Differentiated ultrathin camera module and electronic equipment

Abstract

The utility model relates to a differentiated ultrathin camera module and an electronic device, comprising an RFPC rigid-flex board, the middle of which is provided with a slot matched with a photosensitive chip; the photosensitive chip is embedded into the open slot; the plurality of electronic elements comprise capacitors and resistors which are respectively arranged on the RFPC rigid-flex board; through holes capable of accommodating at least one part of the electronic elements are formed in positions, corresponding to the electronic elements, on the Bracket bracket; the optical filter is arranged on the Bracket bracket and is positioned above the photosensitive chip; the lower end of the optical lens is fixed on the Braket bracket; and the connector is arranged on the RFPC rigid-flex board. The overall height can be reduced.

Description

Technical Field

[0001] This utility model relates to the field of camera module technology, specifically to a differentiated ultra-thin camera module and electronic device. Background Technology

[0002] With the rapid development of technology, consumers' demands for smartphone camera modules are increasing, especially in terms of pixels and performance. In recent years, the resolution of smartphone front-facing cameras has achieved a significant leap, gradually increasing from low pixels in the early days to 32 megapixels today, and even some high-end flagship models are equipped with camera modules as high as 50 megapixels. This improvement in high pixel resolution not only provides users with more delicate and clearer selfie effects, but also brings richer details and higher dynamic range in video shooting, greatly enhancing the user's visual experience.

[0003] However, while high-pixel camera module technology continues to advance, its design also faces some challenges. Currently, camera modules generally adopt a structure design that overlaps the image sensor chip with an RFPC (Radio Frequency Printed Circuit Board) rigid-flex board. While this design optimizes the module's integration and performance to some extent, it also increases the overall height of the module. Because the optical height of the camera module needs to be calculated cumulatively, including the height of the image sensor chip, lens assembly, RFPC board, and other necessary electronic components, the mobile phone camera module often protrudes to some extent. This not only affects the aesthetics of the mobile phone's appearance but may also cause inconvenience or damage during use.

[0004] Furthermore, the layout of internal electronic components such as resistors and capacitors, as well as the bracket (typically used to fix and protect internal components of the camera module), further increases the physical height of the module. To avoid interference and damage between these components, sufficient space needs to be reserved in the design, which results in a relatively high step for the module's mounting, making the phone's camera module relatively thick. This not only limits the trend towards thinner and lighter phone designs but may also affect the user's grip and overall experience.

[0005] Therefore, how to reduce the overall height of the camera module while ensuring high performance and high pixel count has become a pressing technical problem that needs to be solved. Summary of the Invention

[0006] The purpose of this invention is to provide a differentiated ultra-thin camera module and electronic device that can reduce its overall height.

[0007] In a first aspect, the differentiated ultra-thin camera module of this utility model includes:

[0008] The RFPC rigid-flex board has a slot in its middle that matches the photosensitive chip;

[0009] The photosensitive chip is embedded in the slot;

[0010] Multiple electronic components, including capacitors and resistors, are mounted on the RFPC rigid-flex board.

[0011] Brackets have through holes at positions corresponding to each electronic component, each capable of accommodating at least a portion of the electronic component.

[0012] A filter is mounted on a Bracket holder and positioned above the photosensitive chip.

[0013] An optical lens, the lower end of which is fixed to a Bracket bracket;

[0014] Connectors are mounted on the RFPC rigid-flex board.

[0015] Optionally, the slot is a blind via. The design of blind vias can avoid unnecessary damage to other parts of the RFPC rigid-flex board.

[0016] Optionally, the depth of the blind aperture is equal to the depth of the photosensitive chip. Matching the depth of the blind aperture to the depth of the photosensitive chip allows the photosensitive chip to be embedded within the blind aperture of the RFPC rigid-flex board. The thickness of a conventional photosensitive chip is 150µm. This solution can reduce the optical height of the camera module by 150µm, making it suitable for front-facing cameras or foldable phones.

[0017] Optionally, the Bracket bracket has a first top surface, a second top surface, a first bottom surface, and a second bottom surface, arranged sequentially from top to bottom. This multi-layered design provides more assembly and mounting options for the camera module. Different surfaces can be used to mount different components, such as filters and optical lenses, thereby achieving a more compact and efficient layout.

[0018] Optionally, the filter is disposed on the second top surface of the Bracket bracket.

[0019] Optionally, the lower end of the optical lens is fixedly mounted on the first top surface of the Bracket bracket.

[0020] Optionally, the second bottom surface of the Bracket bracket is fixedly mounted on the RFPC rigid-flex plate.

[0021] Optionally, the top surface of the electronic component is flush with the first top surface of the Bracket support. This design ensures that the electronic component does not protrude from the surface of the Bracket support, thereby avoiding interference or damage to other components.

[0022] Optionally, the electronic components are arranged symmetrically in pairs on both sides of the slot. This symmetrical arrangement can improve the structural balance and stability of the camera module.

[0023] Secondly, the electronic device described in this utility model employs the differentiated ultra-thin camera module as described in this utility model.

[0024] This utility model has the following advantages:

[0025] (1) This utility model directly embeds the photosensitive chip into the RFPC rigid-flex board. The thickness of a conventional photosensitive chip is 150um. For a camera module using a 150um thick photosensitive chip, the optical height of the camera module is reduced by 150 micrometers. This improvement is particularly important for electronic devices that pursue the ultimate thin and light design (such as smartphones, tablets, etc.), as it allows the camera module to be integrated into the electronic device more compactly without sacrificing performance.

[0026] (2) This utility model directly embeds electronic components such as resistors and capacitors into the through holes of the Bracket bracket. This design not only eliminates the gap of up to 80 micrometers between the resistors / capacitors and the upper wall of the Bracket bracket in conventional designs, but also reduces the thickness of the Bracket bracket plane by 200 micrometers, resulting in a cumulative reduction of 280 micrometers in the overall height of the Bracket bracket, and consequently, a corresponding reduction of 280 micrometers in the step height of the entire camera module. This significant size reduction makes the camera module particularly suitable for front-facing cameras or foldable ultra-thin mobile phones and other electronic devices with extremely demanding space requirements. Attached Figure Description

[0027] Figure 1 This is a cross-sectional view of the differentiated ultra-thin camera module in the embodiments of this application;

[0028] Figure 2 This is a schematic diagram of the Bracket bracket (including a photosensitive chip and electronic components) described in the embodiments of this application;

[0029] Explanation of reference numerals in the attached drawings: 1. Optical lens, 2. Filter, 3. Bracket bracket, 31. Through hole, 32. First top surface, 33. Second top surface, 34. First bottom surface, 35. Second bottom surface, 4. RFPC rigid-flex board, 41. Slot, 5. Photosensitive chip, 6. Electronic component, 7. Connector. Detailed Implementation

[0030] The following description, with reference to the accompanying drawings and preferred embodiments, illustrates the implementation of the technical solution of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification. This utility model can also be implemented or applied through other different specific embodiments, and various details in this specification can be modified or changed based on different viewpoints and applications without departing from the spirit of this utility model. It should be understood that the preferred embodiments are only for illustrating this utility model and not for limiting the scope of protection of this utility model.

[0031] like Figure 1 and Figure 2 As shown in this embodiment, a differentiated ultra-thin camera module includes an RFPC rigid-flex board 4, a photosensitive chip 5, a bracket 3, a filter 2, an optical lens 1, and multiple electronic components 6. The RFPC rigid-flex board 4 primarily supports the photosensitive chip 5, the bracket 3, the electronic components 6, the filter 2, the optical lens 1, and the connector 7. It also transmits image data processed by the photosensitive chip 5 to the connector 7 via lines and supplies power to the photosensitive chip 5. A slot 41 matching the photosensitive chip 5 is formed in the middle of the RFPC rigid-flex board 4 for mounting the photosensitive chip 5. The photosensitive chip 5 converts visible light passing through the filter 2 into electrical signals, and is embedded in the slot 41. The multiple electronic components 6 include capacitors and resistors, each disposed on the RFPC rigid-flex board 4. The main function of each electronic component 6 is to filter out the power ripple supplied to the photosensitive chip 5 from the motherboard of the electronic device. The bracket 3 has through holes 31 at positions corresponding to each electronic component 6, each capable of accommodating at least a portion of the electronic component 6. The bracket 3 primarily serves to fix the filter 2, support the weight of the optical lens 1, and allow the electronic components 6 to pass. The filter 2 primarily filters out light wavelengths invisible to the human eye, allowing only visible light to pass through, while absorbing stray light emitted between the optical lenses. The filter 2 is mounted on the bracket 3, positioned above the photosensitive chip 5. The optical lens 1 primarily transmits the light signal to be captured to the filter 2 through refraction. The lower end of the optical lens 1 is fixed to the bracket 3. The connector 7 is mounted on the RFPC rigid-flex board 4. The connector 7 primarily transmits electrical signals from the RFPC rigid-flex board 4 to the motherboard and transmits power from the motherboard to the RFPC rigid-flex board 4.

[0032] like Figure 1As shown, in one possible embodiment, the slot 41 on the RFPC rigid-flex board 4 is a blind via. The design of the blind via avoids unnecessary damage to other parts of the RFPC rigid-flex board 4. The depth of the blind via is equal to the depth of the photosensitive chip 5, so that the blind via matches the depth of the photosensitive chip 5, meaning the photosensitive chip 5 is completely embedded within the blind via of the RFPC rigid-flex board 4 without increasing the thickness of the RFPC rigid-flex board 4. The thickness of a conventional photosensitive chip 5 is 150µm. For camera modules using a conventional photosensitive chip 5, this solution can reduce the optical height of the camera module by 150µm, making it suitable for front-facing cameras or foldable phones.

[0033] like Figure 1 As shown, in one possible embodiment, the Bracket bracket 3 has a first top surface 32, a second top surface 33, a first bottom surface 34, and a second bottom surface 35 from top to bottom. This multi-layered structure design provides more assembly and fixing options for the camera module. Different surfaces can be used to mount different components, such as the filter 2 and the optical lens 1, thereby achieving a more compact and efficient layout. The filter 2 is disposed on the second top surface 33 of the Bracket bracket 3. The lower end of the optical lens 1 is fixedly mounted on the first top surface 32 of the Bracket bracket 3. The second bottom surface 35 of the Bracket bracket 3 is fixedly mounted on the RFPC rigid-flex board 4.

[0034] like Figure 1 As shown, in one possible embodiment, the top surface of the electronic component 6 is flush with the first top surface 32 of the Bracket support 3. This design ensures that the electronic component 6 does not protrude from the surface of the Bracket support 3, thereby avoiding interference or damage to other components.

[0035] like Figure 2 As shown in one possible embodiment, the electronic components 6 are arranged symmetrically in pairs on both sides of the slot 41. This symmetrical arrangement can improve the structural balance and stability of the camera module.

[0036] In this embodiment, by directly embedding the photosensitive chip 5 into the RFPC rigid-flex board 4, the optical height of the camera module using a 150µm thick photosensitive chip 5 is reduced by 150µm. This improvement is particularly important for electronic devices that pursue ultra-thin and lightweight designs (such as smartphones and tablets), as it allows the camera module to be integrated more compactly into the electronic device without sacrificing performance.

[0037] In this embodiment, electronic components such as resistors and capacitors are directly embedded into the through-holes 31 of the Bracket bracket 3. This design not only eliminates the gap of up to 80 micrometers between the resistors / capacitors and the upper wall of the Bracket bracket 3 in conventional designs, but also reduces the plane thickness of the Bracket bracket 3 by 200 micrometers. This results in a cumulative reduction in the overall height of the Bracket bracket 3 of 280 micrometers, which in turn reduces the step height of the entire camera module by 280 micrometers. This significant size reduction makes the camera module particularly suitable for front-facing cameras or foldable ultra-thin mobile phones and other electronic devices with extremely demanding space requirements.

[0038] In this application embodiment, an electronic device employs the differentiated ultra-thin camera module as described in this utility model.

[0039] The above embodiments are preferred embodiments of the present utility model, but the embodiments of the present utility model are not limited to the above embodiments. Any changes, modifications, substitutions, combinations, or simplifications made without departing from the spirit and principle of the present utility model shall be considered equivalent substitutions and shall be included within the protection scope of the present utility model.

Claims

1. A differentiated ultra-thin camera module, characterized in that, include: The RFPC rigid-flex board (4) has a slot (41) in its middle that matches the photosensitive chip (5). A photosensitive chip (5) is embedded in the slot (41); Multiple electronic components (6), including capacitors and resistors, are respectively mounted on the RFPC rigid-flex board (4); Bracket (3) has through holes (31) at positions corresponding to each electronic component (6) that can accommodate at least a portion of the electronic component (6). A filter (2) is disposed on a Bracket bracket (3) and located above the photosensitive chip (5); An optical lens (1) is fixed at its lower end to a Bracket bracket (3); The connector (7) is mounted on the RFPC rigid-flex board (4).

2. The differentiated ultra-thin camera module according to claim 1, characterized in that: The slot (41) is a blind hole.

3. The differentiated ultra-thin camera module according to claim 2, characterized in that: The depth of the blind hole is equal to the depth of the photosensitive chip (5).

4. The differentiated ultra-thin camera module according to claim 1, characterized in that: The Bracket support (3) has a first top surface (32), a second top surface (33), a first bottom surface (34), and a second bottom surface (35) from top to bottom.

5. The differentiated ultra-thin camera module according to claim 4, characterized in that: The filter (2) is disposed on the second top surface (33) of the Bracket bracket (3).

6. The differentiated ultra-thin camera module according to claim 4, characterized in that: The lower end of the optical lens (1) is fixedly mounted on the first top surface (32) of the Bracket bracket (3).

7. The differentiated ultra-thin camera module according to claim 4, characterized in that: The second bottom surface (35) of the Bracket bracket (3) is fixedly mounted on the RFPC rigid-flex plate (4).

8. The differentiated ultra-thin camera module according to claim 4, characterized in that: The top surface of the electronic component (6) is flush with the first top surface (32) of the Bracket bracket (3).

9. The differentiated ultra-thin camera module according to claim 1, characterized in that: The electronic components (6) are arranged symmetrically in pairs on both sides of the slot (41).

10. An electronic device, characterized in that: The differentiated ultra-thin camera module as described in any one of claims 1 to 9 is used.

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