the polishing device, the second loading robotic arm being configured to swing between the loading buffer area and the polishing device; A loading robot arm for transferring polished wafers from the polishing apparatus to the loading buffer area, the loading robot arm being configured to swing between the polishing apparatus and the loading buffer area; A third loading robot arm is used to transfer polished wafers from the unloading buffer area to the cleaning and drying area, the third loading robot arm being configured to swing between the unloading buffer area and the cleaning and drying area.
3. The wafer polishing equipment according to claim 2, characterized in that, At least one of the first loading robotic arm, the second loading robotic arm, the third loading robotic arm, and the unloading robotic arm is provided with a plurality of vacuum suction cups at its execution end, which are used to adsorb the wafer during the wafer transfer process.
4. The wafer polishing equipment according to claim 2, characterized in that, The loading buffer area, the unloading buffer area, the cleaning and drying area, and the final unloading area are all located on the same side of the polishing device. The first loading robot arm is located between the loading buffer area and the polishing device, the unloading robot arm is located between the polishing device and the unloading buffer area, and the third loading robot arm is located between the unloading buffer area and the cleaning and drying area.
5. The wafer polishing equipment according to claim 1, characterized in that, The wafer polishing equipment also includes: A loading and conveying mechanism for transporting wafers to be polished from the previous process; and A material handling mechanism for transporting wafers from the final unloading area to the next process.
6. The wafer polishing equipment according to claim 5, characterized in that, Both the loading and unloading mechanisms include unmanned transport vehicles.
7. The wafer polishing equipment according to claim 5, characterized in that, The control unit is also connected to the loading and unloading conveying mechanism to control the working status of the loading and unloading conveying mechanism.
8. The wafer polishing equipment according to claim 1, characterized in that, The polishing apparatus includes multiple wafer carriers; the wafer polishing equipment also includes a visual positioning device configured to determine the placement position of multiple wafers to be polished in each wafer carrier and the position of multiple polished wafers in the wafer carrier based on the acquired images of the wafer carriers.
9. The wafer polishing equipment according to claim 1, characterized in that, The unloading buffer area includes: a cleaning tank for temporarily storing polished wafers; and a preliminary cleaning component for performing preliminary cleaning on the polished wafers stored in the cleaning tank, the preliminary cleaning component being disposed in the cleaning tank.
10. The wafer polishing equipment according to claim 9, characterized in that, The preliminary cleaning assembly includes a bubbling cleaning assembly; wherein the cleaning agent of the bubbling cleaning assembly includes deionized water, and the bubbling gas includes nitrogen.