Transistor short-wave power amplifier board heat dissipation device
By combining air cooling with the airflow structure of the heat sink, the problem of low heat dissipation efficiency of transistor shortwave power amplifier boards is solved, achieving efficient heat exchange and component protection.
Patent Information
- Application Number
- CN202422909223.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-28
- Publication Date
- 2025-10-31
- Estimated Expiration
- 2034-11-28
AI Technical Summary
Existing transistor shortwave power amplifier boards are in a completely open environment inside the chassis, resulting in limited heat dissipation efficiency, which may lead to component damage or reduced lifespan.
It adopts a combination of air cooling and heat sink, and through a unique air duct structure design, it forms a semi-enclosed air duct, using fans to accelerate airflow and improve heat exchange efficiency.
It improves the heat dissipation efficiency of the power amplifier board, enhances the heat exchange effect, prevents components from overheating, and extends their service life.
Smart Images
Figure CN223503245U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of power amplifier board heat dissipation technology, specifically a power amplifier board heat dissipation device for transistor shortwave. Background Technology
[0002] Transistor shortwave power amplifier boards are composed of numerous integrated electrical components. During operation, they generate a large amount of heat, causing the temperature of the electrical components to rise rapidly. This may cause permanent damage to the components or significantly reduce their lifespan. Therefore, the heat dissipation system is an important component of auxiliary operation.
[0003] In existing power amplifier boards, the power amplifier board is in a completely open environment in the chassis, and the heat dissipation is mainly based on air cooling, which has limited heat dissipation efficiency. Therefore, a power amplifier board heat dissipation device with transistor shortwave is proposed to solve the above problems. Utility Model Content
[0004] (a) Technical problems to be solved
[0005] To address the shortcomings of existing technologies, this utility model provides a heat dissipation device for transistor shortwave power amplifier boards, which combines air cooling and heat sinks. Through a unique airflow structure, it can effectively improve the heat dissipation efficiency of the power amplifier board. Furthermore, the semi-enclosed airflow design can accelerate airflow and improve heat exchange efficiency. This solves the problem in existing power amplifier boards where the power amplifier board is in a completely open environment in the chassis, and heat dissipation is mainly based on air cooling, resulting in limited heat dissipation efficiency.
[0006] (II) Technical Solution
[0007] The technical solution of this utility model to solve the above-mentioned technical problems is as follows: a power amplifier board heat dissipation device for transistor shortwave, including a duct base housing and a power amplifier board, the power amplifier board including a high-frequency radio frequency tube, a heat sink is fixedly connected between the front and rear walls of the inner cavity of the duct base housing by screws, the top of the heat sink is fixedly connected to the power amplifier board by screws, the high-frequency radio frequency tube on the surface of the power amplifier board is in contact with the top of the heat sink, the top of the duct base housing is fixedly connected to the duct base cover plate by screws, and a fan communicating with the inside is provided on the right side of the duct base housing.
[0008] The beneficial effects of this utility model are:
[0009] This transistor shortwave power amplifier board heat dissipation device features a power amplifier board mounted on top of a heat sink. The main heat dissipation component on the power amplifier board is a high-frequency radio frequency (RF) tube, with its bottom directly contacting the top of the heat sink for rapid heat exchange. The heat sink is installed inside the air duct housing, covered by an air duct housing cover, forming a semi-enclosed air duct. The air duct has an open intake at the front and a fan at the rear to draw air outwards, with the heat sink placed inside. Compared to a completely open structure, this air duct accelerates the airflow through the heat sink, improving heat exchange efficiency. It combines air cooling with a heat sink, effectively improving the power amplifier board's heat dissipation efficiency through its unique air duct structure. The semi-enclosed air duct design also enhances airflow and improves heat exchange efficiency.
[0010] Based on the above technical solution, the present invention can be further improved as follows.
[0011] Furthermore, the heat sink is made of aluminum fins.
[0012] The beneficial effect of adopting the above-mentioned further solution is that the aluminum heat sink is finned, which increases the contact area with the air and can dissipate heat more effectively.
[0013] Furthermore, the front and rear sides of the air duct housing are fixedly connected with air duct brackets that are symmetrically distributed front and rear by screws.
[0014] The advantage of adopting the above-mentioned further solution is that the air duct housing is supported by an air duct bracket at the bottom, and the empty space below can be used to assemble other parts. Attached Figure Description
[0015] Figure 1 This is a schematic diagram of the structure of this utility model;
[0016] Figure 2 This is an exploded view of the structure of this utility model.
[0017] In the diagram: 1. Air duct housing; 2. Power amplifier board; 3. High-frequency RF tube; 4. Heat sink; 5. Air duct cover plate; 6. Fan; 7. Air duct bracket. Detailed Implementation
[0018] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0019] In the embodiments, by Figure 1-2This invention provides a heat dissipation device for a shortwave power amplifier board. The device includes a duct housing 1 and a power amplifier board 2. The power amplifier board 2 includes a high-frequency radio frequency tube 3. A heat sink 4 is fixedly connected between the front and rear walls of the inner cavity of the duct housing 1 by screws. The top of the heat sink 4 is fixedly connected to the power amplifier board 2 by screws. The high-frequency radio frequency tube 3 on the surface of the power amplifier board 2 is in contact with the top of the heat sink 4. A duct housing cover plate 5 is fixedly connected to the top of the duct housing 1 by screws. A fan 6 communicating with the inside of the duct housing 1 is provided on the right side.
[0020] Heatsink 4 is made of aluminum fins;
[0021] The aluminum heat sink 4 is finned, which increases the contact area with the air and can dissipate heat more effectively.
[0022] The front and rear sides of the air duct housing 1 are fixedly connected with air duct brackets 7 that are symmetrically distributed in front and back by screws.
[0023] The air duct housing 1 is supported by an air duct bracket 7 at the bottom, and the empty space below can be used to assemble other parts.
[0024] Working principle:
[0025] Step 1: The power amplifier board 2 is installed on top of the heat sink 4. The main heat dissipation device on the power amplifier board 2 is the high-frequency radio frequency tube 3. The bottom of the high-frequency radio frequency tube 3 is in direct contact with the top of the heat sink 4, which can quickly exchange heat.
[0026] Step 2: The radiator 4 is installed inside the air duct housing 1 and covered with the air duct housing cover 5, thus forming a semi-enclosed air duct. The front of the air duct is open for air intake, and the fan 6 is placed at the rear to draw air out. The radiator 4 is placed inside. Compared with a completely open structure, this air duct speeds up the airflow through the radiator 4 and improves the heat exchange efficiency. The aluminum radiator 4 is finned, which increases the contact area with the air and can dissipate heat more effectively.
[0027] Step 3: The air duct housing 1 is supported by an air duct bracket 7 at the bottom, and the empty space below can be used to assemble other parts.
[0028] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.
[0029] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.
Claims
1. A power amplifier board heat dissipation device for transistor shortwave, comprising a duct housing (1) and a power amplifier board (2), wherein the power amplifier board (2) includes a high-frequency radio frequency transistor (3), characterized in that: A heat sink (4) is fixedly connected between the front and rear walls of the inner cavity of the air duct housing (1) by screws. A power amplifier board (2) is fixedly connected to the top of the heat sink (4) by screws. The high-frequency radio frequency tube (3) on the surface of the power amplifier board (2) is in contact with the top of the heat sink (4). A air duct cover plate (5) is fixedly connected to the top of the air duct housing (1) by screws. A fan (6) communicating with the inside is provided on the right side of the air duct housing (1).
2. The heat dissipation device for the power amplifier board of the transistor shortwave as described in claim 1, characterized in that: The heat sink (4) is made of aluminum fins.
3. The heat dissipation device for the power amplifier board of transistor shortwave according to claim 1, characterized in that: The front and rear sides of the air duct housing (1) are fixedly connected with air duct brackets (7) that are symmetrically distributed in front and back by screws.