Sound box rear cover module and sound box

Abstract

The utility model provides a sound box rear cover module and a sound box. The sound box rear cover module comprises a cover plate, a circuit board assembly and a first sealing cover. According to the loudspeaker box rear cover module, the circuit board assembly with the mainboard and the first electric connector is integrated on the cover plate. The first electric connector is arranged corresponding to the first opening of the cover plate. A first electric connector is arranged in a first containing cavity defined by a first sealing cover, a cover plate and a first surface of a main board, and sealing layers are arranged between the first sealing cover and the inner side face of the cover plate and between the first sealing cover and the first surface respectively. When the sound box rear cover module is applied to the sound box, the sound of the loudspeaker can be prevented from leaking from the first opening through the first accommodating cavity, the power loss of the sound box is reduced, and the sound quality of the sound box is improved. The first sealing cover is combined with the sealing layer, so that external water can be prevented from entering the sound box through the first opening, and a waterproof effect is achieved.

Description

Technical Field

[0001] This application belongs to the field of speaker structure technology, and in particular relates to a speaker back cover module and a speaker. Background Technology

[0002] A speaker is a device that converts audio signals into sound. Current portable speakers are small, easy to use, and convenient to carry, making them very popular with consumers. How to provide a speaker back cover module that integrates the main board and electrical connectors into the cover to prevent sound leakage is a challenge the industry needs to address. Utility Model Content

[0003] The purpose of this application is to provide a speaker back cover module and a speaker that can integrate the motherboard and electrical connectors into the cover to prevent sound leakage.

[0004] This application provides a speaker back cover module, including: a cover plate, a circuit board assembly, and a first sealing cover; the circuit board assembly includes a main board and a first electrical connector, the main board is disposed on the inner side of the cover plate, the first electrical connector is disposed on the first surface of the main board, and the cover plate has a first opening corresponding to the first electrical connector; the cover plate is provided with a first sealing cover, and a sealing layer is provided between the first sealing cover and the inner side of the cover plate, and between the first sealing cover and the first surface, the first sealing cover, the cover plate, and the first surface together form a first receiving cavity, the first receiving cavity is in communication with the first opening, and the first electrical connector is located in the first receiving cavity.

[0005] In one alternative implementation, the motherboard and the cover plate are arranged perpendicularly.

[0006] In one alternative implementation, the inner side of the cover plate has a positioning groove, and one edge of the main board is inserted into the positioning groove;

[0007] In one alternative implementation, the inner side of the cover plate is provided with fasteners for fixing the motherboard to the cover plate.

[0008] In one alternative implementation, the inner side of the cover plate has a battery slot, a battery is disposed in the battery slot, the battery is electrically connected to the motherboard, and the first sealing cover and the battery are disposed opposite to each other so that the battery is confined in the battery slot.

[0009] In one alternative implementation, the circuit board assembly further includes a second electrical connector disposed on a second surface of the motherboard, with the first surface and the second surface facing away from each other. The cover plate has a second opening corresponding to the second electrical connector. The cover plate is provided with a second sealing cover, and sealing layers are provided between the second sealing cover and the inner side of the cover plate, and between the second sealing cover and the second surface. The second sealing cover, the cover plate, and the second surface together form a second receiving cavity, which communicates with the second opening. The second electrical connector is located within the second receiving cavity.

[0010] In one alternative implementation, the first sealing cover is fixed to the cover plate by fasteners, and the second sealing cover is fixed to the main board and the first sealing cover by fasteners.

[0011] In one alternative implementation, the inner side of the cover plate has a limiting groove, and a portion of the edge of the first sealing cover and a portion of the edge of the second sealing cover are inserted into the limiting groove.

[0012] In one alternative implementation, the edge of the first sealing cap connected to the first surface has a first filling groove, and the edge of the second sealing cap connected to the second surface has a second filling groove.

[0013] In one alternative implementation, a plug is further included, which is detachably installed in a slot in the cover plate; when the plug is installed in the slot, the plug can cover the first opening and the second opening.

[0014] In one alternative implementation, the end of the motherboard is provided with a light-emitting circuit board, which is perpendicular to the motherboard and electrically connected to it. The light-emitting circuit board has LED beads.

[0015] This application provides a speaker, including a housing, a speaker, and the aforementioned speaker rear cover module, wherein the speaker is disposed in the housing and the speaker rear cover module is disposed in the housing.

[0016] The beneficial effects of the speaker back cover module and speaker provided in this application embodiment are as follows: The speaker back cover module integrates a circuit board assembly with a main board and a first electrical connector onto a cover plate. The first electrical connector is positioned corresponding to the first opening of the cover plate. The first electrical connector is disposed in a first receiving cavity formed by the first sealing cover, the cover plate, and the first surface of the main board. Sealing layers are respectively provided between the inner sides of the first sealing cover and the cover plate, and between the first sealing cover and the first surface. When the speaker back cover module is applied to a speaker, it can prevent the sound from the speaker from leaking through the first receiving cavity from the first opening, reducing the power loss of the speaker and improving the sound quality of the speaker. The combination of the first sealing cover and the sealing layer can also prevent external water from entering the speaker through the first opening, thus providing a waterproof function. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 A three-dimensional assembly drawing of the speaker provided in the embodiments of this application;

[0019] Figure 2 for Figure 1 A three-dimensional assembly diagram of the speaker from another perspective;

[0020] Figure 3 for Figure 1 An exploded view of the speaker;

[0021] Figure 4 for Figure 3 A three-dimensional structural diagram of the main body of the speaker from another perspective;

[0022] Figure 5 for Figure 3 A schematic diagram of the button circuit board in a speaker;

[0023] Figure 6 for Figure 3 An exploded 3D view of the speaker's rear cover module;

[0024] Figure 7 for Figure 6 Another perspective of the exploded 3D view of the speaker back cover module;

[0025] Figure 8 for Figure 7 A partial structural assembly diagram of the speaker's rear cover module;

[0026] Figure 9 for Figure 1A cross-sectional view of the speaker along line AA. Detailed Implementation

[0027] In order to make the technical problems, technical solutions and beneficial effects to be solved by this application more clearly understood, this application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this application and are not intended to limit this application.

[0028] In the description of the embodiments of this application, it should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.

[0029] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. Throughout the description of this application, "plurality" means two or more, unless otherwise specifically defined.

[0030] In the embodiments of this application, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in the embodiments of this application can be understood according to the specific circumstances.

[0031] Please see Figures 1 to 3 This application provides a speaker 100, including a housing 10, a speaker 30, and a speaker rear cover module 100a. The speaker 30 is disposed in the housing 10, and the speaker rear cover module 100a is disposed in the housing 10. The housing 10 serves as a mounting carrier for components such as the speaker 30 and the speaker rear cover module 100a.

[0032] In some embodiments, see Figures 1 to 4The housing 10 can be a one-piece molded structure, with a simple structure. The housing 10 has an inner cavity 11, a first wall 12, and a second wall 13. The first wall 12 has a first mounting opening 121, and the second wall 13 has a second mounting opening 131. The speaker 30 is embedded in the first mounting opening 121 and located within the inner cavity 11. The grille 20 is assembled on the first wall 12 and covers the sound-emitting side of the speaker 30. The circuit board assembly 50 is disposed on the cover plate 40 and located within the inner cavity 11. The cover plate 40 is assembled on the second wall 13 and covers the second mounting opening 131. Different components of the speaker 100 can be easily assembled onto the housing 10, resulting in high assembly efficiency and low cost.

[0033] In some embodiments, see Figure 4 The inner wall of the shell 10 has reinforcing ribs 141. This makes the wall of the shell 10 thinner, the structure stronger, and improves the structural strength and stability of the shell 10.

[0034] In some embodiments, see Figures 1 to 3 The grille 20 can be assembled to the housing 10 using fasteners 20a, and the cover 40 can be assembled to the housing 10 using fasteners 40a. Using fasteners facilitates the assembly of the grille 20 to the first wall surface 12 and the cover 40 to the second wall surface 13. The fasteners can be screws. When assembling the speaker 100 as a whole, fewer screws can be used to achieve overall assembly, resulting in high assembly efficiency.

[0035] In some embodiments, see Figures 1 to 3 The housing 10 has a third mounting port 15 at each end, and a passive radiator 31 is provided at each of the third mounting ports 15. The housing 10 also has end caps 32 at each end, which limit the range of motion of the passive radiator 31 and have sound outlets 321 for sound output from the passive radiator 31. The passive radiator 31 enhances bass response and improves sound quality. The end caps 32 can be assembled to the housing 10 using snap-fit ​​or tight-fitting methods. Foot pads 33 can be provided at the bottom of the end caps 32 to ensure the speaker 100 is stably placed on a support surface such as a table.

[0036] In some embodiments, see Figure 3 The mesh cover 20 is made of metal, such as aluminum or copper. The mesh cover 20 has multiple mesh openings 21, which are triangular, circular, or rectangular in shape. The mesh cover 20 also has ribs 22. These ribs 22 enhance the structural strength of the mesh cover 20, making it structurally robust and contributing to its aesthetic appeal.

[0037] In some embodiments, the area between the two speakers 30 on the first wall 12 may be provided with a surface layer 122, so that the surface layer 122 and the speakers 30 are both black, which has a better appearance.

[0038] In some embodiments, see Figure 3 , Figure 4 The inner side edge of the cover plate 40 is provided with an annular boss 41, and the second wall surface 13 is provided with an annular groove 132. The annular groove 132 is provided with a sealing layer. The annular boss 41 is provided in the annular groove 132, so that the sealing layer surrounds the annular boss 41 and the wall surface of the annular groove 132, thereby achieving a reliable seal between the cover plate 40 and the second mounting port 131 of the second wall surface 13.

[0039] In some embodiments, see Figure 3 , Figure 5 The housing 10 is provided with a button circuit board 60, which has a button switch 61 and an LED bead 62. The button circuit board 60 is provided with a light-shielding ring 63, which is sleeved on the LED bead 62. The button circuit board 60 is covered with a flexible light-transmitting plate 64, which has a pressing position 641 corresponding to the button switch 61.

[0040] Users can control the speaker 100 by pressing the pressing position 641 on the flexible light-transmitting plate 64 to activate the button switch 61 on the button circuit board 60, such as turning it on / off, adjusting the volume, and switching between play / pause. The pressing position 641 of the flexible light-transmitting plate 64 can be textured or marked to indicate to the user.

[0041] The LED chip 62 is encased in a light-shielding ring 63. The light emitted by the LED chip 62 propagates through the inner hole of the light-shielding ring 63, concentrating the light outward. The LED chip 62 can be a light-emitting diode (LED). The light-shielding ring 63 can be made of materials such as ethylene vinyl acetate (EVA) copolymer. The flexible light-transmitting plate 64 can be made of materials such as silicone.

[0042] In some embodiments, see Figures 3 to 5 The button circuit board 60 is disposed on the outer wall surface of the housing 10. The button circuit board 60 has a connector 65, which passes through the wall through hole 16 of the housing 10. A sealing layer 60a is provided between the button circuit board 60 and the outer wall surface of the housing 10. The sealing layer 60a extends along the edge of the through hole 16 and can achieve the sealing between the button circuit board 60 and the wall surface of the housing 10.

[0043] Please see Figures 6 to 9 This application provides a speaker back cover module 100a, including: a cover plate 40, a circuit board assembly 50, and a first sealing cover 70; the circuit board assembly 50 includes a main board 51 and a first electrical connector 52, the main board 51 is disposed on the inner side of the cover plate 40, the first electrical connector 52 is disposed on the first surface 51a of the main board 51, and the cover plate 40 has a first opening 42 corresponding to the first electrical connector 52; the cover plate 40 is provided with the first sealing cover 70, combined with... Figure 9 A sealing layer 70a is provided between the inner sides of the first sealing cover 70 and the cover plate 40, and between the first sealing cover 70 and the first surface 51a. The first sealing cover 70, the cover plate 40 and the first surface 51a together form a first receiving cavity 71. The first receiving cavity 71 is connected to the first opening 42. The first electrical connector 52 is located inside the first receiving cavity 71.

[0044] The first electrical connector 52 is used to connect to a matching device. For example, the first electrical connector 52 can be a USB Type-C interface, and the matching device is a data cable. Connecting the data cable to the first electrical connector 52 enables data transmission between the external device and the speaker 100, allowing external power to charge the internal battery 50a of the speaker 100. The first electrical connector 52 can also be a card slot or other data interface, etc.

[0045] Resistors, capacitors, chips, and other components can be installed on the motherboard 51. The inner and outer sides of the cover plate 40 face away from each other. When the cover plate 40 is assembled into the housing 10 of the speaker 100, the inner side of the cover plate 40 is the side that cannot be seen by the user. The sealing layer 70a can be made of materials such as EVA copolymer, which is easy to mold and has a good sealing effect.

[0046] The speaker rear cover module 100a provided in this application embodiment integrates a circuit board assembly 50 having a main board 51 and a first electrical connector 52 onto a cover plate 40. The first electrical connector 52 is disposed corresponding to the first opening 42 of the cover plate 40, and a device mated with the first electrical connector 52 can connect to the first electrical connector 52 through the first opening 42. The first electrical connector 52 is disposed in a first receiving cavity 71 formed by the first sealing cover 70, the cover plate 40, and the first surface 51a of the main board 51. Sealing layers 70a are respectively provided between the inner surfaces of the first sealing cover 70 and the cover plate 40, and between the first sealing cover 70 and the first surface 51a. When the speaker rear cover module 100a is applied to the speaker 100, it can prevent the sound of the speaker 30 from leaking through the first receiving cavity 71 from the first opening 42, reduce the power loss of the speaker 100, and improve the sound quality of the speaker 100. The combination of the first sealing cover 70 and the sealing layer 70a can also prevent external water from entering the speaker 100 through the first opening 42, thus playing a waterproof role.

[0047] In some embodiments, see Figure 8 , Figure 9 The motherboard 51 and the cover plate 40 are arranged perpendicularly. The inner side space of the cover plate 40 is fully utilized to arrange components on the motherboard 51, and other components (such as battery 50a) are arranged on the inner side of the cover plate 40. When the motherboard 51 is mounted on the cover plate 40, the electrical connectors on the motherboard 51 are arranged to correspond to the openings of the cover plate 40.

[0048] In some embodiments, see Figure 7 The inner side of the cover plate 40 has a positioning groove 43, and one edge of the motherboard 51 is inserted into the positioning groove 43. This facilitates the positioning and assembly of the motherboard 51 on the cover plate 40, keeps the motherboard 51 in the predetermined position, and improves assembly efficiency.

[0049] In some embodiments, see Figure 8 The inner side of the cover plate 40 is provided with fasteners 51c for fixing the motherboard 51 to the cover plate 40. The use of fasteners 51c can reliably fix the motherboard 51 to the cover plate 40 and facilitates assembly.

[0050] For example, fastener 51c may include a screw and a washer, with the screw threaded onto cover 40 after passing through the washer. The washer abuts against mainboard 51, securing mainboard 51 to cover 40.

[0051] In some embodiments, see Figures 7 to 9 The inner side of the cover plate 40 has a battery slot 46, in which a battery 50a is disposed. The battery 50a is electrically connected to the main board 51. The first sealing cover 70 is disposed opposite to the battery 50a so that the battery 50a is confined in the battery slot 46. Placing the battery 50a in the battery slot 46 and confining it to the inner side of the cover plate 40 by the first sealing cover 70 makes the battery 50a easy to assemble and improves assembly efficiency.

[0052] In some embodiments, see Figures 7 to 9 The circuit board assembly 50 also includes a second electrical connector 53, which is disposed on the second surface 51b of the main board 51. The first surface 51a and the second surface 51b are opposite to each other. The cover plate 40 has a second opening 44 corresponding to the second electrical connector 53. The cover plate 40 is provided with a second sealing cover 80. A sealing layer 80a is provided between the inner side of the second sealing cover 80 and the cover plate 40, and between the second sealing cover 80 and the second surface 51b. The second sealing cover 80, the cover plate 40 and the second surface 51b together form a second receiving cavity 81. The second receiving cavity 81 is connected to the second opening 44. The second electrical connector 53 is located in the second receiving cavity 81.

[0053] The second electrical connector 53 is used to connect to a compatible device. For example, the second electrical connector 53 can be a trans-flash (TF) card slot, and the compatible device is a TF card. When a TF card is inserted into the second electrical connector 53, the speaker 100 can read the data on the TF card to play audio. The second electrical connector 53 can also be other data interfaces.

[0054] The first electrical connector 52 and the second electrical connector 53 are arranged on different surfaces of the main board 51, with a compact structure, which facilitates the assembly of the first sealing cover 70 and the second sealing cover 80 on the inner side of the cover plate 40.

[0055] The second electrical connector 53 is disposed in the second receiving cavity 81 formed by the second sealing cover 80, the cover plate 40, and the second surface 51b. Sealing layers 80a are respectively provided between the inner surfaces of the second sealing cover 80 and the cover plate 40, and between the second sealing cover 80 and the second surface 51b. The rear part of the speaker 30 is located within the inner cavity 11 of the housing 10. The air inside the inner cavity 11 is isolated from the external space, preventing air from flowing outwards and preventing sound leakage through the second receiving cavity 81 and the second opening 44, thereby reducing the power loss of the speaker 100 and improving the sound quality of the speaker 100. The combination of the second sealing cover 80 and the sealing layer 80a also prevents external water from entering the inner cavity 11 through the second opening 44, thus providing a waterproof function.

[0056] The aforementioned sealing layer 80a can be made of materials such as EVA copolymer, which is easy to mold and has a good sealing effect.

[0057] In some embodiments, see Figure 3 , Figure 6 , Figure 7 The first sealing cover 70 is fixed to the cover plate 40 by fasteners, and the second sealing cover 80 is fixed to the main board 51 and the first sealing cover 70 by fasteners. Fasteners are used to assemble the first sealing cover 70 and the second sealing cover 80 onto the cover plate 40, thus securing the main board 51, the first sealing cover 70, the second sealing cover 80, and the cover plate 40 together. The fasteners can be screws.

[0058] For example, the first sealing cover 70 and the cover plate 40 can be fixedly connected by two screws. The second sealing cover 80 and the first sealing cover 70 are fixedly connected by two screws, which pass through the main board 51, so that both the main board 51 and the second sealing cover 80 are fixed to the first sealing cover 70.

[0059] In some embodiments, see Figures 7 to 9 The inner surface of the cover plate 40 has a limiting groove 45, and a portion of the edge of the first sealing cover 70 and a portion of the edge of the second sealing cover 80 are inserted into the limiting groove 45. This allows the first sealing cover 70 and the second sealing cover 80 to be positioned on the cover plate 40 along its surface. It also facilitates the installation of a sealing layer within the limiting groove 45, achieving a tight connection between the first sealing cover 70 and the cover plate 40, and between the second sealing cover 80 and the cover plate 40.

[0060] In some embodiments, see Figures 6 to 9The edge of the first sealing cover 70, which is connected to the first surface 51a, has a first filling groove 72, and the edge of the second sealing cover 80, which is connected to the second surface 51b, has a second filling groove 82. The sealing layer can fill the first filling groove 72 and the second filling groove 82, so that the edges of the first surface 51a and the first sealing cover 70 of the motherboard 51, and the edges of the second surface 51b and the second sealing cover 80 of the motherboard 51 are tightly connected.

[0061] In some embodiments, see Figure 6 , Figure 9 The device also includes a plug 90, which is detachably mounted in a slot 47 of the cover plate 40. When the plug 90 is mounted in the slot 47, it covers the first opening 42 and the second opening 44, providing waterproof protection for the electrical connector. Removing the plug 90 from the cover plate 40 facilitates the user's insertion of the corresponding device into the electrical connector. For example, the plug 90 may be made of an elastic material such as silicone. The plug 90 may have a connecting buckle 91 that engages with the cover plate 40, keeping the plug 90 near the cover plate 40.

[0062] In some embodiments, see Figures 6 to 8 The main board 51 has a light-emitting circuit board 54 at one end, which is perpendicular to the main board 51 and electrically connected to it. The light-emitting circuit board 54 has an LED bead 541. Assembling the light-emitting circuit board 54 onto the main board 51 to achieve electrical connection results in a simple structure and low cost. The LED bead 541 can be an LED bead.

[0063] The main board 51 and the light-emitting circuit board 54 are integrated into one structure. The main board 51 is installed on the inner side of the cover plate 40, and the cover plate 40 is assembled at the second mounting port 131 of the housing 10. This allows the lamp bead 541 to be arranged in the center of the third mounting port 15 of the housing 10, resulting in better light emission effect of the lamp bead 541.

[0064] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A speaker back cover module, characterized in that, include: Cover plate, circuit board assembly, and first sealing cover; The circuit board assembly includes a motherboard and a first electrical connector. The motherboard is disposed on the inner side of the cover plate, and the first electrical connector is disposed on the first surface of the motherboard. The cover plate has a first opening corresponding to the first electrical connector. The cover plate is provided with a first sealing cover, and a sealing layer is provided between the inner side of the first sealing cover and the cover plate, and between the first sealing cover and the first surface. The first sealing cover, the cover plate and the first surface together form a first receiving cavity. The first receiving cavity is connected to the first opening, and the first electrical connector is located in the first receiving cavity.

2. The speaker back cover module as described in claim 1, characterized in that, The motherboard and the cover plate are arranged perpendicularly.

3. The speaker back cover module as described in claim 2, characterized in that, The inner side of the cover plate has a positioning groove, and one edge of the main board is inserted into the positioning groove; And / or, the inner side of the cover plate is provided with fasteners for fixing the motherboard to the cover plate.

4. The speaker back cover module as described in claim 1, characterized in that, The inner side of the cover plate has a battery slot, in which a battery is disposed. The battery is electrically connected to the motherboard. The first sealing cover and the battery are disposed opposite to each other so that the battery is confined to the battery slot.

5. The speaker rear cover module as described in any one of claims 1 to 4, characterized in that, The circuit board assembly further includes a second electrical connector disposed on a second surface of the motherboard, with the first surface and the second surface facing away from each other, and the cover plate having a second opening corresponding to the second electrical connector; The cover plate is provided with a second sealing cover. A sealing layer is provided between the second sealing cover and the inner side of the cover plate, and between the second sealing cover and the second surface. The second sealing cover, the cover plate and the second surface together form a second receiving cavity. The second receiving cavity is connected to the second opening. The second electrical connector is located in the second receiving cavity.

6. The speaker back cover module as described in claim 5, characterized in that, The first sealing cover is fixed to the cover plate by fasteners, and the second sealing cover is fixed to the main board and the first sealing cover by fasteners.

7. The speaker back cover module as described in claim 5, characterized in that, The inner side of the cover plate has a limiting groove, and a portion of the edge of the first sealing cover and a portion of the edge of the second sealing cover are inserted into the limiting groove. And / or, the edge of the first sealing cap connected to the first surface has a first filling groove, and the edge of the second sealing cap connected to the second surface has a second filling groove.

8. The speaker back cover module as described in claim 5, characterized in that, It also includes a plug, which is detachably installed in a slot in the cover plate; when the plug is installed in the slot, the plug can cover the first opening and the second opening.

9. The speaker back cover module as described in claim 5, characterized in that, The motherboard has a light-emitting circuit board at one end, which is perpendicular to the motherboard and electrically connected to it. The light-emitting circuit board has LED beads.

10. A speaker, characterized in that, It includes a housing, a speaker, and a speaker rear cover module as described in any one of claims 1 to 9, wherein the speaker is disposed in the housing and the speaker rear cover module is disposed in the housing.

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