Substrate detection device

By designing a substrate detection device, using a drive component to achieve linear and rotational movement of the substrate, and combining it with a detection component to perform high-precision warpage detection, the problems of low detection accuracy and low efficiency in the existing technology are solved, and efficient and damage-free warpage detection is achieved.

CN223485103UActive Publication Date: 2025-10-28WUSHI MICROELECTRONICS (SUZHOU) CO LTD
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Patent Information

Application Number
CN202422391442.5
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-09-30
Publication Date
2025-10-28
Estimated Expiration
2034-09-30

AI Technical Summary

Technical Problem

Existing wafer warpage detection methods have problems such as low accuracy, low efficiency and possible damage to the wafer, making it difficult to meet the high precision and high efficiency requirements of modern semiconductor manufacturing.

Method used

A substrate detection device is designed, which includes a workbench, a carrying assembly, a first and a second drive assembly, and a detection assembly. The drive assembly realizes linear and rotational motion of the substrate, and the detection assembly is combined with high-precision warpage detection to avoid damage to the substrate.

Benefits of technology

It achieves high-precision and high-speed warpage detection, meeting the high-precision and high-efficiency requirements of modern semiconductor manufacturing without damaging the substrate.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to a substrate detection device, comprising: a bearing assembly for bearing a substrate; the first driving assembly is used for driving the bearing table to drive the substrate to linearly move; the second driving assembly is arranged on the bearing assembly and used for driving the bearing table to drive the substrate to rotate; the detection assembly is used for detecting the performance of the substrate; and the control assembly is connected with the detection assembly and is used for receiving a feedback signal of the detection assembly for detecting the substrate. In other words, the first driving assembly can drive the second driving assembly and the bearing assembly to move linearly at the same time, so that when the substrate is driven to move linearly, the detection assembly can detect the warping degree of the substrate, and when the substrate is driven to rotate, the detection assembly can detect the warping degree of the substrate. And when the substrate is driven to rotate and linearly move at the same time, the detection assembly can detect the warping degree of the substrate, the detection precision is high, the detection efficiency is high, the substrate cannot be damaged, and comprehensive detection can be achieved.
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Description

[Technical Field]

[0001] This application relates to a substrate testing device, belonging to the field of substrate testing technology. [Background Technology]

[0002] In modern semiconductor manufacturing, substrate quality and performance have a crucial impact on chip yield and reliability. Among these, warpage is one of the key indicators for measuring wafer quality.

[0003] With the continuous development of semiconductor technology, the size of substrates is gradually increasing, the manufacturing process is becoming increasingly complex, and the requirements for controlling wafer warpage are becoming more and more stringent. During wafer manufacturing, processing, and subsequent chip production, various factors can cause wafer warpage. For example, high-temperature treatment, thin film deposition, and chemical mechanical polishing processes can all cause uneven stress distribution within the wafer, leading to warpage.

[0004] Traditional wafer warpage detection methods have several limitations. Some methods have low accuracy, failing to meet the high-precision wafer warpage detection requirements of advanced processes; others are inefficient, making them unsuitable for large-scale production. Furthermore, some detection techniques may damage the wafer, affecting its subsequent use.

[0005] Therefore, it is necessary to improve the existing technology to overcome the aforementioned defects. [Utility Model Content]

[0006] In view of this, embodiments of this application provide a substrate inspection apparatus to solve at least one problem existing in the prior art, comprising:

[0007] Workbench;

[0008] A carrier component, having a carrier section for supporting the substrate;

[0009] A first driving component is connected to the bearing component and is used to drive the bearing platform to move the substrate linearly relative to the worktable.

[0010] The second drive component is connected to the support component and is used to drive the support stage to rotate the substrate relative to the worktable.

[0011] A testing component, mounted on the workbench and located on one side of the support component, is used to test the substrate performance;

[0012] A control component, connected to the detection component, is used to receive feedback signals from the detection component detecting the substrate.

[0013] Optionally, in the above-described substrate testing device, the first driving component includes a first driving member mounted on the worktable and a transmission component connecting the first driving member and the carrier component. The transmission component can convert the rotational motion of the first driving member into the linear motion of the carrier component, thereby driving the substrate on the carrier to move linearly.

[0014] Optionally, in the above-described substrate testing device, the second driving component includes a second driving member and an actuator mounted on the carrier component. The actuator is connected to the second driving member and the carrier component respectively. The second driving member applies a rotational force to the actuator to drive the substrate on the carrier component to rotate.

[0015] Optionally, in the above-described substrate testing device, the second driving component further includes a first guide and a second guide disposed on the carrier component, and the actuator is connected to the carrier component after passing around the guide.

[0016] Optionally, in the above-described substrate testing device, the carrier component includes a carrier platform, a mounting platform connected to the carrier platform, and a quick-release plate mounted on the carrier platform. The carrier part is located on the quick-release plate. The first driving component drives the mounting platform to move the quick-release plate and the second driving component linearly relative to the worktable. The second driving component drives the quick-release plate to rotate relative to the worktable.

[0017] Optionally, in the above-mentioned substrate testing device, multiple quick-release plates are provided, and each quick-release plate includes the bearing portion;

[0018] The plurality of quick-release plates include at least a first quick-release plate and a second quick-release plate. The first quick-release plate is adapted to be mounted on the support platform and has a first receiving space. The second quick-release plate is detachably mounted in the first receiving space and has a second receiving space smaller than the first receiving space.

[0019] Optionally, in the above-mentioned substrate testing device, the first quick-release plate includes a first mounting groove disposed on the inner edge, and the second quick-release plate includes a mounting part disposed on the outer edge and a second mounting groove disposed on the inner edge, wherein the mounting part is disposed in a one-to-one correspondence with the first mounting groove.

[0020] Optionally, the substrate inspection device described above further includes a lifting assembly disposed on one side of the inspection assembly. The lifting assembly is movable in the height direction to detach the substrate from the support assembly.

[0021] Optionally, in the above-described substrate inspection device, the lifting assembly includes a third drive unit mounted on the worktable and a lifting member connected to the third drive unit, wherein the third drive unit drives the lifting member to move in the height direction.

[0022] Optionally, the substrate inspection device described above further includes a guide assembly, which includes a slider disposed on one of the worktable and the mounting plate and a slide rail disposed on the other. The slide rail is adapted to the slider, and the first driving member is capable of driving the mounting plate to move linearly relative to the worktable under the action of the slider and the slide rail.

[0023] Compared with the prior art, this application has the following beneficial effects: by providing a carrier component, a first drive component connected to the carrier component, a second drive component, a detection component disposed on one side of the carrier component, and a control component connected to the detection component, the carrier component is provided with a carrier part for carrying the substrate. The first drive component can drive the carrier stage to move the substrate linearly relative to the worktable, and the second drive component can drive the carrier stage to rotate the substrate relative to the worktable. Moreover, the second drive component is disposed on the carrier component, that is, the first drive component can simultaneously drive the second drive component and the carrier component to move linearly. Thus, it is possible to realize that when the substrate is driven to move linearly, the detection component can detect the warpage of the substrate; when the substrate is driven to move rotationally, the detection component can detect the warpage of the substrate; and when the substrate is driven to move both rotationally and linearly, the detection component can detect the warpage of the substrate. The detection accuracy is high, the detection efficiency is high, it will not damage the substrate, and it can perform comprehensive detection.

Brief Description of the Drawings

[0024] Figure 1 This is a schematic diagram of the substrate testing device shown in this application;

[0025] Figure 2 for Figure 1 A partial enlarged view of the substrate inspection device shown;

[0026] Figure 3 for Figure 1 A schematic diagram of the substrate testing device from another direction;

[0027] Figure 4 for Figure 1 A partial structural schematic diagram of the substrate testing device shown;

[0028] Figure 5 for Figure 1 Another structural schematic diagram of the substrate testing device shown.

[0029] in,

[0030] 1-Workbench;

[0031] 2-Bearing component, 21-Bearing part, 22-Bearing platform, 23-Mounting platform, 24-First quick-release plate, 241-First mounting slot, 25-Second quick-release plate, 251-Second mounting slot, 252-Mounting part;

[0032] 3-First drive assembly, 31-First drive component, 32-Transmission component;

[0033] 4-Second drive assembly, 41-Second drive element, 42-Actuator, 43-First guide element, 44-Second guide element;

[0034] 5-Detection components, 51-First part, 52-Second part;

[0035] 6-Guide assembly, 61-Slider, 62-Slide rail;

[0036] 7-Lifting assembly, 71-Third drive component, 72-Lifting component. [Specific implementation method]

[0037] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application will be described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are for illustrative purposes only and are not intended to limit the scope of this application. Furthermore, it should be noted that, for ease of description, only the parts relevant to this application are shown in the accompanying drawings, not the entire structure. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without inventive effort are within the scope of protection of this application.

[0038] The terms “comprising” and “having”, and any variations thereof, used in this application are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or apparatus that includes a series of steps or units is not limited to the steps or units listed, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to such process, method, product, or apparatus.

[0039] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0040] Please see Figures 1 to 5As shown in the preferred embodiment of this application, the substrate inspection device is used to detect the warpage of the substrate in order to reject unqualified substrates and facilitate subsequent substrate processing.

[0041] The substrate testing device includes a worktable 1, a support assembly 2 mounted on the worktable 1, a first drive assembly 3 and a second drive assembly 4 connected to the support assembly 2, a testing assembly 5 mounted on the worktable 1, and a control assembly connected to the testing assembly 5. The support assembly 2 has a support section 21 for supporting the substrate. The first drive assembly 3 drives the support platform 22 to move the substrate linearly relative to the worktable 1. The second drive assembly 4 drives the support platform 22 to rotate the substrate relative to the worktable 1. The testing assembly 5 is located on one side of the support assembly 2 and is used to test the substrate performance. The control assembly receives feedback signals from the testing assembly 5. For example, after testing the substrate, the testing assembly 5 generates an electrical signal that is transmitted to the control assembly. The control assembly converts and amplifies the electrical signal to form a waveform, thereby obtaining the performance of the substrate being tested.

[0042] It should be noted that in this embodiment, the second driving component 4 is disposed on the bearing component 2. This means that the application can achieve performance testing of the substrate by the detection component 5 when the substrate is performing linear motion alone, when the substrate is performing rotational motion alone, or when the substrate is performing both linear and rotational motions simultaneously. This allows for selective and comprehensive performance testing of the substrate. In this embodiment, the detection component 5 is a warpage detector to detect the warpage of the substrate. In other embodiments, the detection component 5 can be other performance testing instruments; simply replacing it will allow for testing different properties of the substrate. Examples of such instruments are not provided here.

[0043] It is worth noting that, in this embodiment, the detection component includes a first part 51 and a second part 52 respectively disposed above and below the target substrate, and both the first part 51 and the second part 52 can be adjusted in height relative to the target substrate to improve the detection accuracy of the substrate.

[0044] In an optional embodiment, the first driving assembly 3 includes a first driving member 31 mounted on the worktable 1 and a transmission component 32 connecting the first driving member 31 and the bearing assembly 2. The transmission component 32 can convert the rotational motion of the first driving member 31 into the linear motion of the bearing assembly 2, thereby driving the substrate on the bearing portion 21 to perform linear motion. In this embodiment, the first driving member 31 includes a drive motor and a reducer connected to the drive motor; the transmission component 32 is a lead screw component, the drive motor drives the reducer to rotate, and the lead screw component converts the rotational motion of the drive motor into the linear motion of the bearing assembly 2.

[0045] In an optional embodiment, the second drive assembly 4 includes a second drive member 41 and an actuator 42 mounted on the support assembly 2. The actuator 42 is connected to both the second drive member 41 and the support portion 21. The second drive member 41 applies a rotational force to the actuator 42 to drive the substrate on the support portion 21 to rotate. In this embodiment, the second drive member 41 is also a drive motor, and the actuator 42 is a conveyor rope. The drive motor rotates to drive the conveyor rope to rotate, thereby driving the substrate on the support portion 21 to rotate.

[0046] Furthermore, the second drive assembly 4 also includes a first guide 43 and a second guide 44 disposed on the support assembly 2, and the distance between the first guide 43 and the second guide 44 is less than the diameter of the support portion 21. The purpose of this arrangement is that the relatively close distance between the first guide 43 and the second guide 44 allows the actuator 42 to exert a certain pulling force on both sides of the support portion 21, thereby preventing the actuator 42 from detaching from the support portion 21.

[0047] In this embodiment, the detection device further includes a guide component 6, which includes a slider 61 disposed on one of the worktable 1 and the mounting plate and a slide rail 62 disposed on the other. The slide rail 62 is adapted to the slider 61. The first driving member 31 can drive the mounting plate to move linearly relative to the worktable 1 under the action of the slider 61 and the slide rail 62. On the one hand, this can ensure that the bearing component 2 can move linearly along the slider 61 and the slide rail 62, preventing the bearing component 2 from deviating. On the other hand, the arrangement of the slider 61 and the slide rail 62 can also reduce the friction between the bearing component 2 and the worktable 1 when moving, thereby achieving the effect of saving effort.

[0048] As described above, the support assembly 2 includes a support platform 22, a mounting platform 23 connected to the support platform 22, and a quick-release plate mounted on the support platform 22. The support portion 21 is located on the quick-release plate. The first drive assembly 3 drives the mounting platform 23 to move the quick-release plate linearly relative to the worktable 1, and the second drive assembly 4 drives the quick-release plate to rotate relative to the worktable 1. That is, in this embodiment, substrates with only linear motion, substrates with only rotational motion, or substrates with both linear and rotational motion can be selectively inspected, thereby meeting different inspection requirements. It should be noted that in this embodiment, by placing the support portion 21 on the quick-release plate, substrates of different specifications can be inspected by replacing quick-release plates of different specifications, which is convenient and quick.

[0049] In this embodiment, multiple quick-release plates are provided, and each quick-release plate includes the aforementioned support portion 21. Specifically, the multiple quick-release plates include at least a first quick-release plate 24 and a second quick-release plate 25. The first quick-release plate 24 is adapted to be mounted on the support platform 22, and the first quick-release plate 24 has a first accommodating space. The second quick-release plate 25 is detachably mounted within the first accommodating space, and the second quick-release plate 25 has a second accommodating space smaller than the first accommodating space. It can be understood that the first quick-release plate 24 is the quick-release plate with the largest accommodating space, which can accommodate substrates with a larger diameter. The second quick-release plate 25 is a smaller quick-release plate fitted within the first accommodating space, and so on, with the third quick-release plate being an even smaller quick-release plate fitted within the second accommodating space. That is, by removing or adding the second quick-release plate 25, the third quick-release plate, etc., the support for substrates of different specifications can be achieved, thereby completing the testing of substrates of different specifications.

[0050] More specifically, the first quick-release plate 24 includes a first mounting groove 241 on its inner edge, and the second quick-release plate 25 includes a mounting portion 252 on its outer edge and a second mounting groove 251 on its inner edge, with the mounting portion 252 corresponding to the first mounting groove 241. Similarly, the third quick-release plate includes a mounting portion 252 on its outer edge and a third mounting groove on its inner edge, with the mounting plate on the third quick-release plate corresponding to the second mounting groove 251, thereby enabling connection and disassembly between adjacent quick-release plates.

[0051] In this embodiment, the detection device also includes a lifting component 7, which is disposed on one side of the detection component 5. The lifting component 7 can move in the height direction to detach the substrate from the support component 2, thereby cooperating with the robot to complete the unloading of the substrate after detection.

[0052] Specifically, the lifting assembly 7 includes a third drive component 71 mounted on the worktable 1 and a lifting component 72 connected to the third drive component 71. The third drive component 71 is a drive cylinder, which can drive the lifting component 72 to move in the height direction, thereby lifting the substrate located above the lifting component 72. The substrate is then picked up by the robot arm to complete the inspection.

[0053] The above is only one specific implementation of this application, and any other improvements made based on the concept of this application shall be considered within the scope of protection of this application.

Claims

1. A substrate testing device, characterized in that, include: Workbench; A carrier component, having a carrier section for supporting the substrate; A first driving component is connected to the bearing component and is used to drive the bearing part to move the substrate linearly relative to the worktable; The second drive component is connected to the support component and is used to drive the support part to rotate the substrate relative to the worktable; A testing component, mounted on the workbench and located on one side of the support component, is used to test the substrate performance; A control component, connected to the detection component, is used to receive feedback signals from the detection component detecting the substrate.

2. The substrate testing device according to claim 1, characterized in that, The first driving assembly includes a first driving member mounted on the workbench and a transmission component connecting the first driving member and the bearing assembly. The transmission component can convert the rotational motion of the first driving member into the linear motion of the bearing assembly, thereby driving the substrate on the bearing part to move linearly.

3. The substrate inspection device according to claim 2, characterized in that, The second drive assembly includes a second drive member and an actuator mounted on the carrier assembly. The actuator is connected to the second drive member and the carrier part respectively. The second drive member applies a rotational force to the actuator to drive the substrate on the carrier part to rotate.

4. The substrate inspection device according to claim 3, characterized in that, The second drive assembly further includes a first guide and a second guide disposed on the carrier assembly, and the actuator is connected to the carrier portion after passing around the guide.

5. The substrate inspection device according to claim 3, characterized in that, The support assembly includes a support platform, a mounting platform connected to the support platform, and a quick-release plate mounted on the support platform. The support portion is located on the quick-release plate. The first drive assembly drives the mounting platform to move the quick-release plate and the second drive assembly linearly relative to the worktable. The second drive assembly drives the quick-release plate to rotate relative to the worktable.

6. The substrate inspection device according to claim 5, characterized in that, Multiple quick-release plates are provided, and each quick-release plate includes the bearing portion; The plurality of quick-release plates include at least a first quick-release plate and a second quick-release plate. The first quick-release plate is adapted to be mounted on the support platform and has a first receiving space. The second quick-release plate is detachably mounted in the first receiving space and has a second receiving space smaller than the first receiving space.

7. The substrate inspection device according to claim 6, characterized in that, The first quick-release plate includes a first mounting groove on its inner edge, and the second quick-release plate includes a mounting part on its outer edge and a second mounting groove on its inner edge, wherein the mounting part corresponds one-to-one with the first mounting groove.

8. The substrate inspection device according to claim 1, characterized in that, The detection device also includes a lifting assembly disposed on one side of the detection assembly. The lifting assembly is movable in the height direction to detach the substrate from the support assembly.

9. The substrate inspection device according to claim 8, characterized in that, The lifting assembly includes a third drive unit mounted on the workbench and a lifting member connected to the third drive unit, the third drive unit driving the lifting member to move in the height direction.

10. The substrate inspection device according to claim 5, characterized in that, The detection device further includes a guide assembly, which includes a slider disposed on one of the worktable and the mounting platform and a slide rail disposed on the other. The slide rail is adapted to the slider, and the first driving member is capable of driving the mounting platform to move linearly relative to the worktable under the action of the slider and the slide rail.