Test fixture and test system

Abstract

The utility model provides a test fixture and a test system, and relates to the technical field of test. The test fixture comprises a test platform, the test platform is provided with a test area, and the test area is communicated with a first surface and a second surface, which are arranged back to back, of the test platform; the test baffle plate is arranged on the operation side of the test platform, a preset included angle is formed between the test baffle plate and the first surface, and the test baffle plate is arranged corresponding to the test area.

Description

Technical Field

[0001] This application relates to the field of testing technology, and in particular to a test fixture and a test system. Background Technology

[0002] In the mass production testing of some functional modules of electronic devices (such as memory modules), frequent plugging and unplugging operations are essential. However, this process can easily cause the functional modules to come into contact with and collide with peripheral devices (such as CPU coolers, discrete graphics cards, etc.), which can lead to product defects. Utility Model Content

[0003] The purpose of this application is to provide a test fixture and a test system, mainly providing the following technical solutions:

[0004] The first aspect of this application provides a test fixture, which includes: a test platform, the test platform having a test area, the test area being connected to a first side and a second side disposed opposite to each other on the test platform;

[0005] A test baffle is provided on the operating side of the test platform and forms a preset angle with the first surface. The test baffle is provided in a manner corresponding to the test area.

[0006] In some modified embodiments of the first aspect of this application

[0007] The first plate is connected to the first side of the test platform;

[0008] The second plate is connected to the second side of the test platform;

[0009] The operating side of the test platform intersects with the first side and the second side;

[0010] The second side is the side of the test platform that is opposite to the first side in the first direction.

[0011] In some modified embodiments of the first aspect of this application, the first plate and the second plate are respectively connected to a support member, the support member and the second surface form a receiving space for partially accommodating the test motherboard, so that the memory slot of the test motherboard is located within the receiving space, and the test area is located above the memory slot.

[0012] In some modified embodiments of the first aspect of this application, the support member includes a first rod and a second rod, a first end of the first rod is fixedly connected to the corresponding first plate or second plate, and a second end of the first rod is movably connected to the second rod to change the length of the support member.

[0013] In some modified embodiments of the first aspect of this application

[0014] The test baffle is fixedly connected to the test platform and is perpendicular to the first surface; or...

[0015] The test baffle is connected to the operating side of the test platform via an adjustment component to adjust the angle between the test baffle and the first surface to a preset value.

[0016] In some modified embodiments of the first aspect of this application

[0017] The test baffle has a target area, and the target area is connected to the test area;

[0018] The test baffle forming the target area is provided with a first flexible layer;

[0019] The operating side and / or the second surface of the test platform are provided with a second flexible layer.

[0020] In some modified embodiments of the first aspect of this application

[0021] The test area has multiple indicator lights on its side in the first direction, each corresponding to one of the multiple memory slots on the test motherboard.

[0022] The indicator light is connected to the test motherboard signal.

[0023] In some modified embodiments of the first aspect of this application, the test platform is provided with a threading groove, which is located on the side of the test area opposite to the test baffle in a second direction, and the second direction is perpendicular to the first direction.

[0024] In some modified embodiments of the first aspect of this application

[0025] The test platform has a side plate on the side opposite to the test baffle in the second direction, and the side plate is located on the side of the second surface;

[0026] At least one hole is provided on the side plate.

[0027] A second aspect of this application provides a testing system, the testing system comprising: a test motherboard having memory slots;

[0028] A test fixture, corresponding to the test motherboard, is provided; the test fixture includes...

[0029] A test platform, wherein the test platform has a test area, the test area is set corresponding to the memory slot, and the test area is connected to a first side and a second side of the test platform that are set opposite to each other;

[0030] A test baffle is provided on the operating side of the test platform and forms a preset angle with the first surface. The test baffle is provided in a manner corresponding to the test area. Attached Figure Description

[0031] The above and other objects, features, and advantages of exemplary embodiments of this application will become readily understood by reading the following detailed description with reference to the accompanying drawings. In the drawings, several embodiments of this application are illustrated by way of example and not limitation, with the same or corresponding reference numerals denoteing the same or corresponding parts, wherein:

[0032] Figure 1 A schematic diagram of the structure of the test fixture provided in the embodiments of this application is shown.

[0033] Figure 2 A schematic top view of the test fixture provided in an embodiment of this application is shown.

[0034] Figure 3 A schematic diagram of the structure of the test system provided in an embodiment of this application is shown.

[0035] Description of Figure Numbers:

[0036] 1. Test platform; 101. Test area; 102. Cable tray; 1a. First side; 1b. Second side; 1c. First surface; 1d. Second surface; 2. Test baffle; 201. Target area; 3. First board; 4. Second board; 5. Support; 51. First rod; 52. Second rod; 6. Side plate; 601. First hole; 602. Second hole; 7. Test motherboard; 701. Memory slot; 8. Memory module; 9. Heatsink; 10. Indicator light; a. First direction; b. Second direction. Detailed Implementation

[0037] Exemplary embodiments of the present disclosure will now be described in more detail with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

[0038] It should be noted that, unless otherwise stated, the technical or scientific terms used in this application shall have the ordinary meaning as understood by one of ordinary skill in the art to which this application pertains.

[0039] Example 1

[0040] Reference Appendix Figure 1 -Attached Figure 3 Embodiment 1 of this application proposes a test fixture, which includes: a test platform 1 having a test area 101, the test area 101 being connected to a first surface 1c and a second surface 1d disposed opposite to each other on the test platform 1; and a test baffle 2 disposed on the operating side of the test platform 1 and forming a preset angle with the first surface 1c, the test baffle 2 being disposed corresponding to the test area 101.

[0041] Specifically, the test fixture provided in this embodiment can be applied to mass production testing of memory modules, namely, the insertion and removal test of the memory slot 701 and the test motherboard 7, but it is not limited to other insertion and removal test scenarios. The following examples all use the test fixture in insertion and removal testing, specifically the insertion and removal of the memory slot 701 and the test motherboard 7. There is stress between the memory module 8 and the memory slot 701 of the test motherboard 7. When removing the memory module 8, if the operator's technique or force is improper, the memory module 8 may be thrown obliquely, causing it to collide with other functional components on the test motherboard 7, thus leading to product defects.

[0042] To solve the above problems, the test fixture mainly consists of a test platform 1 and a test baffle 2. The test platform 1 can be configured as a rectangular plate structure, including a first side 1c and a second side 1d facing away from each other. The test platform 1 has a hollowed-out test area 101 that runs through the test platform 1, connecting the first side 1c and the second side 1d. The test area 101 can be used for the memory module 8 to pass through and be inserted into the memory slot 701 of the test motherboard 7. The test baffle 2 is located on the operating side of the test platform 1, which refers to the side where the operator inserts the memory module 8 into the test motherboard 7. The test baffle 2 can be, but is not limited to, a rectangular plate, and its orientation is the same as that of the first side 1c. With a preset angle and positioned corresponding to the test area 101 on the test platform 1, the test baffle 2 forms a certain height of shield on the operating side of the test platform 1, and isolates other functional components on the test motherboard 7. When the operator is conducting tests, especially when removing the memory stick 8 from the memory slot 701 of the test motherboard 7, even if improper handling or force occurs, the test baffle 2 can still provide shielding and isolation, preventing the operator's hand or the memory stick 8 in hand from contacting or colliding with the surrounding functional components on the test motherboard 7, such as the CPU (Central Processing Unit) heatsink 9, discrete graphics card, etc., thereby avoiding risks such as reduced product yield and reduced reliability.

[0043] Further, see attached document. Figure 1In specific implementation, the test fixture proposed in the embodiments of this application further includes: a first plate 3, connected to the first side 1a of the test platform 1; and a second plate 4, connected to the second side 1b of the test platform 1; the operating side of the test platform 1 intersects with the first side 1a and the second side 1b; wherein, the second side 1b is the side of the test platform 1 opposite to the first side 1a in the first direction a.

[0044] Specifically, to improve the practicality and applicability of the testing fixture, the technical solution adopted in this application allows for the provision of a first plate 3 and a second plate 4 on the first side 1a and the second side 1b of the testing platform 1, respectively. Here, the first side 1a and the second side 1b refer to opposite sides on the testing platform 1 along the first direction a. The first direction a may refer to, but is not limited to, the length direction of the testing platform 1, i.e., the left-right direction of the tester during testing. The second direction b of the testing platform 1 intersects with the first side 1a and the second side 1b, i.e., the second direction b intersects with the first direction a. Furthermore, the first direction a and the second direction b are perpendicular to the first surface 1c and the second surface 1d, respectively. The second direction b can be used for testing... The operating side of the test platform 1, which is faced by the personnel, is located in the second direction b. The dimensions of the first plate 3 and the second plate 4 in the second direction b can be set to be equal to the dimensions of the test platform 1 in that direction. By setting the first plate 3 and the second plate 4, the dimensions of the test platform 1 in the first direction a can be increased, thereby accommodating a larger test motherboard 7. The first plate 3 or the second plate 4 can be connected to the test platform 1, or the first plate 3 and the second plate 4 can be connected to the test platform in a detachable manner, allowing for a wider range and more flexible adjustment of the dimensions of the test fixture in the first direction a to accommodate a larger test motherboard 7.

[0045] The first plate 3 and the second plate 4 can be fixedly connected to the test platform 1, or, to improve adaptability, the first plate 3 and the second plate 4 can be movably connected to the test platform 1 respectively. The movable connection can be, but is not limited to, a detachable connection, a plug-in connection, a sliding connection, a pull-out connection, etc., so that the first plate 3 and the second plate 4 can reciprocate relative to the test platform 1 along the first direction a, so as to adjust the size of the test fixture in the first direction a to better fit the test motherboard 7. For example, it can be adjusted to fit the size of the test motherboard 7 of the corresponding specification in the first direction a, but it is not limited to this.

[0046] Further, see attached document. Figure 1 and attached Figure 3In a specific implementation, the first plate 3 and the second plate 4 are respectively connected to the support member 5. The support member 5 and the second surface 1d form a receiving space for partially accommodating the test motherboard 7, so that the memory slot 701 of the test motherboard 7 is located in the receiving space, and the test area 101 is located above the memory slot 701.

[0047] Specifically, in order to form a space to accommodate the test motherboard 7, in the technical solution adopted in this application, the first board 3 and the second board 4 are respectively connected to the surface on the same side as the second surface 1d of the test platform 1 with support members 5. The support members 5 can support the first board 3, the second board 4 and the test platform 1 to a certain height, and enclose the second surface 1d to form an accommodating space. The accommodating space can be used to accommodate the test motherboard 7, or a laptop computer or other test subject used for plug-in testing, etc. Taking the accommodating motherboard 7 as an example, the formation of the accommodating space can ensure that at least the area where the memory slot 701 is located on the test motherboard 7 is located within the accommodating space. After the test motherboard 7 is fixed, the position of the memory slot 701 corresponds to the position of the test area 101 of the test platform 1, that is, the test area 101 is located above the memory slot 701, so as to facilitate the plug-in and plug-out operation of the memory stick 8.

[0048] Further, see attached document. Figure 1 In a specific implementation, the support member 5 includes a first rod 51 and a second rod 52. The first end of the first rod 51 is fixedly connected to the corresponding first plate 3 or second plate 4, and the second end of the first rod 51 is movably connected to the second rod 52 to change the length of the support member 5.

[0049] Specifically, to meet testing requirements under different conditions, the technical solution adopted in this application allows the support member 5 to be configured as a height-adjustable rod-shaped structure, specifically including: a first rod 51 and a second rod 52. The first end of the first rod 51 is fixedly connected to the second surface 1d of its corresponding first plate 3 or second plate 4. The end of the first rod 51 opposite to its first end is movably connected to the second rod 52. The bottom end of the second rod 52 is fixed to the bearing surface. Through the relative movement of the first rod 51 and the second rod 52, the length of the support member 5 can be changed, thereby adjusting the height of the test platform 1 to adapt to the height of the portion of the test motherboard 7 located within the accommodating space or other testing conditions. This facilitates improved positioning of the test motherboard 7 and enables precise alignment of the test area with the memory slot 701 of the test motherboard 7. The movable connection between the first rod 51 and the second rod 52 can be, but is not limited to, a detachable connection, a sliding connection, or any other connection method that allows relative movement between the two. For example, the second rod 52 can be configured as a sleeve structure with an inner cavity. The cross-sectional shape and size of the first rod 51 are adapted to the inner cavity of the second rod 52. The second end of the first rod 51 extends into the inner cavity of the second rod 52 and can reciprocate. The position of the first rod 51 can also be fixed by connecting a locking screw or similar structure to the side of the second rod 52, but this is not limited to these methods.

[0050] Further, see attached document. Figure 1 In specific implementation, the test baffle 2 can be fixedly connected to the test platform 1, and the fixed state of the test baffle 2 on the test platform 1 is to satisfy the perpendicular condition with the first surface 1c. However, the fixed connection here is not limited to integral molding or connection by locking parts, etc., which can improve the reliability and stability of the connection between the test baffle 2 and the test platform 1 while realizing the effective isolation and shielding function of the test baffle 2.

[0051] Further, see attached document. Figure 1 In specific implementation, the test baffle 2 and the test platform 1 can also adopt an adjustable connection method. Specifically, the bottom of the test baffle 2 is connected to the operating side of the test platform 1 through an adjustment component, which is used to adjust the test baffle 2 and the first surface 1c to form a preset angle. The adjustment component can, but is not limited to, realize the rotational connection between the test baffle 2 and the test platform 1, and can fix the angle of the test baffle 2 after adjusting to the preset angle. The size of the preset angle can be 100 degrees, 120 degrees, etc., and can be set according to the arrangement of other functional components on the test motherboard 7 outside the accommodating space. No specific restrictions are made here. By adjusting the angle of the test baffle 2, for example, setting the preset angle to 120 degrees, a larger operating space can be provided for the operating side of the test platform 1, which is convenient for the operator to carry out the test process, and can further avoid collisions with the test baffle 2 during the test.

[0052] The adjustment component may include a rotation mechanism connected between the test baffle 2 and the test platform 1. The angle between the test baffle 2 and the first surface 1c is changed by rotating the test baffle 2 relative to the test platform 2. Screws or other locking components may be provided to the rotation mechanism, or the relative position of the test baffle 2 and the test platform 1 after rotating to a preset angle may be maintained by damping force.

[0053] Specifically, in the case where the test baffle 2 is fixedly connected to the test platform 1 or is adjustable, the technical solution adopted in this application can set a target area 201 on the test baffle 2. The target area 201 is located at the bottom of the test baffle 2, that is, on the side close to the test platform 1. The target area 201 is set as a hollow area and is connected to the test area 101. This can provide operators with a larger margin of error. Even if there is a certain degree of improper handling or force, it is not easy to collide with the test baffle 2, which is beneficial to the protection of the memory module 8. In order to further improve the protective function of the test fixture, a first flexible layer can be set in the part of the test baffle 2 that forms the target area 201. The target area 201 is an area that is prone to collision during the test. The setting of the first flexible layer can mitigate the impact when the operator or the memory module 8 held by the operator collides with the target area 201, reducing the damage to the operator or the memory module 8.

[0054] Further, see attached document. Figure 1 In order to improve the protective function of the test fixture, in specific implementation, a second flexible layer can be provided on the operating side or the second surface 1d of the test platform 1, or on the operating side and the second surface 1d of the test platform 1 respectively. The second flexible layer shell is attached to the corresponding surface of the test platform 1, and can play a good protective role during the operation of the operator inserting and removing the memory module 8.

[0055] The first and second flexible layers cover the corresponding surfaces and edges, and can be made of soft rubber strips or protective cotton materials, but are not limited to these. The first and second flexible layers can be made of the same material to simplify the manufacturing process and reduce costs, or they can be made of different materials, which can be set according to the protection needs of different locations to improve the protection effect.

[0056] Further, see attached document. Figure 2 In a specific implementation, the test area 101 is provided with multiple indicator lights 10 on the side of the first direction a, which correspond one-to-one with the multiple memory slots 701 of the test motherboard 7; the indicator lights 10 are connected to the test motherboard 7 via signals.

[0057] Specifically, to facilitate the differentiation between good and defective products during testing, the technical solution adopted in this application includes setting multiple indicator lights 10 on the first surface 1c of the testing platform 1. The positions of the multiple indicator lights 10 correspond to the testing area 101 and are one-to-one with the positions of the multiple memory slots 701 on the testing motherboard 7. The indicator lights 10 are signal-connected to the testing motherboard 7, enabling the testing motherboard 7 to control the on / off state and / or the color of the indicator lights 10, so that the operator can easily obtain the test results of the memory module 8 by observing the status of the indicator lights 10. For example, the testing motherboard 7 can control the indicator lights 10 to display two colors, namely green and yellow. When the indicator lights 10 are green, it means that the memory module 8 is in normal working condition. The indicator light 10 turns yellow when the memory module 8 fails the test. The initial color of indicator light 10 can be set to green. Through communication between indicator light 10 and the test motherboard 7, if a memory module 8 inserted into a memory slot 701 fails the test, indicator light 10 for that memory slot 701 will switch from green to yellow. This serves as a error prevention measure during mass production of memory modules, allowing operators to clearly distinguish between good and bad products. Alternatively, indicator light 10 can be set to an initial dark state. After the memory module 8 is inserted into the memory slot 701, the test motherboard 7 controls indicator light 10 to turn on, and the indicator light 10 displays the corresponding color based on the test results.

[0058] Further, see attached document. Figure 1 and attached Figure 3 In a specific implementation, the test platform 1 is provided with a wire-threading groove 102, which is located on the side of the test area 101 opposite to the test b in the second direction b, and the second direction b is perpendicular to the first direction a.

[0059] Specifically, in order to facilitate the arrangement of the test motherboard 7, the technical solution adopted in this application also provides a wire-passing groove 102 on the test platform 1, which connects the first surface 1c and the second surface 1d of the test platform 1. The wire-passing groove 102 is located on the side of the test area 101 opposite to the test b in the second direction, and can be set near the edge. The wire-passing groove 102 can be set as a long strip-shaped groove extending along the second direction b, which can be used to pass through the wires connected to the test platform 1, making it convenient for wire management.

[0060] Further, see attached document. Figure 1 and attached Figure 3 In a specific implementation, the test platform 1 has a side plate 6 on the side opposite to the test b in the second direction b, and the side plate 6 is located on the side of the second surface 1d; the side plate 6 has at least one hole.

[0061] Specifically, to facilitate the arrangement of the test motherboard 7, the technical solution adopted in this application can also provide a side plate 6 on the side of the test platform 1. The side plate 6 is fixed to the side of the test platform 1 opposite to the test b in the second direction, and the side plate 6 has at least one hole. Taking two holes on the side plate 6, namely the first hole 601 and the second hole 602, as an example, the first hole 601 and the second hole 602 can be arranged at intervals along the first direction a, and can respectively correspond to the USB interface and the power button of the test motherboard 7. The two holes can have different shapes and sizes based on different functions. In addition, the test platform 1 can also be provided with side plates 6 connecting the first board 3 and the second board 4 on both sides in the first direction a, which can make the accommodation space more enclosed and improve the protection of the test motherboard 7.

[0062] Example 2

[0063] Reference Attachment Figure 1 -Attached Figure 3 Embodiment 2 of this application proposes a testing system, which includes: a test motherboard 7 having a memory slot 701; a testing fixture corresponding to the test motherboard 7, the testing fixture including: a test platform 1 having a test area 101 corresponding to the memory slot 701, the test area 101 being connected to a first surface 1c and a second surface 1d opposite to the test platform 1; and a test baffle 2, the test baffle 2 being disposed on the operating side of the test platform 1 and forming a preset angle with the first surface 1c, the test baffle 2 being corresponding to the test area 101.

[0064] Specifically, the testing system provided in this embodiment can be applied to, but is not limited to, mass production testing of memory modules, i.e., insertion and removal testing of memory slots 701 and test motherboard 7, but is not limited to other insertion and removal testing scenarios. The testing system includes: test motherboard 7 and the aforementioned test fixture. The test motherboard 7 has memory slots 701, and the number of memory slots 701 can be multiple, with the multiple memory slots 701 arranged along the first direction a. The test area 101 on the test platform 1 of the test fixture can be used for the memory module 8 to pass through and be inserted into the memory slot 701 of the test motherboard 7. The test baffle 2 is set on the operating side of the test platform 1, and its arrangement direction forms a preset angle with the first surface 1c. The arrangement position corresponds to the position of the test area 101 on the test platform 1. The test baffle 2 can form a shield with a certain height on the operating side of the test platform 1. When the operator performs the test, especially when removing the memory module 8 from the memory slot 701 of the test motherboard 7, even if there is improper handling or force, the test baffle 2 can still play a shielding role and isolate other functional components on the test motherboard 7. It can prevent the operator's hand or the memory module 8 held in hand from contacting or colliding with the heatsink 9 of the central processing unit (CPU) and / or the discrete graphics card and other functional components on the test motherboard 7, thereby avoiding risks such as reduced product yield and reduced reliability.

[0065] It should be noted that in the description of this specification, the terms "upper," "lower," etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application; the terms "connection," "installation," "fixing," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection or an indirect connection through an intermediate medium. For those skilled in the art, the specific meaning of the above terms in this application can be understood according to the specific circumstances.

[0066] In the description of this specification, the terms "one embodiment," "some embodiments," "specific embodiment," etc., refer to a specific feature, structure, material, or characteristic described in connection with that embodiment or example, which is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0067] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A test fixture, characterized in that, include: A test platform having a test area connected to a first and a second side of the test platform that are disposed opposite to each other. A test baffle is provided on the operating side of the test platform and forms a preset angle with the first surface. The test baffle is provided in a manner corresponding to the test area.

2. The test fixture according to claim 1, characterized in that, Also includes: The first plate is connected to the first side of the test platform; The second plate is connected to the second side of the test platform; The operating side of the test platform intersects with the first side and the second side; The second side is the side of the test platform that is opposite to the first side in the first direction.

3. The test fixture according to claim 2, characterized in that, The first plate and the second plate are respectively connected to the support member. The support member and the second surface form a receiving space for partially accommodating the test motherboard, so that the memory slot of the test motherboard is located within the receiving space, and the test area is located above the memory slot.

4. The test fixture according to claim 3, characterized in that, The support includes a first rod and a second rod. The first end of the first rod is fixedly connected to the corresponding first plate or second plate, and the second end of the first rod is movably connected to the second rod to change the length of the support.

5. The test fixture according to claim 3, characterized in that, The test baffle is fixedly connected to the test platform and is perpendicular to the first surface; or... The test baffle is connected to the operating side of the test platform via an adjustment component to adjust the angle between the test baffle and the first surface to a preset value.

6. The test fixture according to claim 1, characterized in that, The test baffle has a target area, and the target area is connected to the test area; The test baffle forming the target area is provided with a first flexible layer; The operating side and / or the second surface of the test platform are provided with a second flexible layer.

7. The test fixture according to claim 3, characterized in that, The test area has multiple indicator lights on its side in the first direction, each corresponding to one of the multiple memory slots on the test motherboard. The indicator light is connected to the test motherboard signal.

8. The test fixture according to claim 2 or 7, characterized in that, The test platform is provided with a threading groove, which is located on the side of the test area opposite to the test baffle in a second direction, and the second direction is perpendicular to the first direction.

9. The test fixture according to claim 8, characterized in that, The test platform has a side plate on the side opposite to the test baffle in the second direction, and the side plate is located on the side of the second surface; At least one hole is provided on the side plate.

10. A testing system, characterized in that, include: Test motherboard, the test motherboard having memory slots; A test fixture, corresponding to the test motherboard, is provided; the test fixture includes... A test platform, wherein the test platform has a test area, the test area is set corresponding to the memory slot, and the test area is connected to a first side and a second side of the test platform that are set opposite to each other; A test baffle is provided on the operating side of the test platform and forms a preset angle with the first surface. The test baffle is provided in a manner corresponding to the test area.

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