Waterproof LED support
By incorporating a hydrophobic layer, a light guide cover, and a water-absorbing and heat-conducting material into the LED bracket, the problem of poor waterproof performance of the LED bracket is solved, achieving effective waterproofing and heat management in humid environments and protecting the LED beads.
Patent Information
- Application Number
- CN202422717352.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-07
- Publication Date
- 2025-10-31
- Estimated Expiration
- 2034-11-07
AI Technical Summary
Existing LED brackets have poor waterproof performance when used outdoors, causing water to seep into the bowl or cup and damage the LED beads, thus affecting the normal use of the product.
Design a waterproof LED bracket, including a bowl-shaped body, a hydrophobic layer, a lead frame, a light guide cover, and a water-absorbing and heat-conducting material. The sealing structure and hydrophobic layer prevent water penetration, the lead frame is connected to the conductive components, the light guide cover seals the top opening, and the water-absorbing material absorbs water and conducts heat.
It effectively prevents moisture from entering the bowl or cup, protects the LED beads, ensures the normal operation of LED products in humid environments, and conducts heat through thermally conductive materials to avoid gap expansion caused by differences in thermal expansion rates.
Smart Images
Figure CN223503333U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of LED packaging technology, and more specifically, to a waterproof LED bracket. Background Technology
[0002] The LED bracket is the base for LED chips before encapsulation. It's on top of the LED bracket that the chip is fixed, the positive and negative electrodes are soldered, and then it's encapsulated in one step using encapsulating adhesive. The design and materials of the LED bracket directly affect the optical properties and lifespan of the LED, especially heat dissipation, which is crucial to LED performance.
[0003] In applications such as outdoor lighting and displays, the waterproof performance of LED brackets is particularly important. Poor waterproof brackets expose LED chips to rain and humid conditions, leading to damage. Current SMD LED brackets typically consist of a plastic cup body and metal leads, manufactured by injection molding. Because these are two different materials, gaps can easily appear at the bonding point. This allows moisture from the air to penetrate into the cup body and come into contact with the LED chips, causing damage and affecting the normal operation of the LED product.
[0004] To ensure that LED products can operate reliably under these conditions, the structure of the LED bracket needs to be optimized to improve its waterproof performance. Utility Model Content
[0005] This invention aims to solve at least one of the technical problems existing in the prior art. To this end, this invention proposes a waterproof LED holder, designed to improve the waterproof performance of the LED holder and prevent moisture in the air from penetrating into the bowl or cup and coming into contact with the LED beads, thus preventing damage to the LED beads.
[0006] A waterproof LED bracket according to an embodiment of the present invention is used for encapsulating LED chips. The waterproof LED bracket includes a bowl-shaped body, a hydrophobic layer, a lead frame, and a light guide cover. The bowl-shaped body has a concave cavity and a receiving cavity. The receiving cavity is filled with a water-absorbing and thermally conductive material. The bowl-shaped body also has a first through hole communicating with the receiving cavity and a second through hole communicating with both the concave cavity and the receiving cavity. A conductive element is sealed in the first through hole. The hydrophobic layer is embedded in the bowl-shaped body and located above the receiving cavity. The hydrophobic layer surrounds the concave cavity and is at least one layer. The lead frame is embedded in the bowl-shaped body. One end of the lead frame extends to the bottom of the concave cavity, and the other end of the lead frame passes through the second through hole and the hydrophobic layer and is connected to the conductive element. The lead frame and the second through hole are sealed together. The light guide cover is disposed on the bowl-shaped body to seal and cover the top opening of the concave cavity.
[0007] According to some embodiments of the present invention, the hydrophobic layer is selected from at least one material selected from polyurethane thermally conductive structural adhesive and high thermal conductivity superhydrophobic polyester waterproof and breathable nanofiber membrane.
[0008] According to some embodiments of the present invention, the water-absorbing thermally conductive material is selected from at least one of polyacrylamide composite hydrogel, carboxymethyl chitosan composite hydrogel, and hydroxylated boron nitride composite hydrogel.
[0009] According to some embodiments of the present invention, the lead frame is provided with a first protrusion, the second through hole is provided with a first groove along its side wall, the first protrusion is fitted into the first groove, and a first sealing ring is sandwiched between the first protrusion and the first groove.
[0010] According to some embodiments of the present invention, the lead frame is provided with a first groove, the second through hole is provided with a first protrusion along its side wall, the first protrusion is fitted into the first groove, and a first sealing ring is sandwiched between the first protrusion and the first groove.
[0011] According to some embodiments of the present invention, the top opening of the cavity is sealed to the periphery of the light guide cover by a heat shrink sleeve.
[0012] According to some embodiments of the present invention, a second protrusion is provided on the top outer wall of the cavity, and a second groove is provided on the periphery of the light guide cover to cooperate with the second protrusion. The size of the second protrusion is larger than the size of the second groove, and the two ends of the heat shrink sleeve are respectively connected to the second protrusion and the second groove.
[0013] According to some embodiments of the present invention, the light guide cover has a second protrusion on its periphery, and the top outer wall of the cavity has a second groove that mates with the second protrusion. The size of the second protrusion is larger than the size of the second groove, and the two ends of the heat shrink sleeve are respectively connected to the second protrusion and the second groove.
[0014] According to some embodiments of the present invention, the conductive element is provided with a third protrusion, the first through hole is provided with a third groove along its side wall, the third protrusion is fitted with the third groove, and a second sealing ring is sandwiched between the third protrusion and the third groove.
[0015] According to some embodiments of this utility model, the conductive element is a corrosion-resistant conductive element.
[0016] The waterproof LED bracket according to the embodiments of this utility model has at least the following beneficial effects: By setting a hydrophobic layer around the cavity of the die-bonded LED chip in the cup body, water seeping in from the crevices of the cup body can be prevented from entering the cavity. At the same time, the lead frame does not extend out of the cup body, but is connected to the conductive component that protrudes from the cup body, preventing moisture in the air from seeping into the cavity from the crevices between the lead frame and the cup body. Meanwhile, since the end of the lead frame connected to the conductive component is immersed in a water-absorbing and heat-conducting material, it can further absorb the water that seeps into the cup body, and effectively conduct the heat generated when the LED chip is working, avoiding heat accumulation that would cause the gap between the cup body and the lead frame to widen due to the difference in thermal expansion coefficients. In addition, after the die-bonded adhesive layer of the LED chip is encapsulated, the top opening of the cavity is sealed by the light guide cover, which can prevent external moisture from entering the cavity through the top of the cavity. Attached Figure Description
[0017] Figure 1 This is a schematic diagram of the structure of a waterproof LED bracket in one embodiment of the present invention;
[0018] Figure 2 for Figure 1 A magnified view of a section at point A in the middle;
[0019] Figure 3 for Figure 1 A magnified view of a section at point B in the middle;
[0020] Figure 4 This is a schematic diagram of the structure of the light guide cover in one embodiment of the present invention;
[0021] In the picture:
[0022] Bowl body 100, concave cavity 110, second protrusion 111, accommodating cavity 120, first through hole 130, conductive component 131, third protrusion 132, third groove 133, second sealing ring 134, second through hole 140, hydrophobic layer 200, lead frame 300, light guide cover 400, second groove 410, first protrusion 500, first groove 600, first sealing ring 700, heat shrink sleeve 800. Detailed Implementation
[0023] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.
[0024] In the description of this utility model, it should be understood that the orientation descriptions, such as up, down, etc., are based on the orientation or positional relationship shown in the drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.
[0025] In the description of this utility model, "multiple" refers to two or more. The use of "first" and "second" is for distinguishing technical features only and should not be construed as indicating or implying relative importance, or implicitly indicating the number of technical features or their sequential relationship.
[0026] In the description of this utility model, unless otherwise explicitly defined, terms such as "setting," "installation," and "connection" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this utility model in conjunction with the specific content of the technical solution.
[0027] Reference Figures 1 to 4As shown, this utility model discloses a waterproof LED bracket for encapsulating LED chips. The waterproof LED bracket specifically includes a bowl-shaped body 100, a hydrophobic layer 200, a lead frame 300, and a light guide cover 400. The upper end of the bowl-shaped body 100 has a recessed cavity 110, and the lower end of the bowl-shaped body 100 has a receiving cavity 120. The receiving cavity 120 is filled with a water-absorbing and heat-conducting material, which can absorb moisture and effectively conduct heat, preventing heat accumulation. The bowl-shaped body 100 also has a first through hole 130 communicating with the receiving cavity 120, and a second through hole 140 communicating with both the recessed cavity 110 and the receiving cavity 120. A conductive element 131 is sealed within the first through hole 130. A hydrophobic layer 200 is embedded within the bowl / cup body 100 and is provided in at least one layer. To prevent water seeping into the cavity 110 from the crevices of the bowl / cup body 100, the hydrophobic layer 200 is provided around the sidewalls and bottom wall of the cavity 110 and is located above the receiving cavity 120. It is understood that to prevent the hydrophobic layer 200 from failing or breaking, multiple hydrophobic layers 200 can be provided to ensure that water can still be prevented from entering the cavity 100 even if some hydrophobic layers 200 are not functioning. A lead frame 300 is embedded in the bowl-shaped cup body 100. The upper end of the lead frame 300 extends to the bottom of the recess 110 to connect to the electrodes of the die-bonded LED chip within the recess 110. The lower end of the lead frame 300 passes through the second through-hole 140 and the hydrophobic layer 200 and connects to the conductive element 131. To prevent moisture from seeping into the recess 110 through the gap between the lead frame 300 and the second through-hole 140, a sealed connection is maintained between the lead frame 300 and the second through-hole 140. A light guide cover 400 is disposed on the bowl-shaped cup body 100 to seal and cover the top opening of the recess 110. Understandably, the light guide cover 400 can project the light emitted by the LED chip within the recess 110.
[0028] In this embodiment, when installing the LED bracket, an external power supply can be electrically connected to the conductive component 131, thereby ensuring that the lead frame 300 does not protrude from the cup body 100. Furthermore, after the LED chip is die-bonded into the cavity 110,
[0029] The cavity 110 is filled with an encapsulating layer to cover the LED chip. This encapsulating layer serves to provide mechanical protection, enhance heat dissipation, provide optical control, and offer moisture, water, and dust protection, as well as electrical insulation. Optionally, the encapsulating layer can be made of encapsulating materials such as epoxy resin or silicone.
[0030] It should be noted that in the process of manufacturing the LED bracket, the lead frame 300 is first stamped to obtain the required shape, and then the lead frame 300 is injection molded to obtain the cup-shaped LED bracket. The injection molding material can be high-temperature nylon (PPA), poly(1,4-cyclohexanedimethyl terephthalate) (PCT), epoxy molding compound (EMC), ceramics, etc. At the same time, a cavity 110, a receiving cavity 120, a first through hole 130 and a second through hole 140 are formed, and a hydrophobic layer 200 is sandwiched in the cup body 100.
[0031] In some embodiments of this invention, the hydrophobic layer 200 is selected from at least one material chosen from polyurethane thermally conductive structural adhesive and high thermal conductivity superhydrophobic polyester waterproof and breathable nanofiber membrane. Polyurethane thermally conductive structural adhesive is a material with good thermal conductivity and structural bonding ability, widely used in thermal management systems in electronics, automotive, and new energy fields. The high thermal conductivity superhydrophobic polyester waterproof and breathable nanofiber membrane is a nanofiber membrane that, while possessing good waterproof and breathable properties, also exhibits excellent air permeability and thermal conductivity. The specific manufacturing process of this membrane involves dissolving FPU and DMAc while simultaneously dispersing BN nanosheets to form a spinning solution, which is then ultrasonically treated and electrospun to form an FPU / BNx membrane (x is the concentration of BN nanosheets). The concentration of FPU is 6%, the mass ratio of fluorinated polyurethane to polyurethane is 1 / 8, and the mass fractions of BN nanosheets are 0%, 6%, 12%, 18%, and 24%, respectively.
[0032] In some embodiments of this utility model, the water-absorbing and thermally conductive material is selected from at least one of polyacrylamide composite hydrogel, carboxymethyl chitosan composite hydrogel, and hydroxylated boron nitride composite hydrogel. By adding these composite hydrogels with good thermal conductivity and water absorption, the water that seeps into the cup body 100 can be absorbed, and the heat generated when the LED chip is working can be effectively conducted, avoiding the accumulation of heat that would cause the gap between the cup body 100 and the lead frame 200 to widen due to the difference in thermal expansion coefficients.
[0033] In some embodiments of this utility model, such as Figure 2 As shown, the lead frame 200 has a first protrusion 500, and the second through hole 140 has a first groove 600 along its side wall. During injection molding, the first protrusion 500 and the first groove 600 are fitted together, and a first sealing ring 700 is sandwiched between the first protrusion 500 and the first groove 600 during injection molding. By setting the first sealing ring 700, when the cup body 100 and the lead frame 200 undergo thermal expansion, moisture in the air can be prevented from seeping into the cavity 110 through the gap between the lead frame 200 and the second through hole 140. At the same time, it can also prevent the water-absorbing thermally conductive material filled in the accommodating cavity 120 from leaking from the gap between the lead frame 200 and the second through hole 140.
[0034] It is understandable that the lead frame 200 may also have a first groove 600 and the second through hole 140 may have a first protrusion 500 along its side wall.
[0035] Because the bowl / cup body 100 and the light guide cover 400 have different coefficients of thermal expansion, the gap between them will widen. To prevent moisture from entering the cavity 110 through this gap, and to avoid deformation due to mutual compression, which could ultimately compromise the seal, in some embodiments of this invention, such as... Figure 1 and Figure 2 As shown, the top opening of the cavity 110 is sealed to the periphery of the light guide cover 400 by a heat shrink sleeve 800. Optionally, the heat shrink sleeve 800 is made of a rubber material with good ductility, and in order to resist the high temperature generated during the operation of the LED chip, a high temperature resistant rubber material can be used.
[0036] In some embodiments of this utility model, in order to seal the bowl body 100 and the light guide cover 400 together using a heat shrink sleeve 800, such as... Figure 4 As shown, a second protrusion 111 is provided on the top outer wall of the cavity 110, and a second groove 410 that mates with the second protrusion 111 is provided around the light guide cover 400. In order to prevent the two from misaligning due to thermal expansion, the size of the second protrusion 111 is larger than the size of the second groove 410. In this way, the second protrusion 111 is always nested in the second groove 410, and the two always remain nested when thermal expansion occurs. The two ends of the heat shrink sleeve 800 are respectively connected to the second protrusion 111 and the second groove 410.
[0037] It is understandable that a second groove 410 can also be provided on the top outer wall of the cavity 110, and a second protrusion 111 that cooperates with the second groove 410 can be provided on the periphery of the light guide cover 400.
[0038] In some embodiments of this utility model, such as Figure 3 As shown, the conductive component 131 has a third protrusion 132, and the first through hole 130 has a third groove 133 along its side wall. During injection molding, the third protrusion 132 and the third groove 133 are fitted together, and a second sealing ring 134 is sandwiched between the third protrusion 132 and the third groove 133 during injection molding. By setting the second sealing ring 134, when the bowl body 100 and the conductive component 131 undergo thermal expansion, moisture in the air can be prevented from seeping into the bowl body 100 through the first through hole 130. At the same time, it can also prevent the water-absorbing and heat-conducting material filled in the accommodating cavity 120 from leaking out of the first through hole 130.
[0039] It is understandable that a third groove 133 can also be provided on the conductive component 131, and a third protrusion 132 can be provided along the side wall of the first through hole 130.
[0040] In order to prevent moisture in the air from corroding the conductive component 131 and causing the seal between the conductive component 131 and the bowl / cup body 100 to be compromised, in some embodiments of this utility model, the conductive component 131 is selected as a corrosion-resistant conductive component, such as a copper conductive component or an aluminum conductive component.
[0041] In summary, the waterproof LED bracket provided by this invention can prevent water from seeping into the cavity 110 through the gaps in the cup body 100. Simultaneously, the lead frame 200 does not extend beyond the cup body 100, but is connected to the conductive element 131 protruding from the cup body 100, preventing moisture in the air from seeping into the cavity 110 through the gaps between the lead frame 200 and the cup body 100. Furthermore, since the end of the lead frame 200 connected to the conductive element 131 is immersed in a water-absorbing and heat-conducting material, it can further absorb moisture seeping into the cup body 100. It also effectively conducts the heat generated during LED chip operation, preventing heat accumulation that could cause the gap between the cup body 111 and the lead frame 200 to widen due to their different thermal expansion rates. In addition, after the LED chip die bonding adhesive layer is encapsulated, the top opening of the cavity is sealed with a light guide 400 cover, preventing external moisture from entering the cavity 110 through the top.
[0042] The embodiments of the present utility model have been described in detail above with reference to the accompanying drawings. However, the present utility model is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present utility model.
Claims
1. A waterproof LED bracket for encapsulating LED chips, characterized in that, The waterproof LED bracket includes: The bowl-shaped cup body has a concave cavity and a receiving cavity. The receiving cavity is filled with a water-absorbing and heat-conducting material. The bowl-shaped cup body has a first through hole communicating with the receiving cavity and a second through hole communicating with both the concave cavity and the receiving cavity. A conductive element is sealed in the first through hole. A hydrophobic layer is embedded in the bowl / cup body and located above the receiving cavity. The hydrophobic layer is disposed around the cavity, and at least one hydrophobic layer is provided. A lead frame is embedded in the bowl-shaped cup body. One end of the lead frame extends to the bottom of the cavity, and the other end of the lead frame passes through the second through hole and the hydrophobic layer and is connected to the conductive component. The lead frame and the second through hole are sealed together. A light guide cover is disposed on the bowl body to seal and cover the top opening of the recess.
2. The waterproof LED bracket according to claim 1, characterized in that, The hydrophobic layer is selected from at least one material among polyurethane thermally conductive structural adhesive and high thermal conductivity superhydrophobic polyester waterproof and breathable nanofiber membrane.
3. The waterproof LED bracket according to claim 1, characterized in that, The water-absorbing thermally conductive material is selected from at least one of polyacrylamide composite hydrogel, carboxymethyl chitosan composite hydrogel, and hydroxylated boron nitride composite hydrogel.
4. The waterproof LED bracket according to any one of claims 1 to 3, characterized in that, The lead frame is provided with a first protrusion, and the second through hole is provided with a first groove along its side wall. The first protrusion is fitted into the first groove, and a first sealing ring is sandwiched between the first protrusion and the first groove.
5. The waterproof LED bracket according to any one of claims 1 to 3, characterized in that, The lead frame is provided with a first groove, and the second through hole is provided with a first protrusion along its side wall. The first protrusion is fitted into the first groove, and a first sealing ring is sandwiched between the first protrusion and the first groove.
6. The waterproof LED bracket according to any one of claims 1 to 3, characterized in that, The top opening of the cavity is sealed to the periphery of the light guide cover by a heat shrink sleeve.
7. The waterproof LED bracket according to claim 6, characterized in that, The top outer wall of the cavity is provided with a second protrusion, and the periphery of the light guide cover is provided with a second groove that mates with the second protrusion. The size of the second protrusion is larger than the size of the second groove. The two ends of the heat shrink sleeve are respectively connected to the second protrusion and the second groove.
8. The waterproof LED bracket according to claim 6, characterized in that, The light guide cover has a second protrusion around its periphery, and the top outer wall of the cavity has a second groove that mates with the second protrusion. The size of the second protrusion is larger than the size of the second groove. The two ends of the heat shrink sleeve are respectively connected to the second protrusion and the second groove.
9. The waterproof LED bracket according to any one of claims 1 to 3, characterized in that, The conductive component has a third protrusion, and the first through hole has a third groove along its side wall. The third protrusion fits into the third groove, and a second sealing ring is sandwiched between the third protrusion and the third groove.
10. The waterproof LED bracket according to any one of claims 1 to 3, characterized in that, The conductive component is a corrosion-resistant conductive component.