Defect detection equipment used before and after chip cleaning

Abstract

The utility model relates to the field of chip defect detection, in particular to defect detection equipment used before and after chip cleaning, and the defect detection equipment used before and after chip cleaning comprises a frame body assembly which is fixed on one side of an external chip cleaning device and comprises two first connecting plates, the two first connecting plates are oppositely arranged and spaced by a preset distance, one sides of the two first connecting plates are fixed to a shell of the external cleaning device, the frame body assembly further comprises a second connecting plate, the second connecting plate is transversely arranged, and the two ends of the second connecting plate are erected at the tops of the two first connecting plates respectively; the fourth connecting plates are arranged at intervals, the fourth connecting plates are fixed to the side, close to the first connecting plate, of the second connecting plate, and at least one camera is further installed on each fourth connecting plate. According to the utility model, the advantages of convenience in use, simple structure, convenience in assembly and disassembly and high practicability can be realized by effectively utilizing the self structural configuration.

Description

Technical Field

[0001] This application relates to the field of chip defect detection, and more specifically to a defect detection device for chips before and after cleaning. Background Technology

[0002] Existing defect detection devices for chips before and after cleaning are rarely used. Typically, chip inspection is performed after cleaning is complete. However, if some defects are caused by the cleaning process, these defects cannot be effectively avoided. This invention, by detecting defects before and after chip cleaning, can distinguish whether the cleaned and post-cleaning chips are identical, thereby ensuring that no new defects are introduced after cleaning. Therefore, there is a need for a user-friendly, simple, easy-to-assemble, and highly practical defect detection device for chips before and after cleaning. Utility Model Content

[0003] The main purpose of this application is to provide a defect detection device for chip cleaning before and after cleaning. The defect detection device for chip cleaning before and after cleaning can effectively utilize its own structural configuration to achieve the advantages of convenient use, simple structure and easy disassembly and assembly.

[0004] Another objective of this application is to provide a defect detection device for chip cleaning before and after cleaning. The device includes a frame assembly and multiple spaced-apart fourth connecting plates. The frame assembly is fixed to one side of an external chip cleaning device. The frame assembly includes two first connecting plates arranged opposite each other at a predetermined distance, with one side of each first connecting plate fixed to the outer casing of the external cleaning device. The frame assembly also includes a second connecting plate arranged laterally, with both ends of the second connecting plate mounted on the tops of the two first connecting plates. Fourth connecting plates are fixed to the side of the second connecting plate closest to the first connecting plates. At least one camera is mounted on each fourth connecting plate to capture images of the chip before and after cleaning, thereby identifying whether the chip defects are consistent before and after cleaning.

[0005] Another objective of this application is to provide a defect detection device for chip cleaning before and after cleaning. The defect detection device for chip cleaning before and after cleaning is simple in structure, easy to operate, does not involve complex manufacturing processes and expensive materials, has high economic efficiency, and is easy to promote and use.

[0006] To achieve at least one of the above-mentioned objectives, this application provides a defect detection device for chip cleaning before and after cleaning, wherein the defect detection device for chip cleaning before and after cleaning includes:

[0007] A frame assembly is fixed to one side of an external chip cleaning device. The frame assembly includes two first connecting plates arranged opposite each other and spaced a predetermined distance apart. One side of each of the two first connecting plates is fixed to the outer casing of the external cleaning device. The frame assembly also includes a second connecting plate arranged laterally, with both ends of the second connecting plate resting on the tops of the two first connecting plates.

[0008] Multiple fourth connecting plates are spaced apart, each fourth connecting plate being fixed to the side of the second connecting plate near the first connecting plate, and at least one camera is mounted on each of the fourth connecting plates.

[0009] In one or more embodiments of this application, the frame assembly further includes two first support components, which are arranged opposite to each other and spaced apart by a predetermined distance. Each first support component includes a positioning plate, and both positioning plates are fixed to the side of the second connecting plate opposite to the first connecting plate.

[0010] In one or more embodiments of this application, each of the positioning plates further has two oppositely arranged protrusions, and each of the protrusions has a first waist-shaped groove that penetrates the protrusion.

[0011] In one or more embodiments of this application, each of the first support components includes a first support rod, one end of which is fixed between the two protrusions, and the other end extends downward a predetermined distance.

[0012] In one or more embodiments of this application, each first support component further includes a first lighting lamp, the two ends of which are rotatably disposed at the ends of the two first support rods that are close to each other, and located at the ends of the first support rods that are away from the positioning plate.

[0013] In one or more embodiments of this application, the frame assembly further includes two second support components, which are arranged opposite to each other and spaced apart by a predetermined distance, and are also located between the two first support components. Each second support component includes a third connecting plate and a second support rod. The third connecting plate is fixed to the side of the second connecting plate away from the first connecting plate, and one end of the second support rod is fixed to the third connecting plate, while the other end extends downward by a predetermined length, i.e., the second support rod is perpendicular to the third connecting plate.

[0014] In one or more embodiments of this application, each of the second support components further includes a first support plate, the first support plate being fixedly connected to one end of the second support rod away from the third connecting plate.

[0015] In one or more embodiments of this application, each of the second support components further includes a second support plate, which is movably connected to the middle section of the second support rod.

[0016] In one or more embodiments of this application, the second support assembly further includes a second lighting lamp, the two ends of which are fixedly connected to the middle section of the side of the two first support rods that are close to each other, and the second lighting lamp is also fixedly connected to the two second support plates.

[0017] In one or more embodiments of this application, each of the third connecting plates further has an extension portion spaced at a predetermined distance from the second support rod, and the extension portion extends downwards by a predetermined distance, wherein each of the second support components further includes a third support plate, and the third support plate is also connected to the extension portion. Attached Figure Description

[0018] These and / or other aspects and advantages of this application will become clearer and more readily understood from the following detailed description of embodiments of this application taken in conjunction with the accompanying drawings, wherein:

[0019] Figure 1 The illustration shows an application diagram of a defect detection device used before and after chip cleaning.

[0020] Figure 2 The figure shows a schematic diagram of a defect detection device used before and after chip cleaning. Figure 1 .

[0021] Figure 3 The figure shows a schematic diagram of a defect detection device used before and after chip cleaning. Figure 2 .

[0022] Figure 4 The illustration shows a partially enlarged view of a defect detection device used before and after chip cleaning. Detailed Implementation

[0023] The terms and words used in the following specification and claims are not limited to their literal meaning, but are used solely by the inventors to enable a clear and consistent understanding of this application. Therefore, it will be apparent to those skilled in the art that the following description of various embodiments of this application is provided for illustrative purposes only and not for the purpose of limiting the application as defined in the appended claims and their equivalents.

[0024] It is understood that the term "a" should be understood as "at least one" or "one or more", that is, in one embodiment, the number of an element can be one, while in another embodiment, the number of the element can be multiple, and the term "a" should not be understood as a limitation on the number.

[0025] While ordinal numbers such as "first," "second," etc., will be used to describe various components, there is no limitation on which components are used herein. The term is used only to distinguish one component from another. For example, a first component may be referred to as a second component, and similarly, a second component may be referred to as a first component, without departing from the teachings of the utility model concept. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0026] The terminology used herein is for the purpose of describing various embodiments only and is not intended to be limiting. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. It will also be understood that the terms “comprising” and / or “having” as used in this specification specify the presence of the described features, numbers, steps, operations, components, elements or combinations thereof, without excluding the presence or addition of one or more other features, numbers, steps, operations, components, elements or groups thereof.

[0027] Indicative of defect detection equipment used before and after chip cleaning

[0028] refer to Figures 1 to 4 According to a preferred embodiment of the present invention, a defect detection device for chip cleaning before and after cleaning is provided. It should be noted that the structure of the defect detection device for chip cleaning before and after cleaning is as follows: Figure 3 As shown, it is located on one side of the external chip cleaning device, specifically as follows: Figure 1 The outer casing 100 of the external cleaning device shown is on which this product is mounted.

[0029] Specifically, the defect detection equipment for chip cleaning before and after cleaning includes a frame assembly 10, which is fixed to one side of an external chip cleaning device. The frame assembly 10 includes two first connecting plates 11, which are arranged opposite each other and spaced a predetermined distance apart. One side of each of the two first connecting plates 11 is fixed to the outer casing of the external cleaning device, i.e., as shown... Figure 2 As shown, the first connecting plate 11 can be fixed by external screws, and the first connecting plate 11 is triangular in shape. The large end of the first connecting plate 11 is fixed to the outer shell, and the small end is away from the outer shell.

[0030] Furthermore, the frame assembly 10 also includes a second connecting plate 12, which is arranged horizontally, and both ends of the second connecting plate 12 are respectively mounted on the tops of the two first connecting plates 11. Specifically, the ends of the second connecting plate 12 are fixed to the tops of the first connecting plates 11 by angle iron, that is, both the second connecting plate 12 and the first connecting plate 11 are connected to the angle iron by screws.

[0031] Furthermore, the frame assembly 10 also includes two first support assemblies 13, which are arranged opposite to each other and spaced apart by a predetermined distance. Each first support assembly 13 includes a positioning plate 131, and both positioning plates 131 are fixed to the side of the second connecting plate 12 opposite to the first connecting plate 11. Specifically, each positioning plate 131 also has two oppositely arranged protrusions, and each protrusion has a first waist-shaped groove that penetrates through the protrusion. Each first support assembly 13 includes a first support rod 132, one end of which is fixed between the two protrusions, and the other end extends downward by a predetermined distance. That is, the first support rod 132 is perpendicular to the protrusion, and the connection between the first support rod 132 and the protrusion can be implemented by screw connection. In addition, it should be noted that the end of the support rod placed between the two protrusions has multiple vertically spaced positioning holes. That is, the user can manually adjust the position of the first support rod 132 to select one of the positioning holes to be aligned with the first waist-shaped groove, and then insert the external positioning bolt to define the position of the first support rod 132.

[0032] Furthermore, each first support component 13 also includes a first lighting lamp 133, the two ends of which are rotatably disposed at the ends of the two first support rods 132 that are close to each other, and located at the ends of the first support rods 132 that are away from the positioning plate 131.

[0033] Furthermore, the frame assembly 10 also includes two second support assemblies 14, which are arranged opposite to each other and spaced apart by a predetermined distance. The two second support assemblies 14 are also located between the two first support assemblies 13. Each second support assembly 14 includes a third connecting plate 141 and a second support rod 142. The third connecting plate 141 is fixed to the side of the second connecting plate 12 away from the first connecting plate 11, and one end of the second support rod 142 is fixed to the third connecting plate 141, while the other end extends downward by a predetermined length, that is, the second support rod 142 is perpendicular to the third connecting plate 141.

[0034] Furthermore, each of the second support components 14 also includes a first support plate 143, which is fixedly connected to one end of the second support rod 142 away from the third connecting plate 141. Specifically, the first support plate 143 can be implemented as a T-shaped plate, and the first lighting lamp 133 is fixedly connected to the first support plate 143, thereby providing support for the first lighting lamp 133. Both the second support rod 142 and the first support plate 143 have a second waist-shaped groove, and the user can adjust the position of the first support plate 143 by adjusting the second waist-shaped groove.

[0035] It is worth mentioning that each of the second support components 14 also includes a second support plate 144, which is movably connected to the middle section of the second support rod 142. Specifically, the middle section of the second support rod 142 and the second support plate 144 both have a third waist-shaped groove, that is, the user can adjust the position of the second support plate 144 through the third waist-shaped groove. In addition, it should be noted that the second support component 14 also includes a second lighting lamp 146, the two ends of the second lighting lamp 146 are fixedly connected to the middle section of the two first support rods 132 on the side close to each other, and the second lighting lamp 146 is also fixedly connected to the two second support plates 144, that is, the connection method can be implemented as a screw connection.

[0036] Other examples Figure 2 As shown, each of the third connecting plates 141 also has an extension 1411, which is spaced at a predetermined distance from the second support rod 142 and extends downward by a predetermined distance. Each of the second support components 14 also includes a third support plate 145, which is connected to the extension 1411. That is, the second lighting lamp 146 can be selectively fixed on the third support plate 145. Therefore, the user can selectively install the second lighting lamp 146 on the second support plate 144 or the third support plate 145 as needed.

[0037] Specifically, the defect detection equipment for chip cleaning before and after also includes a plurality of fourth connecting plates 20 spaced apart. The fourth connecting plates 20 are fixed on the side of the second connecting plate 12 near the first connecting plate 11, and at least one camera 30 is mounted on each of the fourth connecting plates 20. The lens of the camera 30 is vertically downward to facilitate taking pictures of the chip.

[0038] Among them, such as Figure 1 The structure of the conveying device shown is used to convey the tray 200. The tray holds the chip board, and a suction cup device is installed on the top of the tray to grab the tray so that it can be sent into the cleaning device. At this time, the product will take pictures of the chip before cleaning to detect chip defects. Then the cleaning device will send the tray out, and the product will take pictures of the chip after cleaning to detect defects in the chip after cleaning.

[0039] In summary, the defect detection device for chip cleaning before and after the present application embodiment is explained, which provides advantages such as convenient use, simple structure, easy disassembly and assembly, and high practicality.

[0040] It is worth mentioning that, in the embodiments of this application, the defect detection equipment for chip cleaning before and after cleaning has a simple structure, does not involve complex manufacturing processes or expensive materials, and is highly economical. At the same time, for manufacturers, the defect detection equipment for chip cleaning before and after cleaning provided in this application is easy to produce and inexpensive, which is more conducive to controlling production costs and further facilitates product promotion and use.

[0041] Those skilled in the art should understand that the embodiments of the present invention described above and shown in the accompanying drawings are merely examples and do not limit the present invention. The purpose of the present invention has been fully and effectively achieved. The function and structural principle of the present invention have been shown and explained in the embodiments, and any modifications or variations may be made to the implementation of the present invention without departing from these principles.

Claims

1. A defect detection device for chips before and after cleaning, characterized in that, The defect detection equipment used before and after chip cleaning includes: A frame assembly is fixed to one side of an external chip cleaning device. The frame assembly includes two first connecting plates arranged opposite each other and spaced a predetermined distance apart. One side of each of the two first connecting plates is fixed to the outer casing of the external cleaning device. The frame assembly also includes a second connecting plate arranged laterally, with both ends of the second connecting plate resting on the tops of the two first connecting plates. Multiple fourth connecting plates are spaced apart, each fourth connecting plate being fixed to the side of the second connecting plate near the first connecting plate, and at least one camera is mounted on each of the fourth connecting plates.

2. The defect detection device for chip cleaning before and after cleaning according to claim 1, wherein the frame assembly further includes two first support components, the two first support components are arranged opposite to each other and spaced apart by a predetermined distance, wherein each first support component includes a positioning plate, and both positioning plates are fixed to the side of the second connecting plate opposite to the first connecting plate.

3. The defect detection device for chip cleaning before and after cleaning according to claim 2, wherein each of the positioning plates further has two oppositely arranged protrusions, and each of the protrusions has a first waist-shaped groove, the first waist-shaped groove penetrating the protrusion.

4. The defect detection device for chip cleaning before and after cleaning according to claim 3, wherein each of the first support components includes a first support rod, one end of the first support rod is fixed between the two protrusions, and the other end extends downward by a predetermined distance.

5. The defect detection device for chip cleaning before and after according to claim 4, wherein each first support component further includes a first illumination lamp, the two ends of the first illumination lamp being rotatably disposed at the ends of the two first support rods that are close to each other, and located at the ends of the first support rods that are away from the positioning plate.

6. The defect detection device for chip cleaning before and after according to claim 5, wherein the frame assembly further includes two second support components, the two second support components are arranged opposite to each other and spaced apart by a predetermined distance, and the two second support components are also located between the two first support components, wherein each second support component includes a third connecting plate and a second support rod, the third connecting plate is fixed on the side of the second connecting plate away from the first connecting plate, and one end of the second support rod is fixed on the third connecting plate, and the other end extends downward by a predetermined length.

7. The defect detection device for chip cleaning before and after according to claim 6, wherein each of the second support components further includes a first support plate, the first support plate being fixedly connected to one end of the second support rod opposite to the third connecting plate.

8. The defect detection device for chip cleaning before and after cleaning according to claim 7, wherein each of the second support components further includes a second support plate, the second support plate being movably connected to the middle section of the second support rod.

9. The defect detection device for chip cleaning before and after according to claim 8, wherein the second support component further includes a second illumination lamp, the two ends of the second illumination lamp being fixedly connected to the middle section of the side of the two first support rods that are close to each other, and the second illumination lamp being fixedly connected to the two second support plates.

10. The defect detection device for chip cleaning before and after cleaning according to claim 9, wherein each of the third connecting plates further has an extension portion, the extension portion being spaced apart from the second support rod by a predetermined distance, and the extension portion extending downward by a predetermined distance, wherein each of the second support components further includes a third support plate, the third support plate being connected to the extension portion.

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