Binding device for oxide rotating target material

Abstract

The utility model relates to an oxide rotating target material binding device which comprises a base, a bottom tool is fixedly arranged on the base, a bottom flow channel is formed in the bottom tool, the bottom flow channel is connected with the output end of a high-temperature melt pump through a pipeline, a base pipe is installed on the bottom tool in an inserted mode, and the base pipe is connected with the high-temperature melt pump through a pipeline. A bottom flow channel is formed in the top of the base pipe, a sleeve is installed outside the base pipe in a sleeving mode, the sleeve and the base pipe are arranged in a spaced mode, a gap between the sleeve and the base pipe is communicated with the bottom flow channel, a top tool is installed at the top of the base pipe in a sleeving mode, and a top flow channel is formed in the top tool. According to the oxide rotating target material binding device, metal solder in a molten state is injected into the gap between the sleeve and the base tube through the bottom flow channel by the high-temperature melt pump, and the gap is gradually filled from bottom to top, so that air holes formed by bubbles in the gap are prevented, the binding rate is improved, and the service life of the device is prolonged. And meanwhile, the coating quality and the product quality are improved.

Description

Technical Field

[0001] This utility model relates to the field of sputtering coating technology, specifically to an oxide rotating target bonding device. Background Technology

[0002] When binding oxide rotating targets, multiple sintered / cast sleeves need to be bound to a base tube with a smaller size. The traditional binding method is to place the target sleeves one by one on the base tube, and fill the gap between the target and the base tube with molten metal solder from top to bottom. After the solder solidifies, the sleeve is bound to the base tube.

[0003] However, this bonding method often fails to completely remove air bubbles at the bottom and end of segments. After the solder solidifies, it will form pores in the area, reducing the bonding rate. Therefore, in actual magnetron sputtering, it may cause abnormal arcing of the target at the air bubbles, uneven cooling and cracking of the target, and also lead to defects such as poor and uneven coating quality, which seriously affect product quality.

[0004] Therefore, there is an urgent need for an oxide rotating target bonding device to improve its production efficiency and bonding rate. Summary of the Invention

[0005] The purpose of this invention is to overcome the above-mentioned shortcomings and provide an oxide rotating target bonding device that improves its production efficiency and bonding rate.

[0006] The purpose of this utility model is achieved as follows:

[0007] An oxide rotating target bonding device includes a base, on which a bottom fixture is fixedly mounted. The bottom fixture has a bottom flow channel, which is connected to the output end of a high-temperature melt pump via a pipe. A base tube is inserted into the bottom fixture, and a sleeve is fitted around the base tube, with the sleeve spaced apart from the base tube and the gap between the sleeve and the base tube communicating with the bottom flow channel. A top fixture is fitted around the top of the base tube, and a top flow channel is provided on the top fixture. The top flow channel is connected to a solder collection tray via a pipe, and the gap between the sleeve and the base tube communicating with the top flow channel. A bracket is fixedly mounted on the base, and a clamping fixture for holding the sleeve is fixedly mounted on the bracket. An insulation sleeve is fitted around the outside of the sleeve.

[0008] Preferably, the bottom fixture includes a bottom heating plate fixedly disposed on the base, and the bottom heating plate is fixedly disposed on the bottom fixture body.

[0009] Preferably, the top tooling includes a top tooling body sleeved and installed on the top of the base tube, and a top heating plate is fixedly provided on the top of the top tooling body.

[0010] Preferably, both the bottom tooling body and the top tooling body are provided with stepped holes for installing the base tube and the sleeve. The two ends of the base tube are respectively inserted into the lower layer of the stepped holes on the bottom tooling body and the top tooling body, and a sealing ring is provided between the outer wall of the base tube and the stepped hole.

[0011] Preferably, a plurality of stacked spacer rings are embedded in the upper layer of the stepped hole, and the two ends of the sleeve abut against the spacer rings in the bottom tooling body and the top tooling body, respectively, and a sealing ring is provided between the two ends of the sleeve and the spacer rings.

[0012] Preferably, the top flow channel is inclinedly disposed within the top fixture, and the distance from the top flow channel to the top heating plate gradually decreases along the main body of the top fixture from the inside to the outside.

[0013] Compared with the prior art, the beneficial effects of this utility model are:

[0014] 1. This utility model discloses an oxide rotating target bonding device, which has bottom and top flow channels opened on the bottom and top tooling, and both the bottom and top flow channels are connected to the gap between the sleeve and the base tube. The bottom flow channel is connected to the output end of a high-temperature melt pump through a pipe. The high-temperature melt pump injects molten metal solder into the gap between the sleeve and the base tube through the bottom flow channel. The injection method is to gradually fill the gap from bottom to top. Air is squeezed out and discharged from the top flow channel to prevent the formation of pores due to the presence of air bubbles in the gap, thereby improving the bonding rate and improving the coating quality and product quality.

[0015] 2. The present invention provides an oxide rotating target bonding device, which is connected to a solder collection tray via a top flow channel. The distance from the top flow channel to the top heating plate gradually decreases from the inside to the outside along the main body of the top tooling. Excess solder can flow into the solder collection tray through the top flow channel. When the solder in the gap between the sleeve and the base tube cools down, the volume shrinks and the excess solder will flow back into the top flow channel from the solder collection tray, filling the gap and keeping the gap full. This can significantly improve its production efficiency and bonding rate.

[0016] 3. This utility model discloses an oxide rotating target binding device, which has stepped holes on both the bottom tooling body and the top tooling body. The lower layer of the stepped hole fixes the base tube and the upper layer fixes the sleeve. The sealing ring between them has a sealing function to prevent the solder from leaking out. The spacer rings stacked in the upper layer of the stepped hole support the sleeve. The end distance between the sleeve and the base tube can be adjusted by removing the spacer rings to meet the end distance requirements of different models. Attached Figure Description

[0017] Figure 1 This is a three-dimensional structural diagram of an oxide rotating target binding device according to the present invention.

[0018] Figure 2 This is a schematic diagram of the bottom tooling of an oxide rotating target binding device according to the present invention.

[0019] Figure 3 This is a cross-sectional structural diagram of the bottom tooling of an oxide rotating target binding device according to the present invention;

[0020] Figure 4 This is a schematic diagram of the top tooling of an oxide rotating target binding device according to the present invention;

[0021] Figure 5 This is a cross-sectional structural diagram of the top tooling of an oxide rotating target binding device according to the present invention.

[0022] The components include: base 1, bottom fixture 2, bottom flow channel 201, bottom heating plate 2.1, bottom fixture body 2.2, base tube 3, sleeve 4, top fixture 5, top flow channel 501, top fixture body 5.1, top heating plate 5.2, bracket 6, clamping fixture 7, insulation sleeve 8, high temperature melt pump 9, solder collection tray 10, stepped hole 11, and spacer ring 12. Detailed Implementation

[0023] See Figures 1 to 5 The present invention relates to an oxide rotating target binding device, including a base 1, a bottom fixture 2 fixedly disposed on the base 1, a bottom flow channel 201 opened on the bottom fixture 2, and the output end of a high-temperature melt pump 9 connected to the bottom flow channel 201 through a pipe, the high-temperature melt pump 9 conveying molten metal solder to the device through the bottom flow channel 201.

[0024] The bottom fixture 2 includes a bottom heating plate 2.1 fixedly mounted on the base 1 to ensure that the solder is always in a high-temperature molten state. The bottom heating plate 2.1 is fixedly mounted with a bottom fixture body 2.2. The bottom fixture body 2.2 has a stepped hole 11 for installing the base tube 3 and the sleeve 4. The bottom of the base tube 3 is inserted into the lower layer of the stepped hole 11, while the bottom of the sleeve 4 is inserted into the upper layer of the stepped hole 11. The bottom of the base tube 3 and the sleeve 4 can be fixed by the clamping action of the bottom fixture body 2.2, so that the base tube 3 and the sleeve 4 are kept vertical. The sleeve 4 is sleeved on the outside of the base tube 3, and the two are spaced apart, so that a gap is formed between them. The metal solder gradually fills the gap from bottom to top through the bottom flow channel 201.

[0025] A top fixture 5 is provided on the top of the base tube 3. The top fixture 5 includes a top fixture body 5.1. The top fixture body 5.1 also has a stepped hole 11 for installing the base tube 3 and the sleeve 4. The top of the base tube 3 is inserted into the lower layer of the stepped hole 11, while the bottom of the sleeve 4 is inserted into the upper layer of the stepped hole 11. A top heating plate 5.2 is fixedly provided on the top of the top fixture body 5.1 to ensure that the solder is always in a high-temperature molten state. In order to allow air to escape, an inclined top flow channel 501 is provided on the top fixture 5. The distance from the top flow channel 501 to the top heating plate 5.2 is along the top fixture body 5. .1 The flow gradually narrows from the inside out. The inclined top flow channel 501 facilitates the backflow of solder. The gap between the sleeve 4 and the base tube 3 is connected to the top flow channel 501. The top flow channel 501 is connected to the solder collection tray 10 through a pipe. The gas and excess solder in the gap are squeezed into the solder collection tray 10. When the solder in the gap between the sleeve 4 and the base tube 3 cools down, its volume shrinks. The solder in the solder collection tray 10 will flow back into the top flow channel and fill the gap, keeping the gap full. In order to ensure that the solder is always in a high-temperature molten state, the solder collection tray 10 also has a heating function to prevent the solder from cooling down.

[0026] To meet the end distance requirements of different models, several stacked spacer rings 12 are embedded in the upper layer of the stepped hole 11. The two ends of the sleeve 4 abut against the spacer rings 12. The spacer rings 12 support the sleeve 4. The end distance between the sleeve 4 and the base tube 3 can be adjusted by disassembling the spacer rings 12.

[0027] To ensure sealing, sealing rings are provided between the outer wall of the base tube 3 and the stepped hole 11, as well as between the two ends of the sleeve 4 and the spacer ring 12, to prevent the solder from leaking out.

[0028] A bracket 6 is fixedly installed on the base 1, and a clamping fixture 7 for clamping the sleeve 4 is fixedly installed on the bracket 6. The sleeve 4 is clamped and fixed by the clamping fixture 7, so that the sleeve 4 is kept in a vertical state. An insulation sleeve 8 is installed on the outside of the sleeve 4 to ensure that the solder is always in a high-temperature molten state.

[0029] The working principle of the oxide rotating target binding device of this utility model is as follows:

[0030] First, pre-treat the base tube 3 and sleeve 4 by cleaning and drying the surface of the base tube 3 and the inner wall of the sleeve 4. Install spacer wires on the outer wall of the base tube 3. Connect and fix the bottom fixture 2 to the end of the base tube 3. Install the bottom fixture 2 onto the base 1 by hoisting. Install the sleeve 4 onto the base tube 3 and clamp it with the clamping fixture 7. Install gaskets between the sleeves 4 to ensure uniform gap thickness. Then install the top fixture 5 and connect the external high-temperature melt pump 9 and the solder collection tray 10. Turn on the solder heating plate (not shown in the figure), the bottom heating plate 2.1, the top heating plate 5.2, and the insulation sleeve 8, and set the heating temperature. After the temperature stabilizes, start the high-temperature melt pump 9. The high-temperature melt pump 9 delivers molten metal solder through the bottom flow channel 201 to the gap between the device base tube 3 and the sleeve 4, allowing the metal solder to gradually fill the gap. After the solder overflows, the delivery rate of the high-temperature melt pump 9 is gradually reduced and the temperature is maintained. After maintaining the temperature for 30 minutes, the high-temperature melt pump 9 is completely shut off. The heat-maintaining sleeve 8 is closed one by one from the bottom every 30 minutes. The top heating plate 5.2 and the solder collection plate 10 remain heated. The solder in the solder collection plate 10 will flow back into the gap, ensuring that during the cooling stage, as the temperature decreases and the solder volume shrinks, there is still molten solder to replenish it. After complete cooling, all heating is stopped, the target surface is cleaned, and the bonding process is completed.

[0031] Additionally, it should be noted that the above-described specific implementation is merely an optimized solution of this patent, and any modifications or improvements made by those skilled in the art based on the above concept are within the scope of protection of this patent.

Claims

1. An oxide rotating target bonding device, characterized in that: The device includes a base (1), on which a bottom fixture (2) is fixedly mounted. The bottom fixture (2) has a bottom flow channel (201) and is connected to the output end of a high-temperature melt pump (9) via a pipe. A base pipe (3) is inserted and installed on the bottom fixture (2). A sleeve (4) is fitted around the outside of the base pipe (3) and is spaced apart from the base pipe (3). The gap between the sleeve (4) and the base pipe (3) is connected to the bottom flow channel (201). A top fixture (5) is fitted onto the top of the base tube (3). A top flow channel (501) is provided on the top fixture (5), and the top flow channel (501) is connected to the solder collection tray (10) through a pipe. The gap between the sleeve (4) and the base tube (3) is connected to the top flow channel (501). A bracket (6) is fixedly provided on the base (1), and a clamping fixture (7) for clamping the sleeve (4) is fixedly provided on the bracket (6). An insulation sleeve (8) is fitted onto the outside of the sleeve (4).

2. The oxide rotating target bonding device according to claim 1, characterized in that: The bottom fixture (2) includes a bottom heating plate (2.1) fixedly mounted on the base (1), and a bottom fixture body (2.2) is fixedly mounted on the bottom heating plate (2.1).

3. The oxide rotating target bonding device according to claim 2, characterized in that: The top fixture (5) includes a top fixture body (5.1) sleeved and installed on the top of the base pipe (3), and a top heating plate (5.2) is fixedly provided on the top of the top fixture body (5.1).

4. The oxide rotating target bonding device according to claim 3, characterized in that: Both the bottom tooling body (2.2) and the top tooling body (5.1) are provided with stepped holes (11) for installing the base tube (3) and the sleeve (4). The two ends of the base tube (3) are respectively inserted into the lower layer of the stepped holes (11) on the bottom tooling body (2.2) and the top tooling body (5.1), and a sealing ring is provided between the outer wall of the base tube (3) and the stepped holes (11).

5. The oxide rotating target bonding device according to claim 4, characterized in that: A plurality of stacked spacer rings (12) are embedded in the upper layer of the stepped hole (11), and the two ends of the sleeve (4) abut against the spacer rings (12) in the bottom tooling body (2.2) and the top tooling body (5.1) respectively, and a sealing ring is provided between the two ends of the sleeve (4) and the spacer rings (12).

6. The oxide rotating target bonding device according to claim 3, characterized in that: The top flow channel (501) is inclinedly disposed within the top fixture (5), and the distance from the top flow channel (501) to the top heating plate (5.2) gradually decreases from the inside to the outside along the main body (5.1) of the top fixture.

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