Wafer thinning adjustable bearing platform

Abstract

The utility model relates to the technical field of wafer processing platforms, and discloses a wafer thinning adjustable bearing platform, which comprises a bearing platform base, three corners of the bearing platform base are fixedly mounted on a lathe bed support in a three-point positioning manner, and the three corners of the bearing platform base are fixed on the lathe bed support. One positioning point on the bearing table base is fixedly connected with a lathe bed support through a fixing fastener, the other two positioning points on the bearing table base are fixedly connected with the lathe bed support through a leveling assembly, and the leveling assembly comprises a middle stud and a matching piece. The middle stud penetrates through the matching piece and is in threaded connection with the lathe bed support, and the matching piece is in threaded connection with the middle stud. According to the utility model, the adjusting nut is screwed to be matched with the middle stud, so that the planeness of the bearing platform base can be conveniently and quickly adjusted, the leveling time is effectively shortened, the downtime is reduced, and the processing and production efficiency is improved.

Description

Technical Field

[0001] This utility model relates to the field of wafer processing platform technology, specifically to an adjustable wafer thinning support platform. Background Technology

[0002] A wafer thinning machine, also known as a wafer grinding machine, is a specialized piece of equipment used for the fine processing of semiconductor wafer surfaces. It removes one or more layers of material from the wafer surface through a grinding process, thereby reducing the wafer's thickness and improving its process adaptability and surface quality. During processing, the wafer to be ground is precisely clamped on a worktable, its horizontal movement controlled by the feed axis, while a rotary axis drives the wafer to rotate. The grinding head carries the grinding disc and abrasive particles. As the grinding disc rotates, the abrasive particles, aided by grinding fluid, grind the wafer surface, achieving the thinning effect.

[0003] In the process of wafer thinning, the high precision requirements of the thinning machine's support platform and the high technical skills required of the operators, coupled with the potential for flatness errors during long-term operation, can lead to uneven thickness of the wafer after thinning, affecting the overall processing accuracy. Existing technologies involve cumbersome leveling procedures for the support platform base, resulting in low leveling efficiency and long downtime. Utility Model Content

[0004] (a) Technical problems to be solved

[0005] To address the shortcomings of existing technologies, this utility model provides an adjustable support platform for wafer thinning, which solves the problems of the support platform base in existing wafer thinning machines requiring leveling, the cumbersome and inefficient leveling process, and the long downtime.

[0006] (II) Technical Solution

[0007] To achieve the above objectives, this utility model provides the following technical solution:

[0008] An adjustable wafer thinning support platform includes a support base. The three corners of the support base are fixedly mounted on a bed frame via a three-point positioning method. One positioning point on the support base is fixedly connected to the bed frame via a fastener. The other two positioning points on the support base are fixedly connected to the bed frame via an adjustable leveling component. The adjustable leveling component includes a central stud and a mating part. The central stud passes through the mating part and is threadedly connected to the bed frame. The mating part is threadedly connected to the central stud. By screwing the mating part, the support base can move vertically along the central stud.

[0009] Preferably, a worktable is rotatably arranged on the support base, a suction cup is provided on the worktable, and an air channel communicating with the suction cup is arranged in the inner cavity of the worktable. An air slip ring is connected to and fixedly provided at the lower part of the worktable, and a drive motor is installed at the lower part of the air slip ring. The drive motor is used to drive the worktable and the suction cup to rotate through the air slip ring. A slip ring protective cover is provided on the support base and outside the air slip ring.

[0010] Preferably, the suction cup is made of microporous ceramic, and the bed frame is made of mineral casting.

[0011] Preferably, the lower part of the intermediate stud is threaded with a locking nut, which is used to limit and lock the lower end of the mating part.

[0012] Preferably, the upper part of the intermediate stud is threaded with an adjusting nut, the adjusting nut is snapped into the upper part of the mating part, and the rotation of the adjusting nut and the mating part is synchronized.

[0013] Preferably, the upper part of the mating part is provided with a protrusion, and the lower part of the adjusting nut is provided with an opening for engaging with the protrusion.

[0014] (III) Beneficial Effects

[0015] This utility model has the following beneficial effects:

[0016] This adjustable wafer thinning support platform uses a three-point positioning method to install the support base, with one of the positioning points being fixed. When leveling the support base is required, the flatness of the entire base can be quickly adjusted by adjusting the other two positioning points. Through the central stud and mating parts, during leveling, turning the mating parts causes the support base to move vertically along the central stud. By adjusting the flatness at the two positioning points, the flatness of the entire support base is adjusted. The entire leveling process is convenient and quick, and the leveling structure design is simple, which can improve processing and production efficiency. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the application state structure of this utility model;

[0018] Figure 2 This is a schematic diagram showing the overall and partially enlarged cross-sectional structure of this utility model;

[0019] Figure 3 This is a schematic diagram of the disassembled structure of the adjustable leveling component of this utility model.

[0020] In the diagram: 1. Bed frame; 2. Support platform base; 3. Worktable; 4. Suction cup; 5. Air slip ring; 6. Slip ring protective cover; 7. Drive motor; 8. Fixing fastener; 9. Adjustable leveling component; 91. Intermediate stud; 92. Mating part; 93. Adjusting nut; 94. Locking nut; 95. Protrusion; 96. Mating opening. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0022] Please see Figure 1 This utility model provides a technical solution: a wafer thinning adjustable support platform, including a support base 2. The three corners of the support base 2 are fixedly installed on the bed frame 1 by a three-point positioning method. One positioning point on the support base 2 is fixedly connected to the bed frame 1 by a fixing fastener 8. The other two positioning points on the support base 2 are fixedly connected to the bed frame 1 by an adjustable leveling component 9. The adjustable leveling component 9 includes a central stud 91 and a mating part 92. The central stud 91 passes through the mating part 92 and is threadedly connected to the bed frame 1. The mating part 92 is threadedly connected to the central stud 91. By screwing the mating part 92, the support base 2 can move vertically along the central stud 91.

[0023] This utility model uses a three-point positioning method to install the support platform base 2, with one of the positioning points being fixed. When leveling the support platform base 2 is required, the flatness of the entire base can be quickly adjusted by adjusting the other two positioning points. Through the central stud 91 and the mating part 92, during leveling, turning the mating part 92 causes the support platform base 2 to move vertically along the central stud 91. By adjusting the flatness at the two positioning points, the flatness of the entire support platform base 2 can be adjusted. The entire leveling process is convenient and quick, the leveling structure design is simple, and it can improve processing and production efficiency.

[0024] Reference Figure 2As shown, in this embodiment, a worktable 3 is rotatably arranged on the support base 2. A suction cup 4 is mounted on the worktable 3, and an air channel communicating with the suction cup 4 is arranged within the inner cavity of the worktable 3. An air slip ring 5 is connected to and fixedly mounted on the lower part of the worktable 3. A drive motor 7 is installed on the lower part of the air slip ring 5. The drive motor 7 drives the worktable 3 and the suction cup 4 to rotate via the air slip ring 5. A slip ring protective cover 6 is provided on the support base 2, covering the outside of the air slip ring 5. Through the air slip ring 5, negative pressure introduced from the outside can enter the suction cup 4 through the air channel on the worktable 3, thereby causing the suction cup 4 to perform negative pressure adsorption on the workpiece. The drive motor 7 below drives the air slip ring 5 to rotate the worktable 3, which in turn rotates the workpiece to be processed for grinding.

[0025] In this embodiment, the suction cup 4 is made of microporous ceramic, and the bed support 1 is made of mineral casting. The suction cup 4 is a ceramic microporous suction cup 4, and its working principle is based on its porous structure. The porous ceramic suction cup 4 contains a large number of tiny pores, which can be open or closed, and the pore size is generally in the micrometer or submicrometer range. When the external pressure changes, these micropores will adsorb or release air, thereby generating suction or thrust. Specifically, when the external pressure decreases, air is drawn into the micropores, forming a negative pressure, causing the suction cup 4 to adhere to the planar surface; when the external pressure increases, air is released from the micropores, and the suction cup 4 detaches from the surface. The microporous ceramic suction cup 4 has advantages such as high temperature resistance, wear resistance, chemical corrosion resistance, high mechanical strength, easy regeneration, and excellent thermal shock resistance. The bed support 1 uses materials such as mineral casting, which has the characteristics of high precision, high stability, and high strength. It also has shock absorption properties, which is beneficial to improving the dynamic stability and machining accuracy of the machine tool and extending its service life.

[0026] Reference Figure 2 As shown, in this embodiment, a locking nut 94 is threadedly connected to the lower part of the intermediate stud 91. The locking nut 94 is used to limit and lock the lower end of the mating part 92. By setting the locking nut 94, after the flatness of the bearing platform base 2 is adjusted by the mating part 92, the movement of the mating part 92 is limited, which can improve the stability of the bearing platform base 2 during the processing and prevent displacement along the direction of the intermediate stud 91.

[0027] Reference Figure 2 and 3 As shown, in this embodiment, an adjusting nut 93 is threadedly connected to the upper part of the intermediate stud 91. The adjusting nut 93 is snapped into the upper part of the mating part 92, and the rotation of the adjusting nut 93 and the mating part 92 is synchronized. The adjusting nut 93 allows personnel to quickly level the support platform base 2 by turning the adjusting nut 93 through the mating part 92.

[0028] Reference Figure 3As shown, in this embodiment, the upper part of the mating part 92 is provided with a protrusion 95, and the lower part of the adjusting nut 93 is provided with a mating opening 96 that engages with the protrusion 95. The protrusion 95 and the mating opening 96 facilitate quick and easy engagement and fixation of the adjusting nut 93 and the mating part 92, allowing for rapid tightening of the mating part 92 via the adjusting nut 93.

[0029] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, the phrase "comprising an element defined as..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0030] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A wafer thinning adjustable support platform, comprising a support platform base, characterized in that: The three corners of the support platform base are fixedly installed on the bed frame using a three-point positioning method. One positioning point on the support platform base is fixedly connected to the bed frame using a fastener. The other two positioning points on the support platform base are fixedly connected to the bed frame using an adjustable leveling component. The adjustable leveling component includes a central stud and a mating part. The central stud passes through the mating part and is threadedly connected to the bed frame. The mating part is threadedly connected to the central stud. By screwing the mating part, the support platform base can be moved vertically along the central stud.

2. The adjustable wafer thinning support platform according to claim 1, characterized in that: A worktable is rotatably arranged on the support base. A suction cup is provided on the worktable, and an air channel communicating with the suction cup is arranged in the inner cavity of the worktable. An air slip ring is connected to and fixedly installed at the lower part of the worktable. A drive motor is installed at the lower part of the air slip ring. The drive motor is used to drive the worktable and suction cup to rotate through the air slip ring. A slip ring protective cover is provided on the support base and outside the air slip ring.

3. The adjustable wafer thinning support platform according to claim 2, characterized in that: The suction cup is made of microporous ceramic, and the bed frame is made of mineral casting.

4. A wafer thinning adjustable support platform according to any one of claims 1-3, characterized in that: The lower part of the intermediate stud is threaded with a locking nut, which is used to limit and lock the lower end of the mating part.

5. The adjustable wafer thinning support platform according to claim 4, characterized in that: The upper part of the intermediate stud is threaded with an adjusting nut, which is snapped into the upper part of the mating part, and the rotation of the adjusting nut is synchronized with that of the mating part.

6. The adjustable wafer thinning support platform according to claim 5, characterized in that: The upper part of the mating component is provided with a protrusion, and the lower part of the adjusting nut is provided with an opening that engages with the protrusion.

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