LED display device production solder paste printing machine with removing structure

Abstract

The LED display device production solder paste printing machine with the removing structure comprises a base, a movable support, a solder paste barrel, a solder paste roller, a connecting groove and buffer plates, the connecting groove and the buffer plates are formed in the upper end of the base, the buffer plates are fixedly connected to the left side and the right side of the upper end of the solder paste barrel respectively, and the buffer plates are arranged at the left end and the right end of the connecting support respectively in a sleeved mode. And an up-down sliding structure is formed between the buffer plate and the connecting support, and the taking-out mechanism is arranged in the middle of the base. According to the LED display device production solder paste printing machine with the removing structure, redundant solder paste attached to the solder paste roller can be scraped off through the arrangement of the scraping plate, the uniformity in the printing process is improved, the solder paste roller can be driven by the scraping plate together with the solder paste cylinder to conduct buffering, a PCB is prevented from being crushed, and after printing is completed, by combining the arrangement of the taking-out mechanism, the printing efficiency is improved. And the PCB can be directly ejected out of the connecting groove, so that the blanking is convenient.

Description

Technical Field

[0001] This utility model relates to the technical field of LED display device production, specifically to a solder paste printing machine for LED display devices with a cleaning structure. Background Technology

[0002] LED displays are devices used to display various text, images, videos and other information. In the production and processing of LED displays, solder paste needs to be printed on the PCB board of the LED display. Solder paste printing is done with the help of a corresponding solder paste printer.

[0003] As disclosed in announcement number CN220576827U, a solder paste printing device for LED display production includes an electrical box. A lifting platform is fixedly connected to the upper surface of the electrical box, and a printing table is fixedly connected to the top of the lifting platform. A cleaning device is fixedly connected to the side of the upper surface of the electrical box, and a protective cover is fixedly connected to the top of the cleaning device. A linear guide rail is fixedly connected to the inner surface of the protective cover, and a transmission device is slidably connected to the inner surface of the linear guide rail. A telescopic cylinder is fixedly connected to the top of the transmission device, and a scraper is fixedly connected to the output end of the telescopic cylinder. A steel mesh is installed inside the protective cover, and a soldering device is fixedly connected inside the transmission device. Through the cleaning device and the soldering device, the surface of the LED display can be kept clean and dust-free, avoiding dust from affecting the solder paste printing quality. It can also make the solder powder and flux in the solder paste combine more evenly and perfectly, improving the working efficiency and processing quality of the device.

[0004] However, existing technologies suffer from uneven printing results and a lack of buffer protection mechanisms to protect the PCB board during the printing process, which can easily cause damage to the PCB board. After printing, it is inconvenient to remove the PCB board for unloading. For example, the comparative patents listed above have this problem.

[0005] To address this issue, we propose a solder paste printing machine for LED display devices with a clearing structure. Utility Model Content

[0006] The purpose of this utility model is to provide a solder paste printing machine for LED display devices with a clearing structure, so as to solve the problems mentioned in the background art, such as uneven printing effect, lack of buffer protection mechanism to protect the PCB board during printing, easy damage to the PCB board, and inconvenience in removing and unloading the PCB board after printing.

[0007] To achieve the above objectives, this utility model provides the following technical solution: a solder paste printing machine for LED display device production with a cleaning structure, comprising a base, a movable support, a solder paste cylinder, a solder paste roller, and a connecting groove formed at the upper end of the base;

[0008] Also includes:

[0009] The buffer plates are fixedly connected to the left and right sides of the upper end of the solder paste tube, and are respectively sleeved on the left and right ends of the connecting bracket. The buffer plates and the connecting bracket form an up-and-down sliding structure.

[0010] The solder paste tube is fixedly connected to the front side of the lower end, and the scraper is attached to the front side of the solder paste roller.

[0011] The removal mechanism is located in the middle of the base and consists of a top plate, a movable column, a return spring, a connecting plate, and a connecting rod.

[0012] Preferably, an electric telescopic rod is fixedly installed at the middle of the upper end of the movable support, and a connecting bracket is fixedly connected to the output end of the electric telescopic rod, wherein the connecting bracket and the movable support form an up-and-down sliding structure.

[0013] Preferably, the solder paste cylinder has a feed port at its rear end, and a solder paste roller is engaged at the lower end of the solder paste cylinder. The solder paste roller forms a rotating structure at the lower end of the solder paste cylinder, and the upper end of the solder paste roller contacts the solder paste inside the solder paste cylinder.

[0014] Preferably, a buffer spring is provided between the solder paste tube and the connecting bracket.

[0015] Preferably, the lower end of the movable bracket is inserted into the support rail, and a movable block is fixedly connected to the outer side of the lower end of the movable bracket, and the movable block and the support rail form a front-to-back sliding structure.

[0016] The support rails are fixedly connected to the left and right sides of the upper end of the base.

[0017] Preferably, the top plate is engaged with the middle of the base, and the upper surface of the top plate is not higher than the inner wall of the base. The lower end of the top plate is fixedly connected to a movable column, and the movable column is telescopically connected to the middle of the base.

[0018] Preferably, a return spring is fitted on the outer surface of the movable column, and the lower end of the movable column is hemispherical.

[0019] Preferably, a connecting plate is fitted to the lower end of the movable column, and the connecting plate is fixedly connected to the rear end of the connecting rod, and the connecting rod and the base form a rotating structure.

[0020] Compared with the prior art, the beneficial effects of this utility model are: the LED display device production solder paste printing machine with a cleaning structure can scrape off excess solder paste adhering to the solder paste roller through the setting of the scraper, thereby improving the uniformity of the printing process. When the solder paste roller contacts the PCB board, the up-and-down sliding between the buffer plate and the connecting bracket can buffer the solder paste roller along with the solder paste cylinder, preventing damage to the PCB board. Moreover, after printing is completed, the PCB board can be directly pushed out of the connecting groove by the setting of the removal mechanism, which is convenient for unloading.

[0021] 1. It is equipped with a solder paste roller and a scraper. The solder paste roller is rotated and set at the lower end of the solder paste cylinder. Combined with the scraper, it can scrape the solder paste adhering to the solder paste roller evenly, remove excess solder paste, improve the actual printing effect, and facilitate the even application of solder paste on the PCB board.

[0022] 2. It is equipped with a buffer plate and a connecting bracket. The buffer plate slides up and down with the connecting bracket, so that the solder paste cylinder and solder paste roller form a buffer structure at the lower end of the connecting bracket, preventing the solder paste roller from damaging the PCB board.

[0023] 3. An extraction mechanism is provided, which includes a top plate, a movable column, a return spring, a connecting plate, and a connecting rod. The extraction mechanism facilitates the ejection of the printed PCB board from the connecting slot, making unloading easier. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0025] Figure 2 This is a bottom view schematic diagram of the connecting bracket, solder paste cylinder, solder paste roller and scraper of this utility model;

[0026] Figure 3 This is an exploded view of the connecting bracket, solder paste tube, and buffer plate of this utility model;

[0027] Figure 4 This is an exploded structural diagram of the movable bracket, support rail, and movable block of this utility model;

[0028] Figure 5 This is an exploded structural diagram of the base and top plate of this utility model;

[0029] Figure 6 This is a bottom view of the overall structure of the extraction mechanism of this utility model.

[0030] In the diagram: 1. Base; 2. Movable support; 3. Electric telescopic rod; 4. Connecting support; 5. Solder paste cylinder; 6. Solder paste roller; 7. Scraper; 8. Buffer plate; 9. Buffer spring; 10. Support rail; 11. Movable block; 12. Removal mechanism; 13. Top plate; 14. Movable column; 15. Return spring; 16. Connecting plate; 17. Connecting rod; 18. Connecting groove. Detailed Implementation

[0031] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0032] Please see Figures 1-6 The present invention provides the following technical solution.

[0033] Example 1: To address the problem in existing technologies where the lack of a buffer protection mechanism during the printing process easily damages the PCB board, this example provides a solder paste printing machine for LED display devices with a cleaning structure. The machine comprises a base 1, a movable support 2, an electric telescopic rod 3, a connecting support 4, a solder paste cylinder 5, a solder paste roller 6, a buffer plate 8, a buffer spring 9, a support rail 10, a movable block 11, and a connecting groove 18. The upper end of the base 1 has a connecting groove 18. The electric telescopic rod 3 is fixedly installed in the middle of the upper end of the movable support 2, and the output end of the electric telescopic rod 3 is fixedly connected to the connecting support 4. The connecting support 4 and the movable support 2 form a sliding structure. A feed inlet is provided at the rear end of the solder paste cylinder 5, through which an appropriate amount of solder paste is added. A solder paste roller 6 is engaged at the lower end of the solder paste cylinder 5, forming a rotating structure at the lower end of the cylinder. The upper end of the roller 6 contacts the solder paste inside the cylinder 5. A buffer spring 9 is provided between the solder paste cylinder 5 and the connecting bracket 4. The lower end of the movable bracket 2 is inserted into the support rail 10, and a movable block 11 is fixedly connected to the outer side of the lower end of the movable bracket 2. The movable block 11 and the support rail 10 form a sliding structure. Buffer plates 8 are fixedly connected to the left and right sides of the upper end of the solder paste cylinder 5, and are respectively sleeved on the left and right ends of the connecting bracket 4. The buffer plates 8 and the connecting bracket 4 form an up-and-down sliding structure. Figure 1 , Figure 2 , Figure 3 and Figure 4As shown, the PCB board is first embedded in the connecting slot 18, and then the electric telescopic rod 3 is activated. The electric telescopic rod 3 drives the connecting bracket 4 to move downward. The connecting bracket 4 slides between the connecting bracket 4 and the movable bracket 2, which improves the stability of the connecting bracket 4 during the lifting and moving process. The connecting bracket 4 drives the solder paste cylinder 5 to move downward, so that the solder paste cylinder 5 drives the solder paste roller 6 to contact the PCB board. At the same time, the movable bracket 2 moves forward and moves in the support rail 10. The movable bracket 2 drives the movable block 11 to slide between the movable block 11 and the support rail 10. At this time, the solder paste roller 6 rotates at the lower end of the solder paste cylinder 5, so that the solder paste attached to the solder paste cylinder 5 is coated on the PCB board. Moreover, during the coating process, the scraper 7 can scrape off the excess solder paste attached to the solder paste roller 6, which improves the uniformity of the actual coating.

[0034] Example 2: To address the problem of uneven printing results in existing technologies, this example provides the following technical solution: a solder paste printing machine for LED display devices with a cleaning structure, comprising a solder paste roller 6 and a scraper 7. The scraper 7 is fixedly connected to the front side of the lower end of the solder paste cylinder 5, and the scraper 7 is close to the front side of the solder paste roller 6. Figure 1 and Figure 2 As shown, during the coating process, the solder paste roller 6 will squeeze the PCB board during contact with it. The reaction force during the squeezing process causes the solder paste cylinder 5 to move upward. At this time, the solder paste cylinder 5 drives the buffer plate 8 to slide between the connecting bracket 4. The solder paste cylinder 5 squeezes the buffer spring 9, causing the buffer spring 9 to undergo elastic deformation, thereby providing a good buffering effect for the solder paste roller 6 and preventing damage to the PCB board.

[0035] Example 3: To address the problem in existing technologies where it is inconvenient to remove and unload the PCB board after printing, this example provides the following technical solution: an LED display device solder paste printing machine with a cleaning structure, comprising a removal mechanism 12. The removal mechanism 12 is located in the middle of the base 1 and consists of a top plate 13, a movable column 14, a return spring 15, a connecting plate 16, and a connecting rod 17. The top plate 13 is engaged in the middle of the base 1, and its upper surface is not higher than the inner wall of the base 1. The lower end of the top plate 13 is fixedly connected to the movable column 14, which is telescopically connected to the middle of the base 1. The outer surface of the movable column 14 is fitted with the return spring 15, and the lower end of the movable column 14 is hemispherical. The lower end of the movable column 14 is fitted with the connecting plate 16, which is fixedly connected to the rear end of the connecting rod 17. The connecting rod 17 and the base 1 form a rotating structure. Figure 1 , Figure 5 and Figure 6As shown, after printing is completed, the solder paste cylinder 5 moves upward and completely separates from the PCB board. Then, the connecting rod 17 is pressed down directly, and the connecting rod 17 rotates with the base 1. The connecting rod 17 drives the connecting plate 16 to flip upward, and the connecting plate 16 pushes the movable column 14 to slide upward. The movable column 14 squeezes the reset spring 15, causing the reset spring 15 to undergo elastic deformation. At this time, the movable column 14 pushes the top plate 13 to move upward, and the PCB board embedded in the connecting groove 18 is pushed out through the top plate 13. The solder paste can then be directly removed from the PCB board.

[0036] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A solder paste printing machine for LED display device production with a clearing structure, comprising a base (1), a movable bracket (2), a solder paste cylinder (5), a solder paste roller (6), and a connecting groove (18) opened at the upper end of the base (1); Its features are, Also includes: The buffer plate (8) is fixedly connected to the left and right sides of the upper end of the solder paste tube (5), and the buffer plate (8) is sleeved on the left and right ends of the connecting bracket (4). The buffer plate (8) and the connecting bracket (4) form an up-and-down sliding structure. Among them, a scraper (7) is fixedly connected to the front side of the lower end of the solder paste cylinder (5), and the scraper (7) is close to the front side of the solder paste roller (6); The extraction mechanism (12) is located in the middle of the base (1) and is composed of a top plate (13), a movable column (14), a return spring (15), a connecting plate (16) and a connecting rod (17).

2. The solder paste printing machine for LED display devices with a clearing structure according to claim 1, characterized in that: An electric telescopic rod (3) is fixedly installed at the middle of the upper end of the movable support (2), and a connecting bracket (4) is fixedly connected to the output end of the electric telescopic rod (3). The connecting bracket (4) and the movable support (2) form an up-and-down sliding structure.

3. The solder paste printing machine for LED display devices with a cleaning structure according to claim 1, characterized in that: The solder paste cylinder (5) has a feed port at its rear end, and a solder paste roller (6) is engaged at the lower end of the solder paste cylinder (5). The solder paste roller (6) forms a rotating structure at the lower end of the solder paste cylinder (5), and the upper end of the solder paste roller (6) contacts the solder paste inside the solder paste cylinder (5).

4. The solder paste printing machine for LED display devices with a cleaning structure according to claim 3, characterized in that: A buffer spring (9) is provided between the solder paste tube (5) and the connecting bracket (4).

5. The solder paste printing machine for LED display devices with a clearing structure according to claim 1, characterized in that: The lower end of the movable bracket (2) is inserted into the support rail (10), and a movable block (11) is fixedly connected to the outer side of the lower end of the movable bracket (2). The movable block (11) and the support rail (10) form a front-to-back sliding structure. The support rails (10) are fixedly connected to the left and right sides of the upper end of the base (1).

6. The solder paste printing machine for LED display devices with a clearing structure according to claim 1, characterized in that: The top plate (13) is engaged in the middle of the base (1), and the upper end of the top plate (13) is not higher than the inner wall of the base (1). The lower end of the top plate (13) is fixedly connected to a movable column (14), and the movable column (14) is telescopically connected to the middle of the base (1).

7. A solder paste printing machine for LED display devices with a clearing structure according to claim 6, characterized in that: A reset spring (15) is fitted on the outer surface of the movable column (14), and the lower end of the movable column (14) is hemispherical.

8. A solder paste printing machine for LED display devices with a clearing structure according to claim 7, characterized in that: A connecting plate (16) is attached to the lower end of the movable column (14), and the connecting plate (16) is fixedly connected to the rear end of the connecting rod (17). The connecting rod (17) and the base (1) form a rotating structure.

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