Microelectronic component chip testing device

Abstract

The utility model belongs to the technical field of testing devices, and particularly relates to a microelectronic assembly chip testing device which comprises a heating assembly and a supporting table, the supporting table is arranged on one side of the heating assembly, a connecting piece is arranged at the top end of the supporting table, and one end of the heating assembly is fixedly connected to the top end of the supporting table through the connecting piece. A stepped hole is formed in the middle of the top end of the supporting table, an objective table is slidably connected into the stepped hole, and a driving assembly used for driving the objective table to ascend and descend is arranged at the bottom end of the supporting table. According to the utility model, after the chip is heated at a high temperature, the driving assembly drives the objective table to descend, the cooling assembly detects the temperature of the chip, and when the temperature of the chip is too high, the cooling assembly cools the chip and the objective table, so that the chip and the objective table are prevented from scalding a worker; therefore, the chip does not need to be cooled, and the high-temperature test efficiency of the chip is improved.

Description

Technical Field

[0001] This utility model belongs to the field of testing device technology, specifically relating to a microelectronic component chip testing device. Background Technology

[0002] Chip testing is a critical step in ensuring chip performance and quality. It is usually performed in the final stage of chip manufacturing and generally includes steps such as designing a test plan, executing the test, analyzing the test results, and compiling a test report. Temperature resistance testing is an important test item in chip testing.

[0003] The commonly used high-temperature resistance testing equipment for chips places the chip directly on a fixed tray and then heats it. After heating, it is cooled for a period of time before being removed from the device. Since the inner wall of the equipment, the tray, and the chip are all heated during the heating process, the equipment, chip, and tray need to be cooled to avoid burns to the staff when handling them. The inner wall of the equipment has a large surface area, and heat dissipation is difficult to achieve in a short time, which affects the testing efficiency of the chip. Utility Model Content

[0004] The purpose of this invention is to provide a microelectronic component chip testing device that eliminates the need for cooling the inner wall of the heat insulation cover, thereby improving the efficiency of high-temperature chip testing and solving the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a microelectronic component chip testing device, comprising a heating component and a support platform, wherein the support platform is disposed on one side of the heating component, a connector is disposed at the top of the support platform, one end of the heating component is fixedly connected to the top of the support platform through the connector, a stepped hole is disposed in the middle of the top of the support platform, a stage is slidably connected inside the stepped hole, a driving component for driving the stage to rise and fall is disposed at the bottom of the support platform, and a cooling component for cooling the chip is disposed in the middle of the bottom of the support platform, the cooling component being disposed corresponding to the bottom of the stepped hole.

[0006] Furthermore, the heating assembly includes a housing and an airflow delivery column. The bottom end of the airflow delivery column is fixedly connected to a heat insulation cover. The top end of the housing is fixedly connected to an air supply pipe and a return pipe. A partition is fixedly connected inside the airflow delivery column, which divides the inside of the airflow delivery column into two chambers. Both chambers are connected to the heat insulation cover. One end of the air supply pipe and one end of the return pipe are respectively connected to the two chambers.

[0007] Furthermore, a hot air blower and a return air blower are provided inside the outer casing, with one end of the hot air blower and one end of the return air blower respectively located at one end of the air supply pipe and one end of the return air pipe.

[0008] Furthermore, the connector includes four screws arranged in a rectangular array, the bottom end of the screws being fixedly connected to the top end of the support platform, a collar being fixedly fitted on the top of the heat insulation cover, the screws passing through the collar, and a nut being threadedly connected to the top of the screws.

[0009] Furthermore, the drive assembly includes two symmetrically distributed servo electric telescopic cylinders. The top ends of the two servo electric telescopic cylinders are fixedly connected to the bottom end of the support platform. A base plate is fixedly connected between the bottom ends of the two servo electric telescopic cylinders. A connecting rod is fixedly connected to the middle of the base plate. The top end of the connecting rod is fixedly connected to the bottom end of the platform.

[0010] Furthermore, the cooling component includes a cylinder fixedly connected to the bottom of the support platform. The cylinder is correspondingly positioned to the bottom of the stepped hole. A connecting pipe is fixedly connected to the side wall of the cylinder. A fan is fixedly connected to the top of the stepped hole. An air collector is fixedly connected to the bottom of the fan. The bottom of the air collector is fixedly connected to the top of the connecting pipe. Equally spaced through holes are provided at the bottom of the side wall of the cylinder. A conical cylinder is provided in the middle of the side wall of the cylinder. An infrared temperature sensor is fixedly installed inside the conical cylinder.

[0011] Furthermore, a display and a controller are fixedly connected to one side of the support platform. The infrared temperature sensor is electrically connected to the controller. The display, servo electric telescopic cylinder, and fan are all electrically connected to an external power supply through the controller.

[0012] Compared with the prior art, the beneficial effects of this utility model are as follows: after the chip is heated to a high temperature, the stage is lowered by the drive component, and the cooling component detects the temperature of the chip. When the chip temperature is too high, the cooling component cools the chip and the stage to prevent the chip and the stage from burning the staff. Since the staff does not need to contact the inner wall of the heat insulation cover, there is no need to cool it, which improves the efficiency of high temperature chip testing. Moreover, there is no need to preheat the heat insulation cover before the next test, which further improves the testing efficiency. Attached Figure Description

[0013] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0014] Figure 2 This is a front sectional view of the present invention;

[0015] Figure 3 This is a three-dimensional structural diagram of the support platform of this utility model;

[0016] Figure 4 This is a right sectional view of the support platform of this utility model.

[0017] The attached diagram lists the components represented by each number as follows:

[0018] 1. Heating component; 11. Housing; 12. Airflow delivery column; 13. Insulation cover; 14. Air supply pipe; 15. Return pipe; 16. Hot air blower; 17. Return fan; 18. Partition; 2. Support platform; 21. Stepped hole; 3. Connector; 31. Screw; 32. Collar; 33. Nut; 4. Platform; 5. Drive assembly; 51. Servo electric telescopic cylinder; 52. Base plate; 53. Connecting rod; 6. Cooling assembly; 61. Cylinder; 62. Connecting pipe; 63. Fan; 64. Air collection cover; 65. Through hole; 66. Conical cylinder; 67. Infrared temperature sensor; 7. Display; 8. Controller. Detailed Implementation

[0019] To make the objectives and advantages of this utility model clearer, the following detailed description is provided in conjunction with embodiments. It should be understood that the following text is merely used to describe one or more specific embodiments of this utility model and does not strictly limit the scope of protection specifically claimed by this utility model.

[0020] like Figure 1 and 4 As shown, a microelectronic component chip testing device includes a heating component 1 and a support platform 2. The support platform 2 is disposed on one side of the heating component 1. A connector 3 is disposed at the top of the support platform 2. One end of the heating component 1 is fixedly connected to the top of the support platform 2 through the connector 3. A stepped hole 21 is disposed in the middle of the top of the support platform 2. A stage 4 is slidably connected inside the stepped hole 21. A driving component 5 for driving the stage 4 to rise and fall is disposed at the bottom of the support platform 2. A cooling component 6 for cooling the chip is disposed in the middle of the bottom of the support platform 2. The cooling component 6 is disposed corresponding to the bottom of the stepped hole 21.

[0021] According to the above structure, when performing high-temperature resistance testing on the chip, the chip is placed on the top of the stage 4 and then the stage 4 is raised by the drive component 5. The raising stops when the top of the stage 4 is level with the top of the support platform 2. The chip is heated by the heating component 1. After a period of time, the stage 4 is lowered by the drive component 5. The cooling component 6 detects the temperature of the chip. When the chip temperature is too high, the cooling component 6 cools the chip to prevent the chip and stage 4 from burning the staff. Since the staff does not need to contact the inner wall of the heat insulation cover 13, there is no need to cool it, which improves the efficiency of high-temperature chip testing. Moreover, there is no need to preheat the heat insulation cover 13 before the next test, which further improves the testing efficiency.

[0022] like Figure 1 and 2As shown, the heating assembly 1 includes a housing 11 and an airflow delivery cylinder 12. The bottom end of the airflow delivery cylinder 12 is fixedly connected to a heat insulation cover 13. The top end of the housing 11 is fixedly connected to an air supply pipe 14 and a return pipe 15. A partition 18 is fixedly connected inside the airflow delivery cylinder 12, dividing the interior of the airflow delivery cylinder 12 into two chambers. Both chambers are connected to the heat insulation cover 13. One end of the air supply pipe 14 and one end of the return pipe 15 are respectively connected to the two chambers. A hot air fan 16 and a return fan 17 are provided inside the housing 11. One end of the hot air fan 16 and one end of the return fan 17 are respectively provided at one end of the air supply pipe 14 and one end of the return pipe 15.

[0023] According to the above structure, when heating the chip, the hot air blower 16 and the return air blower 17 are started. The hot air blower 16 delivers hot air through the air supply pipe 14 to the inside of the heat insulation cover 13 to heat the chip. The hot air inside the heat insulation cover 13 flows back to the inside of the outer shell 11 through the return pipe 15 and is discharged.

[0024] like Figure 2 As shown, the connector 3 includes four screws 31 arranged in a rectangular array. The bottom end of the screws 31 is fixedly connected to the top end of the support platform 2. The top of the heat insulation cover 13 is fixedly fitted with a collar 32. The screws 31 pass through the collar 32, and the top of the screws 31 is threadedly connected with a nut 33.

[0025] According to the above structure, the heat insulation cover 13 is pressed against the top of the stepped hole 21 by the nut on the screw 31. When disassembling, simply loosen the nut to remove the heat insulation cover 13 from the top of the support platform 2.

[0026] like Figure 3 and 4 As shown, the drive assembly 5 includes two symmetrically distributed servo electric telescopic cylinders 51. The top ends of the two servo electric telescopic cylinders 51 are fixedly connected to the bottom end of the support platform 2. A base plate 52 is fixedly connected between the bottom ends of the two servo electric telescopic cylinders 51. A connecting rod 53 is fixedly connected to the middle of the base plate 52. The top end of the connecting rod 53 is fixedly connected to the bottom end of the platform 4.

[0027] According to the above structure, when the platform 4 is driven to rise and fall, the base plate 52 is driven to rise and fall through the telescopic servo electric telescopic cylinder 51, and the platform 4 is driven to rise and fall through the transmission of the connecting rod 53.

[0028] like Figure 3 and 4As shown, the cooling component 6 includes a cylinder 61 fixedly connected to the bottom of the support platform 2. The cylinder 61 is correspondingly arranged with the bottom of the stepped hole 21. A connecting pipe 62 is fixedly connected to the side wall of the cylinder 61. A fan 63 is fixedly connected to the top of the stepped hole 21. An air collector shroud 64 is fixedly connected to the bottom of the fan 63. The bottom of the air collector shroud 64 is fixedly connected to the top of the connecting pipe 62. Through holes 65 are evenly distributed at the bottom of the side wall of the cylinder 61. A conical cylinder 66 is arranged in the middle of the side wall of the cylinder 61. An infrared temperature sensor 67 is fixedly installed inside the conical cylinder 66. A display 7 and a controller 8 are fixedly connected to one side of the support platform 2. The infrared temperature sensor 67 is electrically connected to the controller 8. The display 7, the servo electric telescopic cylinder 51, and the fan 63 are all electrically connected to an external power supply through the controller 8.

[0029] According to the above structure, after the chip has been heat-treated for a period of time, the drive component 5 drives the stage 4 to descend to the bottom of the cylinder 61. The infrared temperature sensor 67 can monitor the temperature of the chip and the surface of the stage 4 and transmit the detection signal to the controller 8. The controller 8 converts the electrical signal into a digital signal and displays it on the display 7. When the surface temperature of the chip and the stage 4 is too high, the controller 8 controls the servo electric telescopic cylinder 51 to stop extending and starts the fan 63. After the fan 63 starts, it delivers the outside air to the inside of the cylinder 61 along the connecting pipe 62 and discharges it through the through hole 65, taking away the heat from the chip and the stage 4. When the temperature of the chip and the stage 4 drops to room temperature, the controller 8 controls the servo electric telescopic cylinder 51 to extend again. After the chip is sent out from the inside of the cylinder 61, the chip can be taken out.

[0030] The working principle of this utility model is as follows: When heating the chip, the hot air blower 16 and the return air blower 17 are started. The hot air blower 16 delivers hot air to the inside of the heat insulation cover 13 through the air supply pipe 14 to heat the chip. The hot air inside the heat insulation cover 13 flows back to the inside of the outer shell 11 through the return pipe 15 and is discharged. The heat insulation cover 13 is pressed into the top of the stepped hole 21 by the nut on the screw 31. When disassembling, simply loosen the nut to remove the heat insulation cover 13 from the top of the support platform 2. When driving the platform 4 to rise and fall, the base plate 52 is raised and lowered by the telescopic servo electric telescopic cylinder 51. Through the transmission of the connecting rod 53, the platform 4 is raised and lowered. After the chip has been heat-treated for a period of time, the drive assembly 5 drives the platform 4 to rise and fall. As the chip descends to the bottom of the cylinder 61, the infrared temperature sensor 67 monitors the temperature of the chip and the surface of the stage 4 and transmits the detection signal to the controller 8. The controller 8 converts the electrical signal into a digital signal and displays it on the display 7. When the surface temperature of the chip and the stage 4 is too high, the controller 8 controls the servo electric telescopic cylinder 51 to stop extending and starts the fan 63. After the fan 63 starts, it delivers external air to the inside of the cylinder 61 along the connecting pipe 62 and discharges it through the through hole 65, carrying away the heat from the chip and the stage 4. When the temperature of the chip and the stage 4 drops to room temperature, the controller 8 controls the servo electric telescopic cylinder 51 to extend again. Once the chip is sent out from the inside of the cylinder 61, it can be retrieved.

[0031] The above description is merely a preferred embodiment of this utility model. It should be noted that those skilled in the art can make various improvements and modifications without departing from the principle of this utility model, and these improvements and modifications should also be considered within the scope of protection of this utility model. Structures, devices, and operating methods not specifically described or explained in this utility model, unless otherwise specified or limited, shall be implemented using conventional methods in the field.

Claims

1. A microelectronic component chip testing device, comprising a heating component (1) and a support stage (2), characterized in that: The support platform (2) is located on one side of the heating component (1). A connector (3) is provided at the top of the support platform (2). One end of the heating component (1) is fixedly connected to the top of the support platform (2) through the connector (3). A stepped hole (21) is provided in the middle of the top of the support platform (2). A platform (4) is slidably connected inside the stepped hole (21). A driving component (5) for driving the platform (4) to rise and fall is provided at the bottom of the support platform (2). A cooling component (6) for cooling the chip is provided in the middle of the bottom of the support platform (2). The cooling component (6) is provided corresponding to the bottom of the stepped hole (21).

2. The microelectronic component chip testing device according to claim 1, characterized in that: The heating assembly (1) includes a shell (11) and an air delivery cylinder (12). The bottom end of the air delivery cylinder (12) is fixedly connected to a heat insulation cover (13). The top end of the shell (11) is fixedly connected to an air supply pipe (14) and a return pipe (15). A partition (18) is fixedly connected inside the air delivery cylinder (12). The partition (18) divides the inside of the air delivery cylinder (12) into two chambers. Both chambers are connected to the heat insulation cover (13). One end of the air supply pipe (14) and one end of the return pipe (15) are respectively connected to the two chambers.

3. The microelectronic component chip testing device according to claim 2, characterized in that: The outer casing (11) is equipped with a hot air blower (16) and a return air blower (17), with one end of the hot air blower (16) and one end of the return air blower (17) respectively located at one end of the air supply pipe (14) and one end of the return pipe (15).

4. The microelectronic component chip testing device according to claim 3, characterized in that: The connector (3) includes four screws (31) arranged in a rectangular array. The bottom end of the screws (31) is fixedly connected to the top end of the support platform (2). The top of the heat insulation cover (13) is fixedly fitted with a collar (32). The screws (31) pass through the collar (32). The top of the screws (31) is threaded with a nut (33).

5. The microelectronic component chip testing device according to claim 4, characterized in that: The drive assembly (5) includes two symmetrically distributed servo electric telescopic cylinders (51). The top ends of the two servo electric telescopic cylinders (51) are fixedly connected to the bottom end of the support platform (2). A base plate (52) is fixedly connected between the bottom ends of the two servo electric telescopic cylinders (51). A connecting rod (53) is fixedly connected to the middle of the base plate (52). The top end of the connecting rod (53) is fixedly connected to the bottom end of the platform (4).

6. The microelectronic component chip testing device according to claim 5, characterized in that: The cooling component (6) includes a cylinder (61) fixedly connected to the bottom of the support platform (2). The cylinder (61) is correspondingly arranged with the bottom of the stepped hole (21). A connecting pipe (62) is fixedly connected to the side wall of the cylinder (61). A fan (63) is fixedly connected to the top of the stepped hole (21). A fan hood (64) is fixedly connected to the bottom of the fan (63). The bottom of the fan hood (64) is fixedly connected to the top of the connecting pipe (62). Through holes (65) are evenly distributed at the bottom of the side wall of the cylinder (61). A conical cylinder (66) is arranged in the middle of the side wall of the cylinder (61). An infrared temperature sensor (67) is fixedly installed inside the conical cylinder (66).

7. The microelectronic component chip testing device according to claim 6, characterized in that: A display (7) and a controller (8) are fixedly connected to one side of the support platform (2). The infrared temperature sensor (67) is electrically connected to the controller (8). The display (7), the servo electric telescopic cylinder (51), and the fan (63) are all electrically connected to an external power supply through the controller (8).

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