COB light source module structure substrate of flip LED chip
By using a COB light source module structure substrate with flip-chip LEDs, and utilizing LED chip recesses and clip structures, the problem of easy detachment of epoxy resin adhesive is solved, improving chip heat dissipation and fixation, and ensuring safety and reliability.
Patent Information
- Application Number
- CN202422984574.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-04
- Publication Date
- 2025-10-31
- Estimated Expiration
- 2034-12-04
AI Technical Summary
In existing COB modules, the LED chips bonded with epoxy resin are prone to detachment, resulting in poor reliability of outdoor LED displays. Furthermore, the epoxy resin raw materials used in the dispensing process are toxic and pose a health hazard.
The COB light source module structure substrate using flip-chip LEDs utilizes LED chip recesses, clips, and heat sinks to improve chip fixation and security through reflection and heat dissipation, avoiding the use of epoxy resin.
It improves the heat dissipation efficiency and fixing firmness of LED chips, enhances the structural strength and safety of the module, and avoids the health hazards caused by the use of epoxy resin.
Smart Images
Figure CN223503346U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of COB light source technology, and in particular to a COB light source module structure substrate with flip-chip LEDs. Background Technology
[0002] COB light sources can be simply understood as high-power integrated surface light sources. They are high-efficiency integrated surface light source technologies where LED chips are directly mounted on a highly reflective mirror metal substrate. The COB chip-on-board (COB) process first involves covering the silicon wafer placement points on the substrate surface with thermally conductive epoxy resin (usually epoxy resin doped with silver particles). Then, the silicon wafer is directly placed on the substrate surface and heat-treated until it is firmly fixed to the substrate. Finally, an electrical connection is directly established between the silicon wafer and the substrate using wire bonding.
[0003] There are two main forms of bare chip technology: one is COB technology, and the other is flip chip technology. In COB, semiconductor chips are mounted on a printed circuit board, and the electrical connection between the chip and the substrate is achieved by wire bonding and covered with resin to ensure reliability.
[0004] Currently, the installation method for LED displays using COB modules involves bonding the substrate with thermally conductive epoxy resin. However, due to the heat generated during LED operation, environmental conditions such as high temperature, humidity, and photo-oxidation can cause cross-linking or chain breakage of the epoxy resin molecular chains, leading to performance degradation and making the epoxy resin itself brittle. This is especially problematic for outdoor LED displays exposed to wind and sun for extended periods, causing the epoxy resin-bonded LED chips inside the COB module to detach and fall off. Furthermore, some raw materials in the epoxy resin used for dispensing and installing LED chips, such as reactive diluents and curing agents, have varying degrees of toxicity and irritation, posing a health hazard to workers. Therefore, this invention proposes a novel solution. Utility Model Content
[0005] The purpose of this utility model is to at least solve one of the technical problems existing in the prior art, and to provide a COB light source module structure substrate with flip-chip LEDs. This can solve the problem that, especially for outdoor LED displays, which are exposed to wind and sun for a long time, the epoxy resin-bonded LED chips inside the COB module of the LED display will detach and fall off. At the same time, some raw materials of epoxy resin, such as reactive diluents and curing agents, have varying degrees of toxicity and irritation when dispensing and installing LED chips, which endanger the health of workers.
[0006] To achieve the above objectives, this utility model provides the following technical solution: a COB light source module structure substrate with flip-chip LEDs, comprising a COB light source module substrate;
[0007] LED chip mounting assembly, the LED chip mounting assembly is located inside the COB light source module substrate, the LED chip mounting assembly includes LED chip recess, the LED chip recess is formed on the surface of the COB light source module substrate, the sidewall of the LED chip recess is elliptical, and the opening of the LED chip recess is provided with a certain degree of bevel.
[0008] An LED chip mounting base is fixedly connected inside the LED chip recess. Two electrodes are fixedly connected inside the LED chip mounting base. Four LED clips are set inside the LED chip mounting base. One end of each of the four LED clips is fixed to the inner wall of the LED chip mounting base, and the other end of each of the four LED clips is free.
[0009] The LED chip is fixedly mounted inside the LED chip mounting bracket, and the LED chip is located at the focal point inside the LED chip recess.
[0010] Preferably, there are multiple LED chip mounting components, which are arranged in a rectangular array on the surface of the COB light source module substrate.
[0011] Preferably, the COB light source module substrate is internally fixedly connected with multiple connecting posts, and the multiple connecting posts extend into the interior of the corresponding LED chip grooves;
[0012] Multiple connecting posts are arranged in a rectangular array inside the COB light source module substrate, and all of the connecting posts extend downward out of the COB light source module substrate.
[0013] Preferably, the surface of the COB light source module substrate is provided with multiple horizontal grooves and multiple vertical grooves, which are arranged alternately.
[0014] Preferably, the lower end of the COB light source module substrate is provided with a plurality of first heat sinks and a plurality of second heat sinks.
[0015] Preferably, a plurality of first heat sinks and a plurality of second heat sinks are fixedly connected to the surface of the corresponding connecting posts.
[0016] Compared with the prior art, the beneficial effects of this utility model are:
[0017] 1. The COB light source module structure substrate of this flip-chip LED chip uses LED chip grooves to facilitate the reflection of heat and light emitted by the LED chip, improving the heat dissipation efficiency and illumination range of the LED chip. At the same time, LED clips are used to limit the LED chip, so that when the LED chip transfers heat to the surface of the LED clip, the LED clip expands, which facilitates the fixation of the LED chip and improves the firmness of the LED chip fixation. This avoids the risk to the personal safety of workers caused by using epoxy resin to stick the LED chip, thus improving the safety of the COB light source module. Attached Figure Description
[0018] The present invention will be further described below with reference to the accompanying drawings and embodiments:
[0019] Figure 1 This is a schematic diagram of the substrate structure of a COB light source module with flip-chip LEDs according to the present invention.
[0020] Figure 2 This is a schematic diagram of the connecting column of this utility model;
[0021] Figure 3 This is a schematic diagram of the LED chip groove of this utility model;
[0022] Figure 4 This is a schematic diagram of the LED chip of this utility model;
[0023] Reference numerals in the attached diagram: 1. COB light source module substrate; 2. LED chip recess; 3. LED chip mounting base; 4. Horizontal slot; 5. Vertical slot; 6. Connecting post; 7. First heat sink; 8. Second heat sink; 9. LED clip; 10. LED chip; 11. Electrode. Detailed Implementation
[0024] This section will describe in detail the specific embodiments of the present utility model. The preferred embodiments of the present utility model are shown in the accompanying drawings. The purpose of the drawings is to supplement the textual description with graphics, so that people can intuitively and vividly understand each technical feature and the overall technical solution of the present utility model, but they should not be construed as limiting the scope of protection of the present utility model.
[0025] In the description of this utility model, it should be understood that the directional descriptions, such as up, down, front, back, left, right, etc., indicate the directional or positional relationship based on the directional or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.
[0026] In the description of this utility model, terms such as greater than, less than, and exceeding are understood to exclude the stated number, while terms such as above, below, and within are understood to include the stated number. The use of terms like "first" and "second" is merely for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the quantity or sequence of the indicated technical features.
[0027] In the description of this utility model, unless otherwise explicitly defined, terms such as "setting," "installation," and "connection" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this utility model in conjunction with the specific content of the technical solution.
[0028] Please see Figure 1-4 This utility model provides a technical solution: a COB light source module structure substrate with flip-chip LEDs, including a COB light source module substrate 1 and an LED chip mounting assembly. The LED chip mounting assembly is disposed inside the COB light source module substrate 1 and includes an LED chip groove 2. The LED chip groove 2 is formed on the surface of the COB light source module substrate 1. The sidewall of the LED chip groove 2 is elliptical, and the opening of the LED chip groove 2 is provided with a 45-degree bevel. An LED chip mounting base 3 is fixedly connected inside the LED chip groove 2. Two electrodes 11 are fixedly connected inside the LED chip mounting base 3. Four LED clips 9 are provided inside the LED chip mounting base 3. One end of each of the four LED clips 9 is fixed to the inner wall of the LED chip mounting base 3, and the other end of each LED clip 9 is free. An LED chip 10 is fixedly mounted inside the LED chip mounting base 3. The LED chip 10 is located at the focal point inside the LED chip groove 2.
[0029] There are multiple LED chip mounting components, which are arranged in a rectangular array on the surface of the COB light source module substrate 1.
[0030] Multiple connecting posts 6 are fixedly connected inside the COB light source module substrate 1. The multiple connecting posts 6 extend into the interior of the corresponding LED chip groove 2. The multiple connecting posts 6 are arranged in a rectangular array inside the COB light source module substrate 1, and all multiple connecting posts 6 extend downward out of the COB light source module substrate 1.
[0031] The surface of the COB light source module substrate 1 has multiple horizontal slots 4 and multiple vertical slots 5, which are arranged alternately.
[0032] The lower end of the COB light source module substrate 1 is provided with multiple first heat sinks 7 and multiple second heat sinks 8, and the multiple first heat sinks 7 and multiple second heat sinks 8 are respectively fixedly connected to the surface of the corresponding connecting post 6.
[0033] When using this COB light source module, firstly, the LED chip 10 is installed inside the LED chip mounting base 3 and soldered to the corresponding electrode 11. The LED chip 10 is then positioned using four LED clips 9. Since the LED chip 10 generates considerable heat during use, it transfers this heat to the LED chip mounting base 3, which in turn transfers it to the LED clips 9, causing the clips 9 to heat up. Due to thermal expansion and contraction, the LED clips 9 expand, facilitating the fixation of the LED chip 10. Because the inner wall of the LED chip recess 2 is elliptical, and the LED chip 10 is located at the focal point within the recess 2, the heat emitted by the LED chip 10 is reflected by the inner wall of the recess 2 and passes through another focal point, dissipating the heat. This improves the heat dissipation efficiency of the LED chip 10 and enhances its stability during use. It avoids the safety risks associated with using epoxy resin to adhere the LED chip, thus ensuring the safety of the personnel.
[0034] When the LED chip 10 is activated to emit light, it not only illuminates the top of the COB light source module substrate 1, but also illuminates the sides and all around the LED chip 10. When the light emitted by the LED chip 10 illuminates the inner wall of the LED chip groove 2, the light reflected by the inner wall of the LED chip groove 2 is directed toward another focal point and then diffuses from that focal point. At the same time, since the opening of the LED chip groove 2 is provided with a 45-degree angle, it is convenient for the light to diffuse in all directions when passing through the opening of the LED chip groove 2, which helps to increase the illumination range of the LED chip 10.
[0035] When the LED chip 10 generates heat during use, the heat is transferred to the connecting post 6, which in turn transfers the heat to the first heat sink 7 and the second heat sink 8, facilitating heat dissipation for the LED chip 10 and further improving its heat dissipation efficiency. The connecting post 6 also facilitates support for the COB light source module substrate 1. The connecting post 6 enhances the structural strength of the module, and the first heat sink 7 and the second heat sink 8 reinforce the connecting post 6, ensuring that it remains firm and stable during use, resisting various external forces and preventing deformation or damage.
[0036] The use of horizontal slots 4 and vertical slots 5 increases the heat dissipation area on the surface of the COB light source module substrate 1, which is conducive to the rapid dissipation of heat, thereby reducing the operating temperature of the COB light source module substrate 1 and improving the stability and lifespan of the LED chip 10. The design of horizontal slots 4 and vertical slots 5 can optimize the mechanical structure of the COB light source module substrate 1, improve its resistance to deformation, and ensure that it remains firm and stable during use.
[0037] Furthermore, the use of LED chip groove 2 facilitates the reflection of heat and light emitted by LED chip 10, improving the heat dissipation efficiency and illumination range of LED chip 10. At the same time, LED clip 9 is used to limit the LED chip 10, so that when the LED chip 10 transfers heat to the surface of LED clip 9, the LED clip 9 expands, which facilitates the fixation of LED chip 10, improves the firmness of LED chip 10 fixation, and avoids the use of epoxy resin to stick LED chip, which may affect the personal safety of workers. This improves the safety of the COB light source module.
[0038] By using the connecting post 6, the first heat sink 7, and the second heat sink 8, the heat of the LED chip 10 is transferred and dissipated through the connecting post 6, the first heat sink 7, and the second heat sink 8, further improving the heat dissipation efficiency of the LED chip 10. At the same time, the connecting post 6 facilitates the support of the COB light source module substrate 1. The connecting post 6 can enhance the structural strength of the module, and the first heat sink 7 and the second heat sink 8 reinforce the connecting post 6 to ensure that it remains firm and stable during use, resists various external forces, and prevents deformation or damage.
[0039] Working Principle: When using this COB light source module, firstly, the LED chip 10 is installed inside the LED chip mounting base 3 and soldered to the corresponding electrode 11. Four LED clips 9 are used to limit the LED chip 10. Since the LED chip 10 generates a significant amount of heat during use, it transfers this heat to the LED chip mounting base 3, which in turn transfers it to the LED clips 9, causing their temperature to rise. The LED clips 9 expand due to thermal expansion and contraction, facilitating the fixation of the LED chip 10. Because the inner wall of the LED chip recess 2 is elliptical, and the LED chip 10 is located at the focal point within the recess 2, the heat emitted by the LED chip 10 is reflected by the inner wall of the recess 2 and passes through another focal point, dissipating the heat. This improves the heat dissipation efficiency of the LED chip 10 and enhances its stability during use. It avoids the safety risks associated with using epoxy resin to adhere LED chips, thus ensuring the safety of the personnel.
[0040] When the LED chip 10 is activated to emit light, it not only illuminates the top of the COB light source module substrate 1, but also illuminates the sides and all around the LED chip 10. When the light emitted by the LED chip 10 illuminates the inner wall of the LED chip groove 2, the light reflected by the inner wall of the LED chip groove 2 is directed toward another focal point and then diffuses from that focal point. At the same time, since the opening of the LED chip groove 2 is provided with a 45-degree angle, it is convenient for the light to diffuse in all directions when passing through the opening of the LED chip groove 2, which helps to increase the illumination range of the LED chip 10.
[0041] When the LED chip 10 generates heat during use, the heat is transferred to the connecting post 6, which in turn transfers the heat to the first heat sink 7 and the second heat sink 8, facilitating heat dissipation for the LED chip 10 and further improving its heat dissipation efficiency. The connecting post 6 also facilitates support for the COB light source module substrate 1. The connecting post 6 enhances the structural strength of the module, and the first heat sink 7 and the second heat sink 8 reinforce the connecting post 6, ensuring that it remains firm and stable during use, resisting various external forces and preventing deformation or damage.
[0042] The use of horizontal slots 4 and vertical slots 5 increases the heat dissipation area on the surface of the COB light source module substrate 1, which is conducive to the rapid dissipation of heat, thereby reducing the operating temperature of the COB light source module substrate 1 and improving the stability and lifespan of the LED chip 10. The design of horizontal slots 4 and vertical slots 5 can optimize the mechanical structure of the COB light source module substrate 1, improve its resistance to deformation, and ensure that it remains firm and stable during use.
[0043] The embodiments of the present utility model have been described in detail above with reference to the accompanying drawings. However, the present utility model is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present utility model.
Claims
1. A COB light source module structure substrate with flip-chip LEDs, characterized in that: Including COB light source module substrate (1); LED chip mounting assembly, the LED chip mounting assembly is located inside the COB light source module substrate (1), the LED chip mounting assembly includes LED chip groove (2), the LED chip groove (2) is opened on the surface of the COB light source module substrate (1), the sidewall of the LED chip groove (2) is elliptical, and the opening of the LED chip groove (2) is provided with a (45) degree oblique angle. An LED chip mounting base (3) is fixedly connected inside the LED chip groove (2). Two electrodes (11) are fixedly connected inside the LED chip mounting base (3). Four LED clips (9) are provided inside the LED chip mounting base (3). One end of each of the four LED clips (9) is fixed to the inner wall of the LED chip mounting base (3), and the other end of each of the four LED clips (9) is free. The LED chip (10) is fixedly installed inside the LED chip mounting base (3), and the LED chip (10) is located at the focal point inside the LED chip groove (2).
2. The COB light source module structure substrate with flip-chip LEDs according to claim 1, characterized in that: There are multiple LED chip mounting components, which are arranged in a rectangular array on the surface of the COB light source module substrate (1).
3. The COB light source module structure substrate with flip-chip LEDs according to claim 1, characterized in that: The COB light source module substrate (1) is internally fixedly connected with multiple connecting posts (6), and the multiple connecting posts (6) extend into the interior of the corresponding LED chip groove (2); Multiple connecting posts (6) are arranged in a rectangular array inside the COB light source module substrate (1), and all the connecting posts (6) extend downward out of the COB light source module substrate (1).
4. The COB light source module structure substrate with flip-chip LEDs according to claim 1, characterized in that: The surface of the COB light source module substrate (1) is provided with multiple horizontal grooves (4) and multiple vertical grooves (5), which are arranged alternately.
5. The COB light source module structure substrate with flip-chip LEDs according to claim 1, characterized in that: The lower end of the COB light source module substrate (1) is provided with a plurality of first heat sinks (7) and a plurality of second heat sinks (8).
6. The COB light source module structure substrate with flip-chip LEDs according to claim 5, characterized in that: Multiple first heat sinks (7) and multiple second heat sinks (8) are respectively fixedly connected to the surface of the corresponding connecting post (6).