Modularized printed board heat dissipation device

Through the modular printed circuit board heat dissipation device, the combination of heat dissipation plate, thermal pad and protective pad is used to solve the heat dissipation problem of high heat consumption components in the modular structure, and the heat dissipation capacity and product reliability are improved without changing the structural size.

CN223488470UActive Publication Date: 2025-10-28BEIJING RES INST OF TELEMETRY
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Patent Information

Application Number
CN202422718556.6
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-11-08
Publication Date
2025-10-28
Estimated Expiration
2034-11-08

AI Technical Summary

Technical Problem

The modular structural framework lacks versatility in heat dissipation requirements and cannot effectively meet the needs of devices with high heat consumption. The existing modular design cannot improve the heat dissipation capacity without changing the structural dimensions.

Method used

A modular printed circuit board heat dissipation device was designed, including a heat sink, a thermal pad, a protective pad, and a modular structural frame. The position and height of the heat dissipation boss were adjusted to meet the needs of different modules. The aluminum alloy material with good thermal conductivity and a flexible thermal pad were combined to achieve effective heat dissipation of the device.

Benefits of technology

Without changing the modular structure size, the heat dissipation capacity of the modular product is improved, the device is protected and wire damage is avoided, and the reliability and versatility of the product are enhanced.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model provides a modularized printed board heat dissipation device. The modularized printed board heat dissipation device comprises a heat dissipation board, a printed board, a heat conduction pad, a protection pad, a modularized structure frame, an inter-board connector and an external connector. The heat conduction pad is located between the heat dissipation boss and the component, the protection pad is located between the protection pad installation groove and the wire harness, the heat dissipation plate and the printed board body are in threaded connection with the modular structure frame through screw holes, and the wire harness extends to the external connector installation boss. The heat dissipation plate, the printed board, the heat conduction pad, the protection pad, the modular structure frame, the inter-board connector and the external connector form a module; two or more than two modules can be detachably connected through the frame mounting holes. According to the utility model, the heat dissipation problem of a modular product is solved, the design is simple, the processing is convenient, and the assembly is reliable; the utility model is suitable for modularized electronic products, has strong versatility, can be used for different modules by adjusting the position and height of the heat dissipation boss according to the position and height of the heat dissipation device on the printed board, and has strong versatility and wide application range.
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Description

Technical Field

[0001] This utility model relates to the field of electrical technology, specifically to a modular printed circuit board heat dissipation device. Background Technology

[0002] Currently, there are increasing demands for product integration and miniaturization, and modular design is widely used. The most typical feature of modular structure is its uniformity. However, when some modules contain components with high heat dissipation that require heat dissipation, the general-purpose structure is ineffective.

[0003] Due to the versatility requirements of modular structural frameworks, when a module contains components with high heat dissipation, it is necessary to enhance the heat dissipation capacity of the single-layer module without altering the original modular framework structure. Based on the specific heat dissipation requirements of the module, a printed circuit board heat dissipation device was designed. This device is easy to install, has a significant heat dissipation effect, and does not change the structural dimensions of the modular framework, thus meeting the versatility requirements of modular structures.

[0004] Therefore, a heat dissipation device that can solve the heat dissipation problem is needed. Summary of the Invention

[0005] This invention aims to solve the heat dissipation problem by providing a modular printed circuit board heat dissipation device. It addresses the heat dissipation issue in modular products, featuring a simple design, convenient processing, and reliable assembly. This invention is applicable to modular electronic products, exhibiting strong versatility. By adjusting the position and height of the heat dissipation boss according to the location and height of the heat dissipation components on the printed circuit board, it can be used for different modules, demonstrating strong versatility and a wide range of applications.

[0006] This utility model provides a modular printed circuit board heat dissipation device, including a detachably connected heat dissipation plate, a printed circuit board, a thermally conductive pad and a protective pad disposed between the heat dissipation plate and the printed circuit board, and a modular structural frame detachably connected to the outer periphery of the heat dissipation plate and the printed circuit board.

[0007] The heat sink includes a heat sink body, support columns connected to the four corners of the heat sink body, countersunk holes connected to one end of the support columns, heat sink bosses connected to the heat sink body, and protective pad mounting grooves.

[0008] The printed circuit board includes a printed circuit board body, mounting holes connected around the printed circuit board body, components connected to the printed circuit board body, and wire harnesses connected to one side of the printed circuit board body.

[0009] The modular structural frame includes a hollow frame body, printed circuit board mounting bosses connected to the four corners inside the frame body, printed circuit board mounting screw holes connected to the printed circuit board mounting bosses, and external connector mounting bosses connected to the hollow side of the frame body.

[0010] The thermal pad is located between the heat dissipation boss and the component, the protective pad is located between the protective pad mounting groove and the wire harness, the support column and the printed circuit board body are screwed to the printed circuit board mounting screw holes, and the wire harness extends to the external connector mounting boss.

[0011] The modular printed circuit board heat dissipation device of this utility model, as a preferred embodiment, further includes an inter-board connector that is detachably connected to one end of the printed circuit board body and located inside the frame body.

[0012] The module consists of a heat sink, printed circuit board, thermal pad, protective pad, modular structural frame, and inter-board connectors;

[0013] The modular structural frame also includes frame mounting holes at the four corners of the frame body.

[0014] Two or more modules can be detachably connected through the frame mounting holes.

[0015] The modular printed circuit board heat dissipation device of this utility model, as a preferred embodiment, further includes an external connector that is connected to the frame body through an external connector mounting screw hole, and the external connector is connected to the wire harness;

[0016] The modular structural frame also includes external connector mounting screw holes connected to one side of the external connector mounting boss;

[0017] The module also includes external connectors.

[0018] In a preferred embodiment of the modular printed circuit board heat dissipation device described in this utility model, the heat dissipation plate body is a plate-shaped structure, and the support columns and heat dissipation bosses all extend in the same direction; the heat dissipation bosses are cubic structures, and the protective pad mounting grooves are located on one edge of the heat dissipation plate body.

[0019] In a preferred embodiment of the modular printed circuit board heat dissipation device described in this utility model, the number of heat dissipation bosses and thermal pads can be one or more, and the heat dissipation plate body is an axisymmetric structure made of aluminum alloy; the edge of the heat dissipation plate body adjacent to the inter-board connector is concave.

[0020] In a preferred embodiment of the modular printed circuit board heat dissipation device described in this utility model, the number of heat dissipation bosses is less than the number of components.

[0021] In a preferred embodiment of the modular printed circuit board heat dissipation device described in this utility model, the printed circuit board further includes inter-board connector mounting holes connected to the printed circuit board body.

[0022] In a preferred embodiment of the modular printed circuit board heat dissipation device described in this utility model, the thickness of the thermal pad is greater than the distance between the heat dissipation boss and the component.

[0023] In a preferred embodiment of the modular printed circuit board heat dissipation device described in this utility model, the protective pad is a vacuum rubber plate, which is bonded to the protective pad mounting groove.

[0024] In the modular printed circuit board heat dissipation device described in this utility model, the frame body is preferably made of aluminum alloy.

[0025] This utility model discloses a modular printed circuit board heat dissipation device, which is applicable to modular products and relates to the field of electronic equipment structural design.

[0026] The utility model has the following advantages:

[0027] (1) This utility model solves the heat dissipation problem of modular products, and is simple in design, easy to process, and reliable in assembly;

[0028] (2) This utility model is applicable to modular electronic products and has strong versatility. The position and height of the heat dissipation boss can be adjusted according to the position and height of the heat dissipation device on the printed circuit board to be used for different modules. It has strong versatility and wide range of applications. Attached Figure Description

[0029] Figure 1 A front view of a modular printed circuit board heat dissipation device;

[0030] Figure 2 This is a half-sectional side view of a modular printed circuit board heat dissipation device.

[0031] Figure 3 A schematic diagram of the front of the heat sink of a modular printed circuit board heat dissipation device;

[0032] Figure 4 This is a schematic diagram of the reverse side of the heat sink of a modular printed circuit board heat dissipation device.

[0033] Figure 5 This is a schematic diagram of the assembly state of a modular printed circuit board heat dissipation device.

[0034] Figure 6 This is a reverse view of a heat sink plate equipped with thermal pads and protective pads in a modular printed circuit board heat dissipation device.

[0035] Figure 7 A schematic diagram of a modular printed circuit board heat dissipation device;

[0036] Figure 8 This is a schematic diagram of the modular structure frame of a modular printed circuit board heat dissipation device.

[0037] Figure 9 This is a schematic diagram showing the assembly state of two modules of a modular printed circuit board heat dissipation device.

[0038] Figure label:

[0039] 1. Heat sink; 11. Heat sink body; 12. Support column; 13. Countersunk hole; 14. Heat dissipation boss; 15. Protective pad mounting slot; 2. Printed circuit board; 21. Printed circuit board body; 22. Mounting hole; 23. Components; 24. Wire harness; 25. Inter-board connector mounting hole; 3. Thermal pad; 4. Protective pad; 5. Modular structural frame; 51. Frame body; 52. Printed circuit board mounting boss; 53. Printed circuit board mounting screw hole; 54. External connector mounting boss; 55. Frame mounting hole; 56. External connector mounting screw hole; 6. Inter-board connector; 7. External connector. Detailed Implementation

[0040] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0041] Example 1

[0042] like Figures 1-9 As shown, a modular printed circuit board heat dissipation device includes a heat sink 1, a printed circuit board 2, a thermal pad 3, a protective pad 4, a modular structural frame 5 for mounting the heat sink and the printed circuit board, an inter-board connector 6 detachably connected to one end of the printed circuit board 2 and located inside the modular structural frame 5, and an external connector 7 connected to one side of the modular structural frame 5.

[0043] The heat sink 1 includes a heat sink body 11, four pillars 12 at the four corners of the heat sink, four countersunk holes 13, a heat sink boss 14 located above the heat dissipation device and protruding towards the heat dissipation device, and a protective pad mounting groove 15 above the wire bundle 23 soldered to the printed circuit board by the external connector.

[0044] The printed circuit board 2 includes a printed circuit board body 21, four mounting holes 22, a heat-dissipating component 23, a wire harness 24 for external connectors to be soldered to the printed circuit board, and board-to-board connector mounting holes 25 connected to the printed circuit board body 21.

[0045] The modular structural frame 5 for mounting the heat sink and printed circuit board includes a hollow frame body 51, a mounting boss 52 for the printed circuit board 2, a mounting screw hole 53 for the printed circuit board on the mounting boss, a mounting boss 54 for the external connector, a frame mounting hole 55, and a mounting screw hole 56 for the external connector.

[0046] The thermal pad 3 is attached between the upper surface of the heat-dissipating device 23 on the printed circuit board and the lower surface of the heat dissipation protrusion 14 of the heat sink, forming a heat conduction path for the device. In order to ensure good heat conduction effect, the thickness of the thermal pad should be slightly greater than the distance between the upper surface of the heat-dissipating device 23 and the lower surface of the heat dissipation protrusion 14.

[0047] The protective pad 4 is adhered to the protective pad mounting groove 15 of the heat sink, located between the wire bundle 24 soldered to the printed circuit board by the external connector and the protective pad mounting groove 15. This prevents product failure due to friction between the wires and the heat sink, damage to the wire insulation, or continuity between the wire core and the heat sink during product use and testing. This device improves the heat dissipation capacity of modular products and features simple design, convenient processing, and reliable assembly.

[0048] When there are components with high heat dissipation on the printed circuit board of a modular product, the heat sink 1 is installed on the frame 5 together with the printed circuit board 2 through the countersunk hole 13 and the support column 12. The heat dissipation boss 14 is positioned opposite the component 23 with high heat dissipation on the printed circuit board 2. To prevent the heat dissipation boss 14 from damaging the component 23, a thermally conductive pad 3 is placed between the boss 14 and the component 23. This not only protects the component 23 but also reduces contact thermal resistance. The mounting slot of the protective pad 4 is placed on the side of the module facing the external connector, and the protective pad 4 is adhered to the slot 15 to prevent the wire harness of the external connector from rubbing against the heat sink 1. This heat dissipation device with the above features helps dissipate heat from the components on the printed circuit board, avoiding equipment failure caused by overheating, while also preventing damage to the external connector leads, thus improving product reliability.

[0049] The heat sink 1 and frame 5 are made of aluminum alloy with good thermal conductivity, the thermal pad 3 is made of flexible thermal pad, and the protective pad 4 is made of vacuum rubber sheet.

[0050] The thermal pad 3 is 2.5mm thick, the distance between the heat sink 1 and the device 23 is 2mm, and the size of the thermal pad 3 is the same as that of the device 23 that needs to be cooled. For example, if the size of the device 23 is 27mm*27mm, then the size of the thermal pad 3 and the heat sink protrusion 14 is also 27mm*27mm. In order to ensure the heat conduction effect, the thermal pad 3 needs to have a certain amount of compression, generally 20%.

[0051] The model number of PCB connector 6 is RM222.

[0052] The number of modules can be two or more, and the assembly state is as follows: Figure 9 As shown.

[0053] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A modular printed circuit board heat dissipation device, characterized in that: It includes a detachably connected heat sink (1), a printed circuit board (2), a thermally conductive pad (3), a protective pad (4) disposed between the heat sink (1) and the printed circuit board (2), and a modular structural frame (5) detachably connected to the outer periphery of the heat sink (1) and the printed circuit board (2). The heat sink (1) includes a heat sink body (11), a support column (12) connected to the four corners of the heat sink body (11), a countersunk hole (13) connected to the support column (12), a heat sink boss (14) connected to the heat sink body (11), and a protective pad mounting groove (15). The printed circuit board (2) includes a printed circuit board body (21), mounting holes (22) connected around the printed circuit board body (21), components (23) connected to the printed circuit board body (21), and wire harness (24) connected to one side of the printed circuit board body (21). The modular structural frame (5) includes a hollow frame body (51), printed circuit board mounting bosses (52) connected to the four corners inside the frame body (51), printed circuit board mounting screw holes (53) connected to the printed circuit board mounting bosses (52), and external connector mounting bosses (54) connected to the hollow side of the frame body (51). The thermal pad (3) is located between the heat dissipation boss (14) and the component (23), the protective pad (4) is located between the protective pad mounting groove (15) and the wire harness (24), the support column (12) and the printed circuit board body (21) are screwed to the printed circuit board mounting screw hole (53), and the wire harness (24) extends toward the external connector mounting boss (54).

2. The modular printed circuit board heat dissipation device according to claim 1, characterized in that: It also includes an inter-board connector (6) that is detachably connected to one end of the printed circuit board body (21) and located inside the frame body (51); The heat sink (1), the printed circuit board (2), the thermal pad (3), the protective pad (4), the modular structural frame (5), and the inter-board connector (6) constitute a module; The modular structural frame (5) also includes frame mounting holes (55) connected to the four corners of the frame body (51) outside; Two or more of the modules can be detachably connected through the frame mounting holes (55).

3. The modular printed circuit board heat dissipation device according to claim 2, characterized in that: It also includes an external connector (7) that is connected to the frame body (51) via the external connector mounting screw hole (56), and the external connector (7) is connected to the wire harness (24); The modular structural frame (5) also includes an external connector mounting screw hole (56) connected to one side of the external connector mounting boss (54); The module also includes the external connector (7).

4. A modular printed circuit board heat dissipation device according to claim 1, characterized in that: The heat sink body (11) is a plate-shaped structure, and the support column (12) and the heat sink protrusion (14) both extend in the same direction; the heat sink protrusion (14) is a cubic structure, and the protective pad mounting groove (15) is located on one edge of the heat sink body (11).

5. A modular printed circuit board heat dissipation device according to claim 4, characterized in that: The number of the heat dissipation boss (14) and the heat conduction pad (3) can be one or more. The heat dissipation plate body (11) is an axisymmetric structure made of aluminum alloy. The edge of the heat dissipation plate body (11) adjacent to the inter-plate connector (6) is concave.

6. A modular printed circuit board heat dissipation device according to claim 5, characterized in that: The number of heat dissipation protrusions (14) is less than the number of components (23).

7. A modular printed circuit board heat dissipation device according to claim 1, characterized in that: The printed circuit board (2) also includes an inter-board connector mounting hole (25) connected to the printed circuit board body (21).

8. A modular printed circuit board heat dissipation device according to claim 1, characterized in that: The thermal pad (3) is a flexible thermal pad, and the thickness of the thermal pad (3) is greater than the distance between the heat dissipation boss (14) and the component (23).

9. A modular printed circuit board heat dissipation device according to claim 1, characterized in that: The protective pad (4) is a vacuum rubber sheet, and the protective pad (4) is bonded to the protective pad mounting groove (15).

10. A modular printed circuit board heat dissipation device according to claim 1, characterized in that: The modular structural frame (5) is made of aluminum alloy.