Substrate temperature measuring device for MBE equipment
By using an infrared optical lens and image processing module in the substrate temperature measurement device of the MBE equipment, the problem of substrate temperature non-uniformity in the MBE equipment was solved, and high-precision and widely applicable temperature measurement was achieved, thereby improving the quality of material growth and production efficiency.
Patent Information
- Application Number
- CN202423201163.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-24
- Publication Date
- 2025-11-04
- Estimated Expiration
- 2034-12-24
AI Technical Summary
Existing MBE equipment suffers from temperature non-uniformity on large-size substrates, which affects the material growth quality and defect density. Current technology can only adjust the temperature difference in reverse after the material growth is completed, and cannot achieve uniformity control during the growth process.
A substrate temperature measurement device comprising a fixed cover, an adjuster, an infrared optical lens, a support rod, an image processing module, and a mounting housing is employed. The infrared optical lens captures images of the substrate and converts them into thermal infrared images. Combined with the image processing module and the circuit control module, the temperature of any point on the substrate can be measured, thereby improving the measurement accuracy and uniformity.
It enables accurate and uniform measurement of substrate temperature in MBE equipment, improving product quality and production efficiency. It is easy to operate and has a wide range of applications.
Smart Images
Figure CN223512815U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of temperature testing technology, specifically to a substrate temperature measuring device for MBE equipment. Background Technology
[0002] Molecular beam epitaxy (MBE) equipment is used for the growth of high-quality thin film materials and is widely used in semiconductors, optoelectronic materials, and quantum structures. The main working principle of MBE equipment is to deposit raw materials as molecular beams onto the surface of a substrate in a vacuum environment, thereby forming ordered thin films or single-crystal materials. MBE equipment plays a vital role in modern materials science and electronic engineering due to its superior material growth precision and controllability.
[0003] For large-size MBE systems, a sample holder is typically used to heat the substrate. However, due to the limitations of PBN heaters, heating the substrate with a single heater results in uneven heating, particularly with the outer edges of the substrate being significantly cooler than the center. Therefore, a multi-temperature zone design is generally introduced, with corresponding central and outer heaters. However, current technology only allows for the reverse adjustment of the temperature difference based on the material quality after growth is complete.
[0004] Existing technologies can maintain a variation of less than ±0.1℃ at a single fixed temperature measurement point, but they cannot guarantee the uniformity of the entire substrate surface. Temperature is a very important process parameter that affects the quality and defect density of the final grown material. If not properly controlled, it can result in significant differences in material quality between the inner side and the edge of the same sample. Utility Model Content
[0005] The technical problem to be solved by this invention is to provide a substrate temperature measurement device for MBE equipment that is compact in structure, highly stable, and conducive to improving the uniformity of temperature measurement, in order to address the shortcomings of the existing technology.
[0006] To solve the above-mentioned technical problems, the technical solution adopted by this utility model is as follows:
[0007] A substrate temperature measuring device for an MBE device includes: a fixing cover, an adjuster, an infrared optical lens, a support rod, an image processing module, and a mounting housing;
[0008] The fixed cover is used to connect the observation window of the MBE device. One end of the regulator is nested inside the fixed cover, and the other end of the regulator is connected to the mounting housing.
[0009] One end of the support rod is connected to the infrared optical lens, and the other end of the support rod is connected to the mounting housing. The infrared optical lens and the support rod are both located inside the adjuster and the mounting housing, and the infrared optical lens faces the observation window for capturing images of the substrate. The adjuster is used to adjust the shooting angle of the infrared optical lens.
[0010] The image processing module is located inside the mounting housing. The image processing module is used to convert the image captured by the infrared optical lens into a thermal infrared image, and then convert the thermal infrared image into an electrical signal and transmit it to an external device.
[0011] As a further improvement of this utility model, the image processing module includes a sensor module and a circuit control module. The sensor module is connected to the infrared optical lens and the circuit control module respectively. The sensor module is used to convert the substrate image captured by the infrared optical lens into a thermal infrared image and transmit it to the circuit control module. The circuit control module is used to convert the thermal infrared image into an electrical signal and transmit it to an external device.
[0012] As a further improvement of this utility model, the mounting housing includes a front housing and a rear housing arranged opposite to each other. The front housing and the rear housing are connected in the middle by a bellows. The adjuster is connected to the front housing. One end of the support rod is connected to the rear housing. The other end of the support rod passes through the inside of the bellows and the inside of the front housing and extends into the inside of the adjuster for mounting an infrared optical lens.
[0013] As a further improvement of this utility model, an adjusting rod and a connecting spring are provided between the front housing and the rear housing. The connecting springs are symmetrically arranged on both sides of the adjusting rod, and the adjusting rod is used to adjust the tilt angle of the infrared optical lens.
[0014] As a further improvement of this utility model, a connecting plate is provided between the front housing and the rear housing. One end of the connecting plate is connected to the front housing by a rivet, and the other end of the connecting plate is connected to the rear housing by a third fastening screw. When the adjustment rod is rotated to adjust the tilt angle of the infrared optical lens, the rear housing can rotate around the third fastening screw.
[0015] As a further improvement of this utility model, one end of the circuit control module is nested in the end of the rear housing, the side of the rear housing is provided with a second fastening screw for fixing the circuit control module, and the other end of the circuit control module is provided with a transmission interface for connecting a transmission cable.
[0016] As a further improvement of this utility model, the outer side of the fixing cover is provided with multiple mounting holes, and the mounting holes are provided with set screws, which are used to connect and fix the fixing cover to the observation window of the MBE device.
[0017] As a further improvement of this utility model, the end of the regulator is nested inside the connecting flange, and the connecting flange is connected and fixed to the fixing cover by the first fastening screw.
[0018] As a further improvement of this utility model, both the connecting flange and the side of the adjusting rod are provided with scales for recording the adjustment amount of the infrared optical lens.
[0019] As a further improvement of this utility model, the fixing cover is made of an opaque material.
[0020] Compared with the prior art, the advantages of this utility model are:
[0021] This invention relates to a substrate temperature measuring device for MBE (Mechanical, Electrical, and Precipitating) equipment. The device connects a fixed cover and a connecting flange to the two ends of a regulator. The fixed cover connects to the observation window of the MBE equipment. An infrared optical lens is placed inside the regulator, allowing the lens to capture images of the substrate inside the MBE equipment through the observation window. An image processing module converts these images into thermal infrared images, which are then converted into electrical signals and transmitted to external devices. The substrate temperature can then be calculated on these external devices. Because the infrared optical lens captures a complete image of the substrate, it also allows for temperature measurement at any point on the substrate, improving the accuracy and uniformity of temperature measurement. This ensures product quality and increases the production efficiency of the MBE equipment. Furthermore, as long as the entire substrate is visible through the observation window, the temperature of the sample holder can be measured using this device. It is convenient to operate and has a wide range of applications. Attached Figure Description
[0022] Figure 1 This is a schematic diagram of the cross-sectional structure of the substrate temperature measuring device in a specific embodiment of this utility model;
[0023] Figure 2 This is a schematic diagram of the three-dimensional structure of the substrate temperature measuring device in a specific embodiment of this utility model;
[0024] Figure 3 This is a schematic diagram of the main structural principle of the substrate temperature measuring device in a specific embodiment of this utility model;
[0025] Figure 4 This is a side view schematic diagram of the substrate temperature measuring device in a specific embodiment of the present invention.
[0026] Figure 5 This is a schematic diagram of the substrate structure. In the figure, 1, 2, 3, ..., 8, 9 represent different locations on the substrate.
[0027] Figure 6Figure 1 shows a schematic diagram of the local temperature distribution of the substrate. Figure 2(a) is an infrared image, and Figure 3(b) is a temperature distribution diagram of the straight line segment in Figure 2(a).
[0028] Figure 7 Figure 1 shows a schematic diagram of the overall temperature distribution of the substrate, where Figure 2(a) is the overall scan image and Figure 3(b) is the temperature distribution diagram.
[0029] Legend: 1. Fixing cover; 2. Adjuster; 3. Infrared optical lens; 4. Support rod; 5. First fastening screw; 6. Bellows; 7. Sensor module; 8. Circuit control module; 9. Second fastening screw; 10. Transmission interface; 11. Front housing; 12. Rear housing; 13. Connecting plate; 14. Third fastening screw; 15. Mounting hole; 16. Set screw; 17. Adjusting rod; 18. Rivet; 19. Connecting flange; 20. Connecting spring. Detailed Implementation
[0030] The present invention will be further described below with reference to the accompanying drawings and specific preferred embodiments, but this does not limit the scope of protection of the present invention.
[0031] In the description of this utility model, it should be understood that the terms "side", "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.
[0032] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "multiple" means two or more, unless otherwise explicitly specified.
[0033] Example
[0034] like Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown, the substrate temperature measuring device for MBE equipment of this utility model includes: a fixing cover 1, an adjuster 2, an infrared optical lens 3, a support rod 4, an image processing module, and a mounting housing.
[0035] The fixed cover 1 is used to connect the observation window of the MBE device. One end of the adjuster 2 is nested inside the fixed cover 1, and the other end of the adjuster 2 is connected and fixed to the mounting housing 3. One end of the support rod 4 is connected to the infrared optical lens 3, and the other end of the support rod 4 is connected to the mounting housing. Both the infrared optical lens 3 and the support rod 4 are located inside the adjuster 2 and the mounting housing, and the infrared optical lens 3 faces the observation window for capturing images of the substrate. By rotating the adjuster 2, the mounting housing and the infrared optical lens 3 can be rotated as a whole to adjust the shooting angle of the infrared optical lens 3.
[0036] The image processing module is located inside the mounting housing. The image processing module is used to convert the image captured by the infrared optical lens into a thermal infrared image, and then convert the thermal infrared image into an electrical signal and transmit it to an external device.
[0037] As can be seen, after the temperature testing device is installed, the center of the infrared optical lens 3 coincides with the center of the observation window, but it is not necessarily directly facing the center of the substrate, or in other words, it is not necessarily the optimal position for image acquisition. Therefore, the adjuster 2 can rotate within the fixed cover 1, thereby driving the mounting housing and the infrared optical lens 3 to move as a whole, adjusting the shooting angle of the infrared optical lens 3 on the substrate, so as to acquire infrared images of the substrate from different angles according to the layout of the substrate in the MBE equipment, thereby improving the quality of image acquisition. When the substrate is heated, it will generate heat radiation. Since the heat is different at different locations, the heat radiation generated is also different. By acquiring an infrared image of the entire substrate, the temperature at any location on the substrate can be monitored.
[0038] like Figure 1 As shown, the image processing module includes a sensor module 7 and a circuit control module 8. The sensor module 7 is connected to both the infrared optical lens 3 and the circuit control module 8. The sensor module 7 converts the substrate image captured by the infrared optical lens 3 into a thermal infrared image and transmits it to the circuit control module 8. The circuit control module 8 converts the thermal infrared image into an electrical signal and transmits it to an external device, which then calculates the substrate temperature. It can be seen that before temperature measurement, a database of temperature parameters can be pre-established in the external device. After obtaining the actual thermal infrared image of the substrate, the data in the thermal infrared image is compared with the data in the database to obtain the actual temperature of the substrate. For example, a Python program can be written in the external device to calculate and analyze the temperature parameters in the infrared image.
[0039] In this embodiment, by connecting the two ends of the regulator 2 to the fixing cover 1 and the mounting housing respectively, with the fixing cover 1 used to connect the observation window of the MBE equipment, and placing the infrared optical lens 3 inside the regulator 2, the infrared optical lens 3 can capture images of the substrate inside the MBE equipment through the observation window. The sensor module 7 then converts the substrate image captured by the infrared optical lens 3 into a thermal infrared image, which is then converted into an electrical signal by the circuit control module 8 and transmitted to an external device. The substrate temperature can then be calculated in the external device. Furthermore, because the infrared optical lens 3 captures an image of the entire substrate, the temperature of any point on the substrate can be measured, improving the accuracy and uniformity of substrate temperature measurement, thus ensuring product quality and increasing the production efficiency of the MBE equipment. Moreover, as long as the entire substrate can be seen through the observation window, the temperature of the sample holder can be measured using this invention, making it convenient to operate and widely applicable.
[0040] like Figure 1 As shown, in this embodiment, the mounting housing includes a front housing 11 and a rear housing 12 disposed opposite to each other. The front housing 11 and the rear housing 12 are connected at the middle by a bellows 6. The adjuster 2 is connected to the front housing 11. One end of the support rod 4 is connected to the rear housing 12, and the other end of the support rod 4 extends through the bellows 6 and the front housing 11 and then into the adjuster 2 for mounting the infrared optical lens 3. The bellows 6 enables the sealed mounting of the infrared optical lens 3, improving the reliability of image acquisition.
[0041] like Figure 2 and Figure 3 As shown, an adjusting rod 17 and a connecting spring 20 are provided between the front housing 11 and the rear housing 12. The connecting spring 20 is symmetrically arranged on both sides of the adjusting rod 17. The adjusting rod 17 is used to adjust the tilt angle of the infrared optical lens 3.
[0042] In this embodiment, a connecting plate 13 is also provided between the front housing 11 and the rear housing 12. One end of the connecting plate 13 is connected to the front housing 11 by a rivet 18, and the other end of the connecting plate 13 is connected to the rear housing 12 by a third fastening screw 14. When the adjustment rod 17 is rotated to adjust the tilt angle of the infrared optical lens 3, the rear housing 12 can rotate around the third fastening screw 14. Since the support rod 4 for mounting the infrared optical lens 3 is fixedly connected to the rear housing 12, the infrared optical lens 3 will also rotate along with the rear housing 12 during rotation, thereby adjusting the tilt angle of the infrared optical lens 3 on the substrate. Through the flexible support of the connecting spring 20, when the adjustment rod 17 is rotated to stretch or contract the connecting spring 20, the rear housing 12 can be rotated, which helps to improve the accuracy of the tilt angle adjustment of the infrared optical lens 3.
[0043] like Figure 1As shown, one end of the circuit control module 8 is nested in the end of the rear housing 12. The side of the rear housing 12 is provided with a second fastening screw 9 for fixing the circuit control module 8. The other end of the circuit control module 8 is provided with a transmission interface 10 for connecting a transmission cable to realize the connection between the circuit control module 8 and external devices.
[0044] like Figure 1 and Figure 4 As shown, the outer side of the mounting cover 1 has multiple mounting holes 15 evenly distributed, and each mounting hole 15 has a set screw 16. The set screw 16 is used to connect and fix the mounting cover 1 to the observation window of the MBE device, making assembly and disassembly convenient. Furthermore, the mounting cover 1 is made of an opaque material to avoid interference from other stray light on the infrared optical lens 3. In other embodiments, a filter can also be provided inside the mounting cover 1 to filter out light other than infrared light, thereby improving the reliability of image acquisition.
[0045] like Figure 1 and Figure 2 As shown, the end of the regulator 2 is nested inside the connecting flange 19, and the connecting flange 19 is connected and fixed to the fixing cover 1 by the first fastening screw 5.
[0046] like Figure 2 and Figure 3 As shown, the side of the connecting flange 19 is provided with a scale to record the adjustment amount of the adjuster 2, and the side of the adjusting rod 17 is also provided with a scale to record the adjustment amount of the adjusting rod 17, thus realizing the recording of the adjustment amount of the infrared optical lens 3.
[0047] In this embodiment, the MBE device needs to have an observation window that can see the entire sample holder. A high-performance infrared camera is installed at the observation window to monitor and acquire the temperature parameters of the substrate in real time when the sample holder is controlled by the Eurometer, so as to obtain a clear infrared image with pixel-by-pixel resolution.
[0048] In this embodiment, the working principle of the substrate temperature measurement device for the MBE equipment is as follows:
[0049] (1) Install the substrate temperature measuring device onto the observation window of the MBE equipment;
[0050] (2) Adjust the infrared optical lens 3 to the preset tilt angle by adjusting rod 17, and then rotate the adjuster 2 to drive the front housing 11, the rear housing 12 and the infrared optical lens 3 to rotate as a whole. The infrared optical lens 3 can be adjusted in two different dimensions by adjusting rod 17 and adjuster 2, and finally the infrared optical lens 3 can be adjusted to a suitable shooting angle.
[0051] (3) The substrate image is captured by the infrared optical lens 3, the substrate image captured by the infrared optical lens 3 is converted into a thermal infrared image by the sensor module 7 and transmitted to the circuit control module 8, and the thermal infrared image is converted into an electrical signal by the circuit control module 8 and transmitted to an external device.
[0052] (4) The external device calculates the temperature of the substrate based on the received infrared image electrical signal, and then evaluates the uniformity of the substrate temperature.
[0053] like Figure 5 As shown, after obtaining an infrared image of the substrate, any point can be selected in the image, and the heating uniformity of the substrate can be evaluated by measuring the temperature of multiple arbitrary points.
[0054] like Figure 6 As shown, after obtaining the infrared image of the substrate, any two points can be selected in the image, and the heating uniformity of the substrate can be evaluated by the temperature of all points on the line segment connecting these two points.
[0055] like Figure 7 As shown, after obtaining the infrared image of the substrate, a surface scanning mode can also be used to obtain the temperature of the entire substrate, which is more intuitive.
[0056] The above description is merely a preferred embodiment of this utility model. The protection scope of this utility model is not limited to the above embodiments. All technical solutions falling within the scope of this utility model's concept are protected. It should be noted that for those skilled in the art, any improvements and modifications made without departing from the principle of this utility model should also be considered within the protection scope of this utility model.
Claims
1. A substrate temperature measuring device for an MBE device, characterized in that, include: Fixing cover (1), adjuster (2), infrared optical lens (3), support rod (4), image processing module and mounting housing; The fixed cover (1) is used to connect the observation window of the MBE device. One end of the regulator (2) is nested inside the fixed cover (1), and the other end of the regulator (2) is connected to the mounting housing. One end of the support rod (4) is connected to the infrared optical lens (3), and the other end of the support rod (4) is connected to the mounting housing. The infrared optical lens (3) and the support rod (4) are both located inside the adjuster (2) and the mounting housing, and the infrared optical lens (3) faces the observation window for taking images of the substrate. The adjuster (2) is used to adjust the shooting angle of the infrared optical lens (3). The image processing module is located inside the mounting housing. The image processing module is used to convert the image captured by the infrared optical lens (3) into a thermal infrared image, and then convert the thermal infrared image into an electrical signal and transmit it to an external device.
2. The substrate temperature measuring device for MBE equipment according to claim 1, characterized in that, The image processing module includes a sensor module (7) and a circuit control module (8). The sensor module (7) is connected to the infrared optical lens (3) and the circuit control module (8) respectively. The sensor module (7) is used to convert the substrate image captured by the infrared optical lens (3) into a thermal infrared image and transmit it to the circuit control module (8). The circuit control module (8) is used to convert the thermal infrared image into an electrical signal and transmit it to an external device.
3. The substrate temperature measuring device for MBE equipment according to claim 2, characterized in that, The mounting housing includes a front housing (11) and a rear housing (12) arranged opposite to each other. The front housing (11) and the rear housing (12) are connected in the middle by a bellows (6). The adjuster (2) is connected to the front housing (11). One end of the support rod (4) is connected to the rear housing (12). The other end of the support rod (4) passes through the inside of the bellows (6) and the inside of the front housing (11) and extends into the inside of the adjuster (2) for mounting an infrared optical lens (3).
4. The substrate temperature measuring device for MBE equipment according to claim 3, characterized in that, An adjusting rod (17) and a connecting spring (20) are provided between the front housing (11) and the rear housing (12). The connecting spring (20) is symmetrically arranged on both sides of the adjusting rod (17). The adjusting rod (17) is used to adjust the tilt angle of the infrared optical lens (3).
5. The substrate temperature measuring device for MBE equipment according to claim 4, characterized in that, A connecting plate (13) is also provided between the front housing (11) and the rear housing (12). One end of the connecting plate (13) is connected to the front housing (11) by a rivet (18), and the other end of the connecting plate (13) is connected to the rear housing (12) by a third fastening screw (14). When the adjustment rod (17) is rotated to adjust the tilt angle of the infrared optical lens (3), the rear housing (12) can rotate around the third fastening screw (14).
6. The substrate temperature measuring device for an MBE device according to claim 4, characterized in that, One end of the circuit control module (8) is nested in the end of the rear housing (12). The side of the rear housing (12) is provided with a second fastening screw (9) for fixing the circuit control module (8). The other end of the circuit control module (8) is provided with a transmission interface (10) for connecting a transmission cable.
7. The substrate temperature measuring device for an MBE device according to any one of claims 1 to 6, characterized in that, The outer side of the fixing cover (1) is provided with a plurality of mounting holes (15), and a set screw (16) is provided in the mounting hole (15). The set screw (16) is used to connect and fix the fixing cover (1) to the observation window of the MBE device.
8. The substrate temperature measuring device for an MBE device according to any one of claims 4 to 6, characterized in that, The end of the regulator (2) is nested inside the connecting flange (19), and the connecting flange (19) is connected and fixed to the fixing cover (1) by the first fastening screw (5).
9. The substrate temperature measuring device for an MBE device according to claim 8, characterized in that, The connecting flange (19) and the adjusting rod (17) are both provided with scales on their sides for recording the adjustment amount of the infrared optical lens (3).
10. The substrate temperature measuring device for an MBE device according to any one of claims 1 to 6, characterized in that, The fixing cover (1) is made of an opaque material.