Display device

Abstract

The embodiment of the utility model provides a display device, and belongs to the technical field of display. The display device comprises a circuit board and a display panel, the circuit board comprises a body carrier plate and a heat dissipation structure, the first surface of the body carrier plate is provided with at least one groove, and the heat dissipation structure is located in the at least one groove; the display panel is located on the surface, away from the body carrier plate, of the heat dissipation structure and electrically connected with the circuit board, and the orthographic projection part of the heat dissipation structure on the body carrier plate is located on the periphery of the orthographic projection of the display panel on the body carrier plate. According to the embodiment, the heat dissipation effect can be improved, and the display effect and reliability of the display device are improved.

Description

Technical Field

[0001] This disclosure relates to the field of display technology, and in particular to a display device. Background Technology

[0002] With the rapid development of the display industry, display devices are widely used in people's daily lives, such as smartphones, tablets, and smart vehicle terminals.

[0003] In related technologies, a display device includes a circuit board and a display panel, with the display panel located on the surface of the circuit board and electrically connected to the circuit board.

[0004] However, during the use of a display device, the display panel continuously generates heat. Since the display panel is usually bonded to the circuit board, the heat is difficult to dissipate to the outside and accumulates inside the display device. This causes the display panel temperature to rise, which affects the photoelectric conversion efficiency of the display panel, causes material decomposition and oxidation, shortening its lifespan, and can lead to screen burn-in, thus affecting the display effect and reliability of the display device. Utility Model Content

[0005] This disclosure provides a display device that improves heat dissipation, thereby enhancing the display effect and reliability. The technical solution is as follows:

[0006] On one hand, a display device is provided, including a circuit board and a display panel. The circuit board includes a body carrier and a heat dissipation structure. A first surface of the body carrier has at least one groove, and the heat dissipation structure is located in the at least one groove. The display panel is located on the surface of the heat dissipation structure away from the body carrier and is electrically connected to the circuit board. The portion of the orthographic projection of the heat dissipation structure on the body carrier is located around the orthographic projection of the display panel on the body carrier.

[0007] Optionally, the thickness of the heat dissipation structure is greater than or equal to the depth of the groove.

[0008] Optionally, the depth of the groove is 0.4 mm to 0.6 mm.

[0009] Optionally, the heat dissipation structure is a metal structure.

[0010] Optionally, the first surface of the body carrier plate has a plurality of grooves, the plurality of grooves including a plurality of first grooves arranged in strips spaced apart along a first direction and a plurality of second grooves arranged in strips spaced apart along a second direction, the length direction of the first grooves being the second direction, the length direction of the second grooves being the first direction, and the first grooves and the second grooves intersecting.

[0011] Optionally, the distance between two adjacent first grooves and the distance between two adjacent second grooves are both 0.8 mm to 1.2 mm; and / or, the width of the first groove and the width of the second groove are both 0.8 mm to 1.2 mm.

[0012] Optionally, the first groove penetrates the sidewall of the body carrier plate along the second direction; and / or, the second groove penetrates the sidewall of the body carrier plate along the first direction.

[0013] Optionally, the display device further includes a heat dissipation layer, which is bonded to the first surface and the surface of the heat dissipation structure that is away from the body substrate.

[0014] Optionally, the heat dissipation layer has a first portion, which is bonded to the sidewall of the display panel and located on the periphery of the display panel, wherein the surface of the first portion away from the first surface is flush with the surface of the display panel away from the first surface.

[0015] Optionally, the display device further includes a first adhesive layer and a second adhesive layer, both of which are transparent insulating adhesive layers; the first adhesive layer is located between the first surface and the display panel; the second adhesive layer is located between the heat dissipation layer and the first surface, between the heat dissipation layer and the heat dissipation structure, and between the first portion and the sidewall of the display panel.

[0016] The beneficial effects of the technical solutions provided in this disclosure are:

[0017] In this embodiment, at least one groove is provided on the first surface of the main body substrate of the circuit board, and a heat dissipation structure is provided in the at least one groove. The display panel is located on the surface of the heat dissipation structure away from the main body substrate and is electrically connected to the circuit board. The portion of the orthographic projection of the heat dissipation structure on the main body substrate is located around the orthographic projection of the display panel on the main body substrate. During the use of the display device, the heat generated by the display panel can be conducted through the heat dissipation structure to the area on the circuit board located around the display panel and then dissipated to the outside. Therefore, the probability of the display panel temperature rising can be effectively reduced, the photoelectric conversion efficiency and lifespan of the display panel can be improved, the probability of screen burn-in can be reduced, thereby improving the display effect and reliability of the display device. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this disclosure, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of the structure of a display device provided in an embodiment of this disclosure;

[0020] Figure 2 This is a cross-sectional structural diagram of a display device provided in an embodiment of this disclosure.

[0021] Figure label:

[0022] x: First direction; y: Second direction; 10: Body carrier plate; 11: First surface; 111: First groove; 112: Second groove; 20: Heat dissipation structure; 30: Display panel; 40: Heat dissipation layer; 401: First part; 50: First adhesive layer; 51: Second adhesive layer. Detailed Implementation

[0023] To make the objectives, technical solutions, and advantages of this disclosure clearer, the embodiments of this disclosure will be described in further detail below with reference to the accompanying drawings.

[0024] Unless otherwise defined, the technical or scientific terms used herein shall have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms “first,” “second,” “third,” and similar terms used in this patent application specification and claims do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, the terms “an” or “a” and similar terms do not indicate a quantity limitation, but rather indicate the presence of at least one. The terms “comprising” and similar terms mean that the element or object preceding “comprising” encompasses the element or object listed following “comprising” and its equivalents, and do not exclude other elements or objects. The terms “connection” and similar terms are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. “Upper,” “lower,” “top,” “bottom,” etc., are used only to indicate relative positional relationships, which may change accordingly when the absolute position of the described object changes. Furthermore, “A and / or B” indicates the presence of three cases: A, B, and A and B.

[0025] Figure 1 This is a schematic diagram of the structure of a display device provided in an embodiment of this disclosure. Figure 1 As shown, the display device includes a circuit board and a display panel 30. The circuit board includes a body carrier plate 10 and a heat dissipation structure 20. The first surface 11 of the body carrier plate 10 has at least one groove, and the heat dissipation structure 20 is located in at least one groove. The display panel 30 is located on the surface of the heat dissipation structure 20 away from the body carrier plate 10 and is electrically connected to the circuit board. The portion of the orthographic projection of the heat dissipation structure 20 onto the body carrier plate 10 is located at the periphery of the orthographic projection of the display panel 30 onto the body carrier plate 10.

[0026] In this embodiment, at least one groove is provided on the first surface 11 of the circuit board's main body carrier 10, and a heat dissipation structure 20 is provided in the at least one groove. The display panel 30 is located on the surface of the heat dissipation structure 20 away from the main body carrier 10 and is electrically connected to the circuit board. The portion of the orthographic projection of the heat dissipation structure 20 on the main body carrier 10 is located around the orthographic projection of the display panel 30 on the main body carrier 10. During the use of the display device, the heat generated by the display panel 30 can be conducted through the heat dissipation structure 20 to the area on the circuit board located around the display panel 30 and then dissipated to the outside. Therefore, the probability of the display panel 30 temperature rising can be effectively reduced, the photoelectric conversion efficiency and lifespan of the display panel 30 can be improved, the probability of screen burn-in can be reduced, thereby improving the display effect and reliability of the display device.

[0027] For example, the circuit board can be a ceramic circuit board, and the material of the body carrier 10 can be ceramic.

[0028] Optionally, the circuit board further includes a conductive line layer and a pad layer. The conductive line layer is located inside the body carrier 10, and the pad layer is located on the first surface 11 of the body carrier 10. The conductive line layer penetrates the body carrier 10 and is connected to the pad layer. Both the conductive line layer and the pad layer are insulated from the heat dissipation structure 20.

[0029] For example, the display panel 30 can be electrically connected to the pad layer and the conductive line layer via metal lines. For example, the metal lines can be gold wires or aluminum wires.

[0030] For example, the depth of the groove is less than the maximum thickness of the body carrier plate 10. Here, the depth of the groove refers to the distance between the bottom surface of the groove and the first surface 11 in the direction perpendicular to the first surface 11. The maximum thickness of the body carrier plate 10 refers to the maximum thickness of the body carrier plate 10 in the direction perpendicular to the first surface 11. That is, the groove does not penetrate the body carrier plate 10 in the direction perpendicular to the first surface 11. This is beneficial for the heat dissipation structure 20 to be insulated from the conductive circuit layer located inside the body carrier plate 10 through the body carrier plate 10.

[0031] Optionally, the thickness of the heat dissipation structure 20 is greater than or equal to the depth of the groove. Here, the thickness of the heat dissipation structure 20 is the thickness of the heat dissipation structure 20 in the direction perpendicular to the first surface 11. This ensures a reliable connection between the heat dissipation structure 20 and the display panel 30, which helps dissipate the heat generated by the display panel 30 during use, thereby reducing the probability of the display panel 30's temperature rising.

[0032] Figure 2 This is a cross-sectional structural diagram of a display device provided in an embodiment of this disclosure. Figure 2Part (a) is a cross-sectional view in the direction perpendicular to the second direction y. Figure 2 Part (b) is a cross-sectional view in the direction perpendicular to the first direction x. For example... Figure 2 As shown, the thickness of the heat dissipation structure 20 is greater than the depth H1 of the groove.

[0033] Optionally, the depth H1 of the groove is between 0.4 mm and 0.6 mm. If the depth H1 of the groove is too small, it may affect the heat dissipation effect of the heat dissipation structure 20 in the groove; if the depth H1 of the groove is too large, it may affect the strength of the circuit board. With the first depth H1 within this range, the heat dissipation effect of the heat dissipation structure 20 can be ensured without affecting the strength of the circuit board.

[0034] For example, the depth H1 of the groove can be 0.4mm, 0.5mm or 0.6mm, etc.

[0035] See Figure 1 and Figure 2 The first surface 11 of the carrier plate 10 has multiple grooves, including multiple strip-shaped first grooves 111 spaced apart along a first direction x and multiple strip-shaped second grooves 112 spaced apart along a second direction y. The length direction of the first grooves 111 is the second direction y, and the length direction of the second grooves 112 is the first direction x. The first grooves 111 and the second grooves 112 intersect. The heat dissipation structure 20 is located in the multiple first grooves 111 and the multiple second grooves 112. In this way, the heat dissipation structure 20 located in the multiple first grooves 111 and the multiple second grooves 112 can be mesh-like. The heat generated by the display panel 30 can be more evenly conducted to various areas of the circuit board through the heat dissipation structure 20 and then dissipated to the outside, thereby effectively improving the heat dissipation effect.

[0036] In other embodiments, a smaller number of grooves may be provided. For example, only one groove may be provided; or only one first groove 111 and one second groove 112 may be provided; or only a plurality of first grooves 111 spaced apart along the first direction x may be provided; or only a plurality of second grooves 112 spaced apart along the second direction y may be provided, etc. It is sufficient that the portion of the orthographic projection of the heat dissipation structure 20 located in the groove on the main body carrier plate 10 is located outside the orthographic projection of the display panel 30 on the main body carrier plate 10; this disclosure does not impose any limitations on this.

[0037] For example, the first groove 111 and the second groove 112 are both rectangular in shape in the cross-section along their length.

[0038] In other embodiments, the cross-sectional shape of the first groove 111 and the second groove 112 in their length direction can be trapezoidal or hexagonal, etc., and this disclosure does not limit this.

[0039] See Figure 1 and Figure 2 Multiple strip-shaped first grooves 111 are arranged at equal intervals along the first direction x, and multiple strip-shaped second grooves 112 are arranged at equal intervals along the second direction y.

[0040] For example, the first direction x and the second direction y are perpendicular to each other. The first groove 111 and the second groove 112 are perpendicular to each other, and the heat dissipation structure 20 located in the first groove 111 and the second groove 112 is in the form of a rectangular grid.

[0041] In other embodiments, the angle between the first direction x and the second direction y may be less than or greater than 90°, and the heat dissipation structure 20 located in the first groove 111 and the second groove 112 is in the shape of a parallelogram mesh.

[0042] Optionally, the distance between two adjacent first grooves 111 and the distance between two adjacent second grooves 112 are both D, where D is 0.8 mm to 1.2 mm. This ensures that the first grooves 111 and the second grooves 112 are more evenly distributed on the first surface 11 of the body carrier plate 10, and the heat generated by the display panel 30 can be more evenly conducted to various areas of the circuit board through the heat dissipation structure 20 located in the first grooves 111 and the second grooves 112 and then dissipated to the outside.

[0043] For example, the distance between two adjacent first grooves 111 and the distance between two adjacent second grooves 112 can both be 0.8mm, 1mm or 1.2mm, etc.

[0044] Optionally, the width of the first groove 111 and the width of the second groove 112 are both W, where W is between 0.8 mm and 1.2 mm. Here, the width refers to the maximum dimension in the direction parallel to the first surface 11 and perpendicular to the length direction. Within this range, the heat dissipation structures 20 located in the first groove 111 and the second groove 112 can be more evenly distributed, which is beneficial to improving the heat dissipation effect of the heat dissipation structures 20.

[0045] For example, the width of the first groove 111 and the width of the second groove 112 can both be 0.8mm, 1mm or 1.2mm, etc.

[0046] Optionally, the first groove 111 penetrates the sidewall of the body carrier plate 10 along the second direction y. And / or, the second groove 112 penetrates the sidewall of the body carrier plate 10 along the first direction x. In this way, the heat dissipation structure 20 located in the groove can transfer heat to the sidewall of the body carrier plate 10, which is beneficial for better heat dissipation to the outside.

[0047] Optionally, the heat dissipation structure 20 can be a metal structure. Metal structures offer better heat dissipation and also ensure higher strength of the circuit board. For example, the heat dissipation structure 20 can be made of a copper-aluminum alloy.

[0048] Optionally, the display device further includes a heat dissipation layer 40, which is bonded to the first surface 11 and the surface of the heat dissipation structure 20 that is away from the main body carrier plate 10. In this way, the heat dissipation layer 40 has a large coverage area and is exposed. The heat generated by the display panel 30 will be conducted to the heat dissipation layer 40 at the bottom through the mesh-like heat dissipation structure 20, and then better dissipated to the outside through the heat dissipation layer 40, thereby effectively reducing the probability of the display panel 30 temperature rising.

[0049] See Figure 1 and Figure 2 The heat dissipation layer 40 has a first portion 401, which is bonded to the sidewall of the display panel 30 and located on the periphery of the display panel 30. The surface of the first portion 401 away from the first surface 11 is flush with the surface of the display panel 30 away from the first surface 11. In this way, some of the heat generated by the display panel 30 can be dissipated to the outside through the first portion 401 of the heat dissipation layer 40 at the sidewall, which helps to further improve the heat dissipation effect.

[0050] For example, the thickness of each portion of the heat dissipation layer 40 is uniform.

[0051] Optionally, the thickness H2 of the heat dissipation layer 40 is between 0.1 mm and 0.2 mm. If the thickness H2 of the heat dissipation layer 40 is too small, it may affect the heat dissipation effect of the heat dissipation layer 40; if the thickness H2 of the heat dissipation layer 40 is too large, it may make the overall thickness of the display device too large. With the thickness H2 of the heat dissipation layer 40 within this range, the heat dissipation effect of the heat dissipation layer 40 can be ensured while the overall thickness of the display device is relatively small.

[0052] For example, the thickness H2 of the heat dissipation layer 40 can be 0.1 mm, 0.15 mm or 0.2 mm, etc.

[0053] It should be noted that the thickness of the first part 401 in the heat dissipation layer 40 refers to the thickness of the first part 401 in the circumferential direction perpendicular to the display panel 30.

[0054] Alternatively, the heat dissipation layer 40 can be made of graphene. Graphene has very high thermal conductivity, which helps to improve heat dissipation.

[0055] Optionally, the display device further includes a first adhesive layer 50 and a second adhesive layer 51. The first adhesive layer 50 is located between the first surface 11 and the display panel 30. The second adhesive layer 51 is located between the heat dissipation layer 40 and the first surface 11, between the heat dissipation layer 40 and the heat dissipation structure 20, and between the first portion 401 and the sidewall of the display panel 30. That is, the display panel 30 can be reliably bonded to the first surface 11 through the first adhesive layer 50, the heat dissipation layer 40 can be reliably bonded to the first surface 11 and part of the heat dissipation structure 20 through the second adhesive layer 51, and the first portion 401 of the heat dissipation layer 40 can also be reliably bonded to the sidewall of the display panel 30 through the second adhesive layer 51, thereby reducing the probability of film peeling in the display device and improving the reliability of the display device.

[0056] For example, both the first adhesive layer 50 and the second adhesive layer 51 are transparent insulating adhesive layers. Here, transparency means that the film layer has a high light transmittance. For example, the light transmittance of the first adhesive layer 50 and the second adhesive layer 51 can be greater than 95%. For example, the light transmittance of the first adhesive layer 50 and the second adhesive layer 51 can be 96%, 98%, or 99%, etc.

[0057] For example, the first adhesive layer 50 and the second adhesive layer 51 can be made of acetal resin.

[0058] In this embodiment of the disclosure, the display panel 30 may be an organic light-emitting diode (OLED) display panel, a quantum dot light-emitting diode (QLED) display panel, a micro light-emitting diode (Micro LED) display panel, or a liquid crystal (LC) display panel, etc.

[0059] The following explanation uses OLED display panel 30 as an example.

[0060] Optionally, the display panel 30 includes a driving backplate and a light-emitting functional layer stacked sequentially in a direction away from the circuit board.

[0061] Optionally, the driving backplane may include a substrate and a driving circuit layer stacked sequentially in a direction away from the circuit board.

[0062] For example, the substrate can be a silicon substrate.

[0063] Optionally, the driving circuit layer includes multiple pixel driving circuits. Each pixel driving circuit may include at least one thin-film transistor (TFT).

[0064] Optionally, the pixel driving circuit includes an active layer, a gate insulating layer, a gate layer, an interlayer dielectric layer, and a source / drain layer sequentially stacked on a substrate.

[0065] For example, the active layer can be made of amorphous silicon, polycrystalline silicon, or metal oxide semiconductor, etc. In some examples, the active layer of each TFT is made of polycrystalline silicon; in other examples, the active layer of some TFTs is made of polycrystalline silicon, and the active layer of other TFTs is made of metal oxide.

[0066] For example, the material used to fabricate the gate insulating layer can be silicon oxide or silicon nitride, silicon nitride, etc.

[0067] For example, the material used to fabricate the gate layer can be a single-layer metal thin film such as molybdenum, copper, or titanium, or a multi-layer metal thin film such as molybdenum / aluminum / molybdenum or titanium / aluminum / titanium.

[0068] For example, the material used to fabricate the interlayer dielectric layer can be silicon oxide or silicon nitride, etc.

[0069] For example, the source / drain metal layer can be made of a single-layer metal film such as aluminum, molybdenum, copper, or titanium, or it can be a multi-layer metal film such as molybdenum / aluminum / molybdenum or titanium / aluminum / titanium.

[0070] Optionally, the light-emitting functional layer includes an anode layer, a pixel definition layer, a light-emitting layer, and a cathode layer stacked sequentially in a direction away from the driving backplane.

[0071] For example, the anode layer can be made of a metallic material, such as gold, or it can be made of a transparent conductive material, such as indium tin oxide (ITO).

[0072] For example, the materials used to fabricate the pixel definition layer include one or more of polyimide, polyphthalamide, polyphthalamide, silicon oxide, silicon nitride, etc.

[0073] For example, the light-emitting layer may include an electron injection layer (EIL), an electron transport layer (ETL), a hole block layer (HBL), a light-emitting material layer, a hole transport layer (HTL), a hole injection layer (HIL), and an electron blocking layer (EBL) stacked sequentially.

[0074] For example, the cathode layer can be made of a metallic material such as a magnesium-silver alloy; or it can be made of a transparent conductive material, such as ITO.

[0075] It should be noted that the film structure and materials of the driving backplane and the light-emitting functional layer described above are only examples. In other embodiments, the driving backplane and the light-emitting functional layer may include more or fewer film structures, and this disclosure does not limit this.

[0076] Optionally, the display panel 30 may also include an encapsulation layer. The encapsulation layer is located on the surface of the light-emitting functional layer away from the driving backplane.

[0077] For example, the encapsulation layer includes at least one of an aluminum oxide layer, a titanium oxide layer, a silicon nitride layer, and a silicon oxide layer.

[0078] Alternatively, the display device can be any product or component with display functionality, such as a mobile phone, tablet computer, or monitor.

[0079] This disclosure also provides a display device, which includes the aforementioned display apparatus and power supply, wherein the display apparatus is electrically connected to the power supply.

[0080] The above description is not intended to limit this disclosure in any way. Although this disclosure has been disclosed above through embodiments, it is not intended to limit this disclosure. Any person skilled in the art can make some modifications or alterations to the above-disclosed technical content to create equivalent embodiments without departing from the scope of the technical solution of this disclosure. Any simple modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of this disclosure without departing from the content of the technical solution of this disclosure shall still fall within the scope of the technical solution of this disclosure.

Claims

1. A display device, characterized in that, Including circuit boards and display panels (30), The circuit board includes a body carrier board (10) and a heat dissipation structure (20). The first surface (11) of the body carrier board (10) has at least one groove, and the heat dissipation structure (20) is located in the at least one groove. The display panel (30) is located on the surface of the heat dissipation structure (20) away from the main body carrier plate (10) and is electrically connected to the circuit board. The portion of the orthographic projection of the heat dissipation structure (20) on the main body carrier plate (10) is located around the orthographic projection of the display panel (30) on the main body carrier plate (10).

2. The display device according to claim 1, characterized in that, The thickness of the heat dissipation structure (20) is greater than or equal to the depth of the groove.

3. The display device according to claim 2, characterized in that, The depth of the groove is 0.4 mm to 0.6 mm.

4. The display device according to any one of claims 1 to 3, characterized in that, The heat dissipation structure (20) is a metal structure.

5. The display device according to any one of claims 1 to 3, characterized in that, The first surface (11) of the body carrier plate (10) has a plurality of grooves, the plurality of grooves including a plurality of strip-shaped first grooves (111) spaced apart along a first direction and a plurality of strip-shaped second grooves (112) spaced apart along a second direction, the length direction of the first grooves (111) is the second direction, the length direction of the second grooves (112) is the first direction, and the first grooves (111) and the second grooves (112) intersect.

6. The display device according to claim 5, characterized in that, The distance between two adjacent first grooves (111) and the distance between two adjacent second grooves (112) are both 0.8 mm to 1.2 mm; and / or, The width of the first groove (111) and the width of the second groove (112) are both 0.8 mm to 1.2 mm.

7. The display device according to claim 5, characterized in that, The first groove (111) penetrates the sidewall of the body carrier plate (10) along the second direction; and / or, The second groove (112) penetrates the side wall of the body carrier plate (10) along the first direction.

8. The display device according to any one of claims 1 to 3 and claims 6 to 7, characterized in that, The display device further includes a heat dissipation layer (40), which is bonded to the first surface (11) and the surface of the heat dissipation structure (20) away from the main body carrier plate (10).

9. The display device according to claim 8, characterized in that, The heat dissipation layer (40) has a first portion (401), which is bonded to the sidewall of the display panel (30) and located on the periphery of the display panel (30). The surface of the first portion (401) away from the first surface (11) is flush with the surface of the display panel (30) away from the first surface (11).

10. The display device according to claim 9, characterized in that, The display device further includes a first adhesive layer (50) and a second adhesive layer (51), both of which are transparent insulating adhesive layers; The first adhesive layer (50) is located between the first surface (11) and the display panel (30); The second adhesive layer (51) is located between the heat dissipation layer (40) and the first surface (11), between the heat dissipation layer (40) and the heat dissipation structure (20), and between the first portion (401) and the sidewall of the display panel (30).

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